CN211090489U

CN211090489U - COB lamp strip processing equipment

Info

Publication number: CN211090489U
Application number: CN201922270602.XU
Authority: CN
Inventors: 郑瑛
Original assignee: Chongqing Huiku Technology Co ltd
Current assignee: DONGGUAN HAOLIN OPTICAL INDUSTRIAL Co.,Ltd.
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-07-24
Anticipated expiration: 2029-12-17

Abstract

The utility model provides a COB lamp strip processing equipment, including resistance feeding mechanism, the chip bears the mechanism, chip ejection mechanism, circuit board fixed establishment, component transfer mechanism and control platform, wherein chip bears the mechanism including bearing the support and setting up the brilliant dish mounting that is used for fixed L ED brilliant dish on bearing the support, control platform can control component transfer mechanism snatch the chip resistance and shift to put to flexible circuit board's resistance paster position from resistance feeding mechanism on, it is ejecting again to control the L ED chip in chip ejection mechanism will L ED brilliant dish, and control component transfer mechanism snatch by the top L ED chip shift put to flexible circuit board on the solid brilliant position of L ED chip, realize resistance paster and L ED chip's subsides dress simultaneously and handle, and therefore, the cost is reduced, promote subsides dress efficiency, can avoid again to shift between different equipment the flexible circuit board and the subsides dress deviation that causes, promote the yields of COB lamp strip L.

Description

COB lamp strip processing equipment

Technical Field

The embodiment of the utility model provides a relate to lamp strip processing field, especially relate to a COB (Chip On Board, Chip-On-Board) lamp strip processing equipment.

Background

In the L ED field, SMT (Surface Mounted Technology) is generally adopted to mount a resistor element and L ED lamp beads on a substrate or a base plate, and when mounting, a resistor mounter is generally adopted to mount the resistor element on the base plate, and then the base plate is transferred to a L ED lamp bead mounter to mount L ED lamp beads, wherein the mounting mode at least has the following defects:

the substrate is required to be transferred between a resistance chip mounter and an L ED lamp bead chip mounter, so that the chip mounting efficiency is reduced, and meanwhile, components mounted on the substrate can be shifted in the transfer process, or the position of the substrate is deviated when the substrate is transferred onto the chip mounter, so that the deviation of the chip mounting is caused, and the yield of the product is reduced;

in addition, when a chip mounter is used for chip mounting in the L ED field at present, the chip mounting is carried out on L ED lamp beads, L0 ED lamp beads are manufactured by generally taking L1 ED chips off a L2 ED crystal disc, transferring the L ED chips to a L3 ED bracket to complete die bonding and welding of L4 ED chips, then packaging to obtain L5 ED lamp beads, and transferring L ED lamp beads to a substrate through a L ED lamp bead chip mounter, wherein the size of the obtained L ED lamp beads is greatly improved compared with that of L ED chips, the high integration and the ultra-thinness of L ED products are not facilitated, the cost of L ED lamp beads is doubled compared with that of L ED chips, and the cost of L ED products is also doubled.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a COB lamp strip processing equipment, the chip mounter of solving present L ED field adoption has efficiency and low, the with high costs problem of yields.

In order to solve the above problems, an embodiment of the present invention provides a COB lamp strip processing device, which includes a resistance feeding mechanism, a chip bearing mechanism, a chip ejecting mechanism, a circuit board fixing mechanism, an element transferring mechanism, and a control platform;

the chip carrying mechanism comprises a carrying bracket and a wafer fixing piece which is arranged on the carrying bracket and used for fixing an L ED wafer, wherein a plurality of L ED chips are distributed on the L ED wafer;

the circuit board fixing mechanism is used for fixing the flexible circuit board on the circuit board mounting position;

the control platform controls the element transfer mechanism to grab the chip resistors from the resistor feeding mechanism and transfer the chip resistors to the resistor chip positions of the flexible circuit board, controls the chip ejection mechanism to eject the L ED chips in the L ED wafer, and controls the element transfer mechanism to grab the ejected L ED chips and transfer the ejected L ED chips to the L ED chip die-bonding positions of the flexible circuit board.

The embodiment of the utility model provides a beneficial effect is:

the embodiment of the utility model provides a COB lamp strip processing equipment, control platform can component transfer mechanism snatch the chip resistor and shift to put to Flexible Circuit board (Flexible Printed Circuit, FPC) on the resistance paster position from resistance feeding mechanism, can control chip ejection mechanism to ejecting L ED chip in L ED crystal dish again, and control component transfer mechanism snatchs L ED chip that is ejected shifts to put to Flexible Circuit board's L ED chip solid crystal position, also can realize the paster processing of resistance paster and L ED chip through this COB lamp strip processing equipment that this embodiment provided, and need not shift Flexible Circuit board between different equipment, therefore can simplify the subsides dress technology, promote subsides dress efficiency, can avoid because of the paster deviation that causes the Flexible Circuit board shifts again, promote the yields of 2ED product, in addition, COB lamp strip processing equipment that this embodiment provides can realize the paster to L ED chip, relatively current can only realize the paster to the paster L, can reduce the lamp pearl 8295 times, can further save the cost of the paster size of the lamp pearl, it is favorable to the integrated package of the ED product L, it can promote more to promote the integrated dimension of ED product 3876, it is more favorable to the integrated dimension of the ED product size of the feasible L.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic structural view of a COB lamp strip processing device provided in an embodiment of the present invention;

fig. 2-1 is a first schematic diagram of distribution of feeding positions according to a first embodiment of the present invention;

fig. 2-2 is a schematic diagram of distribution of feeding positions provided by the first embodiment of the present invention;

fig. 2-3 are schematic diagrams of distribution of feeding positions provided by the first embodiment of the present invention;

fig. 2-4 are schematic diagrams of distribution of feeding positions provided by the first embodiment of the present invention;

fig. 2 to 5 are schematic diagrams of distribution of feeding positions provided by a first embodiment of the present invention;

fig. 2 to 6 are schematic diagrams of distribution of feeding positions provided in the first embodiment of the present invention;

fig. 2 to 7 are schematic diagrams seven illustrating distribution of feeding positions according to a first embodiment of the present invention;

fig. 3-1 is a schematic view of an L ED wafer structure provided in the second embodiment of the present invention;

fig. 3-2 is a schematic diagram of a L ED wafer structure provided in the second embodiment of the present invention;

fig. 3-3 are schematic views of a L ED wafer structure provided in the second embodiment of the present invention;

fig. 4-1 is a schematic view of a flexible printed circuit board according to an embodiment of the present invention;

fig. 4-2 is a schematic diagram of a flexible circuit board ii provided in the second embodiment of the present invention;

fig. 4-3 are schematic diagrams of a flexible circuit board iii according to an embodiment of the present invention;

fig. 5-1 is a schematic view of a part of a structure of a COB light bar processing apparatus provided in an embodiment of the present invention;

fig. 5-2 is a schematic structural view of a fixing member for a polycrystalline disc according to a second embodiment of the present invention;

