CN218274520U - Chip taking part and chip mounting device - Google Patents
Chip taking part and chip mounting device Download PDFInfo
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- CN218274520U CN218274520U CN202121786808.9U CN202121786808U CN218274520U CN 218274520 U CN218274520 U CN 218274520U CN 202121786808 U CN202121786808 U CN 202121786808U CN 218274520 U CN218274520 U CN 218274520U
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- chip
- groove
- blue film
- recess
- blue
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Abstract
The utility model discloses a chip is got material structure and chip and is pasted dress device belongs to chip technical field. The utility model discloses a material structure is got to chip for separate the chip from blue membrane, include: the blue film is arranged on the surface of the chip, and the surface of the chip, which is provided with the groove, faces the blue film; the ejector pin is abutted against one surface of the blue film, which is far away from the groove, and the center line of the ejector pin is superposed with the center line of the groove, so that the blue film is bent towards the inside of the groove and is in surface contact with the chip; and the material taking part is used for taking away the chip. The utility model discloses a chip is got material structure and chip and is pasted dress device and push into the recess of chip through a thimble, can realize the separation of chip and blue membrane, has greatly promoted the efficiency of chip processing.
Description
Technical Field
The utility model relates to a chip technology field, concretely relates to chip gets material portion and chip subsides dress device.
Background
In the chip mounting process, a plurality of chips are placed on a blue film during feeding, and the chips need to be taken down from the blue film for mounting during assembly.
When the chip is placed on the blue film, the chip and the blue film have adhesive force, and for the chip with the groove, the blue film is removed generally by two methods: through two thimble simultaneous action at the same diagonal both ends of recess, perhaps, through four thimble simultaneous action at four tip of recess, above-mentioned two kinds of modes need be in same height when the thimble is used, the degree of difficulty is higher during the debugging, causes the blue membrane easily and is difficult to take off the scheduling problem.
SUMMERY OF THE UTILITY MODEL
In order to solve the not enough or partial not enough of solving prior art of prior art, the embodiment of the utility model provides a chip is got material portion and chip and is pasted dress device to automatically, conveniently with chip and blue membrane separation.
In a first aspect, an embodiment of the present invention provides a chip taking structure for separate the chip from the blue membrane, the chip taking structure includes:
the blue film is provided with a plurality of concave grooves, and the concave grooves are arranged on one surface of the blue film;
the thimble is abutted against one surface of the blue film, which is far away from the groove, and the center line of the thimble is superposed with the center line of the groove, so that the blue film is bent towards the inside of the groove and is separated from the surface contact with the chip; and the number of the first and second groups,
and the material taking part is used for taking away the chip.
In one embodiment of the present application, the groove has a first plane with a width in the first cross section smaller than that of the needle in the first cross section in the direction away from the blue film, and the width of the groove in the first cross section is greater than or equal to the cross sectional width of the needle in the first cross section between the first plane and the opening of the groove.
In an embodiment of the present application, an accommodating space is provided between the first plane and the bottom surface of the groove.
In an embodiment of this application, get material portion and be vacuum nozzle, vacuum nozzle has and is used for adsorbing the through-hole of chip.
In one embodiment of the application, the edge of one end of the thimble used for being pushed into the groove is provided with a chamfer,
and/or the presence of a gas in the atmosphere,
the groove is an inward concave arc surface at the first plane position.
In a second aspect, the embodiment of the present invention provides a chip mounting device, which is characterized in that the chip taking structure extracts the chip, the chip mounting device further comprises a tube seat, and the chip is mounted on the tube seat.
In an embodiment of the present application, the groove of the chip is communicated with the outside.
In an embodiment of the present application, the tube seat has a dispensing portion thereon;
and placing the chip on the tube seat, and gluing and fixing the chip on the tube seat through the glue dispensing part.
In an embodiment of the present application, the dispensing portion has two dispensing positions, and the two dispensing positions respectively correspond to two ends of a diagonal line of the chip.
In an embodiment of the application, the height of the dispensing portion is H, and the height of the chip is H, wherein H is not more than H.
