CN117174623A - Device for needling transfer chip - Google Patents
Device for needling transfer chip Download PDFInfo
- Publication number
- CN117174623A CN117174623A CN202311433627.1A CN202311433627A CN117174623A CN 117174623 A CN117174623 A CN 117174623A CN 202311433627 A CN202311433627 A CN 202311433627A CN 117174623 A CN117174623 A CN 117174623A
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- chip
- thimble
- substrate
- needling
- transfer
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- 238000012546 transfer Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 230000001502 supplementing effect Effects 0.000 claims description 12
- 230000000153 supplemental effect Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 2
- 239000013078 crystal Substances 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 29
- 230000000007 visual effect Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012780 transparent material Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
The invention relates to a device for needling and transferring chips, which comprises a thimble cap assembly for chip transferring operation, a chip moving carrier for storing chips, a substrate and a substrate moving carrier for fixing the substrate, wherein the chip moving carrier is arranged between the thimble cap assembly and the substrate moving carrier, a thimble capable of moving up and down is arranged on the thimble cap assembly, a vision assembly is used for collecting image information right below the thimble and right below the substrate, when the vision assembly detects that the chips on a blue film and the transfer film solid crystal point on the substrate are right below the thimble, namely coaxial, the thimble ejects the chips on the blue film and transfers the chips to the transfer film, and the chips are positioned on the substrate after the transfer are detected at a signal speed, so that the chips can be transferred more accurately, and judgment errors caused by position errors caused by movement after vision judgment, precision errors caused by shrinkage of the blue film and judgment errors caused by lens distortion are avoided.
Description
Technical Field
The invention relates to the technical field of chip transfer, in particular to a device for needling and transferring chips.
Background
Semiconductor devices are electronic components that utilize semiconductor materials such as silicon, germanium, gallium arsenide, and the like. Semiconductor devices are typically manufactured as a single discrete device or Integrated Circuit (IC). Examples of single discrete devices include electrically actuatable elements such as Light Emitting Diodes (LEDs), diodes, transistors, resistors, capacitors, fuses, and the like.
The fabrication of semiconductor devices typically involves an intricate fabrication process with a large number of steps. The final product manufactured is a "packaged" semiconductor device. "packaged" modifier refers to the enclosure and protection features built into the final product and the interface that enables the devices in the package to be incorporated into the final circuit.
Conventional fabrication processes for semiconductor devices begin by processing semiconductor wafers. The wafer is diced into a number of "unpackaged" semiconductor devices and transferred. An "unpackaged" modifier refers to an unpackaged semiconductor device that has no protective features. The unpackaged semiconductor devices may be referred to herein as chips.
In the prior art, the chip is peeled off from the carrying platform firstly in the process of transferring, transferring and arranging the chip, then transferring the peeled chip, and in the traditional swing arm type chip transferring mode, when the product with small point-to-point distance is formed, the precision and the speed can not be improved because of the non-coaxial center and inertia problems of the rotating shaft and the suction nozzle, meanwhile, in the process of visual identification and positioning, the visual identification light source is realized by an LED, the LED is a substrate of a wafer by sapphire, aiming at the characteristic of the sapphire on light, the edge is difficult to grasp by matching with a visual component when the chip surface is irradiated, and the image identification has errors;
there is therefore a need for an arrangement to solve the technical problems.
Disclosure of Invention
The invention aims to provide a device for solving the problems that the precision and the speed of a traditional swing arm type chip transferring mode cannot be improved, and meanwhile, a traditional light source is easy to generate errors aiming at visual identification.
The invention is realized in such a way, a device for needling and transferring chips comprises a thimble cap component for chip transferring operation, a chip moving carrier for storing chips, a substrate and a substrate moving carrier for fixing the substrate, wherein the chip moving carrier is arranged between the thimble cap component and the substrate moving carrier, the thimble cap component is provided with a thimble capable of moving up and down automatically, the device also comprises a vision component and a light source, the vision component is used for collecting image information under the thimble, the light source is used for supplementing light, the vision component is used for detecting the positions of the thimble, the substrate and the chips, and the substrate is transparent;
preferably, the light source includes a backlight, and the backlight is disposed above the chip.