FIG. 5-3 is a cross-sectional view of portion A of FIG. 5-1;

fig. 5-4 are schematic views of a single thimble according to a second embodiment of the present invention;

fig. 5-5 are schematic views of an inverted T-shaped thimble according to a second embodiment of the present invention;

fig. 5-6 are schematic diagrams of multiple thimbles provided in the second embodiment of the present invention;

fig. 5-7 are schematic views of a general mounting head provided in a second embodiment of the present invention;

fig. 5 to 8 are schematic diagrams of a resistor mounting head according to a second embodiment of the present invention;

fig. 6 is a schematic view of a resistance feeding mechanism provided in the second embodiment of the present invention;

fig. 7-1 is a first schematic view of an image capturing assembly according to a third embodiment of the present invention;

fig. 7-2 is a schematic view of an image capturing assembly according to a third embodiment of the present invention;

fig. 7-3 are schematic views showing a third image capturing assembly according to a third embodiment of the present invention;

fig. 7-4 are the image capturing assembly setup schematic diagram four provided by the third embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments, not all embodiments, in the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The present invention will now be further explained by way of the detailed description in conjunction with the drawings.

The first embodiment is as follows:

in addition, the COB lamp strip processing equipment provided by the embodiment can directly adopt L ED chips for chip mounting, the size of L ED chips can be doubled and smaller compared with the size of L ED lamp beads, which is more beneficial to reducing the size of L ED products and improving the integration level of the product, and in addition, the COB lamp strip processing equipment provided by the embodiment can be particularly applied to L ED lamp strip products, L ED backlight products and L ED light source products, and it should be understood that the COB lamp strip processing equipment shown by the embodiment is not limited to the COB lamp strip L processing equipment, but also can be applied to other COB lamp strip products and other COB lamp bead surface light source products according to other corresponding requirements of the COB lamp strip processing equipment, so that the COB lamp strip processing equipment is applicable to other COB lamp strip surface light source products and other COB light source products, and the COB lamp strip surface light source products can be replaced by other COB lamp strip surface light source products according to other corresponding requirements of the COB lamp strip surface light source products or other COB light source products.

For the convenience of understanding, the present embodiment is described below with reference to the COB light bar processing apparatus shown in fig. 1 as an example. Please refer to fig. 1, the COB lamp strip processing apparatus includes a chip carrying mechanism, a chip ejection mechanism, a resistor feeding mechanism, a circuit board fixing mechanism, an element transferring mechanism, and a control platform. The mechanisms and the control platform in the embodiment can be integrated on the same rack, and can also be distributed on different racks according to requirements. For example, in some application scenarios, the resistance feeding mechanism, the chip carrying mechanism, the chip ejection mechanism, the circuit board fixing mechanism, and the component transferring mechanism may be disposed on a rack, and the control platform may be disposed outside the rack. For another example, in some application scenarios, the resistance feeding mechanism, the chip carrying mechanism, the chip ejection mechanism, the circuit board fixing mechanism, the component transferring mechanism, and the control platform may be integrally disposed on a rack.

In this embodiment, the chip carrying mechanism is mainly used for carrying L ED chips, and includes a carrying bracket and a wafer fixing member disposed on the carrying bracket for fixing a L ED wafer, wherein a plurality of L ED chips are disposed on a L ED wafer in this embodiment.

In this embodiment, the chip ejection mechanism is mainly used for ejecting out the L ED chip on the L ED wafer under the control of the control platform, so as to be grabbed by the component transfer mechanism.

In this embodiment, the resistance feeding mechanism may implement feeding of the chip resistor, and it should be understood that the resistance feeding mechanism in this embodiment may be a feeding mechanism that is controlled by the control platform to implement automatic feeding, a feeding mechanism that is manually controlled by an operator, or a feeding mechanism that is combined with manual operation of an operator to implement semi-automatic feeding based on the control platform. In this embodiment, the number of the chip resistor trays supported by the resistor feeding mechanism may be set according to the application scene requirements, for example, the number of the chip resistor trays supported by the resistor feeding mechanism may be set to any number of 1 to 60 according to the requirements. In addition, the number of feeders adopted by the resistance feeding mechanism in the embodiment can also be correspondingly set according to requirements, and the feeders can be realized on the basis of electric operation or starting. The specific structure of the resistor feeding mechanism in this embodiment can be adopted, but is not limited to, various existing structures capable of realizing chip resistor feeding.

In this embodiment, the circuit board fixing mechanism is mainly used for bearing and fixing a flexible circuit board on which components are to be placed (of course, in some examples, the flexible circuit board may be replaced with other substrates for bearing components and providing circuit connection for the components as well). in this embodiment, a resistor pad position for placing a resistor element (the resistor element may be, but is not limited to, a chip resistor) and a L ED chip die bonding position for placing a L ED chip are provided on the flexible circuit board, in some examples of this embodiment, a resistor pad corresponding to a positive pad or a negative pin of the resistor element is provided on the resistor pad position, and a chip pad corresponding to a positive pad or a negative pin of a L ED chip is provided on the L ED chip die bonding position.

For example, in some examples, the chip ejection mechanism may be fixedly arranged and may not move during operation, the wafer fixing member may be arranged to move, and the chip ejection mechanism may be arranged to move to a corresponding position below the wafer fixing member by controlling the wafer fixing member to move to the chip ejection mechanism and to enable the chip ejection mechanism to be located at a corresponding position below the wafer fixing member when needed.