The utility model has the advantages that:
the utility model discloses a material structure is got to chip through seting up the recess on the chip, through a thimble with blue membrane to push into in the recess, make blue membrane produce the bending to can use and get material portion and tak eoff away the chip, compare in two thimbles or four thimbles among the prior art, the utility model discloses a thimble is one, therefore need not to adjust the highly keeping unanimous of each thimble of the highly messenger of each thimble, only need the thimble with the central line coincidence of recess can, reduced the adjustment degree of difficulty, promoted the material efficiency of getting of chip. Through the utility model discloses a chip is got material structure, can realize that the automation of chip is got the material, has greatly promoted the efficiency of chip processing.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flow chart of a chip taking structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a chip taking structure according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of a chip mounting method according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a chip mounting device according to an embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of section C-C in fig. 4.
Wherein, the corresponding relationship between the reference numbers and the component names in fig. 2, fig. 4 and fig. 5 is as follows:
1. a chip; 10. a groove; 2. a blue film; 3. a thimble; 4. a tube holder; 40. a pin; 41. a bonding pad; 5. and (6) dispensing positions.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Embodiments of a chip taking structure and method
Fig. 2 shows the structure schematic diagram of the chip taking process of the embodiment of the present invention, as fig. 2, the embodiment of the present invention provides a chip taking structure for separating chip 1 from blue membrane 2, the chip taking structure includes: the blue film manufacturing method comprises the following steps that a chip 1 is provided with a concave groove 10 on one surface of the chip 1, and the surface, provided with the groove 10, of the chip 1 faces a blue film 2; the thimble 3 is abutted against one surface of the blue film 2, which is far away from the groove 10, and the center line of the thimble 3 is overlapped with the center line of the groove 10, so that the blue film 2 is bent towards the inside of the groove 10 and is separated from surface contact with the chip 1, and the blue film 2 is bent towards the inside of the groove 10 and is separated from surface contact with the chip 1; and a take-out section for taking out the chip 1.
The utility model discloses a chip is got material structure, through seting up recess 10 on chip 1, through a thimble 3 with blue membrane 2 to go into in the recess 10 the top, make blue membrane 2 produce the bending to can use and get material portion and tak away chip 1, compare two thimbles 3 or four thimbles 3 among the prior art, the utility model discloses a thimble 3 is one, therefore need not to adjust the height that highly makes each thimble 3 of each thimble 3 and keep unanimous, only need the thimble 3 with the central line coincidence of recess 10 can, reduced the adjustment degree of difficulty, promoted chip 1 get material efficiency.
Specifically, chip 1, blue membrane 2, thimble 3 set gradually, inwards sunken recess 10 has been seted up to the one side of chip 1 towards blue membrane 2, thimble 3 sets up for the position of recess 10, when under initial condition (fig. 2 does not show), blue membrane 2 is parallel with the horizontal plane, blue membrane 2 is laminated with the one side of chip 1 towards blue membrane 2, after thimble 3 pushes into the recess, like fig. 2, thimble 3 drives blue membrane 2 together and pushes into in the recess 10, and make blue membrane 2 produce the bending, originally blue membrane 2 also separates from each other under blue membrane 2 crooked effect with the part of 1 face contact of chip.
In the direction in which the chip 1 is far away from the blue film 2, the groove 10 has a first plane a, the width of the first plane a in a first cross section (cross section shown in fig. 2) is smaller than the width of the thimble 3 in the first cross section, and the width of the groove 10 in the first cross section is greater than or equal to the width of the thimble 3 in the first cross section between the first plane a and the opening of the groove 10. Therefore, between the first plane a and the opening of the groove 10, the groove 10 forms a first space for the movement of the thimble 3, and the thimble 3 can drive the blue film 2 to move in the first space, and is stopped at the first plane a.
As shown in fig. 2, when the thimble 3 pushes the blue film 2 into the groove 10, a portion of the blue film 2 between the top surface of the thimble 3 and the bottom surface of the groove 10 is bent toward the bottom surface of the groove 10.
In one embodiment, the bottom surface of the recess 10 is the surface of the first plane a, and at this time, the portion of the blue film 2 located between the top surface of the ejector pin 3 and the bottom surface of the recess 10 is attached to the bottom surface of the recess 10 under the action of the ejector pin 3, in this embodiment, the surface of the chip 1 that is originally attached to the blue film 2 is in contact with the surface that is separated from the blue film 2, so that the adhesion force between the blue film 2 and the chip 1 is reduced.