Preferably, the light source comprises a light supplementing source, and the light supplementing source is arranged below the substrate.
Preferably, the vision assembly comprises a first image capturing machine, and the first image capturing machine is arranged right below the thimble.
Preferably, the vision component comprises a first reflector and a first image capturing machine, wherein the first reflector is arranged right below the thimble, and the first image capturing machine collects image information right below the thimble through reflection of the first reflector.
Preferably, the vision component further comprises a half-lens group and a second image capturing machine, the image information collected by the first image capturing machine passes through the half-lens group, and the second image capturing machine collects the image information coaxial with the first image capturing machine through reflection of the first reflecting mirror to obtain the image information right below the substrate.
Preferably, the thimble cap assembly comprises a thimble cap and a lifting mechanism, the thimble is arranged on the lifting mechanism, and the lifting mechanism drives the thimble to move up and down in the thimble cap.
Preferably, the thimble cap assembly further comprises a light-permeable sucker arranged at the bottom of the thimble cap, a negative pressure hole is arranged in the light-permeable sucker, and the vacuum energy absorption can be provided by connecting the negative pressure pump in series through a pipeline.
Preferably, the light-permeable sucker is provided with an embedded light source.
Preferably, the light source is arranged outside the thimble cap, one side of the thimble cap is provided with a hole, and a second reflecting mirror is arranged in the thimble cap, and light emitted by the light source is reflected to the lower part of the thimble cap through the hole.
The device for needling and transferring the chip has the beneficial effects that: the vision subassembly is used for gathering the image information under the thimble and under the base plate, and when the vision subassembly detects the chip on the blue membrane and the transfer membrane solid crystal point on the base plate is located under the thimble, and when just being coaxial, the thimble is ejecting with the chip on the blue membrane and transfer to the transfer membrane to the signal is fast to detect the position that the chip is located on the base plate after transferring, more can accurately transfer the chip, also avoid because the vision judge just remove the position error that causes, the precision error that the shrinkage of blue membrane caused, the judgement error that the camera lens distortion caused.
When the light source is used for image recognition, errors of the light source on RGB wafer image recognition can be eliminated, and the transfer precision can be improved.
Compared with the traditional swing arm type die bonding method, the chip transferring speed and accuracy can be improved, the demand for smaller and smaller dot spacing is met, and the chip transferring speed and accuracy cannot be influenced by the size limitation of the suction nozzle.
Drawings
FIG. 1 is a schematic diagram of an apparatus for needling a transfer chip according to an embodiment of the present invention;
FIG. 2 is a schematic view of a light source embedded in a light-permeable sucker of a device for needling a transfer chip according to an embodiment of the present invention;
FIG. 3 is a schematic view of a light source structure outside a device for needling a transfer chip according to an embodiment of the present invention;
FIG. 4 is a schematic view of a coaxial structure of a visual assembly of a device for needling a transfer chip according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a non-coaxial structure of a visual assembly of a device for needling a transfer chip according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely illustrative and should not be construed as limitations of the present patent, and specific meanings of the terms may be understood by those skilled in the art according to specific circumstances.
The implementation of the present invention will be described in detail below with reference to specific embodiments.
Examples
Referring to fig. 1, a device for needling and transferring chips includes a thimble cap assembly, a chip moving carrier 10, a substrate 4 and a substrate moving carrier 12, wherein the chip moving carrier 10 is disposed between the thimble cap assembly and the substrate moving carrier 12, a thimble 1 capable of moving up and down is disposed on the thimble cap assembly, a vision assembly is disposed below the substrate 4 for collecting image information under the thimble 1, and a light source for supplementing light is provided for the vision assembly to detect positions of the thimble 1, the substrate 4 and the chip 5.