In some examples of this embodiment, the component transfer mechanism may be configured as a movable mechanism, and the component transfer mechanism may be configured to move to a corresponding position above the die pad mount and the resistor feed mechanism to effect grasping of the corresponding component, if desired, while in some examples of this embodiment, the component transfer mechanism may be configured to be stationary and the die pad mount and the resistor feed mechanism may be configured to be movable, and the die pad mount and the resistor feed mechanism may be configured to move to a corresponding position below the component transfer mechanism, if desired, such that the component transfer mechanism performs accurate grasping of the corresponding component, and in this example, the flexible circuit board secured to the circuit board mount may be configured to move correspondingly to a position below the component transfer mechanism, such that the component transfer mechanism places the grasped chip on the corresponding resistor pad of the flexible circuit board, and the component transfer mechanism may be configured to move correspondingly to the led chip pick up the led chip, and the component transfer mechanism may be configured to move correspondingly to the component pick up the led chip and the led chip on the flexible circuit board, if desired, and the component transfer mechanism may be configured to move to control the component pick up the electrical components.

In the embodiment, the control platform can control the element transfer mechanism to grasp the chip resistors from the resistor feeding mechanism and transfer the chip resistors to the resistor chip positions of the flexible circuit board, and control the chip ejection mechanism to eject the L ED chips in the L ED wafer, and control the element transfer mechanism to grasp the ejected L ED chips and transfer the same to the L ED chip die fixing positions of the flexible circuit board.

Firstly completing the paster of L ED chips and then completing the paster of resistors, and the method comprises the steps that a control platform can control a chip ejection mechanism to eject a L ED chip in a L ED wafer, control an element transfer mechanism to grab the lifted L ED chip and transfer the grabbed chip to a L ED chip die bonding position of a flexible circuit board, control the element transfer mechanism to grab a paster resistor from a resistor feeding mechanism and transfer the paster resistor to a resistor paster position of the flexible circuit board after L ED chips are placed at all L ED chip die bonding positions on the flexible circuit board, and output the flexible circuit board to be subjected to subsequent welding and other process treatments after the paster resistors are placed at all resistor paster positions on the flexible circuit board.

The second mode is that the resistor chip mounting is finished firstly, then the L ED chip mounting is finished, and the control platform can control the element transfer mechanism to grab the chip resistors from the resistor feeding mechanism and transfer the chip resistors to the resistor chip mounting positions of the flexible circuit board, control the chip ejection mechanism to eject the L ED chips in the L ED crystal tray after all the resistor chip mounting positions on the flexible circuit board are provided with the chip resistors, control the element transfer mechanism to grab the ejected L ED chips and transfer the grabbed chips to the L ED chip crystal fixing positions of the flexible circuit board, and output the flexible circuit board to be subjected to subsequent welding and other process treatments after all the L ED chip crystal fixing positions on the flexible circuit board are provided with the L ED chips.

L the paster of the ED chip and the paster of the resistance are executed alternately, for example, based on the above-mentioned mode one and mode two, control L ED chip and paster resistance to be placed on the flexible circuit board alternately, for example, based on the mode one, the control platform can execute control alternately that after the control component transfer mechanism grabs the N pieces of L ED chip that are pushed out and transfers to the N pieces of L ED chip fixed crystal positions of the flexible circuit board, the control component transfer mechanism grabs M pieces of paster resistance from the resistance feeding mechanism and transfers to the M pieces of resistance paster positions of the flexible circuit board, for example, based on the above-mentioned mode two, the control platform can execute control alternately that after the control component transfer mechanism grabs M pieces of paster resistance from the resistance feeding mechanism and transfers to the M pieces of resistance paster positions of the flexible circuit board, the control component transfer mechanism grabs the N pieces of L chip that are pushed out and transfers to the N pieces of L ED chip fixed crystal positions of the flexible circuit board, wherein the values of N and M can be set flexibly according to the demands, for example, N can be 3, 5, 10, 15, 20, M2, etc.

And in the fourth mode, the L ED chip is pasted and the resistor is pasted, and under the condition that the pasting operation space allows, a parallel control element transfer mechanism can grab the pasted resistor and is ejected L ED chips to be respectively transferred to a resistor pasting position and a L ED chip die bonding position of the flexible circuit board.

In addition, in an example of the present embodiment, in the process of implementing the chip resistor on the flexible circuit board and the L ED chip, the mounting process can be completed in one station, that is, only one circuit board mounting position can be set on the circuit board fixing mechanism, after the flexible circuit board is fixed on the circuit board mounting position, after the mounting process of the chip resistor and the L ED chip is completed through the above processes, the flexible circuit board is moved out from the circuit board mounting position for subsequent process processing, and it should be understood that, in the present example, the relative positions of the resistor feeding mechanism, the chip ejecting mechanism and the chip carrying mechanism and the circuit board mounting position can be flexibly set, as long as the mounting process of the chip resistor and the L ED chip can be completed according to the above example, for example, some application scenarios of the present example can be set as follows:

in an application scenario one, please refer to fig. 2-1, where b is a circuit board mounting location, a flexible circuit board may be fixed in the circuit board mounting location b, a spatial region where the resistance feeding mechanism is located is shown as a in fig. 2-1, and this embodiment is hereinafter referred to as a resistance feeding location a; the space region where the chip ejection mechanism and the chip carrying mechanism are located is shown as c in fig. 2-1, which is hereinafter referred to as a chip feeding position c in this embodiment. In the application scenario, the chip feeding position c and the resistor feeding position a are spatially located at two sides of the circuit board mounting position b respectively, and optionally, the chip feeding position c and the resistor feeding position a can be spatially symmetrically arranged.

In the second application scenario, please refer to fig. 2-2, which is different from the first application scenario in that the chip feeding position c and the resistor feeding position a are spatially located on the same side of the board mounting position b.

In the third application scenario, please refer to fig. 2-3, compared with the first application scenario, the chip feeding position c and the resistor feeding position a are also spatially located on two sides of the circuit board mounting position b, respectively, and the difference is that the whole is diagonally arranged.

In the fourth application scenario, please refer to fig. 2-4, compared with the first application scenario, the chip feeding level c and the resistor feeding level a are also spatially located at two adjacent sides of the board mounting level b, respectively.