In one embodiment, a second space is formed between the first plane a and the bottom surface of the groove 10 in a direction away from the blue film 2, a portion of the blue film 2 between the top surface of the thimble 3 and the bottom surface of the groove 10 is bent in the second space, and the second space provides a bendable space for the portion of the blue film 2, so that the portion of the blue film 2 is prevented from adhering to the bottom surface of the whole groove 10, and the adhesion force between the chip 1 and the blue film 2 is reduced.
Optionally, the second space is sufficient to accommodate the bending of the portion of the blue film 2 between the top surface of the thimble 3 and the bottom surface of the groove 10, so that the blue film 2 does not contact the bottom surface of the groove 10, and at this time, the adhesion force between the blue film 2 and the chip 1 can be reduced to the maximum extent, and the chip 1 can be removed from the blue film 2 more easily.
It should be noted that, in the embodiment of the present invention, under the action of the ejector pin 3, the chip 1 and the blue film 2 are separated from the surface contact, so as to reduce the adhesion force between the chip 1 and the blue film 2, and thus, the chip 1 is separated from the blue film 2, however, when the ejector pin 3 abuts against the first plane a of the groove 10, under the action of the ejector pin 3, the blue film 2 also contacts the groove 10, but at this time, the part of the blue film 2 contacting the groove 10 is in line contact, and obviously, the adhesion force thereof is far smaller than the adhesion force between the two when the surface contacts.
In order to realize that the thimble 3 is pushed upwards, the blue film 2 is not in contact with the chip 1 or in line contact or partial surface contact, and the groove 10 can be in various shapes such as square, circular, trapezoid and the like on the first cross section, without limitation.
Optionally, an inward concave arc surface is arranged on the inner wall surface of the groove 10 at the first plane a, and/or a chamfer is arranged on the edge of one end of the thimble 3, which is used for being pushed into the groove 10, so as to prevent the damage to the blue film 2 or the chip 1 caused in the process of pushing the thimble 3 into the groove.
Fig. 1 shows a schematic flow diagram of a chip taking structure according to an embodiment of the present invention, referring to fig. 1, based on the above-mentioned chip taking structure, a chip taking method is provided for separating a chip 1 from a blue film 2, the method includes:
and 4000, taking the chip 1 by the material taking part.
Specifically, the material taking part comprises a vacuum suction nozzle, and the vacuum suction nozzle is provided with a through hole for adsorbing the chip 1. Chip 1 has and hangs the membrane, hangs the membrane and sets up between the bottom surface of recess 10 and the upper surface of chip 1, in order to prevent to influence the membrane that hangs on chip 1, when vacuum nozzle adsorbs, hangs the membrane and is not in the inlet air duct of through-hole to can not adsorb and hang the membrane, make and hang the membrane deformation.
Embodiments of chip mounting apparatus and methods
Fig. 4 shows a schematic structural diagram of a chip mounting device according to an embodiment of the present invention, and fig. 5 shows a schematic cross-sectional diagram of C-C in fig. 4, the chip mounting device according to an embodiment of the present invention is formed by mounting through the above-mentioned chip mounting method, and referring to fig. 4 and fig. 5, including a tube seat 4, a chip 1 is mounted on the tube seat 4.
Furthermore, because the airtight space expands with heat and contracts with cold, atmospheric pressure changes along with the temperature, can lead to chip 1 performance unstability to influence chip 1 function, consequently, chip 1's recess 10 will keep the intercommunication with the outside air after pasting dress, thereby makes the atmospheric pressure of recess 10 dimension steady, and chip 1's performance remains stable.
Wherein, the tube seat 4 is fixed with the chip 1 by a glue binding mode, and the tube seat 4 is provided with a glue dispensing part; and placing the chip 1 on the tube seat 4, and gluing and fixing the chip 1 on the tube seat 4 through the glue dispensing part. Specifically, the dispensing portion includes two dispensing positions 5, and the two dispensing positions 5 correspond to two ends of a diagonal line of the chip 1, respectively. During pasting, two pairs of angles corresponding to the diagonal of the chip 1 on the tube seat 4 are arranged in advance to glue the positions 5, two pairs of angles corresponding to the chip 1 are respectively aligned to two glue the positions 5, so that the chip 1 is glued and fixed on the tube seat 4, after the glue is fixed, the groove 10 of the chip 1 is connected with the tube seat 4 only at the two glue dispensing positions 5, and other positions can be communicated with the outside, so that a better ventilation effect is ensured, and the stability of the chip 1 is maintained.
