CN217606776U - Chip transfer mounting equipment - Google Patents
Chip transfer mounting equipment Download PDFInfo
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- CN217606776U CN217606776U CN202220768957.0U CN202220768957U CN217606776U CN 217606776 U CN217606776 U CN 217606776U CN 202220768957 U CN202220768957 U CN 202220768957U CN 217606776 U CN217606776 U CN 217606776U
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Abstract
The utility model relates to the technical field of chip detection, in particular to a chip transfer mounting device, which is used for sorting chips and mounting the chips on a substrate, and comprises a body, a light source device, a camera device, a transfer device and a detection film for bearing the chips, wherein the light source device, the camera device and the transfer device are all positioned on one surface of the detection film bearing the chips; the light that light source device sent shines the region of placing the chip on the detection membrane, camera device corresponds the position of chip and shoots and discern the color of the chip that is shone by light source device, just transfer device carries out the chip based on the chip color and shifts and paste the dress on the base plate. The utility model provides a pair of chip shifts to paste and pastes equipment and select direct dress chip behind the chip, reaches the effect of the even paster of luminance, saves the chip and surveys and select separately the link, increases substantially efficiency.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a chip detects technical field, in particular to chip shifts pastes dress equipment.
[ background of the invention ]
At present, most of display products (backlight/direct display) and other products capable of emitting light need to use chips, but due to the fact that brightness is not uniform among the chips, mura (brightness non-uniformity) phenomena of the display products (backlight/direct display) and other light emitting products can be caused.
Generally, before the chip is put into use, the chip can be detected through a point measuring machine, the chip is firstly lightened in the detection process, after brightness is compared, a sorting machine carries out light splitting and screening on the chip with the same brightness to the same film, mounting is carried out after screening, a large amount of time can be consumed, and meanwhile, the efficiency is low.
[ Utility model ] A method for manufacturing a semiconductor device
For solving the technical problem that chip detection pastes the inefficiency, the utility model provides a chip detection device.
The utility model provides a solution to the technical problem provide a chip transfer pastes dress equipment for sorting chips and pasting chips to the base plate, including the body and light source device, camera device, transfer device and the detection membrane that is used for bearing the weight of the chip that set up on the body, light source device, camera device and transfer device all are located the detection membrane bears the weight of one side of the chip;
the light that light source device sent shines the region of placing the chip on the detection membrane, camera device corresponds the position of chip and shoots and discern the color of the chip that is shone by light source device, just transfer device carries out the chip based on the chip color and shifts and paste the dress on the base plate.
Preferably, the chip transferring and mounting equipment further comprises a control unit, the control unit is arranged on the body and is in signal connection with the light source device, the transferring device and the camera device respectively; the control unit identifies the color corresponding to each chip based on the image shot by the camera device and judges whether the color of each chip is the same, and then controls the transfer device to transfer and mount the chips with the same color onto the same substrate.
Preferably, the detection membrane is one of a blue membrane, a UV membrane or a thermal membrane.
Preferably, the chip transfer and mounting equipment further comprises a transmission device, wherein the transmission device is in signal connection with the control unit; the detection membrane is connected with the transmission device and moves through the transmission device.
Preferably, the chip transferring and mounting equipment further comprises an ejection device, the ejection device is arranged on the surface opposite to the detection film placing chip, and the ejection device is in signal connection with the control unit; and after recognizing the color of the chip, the control unit controls the ejection device to eject the chip with the same color out and separate the chip from the detection film, and then the lifted chip is transferred by the transfer device.
Preferably, the ejection means is a single movable ejector pin.
Preferably, the imaging device is disposed perpendicularly to the detection film.
Preferably, the light source device is a light source device with single wavelength light or a light source device with a combination of multiple wavelength light.
Preferably, the included angle formed between the light irradiated by the light source device and the detection film is 15-75 degrees.
Preferably, the transfer device comprises a movable swing arm arranged on the body and a suction nozzle arranged on the swing arm for sucking the chip.