In another example of the present embodiment, the board fixing mechanism may include a flexible board fixing station for fixing the flexible board, and a fixing station driving mechanism for driving the flexible board fixing station to move, and the board mounting station includes a first board mounting station and a second board mounting station that are set, when the control platform controls the flexible board fixing station to move through the fixing station driving mechanism to fix the flexible board at the first board mounting station, the component transferring mechanism may be controlled to pick the chip resistor from the resistor feeding mechanism and transfer the chip resistor to the resistor chip mounting station, and when the control platform controls the flexible board fixing station to move through the fixing station driving mechanism to fix the flexible board at the second board mounting station, the component transferring mechanism may be controlled to pick the ejected L ED chip and transfer the chip resistor chip to the L ED chip mounting station, in the first and second control modes, after one of the board mounting stations completes the mounting of the corresponding component, the other board mounting station may be transferred to the other board mounting station to complete the mounting of the other component mounting station, in the third control mode, the flexible board mounting station may be set as an idle mounting mode in which the fourth mode, where the mounting station may be set as an idle mounting mode, where the mounting mode is applicable to mount the circuit board mounting station, where the circuit board mounting station is set as an idle mounting station:

in an application scenario five, please refer to fig. 2-5, where d is a first pcb mounting location and e is a second pcb mounting location. The space area where the resistance feeding mechanism is located is shown as a in 2-5 in the figure, and is subsequently called as resistance feeding position a in the embodiment; the space region where the chip ejection mechanism and the chip carrying mechanism are located is shown as c in fig. 2-5, which is hereinafter referred to as the chip feeding position c in this embodiment. In the application scenario, the chip feeding position c and the resistor feeding position a are spatially located on the same side and are respectively located in the areas corresponding to the first circuit board mounting position d and the second circuit board mounting position e.

In the application scenario six, compared with the application scenario five, the difference is that the chip feeding position c and the resistor feeding position a are spatially located at two opposite sides and are respectively located in the areas corresponding to the first circuit board mounting position d and the second circuit board mounting position e.

In the application scenario seven, compared with the application scenario five, the difference is that the chip feeding position c and the resistor feeding position a are spatially located at two adjacent sides and are respectively located in the areas corresponding to the first circuit board mounting position d and the second circuit board mounting position e.

The COB light bar processing equipment provided by the embodiment can realize the mounting of a resistor element and can directly mount an L ED chip, so that the mounting efficiency and the yield can be improved, the cost of L ED products can be reduced, the mounting process can be simplified, the integration level of L ED products is improved, the size of L ED products is reduced, the COB light bar processing equipment can be better applied to the requirement of application scenes of small-size L ED products, and the competitiveness of the products is improved.

Example two:

for the convenience of understanding, the following description of the present embodiment provides an example for the implementation of some mechanisms of the COB light bar processing equipment and the structure of the wafer tray.

In an example of this embodiment, the L ED wafer may include a wafer ring, a thin film fixed on the wafer ring, and L ED chips located on the thin film, where the thin film in this embodiment may be a white film, a blue film, a green film, or the like, and the L ED wafer in this embodiment may be implemented by, but not limited to, a wafer spreading process.

Please refer to the L ED wafer shown in fig. 3-1, which includes a wafer ring 31, a thin film (here, a blue film 32 is taken as an example for illustration) fixed on the wafer ring 31, and L ED chips 33 distributed on the blue film 32, wherein in some application scenarios, one side of the positive and negative pads on the L ED chip 33 can be attached to the blue film 32, in other application scenarios, one side of the positive and negative pads on the L ED chip 33 can also not be attached to the blue film 32, for example, it can be disposed upward, in the L ED wafer shown in fig. 3-1, the L ED chip 33 can be, but not limited to, a flip chip, whose overall outer profile is square, and the spacing between L ED chips 33 on the blue film 32 can be flexibly set in the wafer expanding process according to the requirement.

Please refer to the L ED wafer shown in fig. 3-2, which also includes a wafer ring 31, wherein the wafer ring 31 is also circular, and a thin film (here, the blue film 32 is still used as an example for illustration) fixed on the wafer ring 31, and L ED chips 33 distributed on the blue film 32, one side of the positive and negative electrode pads of the L ED chip 33 can be attached to the blue film 32, or not attached to the blue film 32, and can be flexibly set according to the requirement, in the L ED wafer shown in fig. 3-2, the L ED chip 33 can be, but not limited to, a flip chip, and the overall outer profile of the wafer is rectangular.

Referring to the L ED wafer shown in fig. 3-3, it also includes a wafer ring 31, the wafer ring 31 is rectangular, and a thin film (here, the blue film 32 is still exemplified for illustration) fixed on the wafer ring 31, and L ED chips 33 distributed on the blue film 32, one side of the L ED chips 33 having positive and negative pads can be attached to the blue film 32, and in the L ED wafer shown in fig. 3-3, the L ED chips 33 can also be flip chips.

In this embodiment, the number of die holders included in the chip carrier mechanism of the COB light bar manufacturing apparatus may also be flexibly set according to requirements, for example, in some examples, one die holder may be disposed on the carrier bracket of the chip carrier mechanism, and in other examples, in order to further improve the chip mounting efficiency, two or more die holders may be disposed on the carrier bracket of the chip carrier mechanism, so that the mounting of two or more L ED dies may be simultaneously achieved, for example, in some application scenarios, a plurality of L ED dies that are simultaneously mounted may be the same led die 42 0, so that in the mounting process, after one L ED die is used up, the next L ED die may be continuously recycled, and the previously used 4ED die may be replaced, so that the interruption of L ED dies due to the replacement of L4 ED dies is avoided, the mounting efficiency is improved, and the mounting efficiency is improved, for mounting a plurality of 466 ED dies L in different color temperature ranges from a first led die holder 357 to a different color temperature range of a first led die pad, a second led die holder, a different led die pad, or a different led pad may be used for mounting a different color temperature range of a different led dies, or a different led die pad, and a different led pad may be used for mounting a different color temperature range of a different led pad, or different led pad, and different led pad may be used for mounting a different led dies, or different color temperature range of a different led pad, and different led pad may be used for mounting a different led pad, and different led pad size, and further range of a different led pad may be used for mounting a different led pad size, and further range of a different led pad size, and different led pad may be used for mounting a different led pad size, and different led pad may be used for mounting a different led pad for mounting a different led chip mounting of a different led chip mounting a different color temperature range of a different led chip mounting chip.