The thimble cap assembly comprises a thimble cap 2 and a lifting mechanism 7, the thimble 1 is driven by the lifting mechanism 7 to be arranged in the thimble cap 2 and can move along the vertical direction, the lifting mechanism 7 is used for driving the thimble 1 to lift automatically, such as a screw rod or a telescopic cylinder, and then the chip 5 fixed on the blue film 6 can be ejected downwards to act on the transfer film 3 to realize transfer operation.
Further, the chip moving carrier 10 fixes the blue film 6 for attaching the chip 5 through the die bonding rings 11a and 11b, the die bonding rings 11a and 11b are formed by two frames with matched inner and outer edges, the blue film 6 is fixed by tensioning the inner and outer edges of the two frames, the chip 5 is horizontally suspended below the thimble cap assembly, the tensioned blue film 6 can ensure good recovery effect after the thimble 1 is lifted, the problem of visual precision error caused by shrinkage of the blue film 6 is reduced, the thimble cap assembly also comprises a light-permeable sucker 15 arranged at the bottom of the thimble cap 2, a negative pressure hole is arranged in the light-permeable sucker 15, vacuum energy absorption can be provided by connecting a negative pressure pump in series through a pipeline, and the precision error of the chip 5 is subsequently transferred through vacuum absorption of the blue film 6 caused by shrinkage of the blue film 6.
And, the substrate moving carrier 12 fixes the substrate 4 through the substrate fixing mechanism 13, the substrate fixing mechanism 13 is a clamp, the transfer film 3 is attached to the surface of the substrate 4, and is used for receiving the transferred chip 5, the substrate 4 is made of a hard transparent material, the substrate 4 has a light-permeable property, and can enable the vision component to identify whether the thimble 1, the chip 5 and a die bonding point (the die bonding point is a position where the chip 5 is transferred on the substrate 4) of the transfer film 3 are at a coaxial position or not during vision identification, so that the positioning operation of the chip 5 transfer is conveniently performed in cooperation with the vision component, the hard transparent material is one or more of plastics, ceramics, film materials and crystal materials, the chip moving carrier 10 and the substrate moving carrier 12 can respectively move the chip 5 and the substrate 4 to the coaxial position, and transfer the chip 5 on the blue film 6 to the transfer film 3 through the thimble 1.
It is noted that, the light source is the backlight source 14 that sets up in the chip 5 top and the light supplementing source 9 that sets up in the base plate 4 below, the vision subassembly includes first image capturing machine 8, first image capturing machine 8 is camera, video camera or scanner etc. install under coaxial with thimble 1, and thimble 1, chip 5 and the solid brilliant point of base plate 4 are on the coaxial center, light supplementing source 9 is used for carrying out the light supplementing operation to the solid brilliant point of base plate 4, improve the receipts light effect of vision subassembly, under the illumination of backlight source 14, the periphery of chip 5 is bright and the centre is dark, the edge of chip 5 can become clearer, let the vision subassembly can snatch the edge of chip 5 fast, and then more accurate transfer chip 5, avoid because the vision judges the position error that just moves or blue membrane 6 shrink the precision error that causes, the judgement error condition that the camera distortion caused, the error condition that the error appears is got rid of image recognition.
In this embodiment, referring to fig. 4, the vision assembly further includes a half-lens group 19 and a second image capturing machine 18, the image information collected by the first image capturing machine 8 passes through the half-lens group 19, the second image capturing machine 18 collects the image information coaxial with the first image capturing machine 8 through reflection of the first reflecting mirror 16, and obtains the image information directly under the substrate 4, under the effect of the half-lens group 19, the image information obtained by the first image capturing machine 8 and the second image capturing machine 18 can be on the same axis and focus on different positions, the first image capturing machine 8 focuses on the chip 5 under the center 1, and the second image capturing machine 18 focuses on the lower part of the substrate 4, so as to monitor in real time whether the position of the transferred chip 5 on the transfer film 3 on the substrate 4 is qualified or not.