Compared with the prior art, the utility model provides a pair of chip sorting device has following advantage:
1. the chip transfer mounting equipment comprises a body, a light source device, a camera device, a transfer device and a detection film, wherein the light source device and the camera device are arranged on the body; the light source device comprises a light source device, a transfer device, a chip epitaxial layer, a chip mounting device and a chip mounting device, wherein the light source device is arranged on the chip, the chip epitaxial layer is arranged on the chip mounting device, the light source device is arranged on the chip, the transfer device is arranged on the chip mounting device, the light source device is arranged on the chip epitaxial layer, the light source device is arranged on the chip epitaxial layer, the light source device is arranged on the light source device, the light source device is arranged on the chip epitaxial layer, and the light source device is arranged on the chip epitaxial layer.
2. The utility model discloses a chip shifts and pastes dress equipment still includes a the control unit, through the operation of control unit with the control equipment, the colour that the control unit can discern which chips according to the image that camera device shot is the same simultaneously, and then control transfer device shifts the chip and pastes the dress.
3. The utility model discloses a detect the membrane and be blue membrane, UV membrane or hot membrane one of them, the chip drops when these membranes all have certain stickness and can avoid removing.
4. The utility model discloses a chip shifts pastes dress equipment still includes a transmission, wherein detect membrane and transmission and connect and accessible transmission removes, can understand ground, because camera device generally keeps motionless when the equipment moves, avoid removing and influence the shooting, and camera device's shooting scope is limited, can't contain whole chip of whole blue membrane in a shooting window, make camera device can shoot whole chip on the detection membrane by the control unit control transmission and then the removal detection membrane, in order to avoid the error, and the efficiency of the promotion.
5. The utility model discloses a chip shifts subsides dress equipment sets up ejecting device, wherein ejecting device sets up to single mobilizable thimble, the thimble set up in with the detection membrane bears the one side that the chip carried on the back mutually, can understand, when discerning the same or close chip of colour by the control unit, it pierces through the detection membrane and also separates chip jack-up and detection membrane mutually simultaneously to remove the thimble through control, perhaps the jack-up chip reduces and detects the area of contact between the membrane and then reduces the stickness between chip and the detection membrane, and then make things convenient for the transfer device to shift the chip, avoid the stickness influence transfer device of detection membrane to pick up the chip.
6. The utility model discloses a camera device perpendicular to detects the membrane setting to guarantee that camera device can shoot the positive view of chip, avoid shooting the production error.
7. The utility model discloses a light source device includes the light source and rotates the piece, can understand ground, and the light source is used for giving out light and shines the chip on detecting the membrane and make the chip epitaxial layer present different colours, rotates the angle that the piece shines the chip in order to guarantee adjustable light source through setting up.
8. The utility model discloses a transfer device includes swing arm and suction nozzle, can understand ground, makes the suction nozzle can absorb the chip through removing the swing arm and then removing the suction nozzle, reachs through removing the swing arm at last and treats solid brilliant position and can accomplish solid brilliant, directly carries out chip transfer and subsides dress through transfer equipment after screening out the chip, increases substantially efficiency.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a chip transfer and mounting apparatus according to a first embodiment of the present invention.
Fig. 2 is a schematic partial structural diagram of a chip transfer and mounting apparatus according to a first embodiment of the present invention.
Fig. 3 is a schematic diagram of a partial structure of a chip transfer and mounting apparatus according to a first embodiment of the present invention.
Fig. 4 is a schematic diagram of a partial structure of a chip transfer and mounting apparatus according to a first embodiment of the present invention.
Fig. 5 is a schematic diagram of a partial structure of a chip transfer and mounting apparatus according to a first embodiment of the present invention.
The attached drawings indicate the following:
1. chip transfer mounting equipment;
10. a light source device; 20. a camera device; 30. a detection membrane; 40. a chip; 50. a control unit; 60. an ejection device; 70. a transfer device;
601. a thimble; 701. swinging arms; 702. a suction nozzle.