Optionally, in some examples of this embodiment, the COB light bar processing apparatus may further include, but is not limited to, an automatic tray recycling mechanism for automatically recycling used trays, and a tray feeding mechanism for automatically fixing L ED trays on empty tray fixing members, that is, automatically feeding L ED trays.

In this embodiment, a chip ejecting mechanism ejects L ED chips on an ED wafer, wherein one end of L ED chips is provided with a thimble group, a control platform can control the thimbles in the thimble group to eject 53962 ED chips on L ED wafer, in some examples of this embodiment, the number of thimbles included in the thimble group can be one, L ED chips can be ejected by one thimble, the specific position of the thimble group can be the central position of L ED chips, so as to avoid inclination and even turning of L ED chips during ejection, however, in actual use, it is found that when a single thimble is used to eject L ED chips, L ED chips are easily damaged, and practically, L ED chips are easily inclined during ejection, so that the accuracy of L ED chips cannot be guaranteed, for this, in other examples, the thimble group may include at least two thimbles, at least two thimble groups are used to eject L ED chips, so as to avoid damage to the position of two or three thimble groups of the ED chips, such as to lift a triangle, so as to avoid damage to three thimble groups of the ED chips, such as to three thimble groups, and to lift up two thimble groups of the thimble groups, such as to avoid damage to three thimble groups, the size of the two thimble groups may be set up the thimble group, such as to avoid lifting of the thimble group may be set up the thimble group, so as to increase the thimble group of the thimble group may be set up two thimble group, and to prevent lifting of the thimble group may include three thimble group of the thimble group, such as to prevent lifting of.

In this embodiment, the flexible circuit board may be a flexible circuit board used for manufacturing a COB light bar circuit board, and may also be a flexible circuit board of a COB area light source or a COB backlight source; and according to the specific application scenario. For ease of understanding, the present embodiment is described below with reference to a flexible circuit board used for manufacturing a COB light bar as an example.

In an example, referring to fig. 4-1, the flexible circuit board 41 may be a strip, and the circuit board fixing mechanism may stably fix the flexible circuit board 41 on the circuit board mounting position in a vacuum suction manner, so as to prevent the flexible circuit board 41 from being in a plane and causing a deviation of a mounting position, thereby further improving a yield of a product, in this embodiment, the flexible circuit board 41 specifically includes a plurality of rows of circuits 411 for forming a L ED light bar, a structure for facilitating tearing or cutting may be disposed between adjacent circuits 411, after the flexible circuit board 41 completes mounting and packaging, the adjacent circuits 411 may be torn or cut and then spliced one by one to form the light bar, in fig. 4-1, a plurality of L chip ED die fixing positions 412 and a plurality of resistor mounting positions 413 disposed at intervals are disposed on each circuit, in fig. 4-1, a row of resistor mounting positions 412 and a resistor mounting position 413 are disposed in the same row, and it should be understood that an electrical connection between a resistor mounting position 413 and a chip L die fixing position 412 and a resistor mounting position 413 in fig. 4-1 may be disposed in parallel connection with another row of a resistor mounting circuit board 412, and a resistor mounting mechanism may be disposed in addition to a row of resistors 673-3, and a resistor mounting mechanism for forming a row of a flexible circuit board according to the embodiment, which is specifically, and a resistor mounting mechanism is shown in a resistor mounting scene, and a resistor mounting mechanism is not limited to the embodiment, but may be disposed in the embodiment, and a series connection diagram 3, and a series connection of the flexible circuit board 41, and a resistor mounting diagram, and a series connection of the flexible circuit board 41, and a resistor mounting diagram, and the embodiment, and the flexible circuit board 41.

In some examples of the embodiment, the component transfer mechanism includes a resistor mounting head movable between the resistor feeding mechanism and the circuit board mounting station, the resistor mounting head is provided with a first suction nozzle, the control platform can control the resistor mounting head to suck the chip resistors from the resistor feeding mechanism through the first suction nozzle and transfer the chip resistors onto the resistor mounting station, the component transfer mechanism further includes a die head movable between the wafer mounting device and the circuit board mounting station, the die head is provided with a second suction nozzle, and the control platform controls the die head to suck the ejected L ED chips through the second suction nozzle and transfer the chip chips onto the L ED chip die mounting station.

In other examples of the embodiment, the component transfer mechanism comprises a universal mounting head which can move among the resistor feeding mechanism, the wafer fixing member and the circuit board mounting position, the universal mounting head is provided with a third suction nozzle, and the control platform controls the universal mounting head to suck the chip resistor or the pushed L ED chip through the third suction nozzle and transfer the chip resistor or the pushed L ED chip onto the flexible circuit board, namely the chip resistor and the L ED chip can share the same mounting head and the same suction nozzle to realize the extraction and mounting of the chip resistor and the L ED chip.

In other examples of this embodiment, the component transfer mechanism includes a universal placement head movable between the resistor feed mechanism, the wafer mount, and the board placement station, and the universal placement head is provided with a fourth nozzle and a fifth nozzle, and the control platform controls the universal placement head to suck the lifted L ED chip through the fourth nozzle and transfer the sucked chip to the L ED chip bonding station, and controls the universal placement head to suck the chip resistor through the fifth nozzle and transfer the sucked chip resistor to the resistor placement station.

In addition, it should be understood that the material of the suction nozzle in this embodiment can be flexibly selected according to the requirement, for example, but not limited to, a rubber suction nozzle, a high temperature suction nozzle, a tungsten carbide suction nozzle, etc.; according to the contact mode of the suction nozzle and the component, but not limited to, a surface contact type suction nozzle, a 2-edge contact type suction nozzle and a 4-edge contact type suction nozzle can be adopted.

For convenience of understanding, in the present embodiment, the COB light bar processing apparatus provided in the present embodiment is described below with reference to the example structures shown in fig. 5-1 to fig. 6.

Referring to fig. 5-1, the chip carrier 51 of the COB lamp strip manufacturing apparatus includes a carrier 512, and a wafer holder 511 disposed on the carrier for holding L ED wafers, and as discussed above, the wafer holder 511 in this embodiment may include one or more wafer holders, for example, referring to fig. 5-2, three wafer holders 511 may be disposed according to requirements, and the three wafer holders 511 may be respectively used for holding L ED wafers of different sizes, and may also be used for separately holding L ED wafers of different light colors, such as red L ED wafers, blue L ED wafers, and green L ED wafers, and at least one of the wafer holders 511 may be adjusted in rotation angle by a motor 5111 and a belt 5112.