The substrate 4 and the chip 5 are fixed through the substrate fixing mechanism 13 and the chip moving carrier 10 respectively, and are guided to the lower part of the thimble cap 2, the vision component and the light source are started, the vision component irradiates behind the chip 5 through the backlight source 14, so that the vision component can quickly grasp the edge of the chip 5, the thimble 1 and the chip 5 are quickly positioned, visual judgment is completed when the thimble 1 and the chip 5 enter the substrate 4 crystal fixing point, and the second image capturing machine 18 is utilized for qualification detection, so that compared with the traditional vision judgment before moving, the precision is greatly improved.
In some embodiments, the light source may also be one of the backlight 14 or the supplemental light source 9.
In the embodiment, the backlight source 14 is disposed in the thimble cap 2, and in other embodiments, the backlight source may be further embedded in the light-permeable sucker 15, as shown in fig. 2, which belongs to an alternative scheme with the same effect, and may be applied to more usage scenarios.
In another embodiment, the backlight source 14 may be further disposed outside the thimble cap 2, and the second reflecting mirror 17 is disposed inside the thimble cap 2, and a hole is formed on one side of the thimble cap 2, and the backlight source 14 is reflected by the second reflecting mirror 17, as shown in fig. 3, which belongs to an alternative scheme with the same effect, and may be applied to more usage scenarios.
Examples
Referring to fig. 4, a device for needling and transferring chips comprises a thimble cap assembly, a chip moving carrier 10, a substrate 4 and a substrate moving carrier 12, wherein the chip moving carrier 10 is arranged between the thimble cap assembly and the substrate moving carrier 12, a thimble 1 capable of moving up and down is arranged on the thimble cap assembly, a vision assembly is arranged below the substrate 4 and used for collecting image information right below the thimble 1, and a light source is also arranged for supplementing light and used for the vision assembly to detect positions of the thimble 1, the substrate 4 and the chip 5.
The thimble cap assembly comprises a thimble cap 2 and a lifting mechanism 7, the thimble 1 is driven by the lifting mechanism 7 to be arranged in the thimble cap 2 and can move along the vertical direction, the lifting mechanism 7, such as a screw rod or a telescopic cylinder, is used for driving the thimble 1 to lift automatically, and then the chip 5 fixed on the blue film 6 can be ejected downwards to act on the transfer film 3 to realize transfer operation.
The chip moving carrier 10 is fixed with a blue film 6 for attaching a chip 5 through die bonding rings 11a and 11b, the die bonding rings 11a and 11b are formed by two frames with matched inner and outer edges, the blue film 6 is fixed by tensioning the inner and outer edges of the two frames, the chip 5 is horizontally suspended below a thimble cap assembly, the tensioned blue film 6 can ensure good recovery effect after the thimble 1 is lifted, the problem of visual precision error caused by shrinkage of the blue film 6 is reduced, the thimble cap assembly also comprises a light-permeable sucker 15 arranged at the bottom of the thimble cap 2, a negative pressure hole is arranged in the light-permeable sucker 15, vacuum energy absorption can be provided through connecting a pipeline with a negative pressure pump in series, and the precision error of the chip 5 is subsequently transferred through vacuum absorption of the blue film 6 caused by shrinkage of the blue film 6.
The substrate moving carrier 12 fixes the substrate 4 by the substrate fixing mechanism 13, the substrate fixing mechanism 13 is a fixture, the transfer film 3 is attached to the surface of the substrate 4, and is used for receiving the transferred chip 5, the substrate 4 is made of a hard transparent material, the substrate 4 has a light-permeable property, and when in visual identification, the visual component can identify whether the thimble 1, the chip 5 and a die bonding point (the die bonding point is a position where the chip 5 is transferred on the substrate 4) of the transfer film 3 are in a coaxial position, so that the positioning operation of the chip 5 transfer is conveniently performed by matching with the visual component, the hard transparent material is one or more of plastics, ceramics, film materials and crystal materials, the chip moving carrier 10 and the substrate moving carrier 12 can respectively move the chip 5 and the substrate 4 to the coaxial position, and transfer the chip 5 on the blue film 6 onto the transfer film 3 by the thimble 1, compared with the traditional swing arm type die bonding method, the speed and precision of transferring the chip 5 are improved, and the requirement for smaller and smaller point spacing is not affected by the size limitation of the suction nozzle.