[ detailed description ] A
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It is to be noted that the terms "first" and "second" and the like in the description and the claims of the present invention are used for distinguishing different objects, and are not used for describing a specific order.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1, a first embodiment of the present invention provides a chip transferring and mounting apparatus 1, for sorting a chip 40 and mounting the chip 40 onto a substrate (not shown), including a body (not shown), a light source device 10, a camera device 20, a transferring device 70 and a detecting film 30 for carrying the chip 40, which are disposed on the body, wherein the light source device 10, the camera device 20 and the transferring device 70 are all located on a surface of the detecting film 30 carrying the chip 40; the light emitted from the light source device 10 irradiates the area of the detection film 30 where the chip 40 is placed, the image pickup device 20 picks up an image corresponding to the position of the chip 40 and recognizes the color of the chip 40 irradiated by the light source device 10, and the transfer device 70 transfers and attaches the chip 40 to the substrate based on the color of the chip 40 recognized by the image pickup device 20.
It can understand, when the light that light source device 10 sent shines on chip 40, chip 40 epitaxial layer can demonstrate different colours, the image of the chip 40 that shines is shot to rethread camera device 20 this moment, and then the colour of chip 40 is discerned, shift and paste to same base plate through transfer device 70 with the close chip 40 of colour, thereby realize selecting directly to paste dress chip 40 behind the chip 40, reach the even paster effect of luminance, save chip 40 point survey and select separately the link, raise the efficiency by a wide margin.
Specifically, in the present embodiment, the image capturing device 20 is a CCD camera.
It will be appreciated that the camera device 20 may also be used to locate the position of the chip 40.
Further, the chip transferring and mounting apparatus 1 further includes a control unit 50, the control unit 50 is disposed on the main body, the control unit 50 is respectively in signal connection with the light source device 10, the transferring device 70 and the image pickup device 20, the control unit 50 identifies the color corresponding to each chip 40 based on the image captured by the image pickup device 20 and determines whether the color of each chip 40 is the same, and then controls the transferring device 70 to transfer and mount the chips 40 having the same color onto the same substrate.
It can be understood that the control unit 50 controls the operation of the chip transfer and mounting apparatus 1, and the control unit 50 can identify which chips 40 have the same or similar color according to the image captured by the image capturing device 20, and then control the transfer device 70 to transfer the chips 40 for mounting, and can also control the on/off of the light source device 10 through signal connection.
In one embodiment, the RGB value range of the color is set in the control unit 50, the RGB values of each chip 40 are firstly identified by the image captured by the image capturing device 20, and the chips 40 in the same RGB value range are determined as the chips 40 with the same color.
It will be appreciated that when the camera device 20 takes a picture, the picture is transmitted to the control unit 50 via the signal connection and processed by the control unit 50 and the color of the chip 40 is identified, and the control unit 50 controls the transferring device 70 to transfer the chip 40 having the same color based on the identified chip 40.
Further, the detection film 30 is one of a blue film, a UV film, or a thermal film.
Specifically, in the present embodiment, the detection film 30 is a blue film.
It will be appreciated that the blue film, the UV film or the thermal film may have a certain viscosity to prevent the chip 40 from falling off during movement.
Further, the chip transfer and mounting apparatus 1 further includes an actuator (not shown) in signal connection with the control unit 50; the detection membrane 30 is connected to and moved by an actuator.
It can be understood that the camera device 20 generally remains stationary when the chip transferring and mounting apparatus 1 operates, and is prevented from moving to affect the shooting, and the shooting range of the camera device 20 is limited, and all chips on the detection film 30 cannot be shot at one time, and the control unit 50 controls the transmission device and then moves the detection film 30 so that the camera device 20 can shoot all chips 40 on the detection film 30, so as to avoid errors and improve the efficiency.
Specifically, in the present embodiment, the transmission device is a motor, and the motor is controlled to control the movement of the detection film 30.