Referring to fig. 5-1, a chip ejection mechanism 52 of a COB lamp strip processing apparatus is located below a wafer fixing piece 511, and is capable of ejecting an L ED chip on a L ED wafer fixed on the wafer fixing piece 511, in one example, a cross-sectional view shown by a mark a in fig. 5-1 is shown in fig. 5-3, an ejection end of the chip ejection mechanism 52 is provided with an ejector pin 521, and in some application scenarios, as shown in fig. 5-4, an ejector pin 521 is provided, through which the ejector pin 521 is ejected to a middle position of a L0 ED chip 56, so that a L ED chip is ejected from a film, and in addition, in order to prevent the ejector pin 521 from damaging an ED 45 chip during ejection, a contact between one end of the ED chip 521 and a film may be set from a "point" contact "or a" line contact ", for example, as shown in fig. 5-5, one end of the ejector pin 521 used for ejecting a L ED chip may be of an" inverted T "type", so as to form a "line contact" with a film ", so as to prevent L from being damaged by a stable contact between two ejector pins", and a chip lifting mechanism is also set for enabling the two ejector pins 52 to be easily and for two ejector pins to be set up a chip lifting the two ejector pins 52, and for example, and for the two ejector pins are set up a chip lifting the ejector pin lifting the two ejector pin 521, and for the two ejector pin mechanisms are set for the two.

The thimble tip of the thimble 521 shown in fig. 5-4 and 5-6 may be sharp, or may be round or hollow.

Please refer to fig. 5-1, in the structure shown in the figure, the component transfer mechanism includes a general mounting head 53 capable of moving among the resistor feeding mechanism, the wafer holder and the circuit board mounting position, the general mounting head 53 is provided with 4 suction nozzles 531, in an application scenario, the 4 suction nozzles may all be third suction nozzles, the control platform controls the general mounting head to suck the chip resistors or the ejected L ED chips through at least one of the 4 third suction nozzles and transfer the chip resistors onto the flexible circuit board, for example, the control platform may activate only one of the 4 third suction nozzles to suck the chip resistors or the ejected L ED chips and transfer the chip resistors onto the flexible circuit board, or activate the 4 third suction nozzles simultaneously, and control the 4 third suction nozzles to respectively suck the chip resistors sequentially or the ejected L (may suck 4 chip resistors or L ED chip resistors, or suck a portion of the chip resistors, another portion of chip resistors, L, another suction nozzle may suck another group of the chip resistors, transfer the chip resistors onto the fourth suction nozzle, and transfer the chip resistor, and the fourth nozzle to the fourth nozzle, and transfer the fourth nozzle to the fourth nozzle, and the fourth nozzle to finish the chip mounting head using the fourth nozzle as a flexible mounting process (after the chip mounting efficiency control platform), and the fourth nozzle) to mount the fourth nozzle, which is not to mount the chip resistor mounting efficiency, and the fourth nozzle to finish mounting efficiency after the fourth nozzle is not finished chip mounting efficiency, which is not finished chip mounting efficiency is not finished chip mounting by using the fourth nozzle, and the fourth nozzle 3 and the fourth nozzle, and the fourth nozzle, the fourth nozzle 3 and the fourth nozzle, where the fourth nozzle is not by using the fourth nozzle, and the fourth nozzle, the fourth nozzle to finish mounting efficiency, the fourth nozzle after the fourth nozzle, the fourth nozzle is finished chip mounting efficiency, the fourth nozzle is finished chip mounting process, the fourth nozzle is not finished by using the fourth nozzle 3, the fourth nozzle, the.

In other examples of this embodiment, please refer to fig. 5-7 and fig. 5-8, respectively, the component transfer mechanism further includes a die attach head 54 movable between the die pad fixing member and the circuit board mounting position, the die attach head is provided with a second suction nozzle 541, the control platform controls the die attach head 54 to suck the pushed L ED chip through the second suction nozzle 541 and transfer the sucked L ED chip to the L ED chip mounting position, the component transfer mechanism further includes a resistor attach head 55 movable between the resistor feeding mechanism and the circuit board mounting position, the resistor attach head 55 is provided with a first suction nozzle 551, the control platform controls the resistor attach head 55 to suck the chip resistor from the resistor feeding mechanism through the first suction nozzle 551 and transfer the chip resistor to the resistor attach position, the resistor attach head 55 shown in fig. 5-8 includes a plurality of first suction nozzles 551 to achieve one-time fetching of a plurality of resistor patches and mounting, thereby improving the chip mounting efficiency.

Referring to fig. 6, the resistor feeding mechanism 61 of the present embodiment includes a motor 610, the motor 610 is connected to a transmission belt 616, a transmission block base 611 is disposed below the transmission belt 616, a feeding rail base 612 is disposed above the transmission belt 616, a feeding rail 614 is disposed above the feeding rail base 612, a trough is disposed above the feeding rail 614, and a chip resistor is disposed in the trough. The feeding rail base 612 is provided with a feeding converging block 613, and the feeding converging block 613 is provided with a feeding rail. A material blocking structure 615 is arranged on one side of the feeding rail 614; when the chip resistor material feeding device is used, the trough is a clamping position arranged on the feeding rail, and when the suction nozzle above the trough places the chip resistor material into the trough, the motor 610 drives the transmission belt 616 and the feeding rail 614 to reciprocate so as to bring the chip resistor material to a station of the next procedure. The cam is arranged below the transmission belt 616, the cam jacks up the trough and simultaneously receives away the chip resistor material in the rotation process, and the trough can be close to the suction nozzle and the chip resistor material can be scraped away to the next procedure through the clamping structure of the trough while the rotation belt moves in the mode, so that feeding is smoothly completed.

It should be understood that the specific structure of each part mechanism of the COB light bar processing equipment provided in the present embodiment is only an illustrative example for easy understanding. COB lamp strip processing equipment in this embodiment is not limited to the structure that adopts the above example, as long as COB lamp strip processing equipment's framework is the framework that this description fig. 1 shows, all is in the utility model discloses a protection scope and so on.