The light source is a backlight source 14 arranged above the chip 5 and a light supplementing source 9 arranged below the substrate 4, the vision component comprises a first image capturing machine 8 and a first reflecting mirror 16, the first image capturing machine 8 is a camera, a video camera or a scanner and the like, is arranged below the thimble 1 in a non-coaxial mode, the first reflecting mirror 16 is used for reflecting images, whether the thimble 1, the chip 5 and a crystal fixing point of the substrate 4 are on the same axis or not is guaranteed to be judged by the reflected images, the light supplementing source 9 is used for carrying out light supplementing operation on the crystal fixing point of the substrate 4, the light receiving effect of the vision component is improved, the periphery of the chip 5 is bright and middle dark under the irradiation of the backlight source 14, the edge of the chip 5 can become clearer, the vision component can quickly grasp the edge of the chip 5, the chip 5 can be accurately transferred, position errors caused by movement of the vision judging is avoided, accuracy errors caused by shrinkage of the blue film 6, and errors caused by judgment of lens distortion are avoided.
In this embodiment, referring to fig. 5, the vision assembly further includes a half-lens group 19 and a second image capturing machine 18, the image information collected by the first image capturing machine 8 passes through the half-lens group 19, the second image capturing machine 18 collects the image information coaxial with the first image capturing machine 8 through reflection of the first reflecting mirror 16, and obtains the image information directly under the substrate 4, under the effect of the half-lens group 19, the image information obtained by the first image capturing machine 8 and the second image capturing machine 18 may be on a non-coaxial and focused at different positions, the first image capturing machine 8 focuses on the chip 5 directly under the coaxial thimble 1, and the second image capturing machine 18 focuses on the lower part of the substrate 4, so as to monitor in real time whether the position of the transferred chip 5 on the substrate 4 where the transferred film 3 is qualified.
In some embodiments, the light source may also be one of the backlight 14 or the supplemental light source 9.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. The utility model provides a device for needling shifts chip, includes the thimble cap subassembly that is used for the chip to shift the operation, is used for storing the chip and moves carrier, base plate and is used for the base plate that fixes the base plate to remove the carrier, the chip removes the carrier setting between thimble cap subassembly and base plate and removes the carrier, be equipped with the thimble that can reciprocate on the thimble cap subassembly, its characterized in that: the optical module is used for collecting image information under the thimble, the substrate is transparent, and the light source is used for supplementing light so that the optical module can detect positions of the thimble, the substrate and the chip.
2. The apparatus for needled transfer of chips of claim 1, wherein said light source includes a backlight, said backlight being disposed above the chip.
3. A device for needling a transfer chip according to claim 1 or 2, wherein the light source comprises a supplemental light source disposed below the substrate.
4. The apparatus for needling a transfer chip of claim 1, wherein the vision assembly includes a first image capture machine disposed directly below the ejector pin.
5. The apparatus for needling a transfer chip of claim 1, wherein the vision assembly includes a first mirror disposed directly below the thimble and a first image capturing device that captures image information directly below the thimble by reflection from the first mirror.
6. The apparatus for needling a transfer chip of claim 5, wherein the vision assembly further comprises a half-lens assembly and a second image capturing machine, the image information collected by the first image capturing machine is transmitted through the half-lens assembly, and the second image capturing machine is reflected by the first reflecting mirror to collect the image information coaxial with the first image capturing machine and obtain the image information directly under the substrate.
7. The apparatus for needling a transfer chip of claim 1, wherein the spike cap assembly includes a spike cap and a lift mechanism, the spike being disposed on the lift mechanism, the lift mechanism driving the spike to move up and down within the spike cap.