Referring to fig. 1, 2 and 3, the chip transfer and mounting apparatus 1 further includes an ejector 60, the ejector 60 is disposed on a side of the detection film 30 opposite to the side on which the chip 40 is disposed, the ejector 60 is in signal connection with the control unit 50, and after the control unit 50 recognizes the color of the chip 40, the control unit 50 controls the ejector 60 to eject the chip 40 with the same color out of the detection film 30, and then the lifted chip 40 is transferred by the transfer device 70.
It can be understood that, when the control unit 50 identifies the chips 40 with the same or similar colors, the control unit 50 controls the ejection device 60 to eject the chips 40, so as to facilitate the transfer device to transfer the chips 40 and prevent the adhesion of the detection film 30 from affecting the chip pickup of the transfer device 70.
It is understood that, when the control unit 50 recognizes the color of the chip, the ejection device 60 is controlled to eject the chip having the same color separately from the detection film 30, and then the transfer device 70 is controlled to transfer the ejected chip 40.
Further, in the present embodiment, the ejector 60 is a single movable thimble 601.
It will be appreciated that the test film 30 has a certain viscosity, and when the chip 40 is directly transferred by the transfer device 70, the test film 30 may be pulled to affect other chips 40 around the chip 40.
Referring to fig. 3, in the schematic diagram of the embodiment of the invention that the chip 40 is lifted by the ejector pin 601, it can be understood that the chip 40 is relatively precisely lifted by the ejector pin 601 due to the small volume of the chip 40, and the chip 40 can be directly lifted and separated from the detection film 30 by piercing the detection film 30 when the chip 40 is lifted by the ejector pin 601; and because the thimble 601 has a small volume, other chips 40 around the chip 40 are not affected when the chip 40 is jacked up by piercing the detection membrane 30.
Referring to fig. 4, in another schematic diagram of the embodiment that the chip 40 is lifted by the ejector pin 601, it can be understood that the detection film 30 has a certain ductility, and the detection film 30 is not broken when the chip 40 is lifted each time; when the ejector pin 601 ejects the chip 40, the chip 40 can be easily transferred by the transfer device 70 even though the chip 40 does not pierce the detection film 30, but the contact area between the chip 40 and the detection film 30 is reduced, thereby reducing the adhesion between the chip 40 and the detection film 30.
It is understood that the control unit 50 controls the ejector pins 601 to eject only one chip 40 at a time, and then ejects another chip 40 through the ejector pins 601 after the ejected chip 40 is transferred by the transfer device 70.
In another embodiment, the detecting film 30 moves in the horizontal direction, the ejector pins 601 are adjusted in advance to be fixed in position and can move only in the vertical direction, and after the control unit 50 recognizes the color of the chip 40, the corresponding chip 40 is moved above the ejector pins 601 by controlling the moving detecting film 30 and the ejector pins 601 are controlled to jack up the chip, thereby realizing the transfer and mounting of the chip 40.
Further, the image pickup device 20 is disposed perpendicularly to the detection film 30.
It will be appreciated that this arrangement is provided to ensure that the camera 20 can capture a front view of the chip 40, to avoid errors in the capture,
specifically, the camera device 20 is fixedly disposed above a surface of the detection film 30, which bears the chip 40, and the fixed arrangement prevents the camera device 20 from moving to affect focusing and cause unclear shooting, thereby affecting the color of the chip 40 recognized by the final control unit 50.
Further, in the present embodiment, the light source device 10 is a light source device 10 having a single wavelength light or a light source device 10 having a combination of a plurality of wavelengths of light.
It should be understood that the light source device 10 having a single wavelength light means that the light source device 10 can only fixedly emit light of one wavelength, and the light source device 10 having a combination of multiple wavelengths means that the light source device 10 can emit multiple light beams, and can freely switch among the light beams of multiple wavelengths.
Further, referring to fig. 5, the light emitted from the light source device 10 forms an angle α with the detection film 30 in the range of 15 ° to 75 °.
Specifically, in the present embodiment, the angle α formed between the light irradiated from the light source device 10 and the detection film 30 is 45 °.
It can be understood that, when the included angle is in this range, the color of the epitaxial layer of the chip 40 is clearer when the light emitted by the light source device 10 irradiates on the chip 40, so that the identification is easier, the identification accuracy is higher, and the error is reduced.