Example three:

in some examples of the embodiment, the accuracy of the mechanical structure can be ensured by accurately controlling the mechanisms of the COB light bar processing equipment in machining and assembling, and by setting the material taking position on the resistance feeding mechanism, the position of the L ED wafer on the wafer fixing piece and calculating the position of each L ED chip based on the array distribution condition of each L ED chip, and determining the corresponding positions of the resistance chip and the L ED chip die bonding position based on the distribution rules of the resistance chip position and the L ED chip die bonding position on the circuit board, the corresponding resistance chip and chip die bonding program are set, the chip resistor is accurately taken from the resistance material taking position and transferred to the corresponding resistance chip position, and the L ED chip is accurately taken from the L ED chip wafer and transferred to the corresponding L ED chip die bonding position, in this example, an image acquisition component for position determination is not needed, and an image acquisition component for detecting whether the chip L ED chip and/or the resistor die mounted component is in place can be set according to requirements.

In order to further improve the mounting accuracy of L ED chips and chip resistors, in some examples of the present embodiment, an image capturing assembly may be further disposed on the COB light bar processing equipment.

In the first setting mode, L ED wafer images on the wafer fixing piece and flexible circuit board images on the circuit board mounting position can be acquired through one image acquisition assembly, the integration level is high, and the cost is low.

In this manner, the L ED wafer image captured by the first image capture assembly can be communicated to the control platform for use in, but not limited to, at least one of:

used for determining the position of L ED crystal plate;

used for determining the central position of each L ED chip on L ED crystal plate;

for determining whether L ED wafer is in place, whether L ED wafer is correct in its spatially fixed form (e.g., whether tilted, whether the angle is correct, etc.);

used for determining L ED crystal plate whether there is breakage;

for determining L ED wafer whether L ED chips were missing or broken;

in this manner, the flexible circuit board image captured by the first image capturing assembly may be communicated to the control platform for use in, but not limited to, at least one of:

for determining the position of the flexible circuit board;

the device is used for determining whether the position of the flexible circuit board is placed in place or not, and whether the fixed form of the flexible circuit board in space (such as whether the flexible circuit board is inclined or not, whether the angle is accurate or not) is correct or not;

the chip fixing device is used for determining the position of a resistor chip position and/or an L ED chip die bonding position on the flexible circuit board;

the chip resistor detecting device is used for detecting whether a chip resistor mounted on a mounting position of a circuit board is in place and/or whether a L ED chip on a die bonding position of an L ED chip is in place;

when COB lamp strip processing equipment still integrateed there is the point subassembly, still can be used to detect the point on resistance paster position and/or the L ED chip die bonding position and glue and whether target in place.

In addition, it should be understood that, in this embodiment, the first image capturing assembly may capture L ED wafer images and flexible circuit board images simultaneously (that is, L ED wafer images and flexible circuit board images are in one photo), or may capture L ED wafer images and flexible circuit board images separately, and according to specific application requirements, the first image capturing assembly may capture L ED wafer images in the wafer mounting stage, or may capture L ED wafer images once in each die bonding, or may capture L ED wafer images dynamically according to a preset time interval or die bonding frequency interval, and the first image capturing assembly may also capture circuit board images in the flexible circuit board mounting stage, or may capture circuit board images once in each die bonding, or may capture circuit board images dynamically according to a preset time interval or die bonding frequency interval.

In the second setting mode, the COB lamp bar processing equipment comprises a second image acquisition assembly for acquiring L ED wafer images on the wafer fixing piece and a third image acquisition assembly for acquiring flexible circuit board images on the circuit board mounting position, namely, in the second setting mode, different image acquisition groups are respectively adopted for acquiring L ED wafer images and flexible circuit board images, in the first setting mode, the second image acquisition assembly and the third image acquisition assembly can adopt the same type of cameras, such as infrared cameras, or different types of cameras, such as infrared cameras adopted by the second image acquisition assembly and common cameras adopted by the third image acquisition assembly, and the specific setting positions of the second image acquisition assembly and the third image acquisition assembly on the rack of the COB lamp bar processing equipment can be flexibly determined as long as required image information can be acquired, for example, one setting example is shown in fig. 7-2, the second image acquisition assembly C2 and the third image acquisition assembly C3 are respectively arranged corresponding to L ED wafer 71 and the flexible circuit board 70, and the image acquisition assemblies C3875 and the flexible circuit board images of the flexible circuit board 70 can be controlled according to the image acquisition strategies 395925 and the ED wafer 70.

In this manner, the functions of the collected L ED wafer image and the flexible circuit board image and the image collection rules can be referred to the first setting manner, which is not described herein again.

Optionally, in order to further improve the processing efficiency and the processing accuracy, image acquisition may be performed on the captured chip resistors and/or L ED chips after the component transfer mechanism captures the chip resistors from the resistor capture position, and/or after the L ED chips are captured from the L ED wafer, and before the captured chip resistors and/or L ED chips are placed on the flexible circuit board, so as to determine at least one of the following:

whether the chip resistor and/or L ED chip is normally grabbed currently;

whether the currently grabbed chip resistor and/or L ED chip is damaged or not;

whether the position of the currently grabbed chip resistor and/or L ED chip on the element transfer mechanism is accurate or not;

whether the currently grasped chip resistor and/or L ED chip is normal in shape (e.g., whether flipping occurred, etc.) on the component transfer mechanism.

For example, in one example, the COB lamp strip processing apparatus may include a fourth image capturing component for capturing a chip resistor image captured by the component transferring mechanism and a captured L ED chip image, that is, in this example, one image capturing component may be used to capture the chip resistor image captured by the component transferring mechanism and a captured L ED chip image, for example, as shown in fig. 7-1 and 7-2, a fourth image capturing component C4 may be disposed at a suitable position, and the C4 may capture the chip resistor image captured by the capturing component transferring mechanism and a captured L ED chip image according to a control strategy, for example, C4 may capture an image in real time each time the capturing component transferring mechanism captures a chip resistor and/or L ED chip.

For example, please refer to fig. 7-3 and fig. 7-4, the fifth image capturing module C5 and the sixth image capturing module C6 may be respectively disposed at proper positions, and the fifth image capturing module C5 and the sixth image capturing module C6 may respectively capture the chip resistance image captured by the capturing element transfer mechanism and the captured L ED chip image according to a control strategy, for example, real-time image capturing may be performed each time the capturing element transfer mechanism captures the chip resistance and the L ED chip.