8. The apparatus for needling a transfer chip of claim 7, wherein said spike cap assembly further comprises a light transmissible suction cup disposed at the bottom of the spike cap, a negative pressure hole being disposed in the light transmissible suction cup.
9. A device for needling a transfer chip according to claim 8, wherein said light transmissible suction cup is provided with an embedded light source.
10. The device for needling a transfer chip of claim 8 wherein the light source is disposed outside the cap, one side of the cap is perforated, and a second reflector is disposed therein, light from the light source being reflected through the perforation to below the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311433627.1A CN117174623A (en) | 2023-11-01 | 2023-11-01 | Device for needling transfer chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311433627.1A CN117174623A (en) | 2023-11-01 | 2023-11-01 | Device for needling transfer chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117174623A true CN117174623A (en) | 2023-12-05 |
Family
ID=88932024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311433627.1A Pending CN117174623A (en) | 2023-11-01 | 2023-11-01 | Device for needling transfer chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117174623A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200949983A (en) * | 2008-05-27 | 2009-12-01 | Mjc Probe Inc | Needle device for pick and place machine |
| CN102024668A (en) * | 2009-09-10 | 2011-04-20 | 由田新技股份有限公司 | Combination of chip ejection device and image acquisition device |
| CN209389053U (en) * | 2018-12-12 | 2019-09-13 | 东莞市中麒光电技术有限公司 | The device of LED chip is shifted, is arranged in a kind of fully-automatic intelligent positioning |
| TWM615492U (en) * | 2021-03-22 | 2021-08-11 | 梭特科技股份有限公司 | Reflective pin ejection cap |
| CN114156195A (en) * | 2021-11-30 | 2022-03-08 | 矽磐微电子(重庆)有限公司 | Packaging method, chip identification method and device |
| CN217306452U (en) * | 2022-03-04 | 2022-08-26 | 梭特科技股份有限公司 | Thimble cap equipment |
| CN115008007A (en) * | 2022-06-15 | 2022-09-06 | 东莞市德镌精密设备有限公司 | Needling type PCB welding crystal discharging machine |
| CN217606776U (en) * | 2022-04-02 | 2022-10-18 | 深圳市瑞丰光电子股份有限公司 | Chip transfer mounting equipment |
| CN218274520U (en) * | 2021-08-02 | 2023-01-10 | 芯思杰技术(深圳)股份有限公司 | Chip taking part and chip mounting device |
-
2023
- 2023-11-01 CN CN202311433627.1A patent/CN117174623A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200949983A (en) * | 2008-05-27 | 2009-12-01 | Mjc Probe Inc | Needle device for pick and place machine |
| CN102024668A (en) * | 2009-09-10 | 2011-04-20 | 由田新技股份有限公司 | Combination of chip ejection device and image acquisition device |
| CN209389053U (en) * | 2018-12-12 | 2019-09-13 | 东莞市中麒光电技术有限公司 | The device of LED chip is shifted, is arranged in a kind of fully-automatic intelligent positioning |
| TWM615492U (en) * | 2021-03-22 | 2021-08-11 | 梭特科技股份有限公司 | Reflective pin ejection cap |
| CN218274520U (en) * | 2021-08-02 | 2023-01-10 | 芯思杰技术(深圳)股份有限公司 | Chip taking part and chip mounting device |
| CN114156195A (en) * | 2021-11-30 | 2022-03-08 | 矽磐微电子(重庆)有限公司 | Packaging method, chip identification method and device |
| CN217306452U (en) * | 2022-03-04 | 2022-08-26 | 梭特科技股份有限公司 | Thimble cap equipment |
| CN217606776U (en) * | 2022-04-02 | 2022-10-18 | 深圳市瑞丰光电子股份有限公司 | Chip transfer mounting equipment |
| CN115008007A (en) * | 2022-06-15 | 2022-09-06 | 东莞市德镌精密设备有限公司 | Needling type PCB welding crystal discharging machine |
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