Further, the transfer device 70 includes a swing arm 701 movably provided on the body and a suction nozzle 702 provided on the swing arm 701 for sucking the chip 40.
It can be understood that the swing arm 701 is controlled by the control unit 50, the control unit 50 controls the swing arm 701 according to the position of the chip 40 identified by the image pickup device 20, and then moves the suction nozzle 702 to a position right above the chip 40, the thimble 601 pierces the detection film 30 and jacks up the chip 40, at this time, the swing arm 701 presses down the suction nozzle 702, the suction nozzle 702 sucks up the chip 40 under negative pressure, then the swing arm 701 is controlled to move to a position to be die-bonded, and the swing arm 701 presses down to the right position while canceling the suction nozzle 702 under negative pressure to complete die bonding.
To sum up, the utility model provides a pair of chip shifts to paste dress equipment 1 can demonstrate different colours through the chip 40 epitaxial layer that utilizes the special light that light source device 10 sent to shine on detecting membrane 30, rethread camera device 20 shoots the discernment and gets for the picture the back, paste the dress on same base plate through the close or the same chip 40 of colour that transfer device 70 will discern to realize that chip shifts to paste dress equipment 1 and directly select separately and paste the dress chip, reach the colour, the even paster's of luminance effect, efficiency is greatly improved.
Compared with the prior art, the utility model provides a pair of chip shifts subsides dress equipment has following advantage:
1. the chip transfer mounting equipment comprises a body, a light source device, a camera device, a transfer device and a detection film, wherein the light source device and the camera device are arranged on the body; it can be understood that when the chip is irradiated by the light source device, the epitaxial layer of the chip will show different colors, and then the image of the irradiated chip is shot by the camera device, so as to identify the color of the chip, the chips with the same color are transferred and mounted on the same substrate through the transfer device, so that the chips are directly mounted after being screened out, the effect of uniform mounting of colors and brightness is achieved, the link of chip sorting is omitted, and the efficiency is greatly improved.
2. The utility model discloses a chip shifts and pastes dress equipment still includes a the control unit, through the operation of control unit with the control equipment, the colour that the control unit can discern which chips according to the image that camera device shot is the same simultaneously, and then control transfer device shifts the chip and pastes the dress.
3. The utility model discloses a detect the membrane and be blue membrane, UV membrane or hot membrane one of them, the chip drops when these membranes all have certain stickness can avoid removing.
4. The utility model discloses a chip shifts subsides dress equipment still includes a transmission, wherein detect the membrane and connect and accessible transmission removes, can understand ground, because camera device generally keeps motionless when the equipment moves, avoid removing and influence the shooting, and camera device's shooting scope is limited, can't once only shoot and detect whole chips on the membrane, control unit control transmission and then remove and detect the membrane and make camera device can shoot and detect whole chips on the membrane, in order to avoid the error, the lifting efficiency.
5. The utility model discloses a chip shifts subsides dress equipment sets up ejecting device, wherein ejecting device sets up to single mobilizable thimble, the thimble set up in with the detection membrane bears the one side that the chip carried on the back mutually, can understand, when discerning the same or close chip of colour by the control unit, it pierces through the detection membrane and also separates chip jack-up and detection membrane mutually simultaneously to remove the thimble through control, perhaps the jack-up chip reduces and detects the area of contact between the membrane and then reduces the stickness between chip and the detection membrane, and then make things convenient for the transfer device to shift the chip, avoid the stickness influence transfer device of detection membrane to pick up the chip.
6. The utility model discloses a blue membrane of camera device perpendicular to sets up to guarantee that camera device can shoot the front view of chip, avoid shooing the production error.
7. The utility model discloses a light source device includes the light source and rotates the piece, can understand ground, and the light source is used for giving out light and shines the chip on detecting the membrane and make the chip epitaxial layer present different colours, rotates the angle that the piece shines the chip in order to guarantee adjustable light source through setting up.