It should be understood that the several image capturing component arrangements shown in fig. 7-1 to 7-4 in this embodiment are only examples for easy understanding, and the specific image component arrangement can be flexibly set according to the specific application scenario. For example, in fig. 7-1, C1 or C4 may be omitted as needed, in fig. 7-2, at least one of C2, C3, and C4 may be omitted as needed, and in fig. 7-3, at least one of C2, C3, C5, and C6 may be omitted as needed; also, in fig. 7-4, at least one of C1, C5, and C6 may also be omitted as desired.

In addition, it should be understood that, in this embodiment, a specific analysis processing algorithm based on the acquired image may adopt an existing algorithm as required, and is not described herein again.

In this embodiment, the control platform determines that the placement form of the flexible circuit board is abnormal according to the image information, for example: when the mounting surface of the flexible circuit board is not in a horizontal state in space, a flexible circuit board form dislocation alarm can be generated to remind an operator to intervene and adjust manually; in some application scenarios, the flexible circuit board can be automatically adjusted in placement form. Of course both may be performed simultaneously.

It can be seen that the COB lamp strip processing equipment that this embodiment provided can carry out image acquisition to at least one in chip resistor, L ED chip and the flexible circuit board to according to the nimble many-sided monitoring control such as position, form that carries on of image gathered, thereby guarantee the yields of dress.

In addition, it should be understood that, in order to further promote machining efficiency, the subassembly is glued to the still integrated setting point on the COB lamp strip processing equipment that this embodiment provided, of course, also can be with this point subassembly independent of COB lamp strip processing equipment outside alone setting, no longer describe here.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above embodiment numbers of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.

Through the above description of the embodiments, it is clear to those skilled in the art that the control process in the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation. Based on such understanding, the technical solution of the present invention essentially or the portions contributing to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk), and includes a plurality of instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.

While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. The COB light bar processing equipment is characterized by comprising a resistance feeding mechanism, a chip bearing mechanism, a chip ejection mechanism, a circuit board fixing mechanism, an element transferring mechanism and a control platform;

2. The COB light bar processing apparatus of claim 1, wherein the chip carrier mechanism includes two wafer mounting pieces, one of which is used to mount an L ED wafer emitting light of a first color temperature, and the other is used to mount a L ED wafer emitting light of a second color temperature.

3. The COB light bar processing apparatus of claim 1, wherein the chip carrier mechanism includes three wafer mounts for holding a red L ED wafer, a green L ED wafer, and a blue L ED wafer, respectively.

4. The COB light bar processing apparatus of any one of claims 1 to 3, wherein an end of the chip ejection mechanism ejecting the L ED chip is provided with a thimble group, and the thimble group comprises at least two thimbles.

5. The COB light bar processing apparatus according to any one of claims 1 to 3, wherein the component transfer mechanism includes a resistor mounting head movable between the resistor feeding mechanism and the circuit board mounting station, the resistor mounting head is provided with a first suction nozzle, and the control platform controls the resistor mounting head to suck the chip resistors from the resistor feeding mechanism through the first suction nozzle and transfer the chip resistors onto the resistor mounting station;

the component transfer mechanism further comprises a die bonder head which can move between the wafer tray fixing piece and the circuit board mounting position, the die bonder head is provided with a second suction nozzle, and the control platform controls the die bonder head to suck the pushed L ED chip through the second suction nozzle and transfer the die bonder head to the L ED chip die bonder position.

6. The COB light bar processing apparatus of any one of claims 1-3, wherein the component transfer mechanism includes a universal mounting head movable between the resistance feed mechanism, the die holder, and the circuit board mounting station;

the universal mounting head is provided with a third suction nozzle, and the control platform controls the universal mounting head to suck the chip resistor or the pushed L ED chip through the third suction nozzle and transfer the chip resistor or the pushed L ED chip onto the flexible circuit board;

or the like, or, alternatively,

the general mounting head is equipped with fourth suction nozzle and fifth suction nozzle, control platform control general mounting head passes through the fourth suction nozzle absorption the L ED chip of being ejected and transfer put to on the solid brilliant position of L ED chip, and control general mounting head passes through the fifth suction nozzle absorption chip resistor and transfer put to on the resistance paster position.

7. The COB light bar processing apparatus of claim 6, wherein the number of the fourth suction nozzles is greater than the number of the fifth suction nozzles;

and/or the presence of a gas in the gas,

at least one of the suction force generated by the fourth suction nozzle and the area covered by the generated suction force is larger than that of the fifth suction nozzle.

8. The COB light bar processing apparatus of any one of claims 1 to 3, wherein the circuit board fixing mechanism includes a flexible circuit board fixing stage for fixing a flexible circuit board, and a fixing stage driving mechanism for driving the flexible circuit board fixing stage to move, and the circuit board mounting positions include a first circuit board mounting position and a second circuit board mounting position which are set;

control platform passes through fixed station actuating mechanism control the flexible circuit board fixed station removes will flexible circuit board is fixed during first circuit board pastes the dress position, control component transfer mechanism follows snatch the chip resistor and shift to on the resistance feeding mechanism resistance chip position, and pass through fixed station actuating mechanism control the flexible circuit board fixed station removes will flexible circuit board is fixed during second circuit board pastes the dress position, control component transfer mechanism snatchs the L ED chip that is pushed out and shifts to on the solid crystal position of L ED chip.

9. The COB light bar processing apparatus of any one of claims 1-3, further comprising a first image capture assembly for capturing an L ED die image on the die mount, and a flexible circuit board image on the circuit board mount site;

or the like, or, alternatively,

COB lamp strip processing equipment still includes and is used for gathering the second image acquisition subassembly of L ED brilliant dish image on the brilliant dish mounting, and be used for gathering the third image acquisition subassembly of flexible circuit board image is located to the circuit board subsides.

10. The COB light bar processing apparatus of any one of claims 1-3, further comprising a fourth image capture assembly for capturing images of the chip resistors captured by the component transfer mechanism and images of the L ED chips captured;

or the like, or, alternatively,

COB lamp strip processing equipment still includes the fifth image acquisition subassembly that is used for gathering the paster resistance image that the component transfer mechanism snatched, and is used for gathering the sixth image acquisition subassembly of L ED chip image that the component transfer mechanism snatched.