As shown in fig. 5, during the process of gluing the chip 1, a part of the glue is extruded into the groove 10 and climbs upwards along the inner wall of the groove 10, optionally, the height of the glue climbing is less than or equal to half of the thickness of the chip 1, that is, the height of the glue dispensing part is H, and the height H of the chip 1, where H is less than or equal to H.
Optionally, as in fig. 4 and 5, the chip mounting apparatus of the embodiment of the present invention further includes a pin 40, the pin 40 runs through the socket 4, the one side of the socket 4 where the chip 1 is disposed is connected to one end of the pin 40, the pad 41 disposed on the surface of the socket 4 is connected to one end of the pin 40, and the pin 40 extends in a direction away from the socket 4 on one side of the socket 4 where the chip 1 is away from.
Fig. 3 shows a schematic flow chart of a chip mounting method according to an embodiment of the present invention, and referring to fig. 3, the method includes:
and 5000, placing the chip 1 on the tube seat 4, enabling two ends of a diagonal line of the chip 1 to respectively correspond to the two dispensing positions 5, and gluing and fixing the chip 1 on the tube seat 4.
According to the utility model discloses chip pastes dress method can realize in chip pastes dress process that the automation of chip 1 is got the material to realize chip 1's automatic dress, showing and having saved the human cost, promoted the efficiency of processing.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A chip material taking structure is used for separating a chip from a blue film, and comprises:
one surface of the chip is provided with an inward concave groove, and the surface of the chip provided with the groove faces the blue film;
the ejector pin is abutted against one surface of the blue film, which is far away from the groove, and the center line of the ejector pin is superposed with the center line of the groove, so that the blue film is bent towards the inside of the groove and is in surface contact with the chip; and the number of the first and second groups,
and the material taking part is used for taking away the chip.
2. The chip take off structure as recited in claim 1, wherein the recess has a first plane with a width in a first cross-section that is less than a width of the pin in the first cross-section in a direction away from the blue film, and wherein the recess has a width in the first cross-section that is greater than or equal to the width of the pin in the first cross-section between the first plane and the opening of the recess.
3. The die pick up structure of claim 2, wherein an accommodation space is provided between the first plane and the bottom surface of the recess.
4. The chip take-out structure as claimed in claim 1, wherein the take-out part is a vacuum nozzle having a through hole for sucking the chip.
5. The chip take-out structure as claimed in any one of claims 1 to 4,
the edge of one end of the thimble used for jacking into the groove is provided with a chamfer,
and/or the presence of a gas in the gas,
the groove is an inward concave arc surface at the first plane position.
6. A chip mounting apparatus, characterized in that a chip is extracted by the chip taking structure as claimed in any one of claims 1 to 5, the apparatus further comprising a socket on which the chip is mounted.
7. The chip mounting device according to claim 6, wherein the recess of the chip is in communication with the outside.
8. The die bonding apparatus according to claim 6, wherein the socket has a dispensing portion thereon;
and placing the chip on the tube seat, and gluing and fixing the chip on the tube seat through the glue dispensing part.
9. The apparatus as claimed in claim 8, wherein the dispensing part has two dispensing positions corresponding to two ends of a diagonal line of the die.
10. The die bonding apparatus according to claim 7, wherein the height of the dispensing portion is H, and the height of the die is H, wherein H is less than or equal to H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121786808.9U CN218274520U (en) | 2021-08-02 | 2021-08-02 | Chip taking part and chip mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121786808.9U CN218274520U (en) | 2021-08-02 | 2021-08-02 | Chip taking part and chip mounting device |
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| Publication Number | Publication Date |
|---|---|
| CN218274520U true CN218274520U (en) | 2023-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121786808.9U Active CN218274520U (en) | 2021-08-02 | 2021-08-02 | Chip taking part and chip mounting device |
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| CN (1) | CN218274520U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174623A (en) * | 2023-11-01 | 2023-12-05 | 深圳新连芯智能科技有限公司 | Device for needling transfer chip |
-
2021
- 2021-08-02 CN CN202121786808.9U patent/CN218274520U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174623A (en) * | 2023-11-01 | 2023-12-05 | 深圳新连芯智能科技有限公司 | Device for needling transfer chip |
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