8. The utility model discloses a transfer device includes swing arm and suction nozzle, can understand ground, makes the suction nozzle can absorb the chip through removing the swing arm and then removing the suction nozzle, reachs through removing the swing arm at last and treats solid brilliant position and can accomplish solid brilliant, directly carries out chip transfer and subsides dress through transfer equipment after screening out the chip, increases substantially efficiency.
The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the present invention, and any modification, equivalent replacement and improvement made within the principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a chip shifts pastes dress equipment for select separately the chip and paste dress chip to the base plate on, its characterized in that: the detection device comprises a body, a light source device, a camera device, a transfer device and a detection film, wherein the light source device, the camera device, the transfer device and the detection film are arranged on the body, and are used for bearing a chip;
the light that light source device sent shines the region of placing the chip on the detection membrane, camera device corresponds the position of chip and shoots and discern the color of the chip that is shone by light source device, just transfer device carries out the chip based on the chip color and shifts and paste the dress on the base plate.
2. The chip transfer mounting apparatus according to claim 1, wherein: the chip transferring and mounting equipment further comprises a control unit, wherein the control unit is arranged on the body and is in signal connection with the light source device, the transferring device and the camera device respectively; the control unit identifies the color corresponding to each chip based on the image shot by the camera device and judges whether the color of each chip is the same, and then controls the transfer device to transfer and mount the chips with the same color onto the same substrate.
3. The chip transfer mounting apparatus according to claim 2, wherein: the detection film is one of a blue film, a UV film or a thermal film.
4. The chip transfer mounting apparatus according to claim 2, wherein: the chip transferring and mounting equipment further comprises a transmission device, and the transmission device is in signal connection with the control unit; the detection membrane is connected with the transmission device and moves through the transmission device.
5. The chip transfer mounting apparatus according to claim 2, wherein: the chip transferring and mounting equipment further comprises an ejection device, the ejection device is arranged on the surface opposite to the detection film placing chip, and the ejection device is in signal connection with the control unit; and after recognizing the color of the chip, the control unit controls the ejection device to eject the chip with the same color out and separate the chip from the detection film, and then the lifted chip is transferred by the transfer device.
6. The chip transfer mounting apparatus according to claim 5, wherein: the ejection device is a single movable ejector pin.
7. The chip transfer mounting apparatus according to claim 1, wherein: the camera device is arranged perpendicular to the detection film.
8. The chip transfer mounting apparatus according to claim 1, wherein: the light source device is a light source device with single wavelength light or a light source device with a plurality of wavelength light combinations.
9. The chip transfer mounting apparatus according to claim 1, wherein: the included angle formed between the light irradiated by the light source device and the detection film is 15-75 degrees.
10. The chip transfer mounting apparatus according to claim 1, wherein: the transfer device comprises a movable swing arm arranged on the body and a suction nozzle arranged on the swing arm and used for sucking the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220768957.0U CN217606776U (en) | 2022-04-02 | 2022-04-02 | Chip transfer mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220768957.0U CN217606776U (en) | 2022-04-02 | 2022-04-02 | Chip transfer mounting equipment |
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| Publication Number | Publication Date |
|---|---|
| CN217606776U true CN217606776U (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220768957.0U Active CN217606776U (en) | 2022-04-02 | 2022-04-02 | Chip transfer mounting equipment |
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| CN (1) | CN217606776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174623A (en) * | 2023-11-01 | 2023-12-05 | 深圳新连芯智能科技有限公司 | Device for needling transfer chip |
-
2022
- 2022-04-02 CN CN202220768957.0U patent/CN217606776U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174623A (en) * | 2023-11-01 | 2023-12-05 | 深圳新连芯智能科技有限公司 | Device for needling transfer chip |
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Effective date of registration: 20221212 Address after: 436070 entrepreneurship service center of Gedian Development Zone, Ezhou City, Hubei Province Patentee after: Hubei Ruihua photoelectric Co.,Ltd. Address before: 518000, 6th floor, building 1, Tianliao community, Gongming office, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Refond Optoelectronics Co.,Ltd. |