KR100994493B1

KR100994493B1 - Apparatus for detecting a align mark and method for align using the same

Info

Publication number: KR100994493B1
Application number: KR20080038768A
Authority: KR
Inventors: 임용진
Original assignee: 엘아이지에이디피 주식회사
Priority date: 2008-04-25
Filing date: 2008-04-25
Publication date: 2010-11-15
Also published as: KR20090112961A

Abstract

The present invention relates to an alignment mark detection device and an alignment method using the same, in an alignment mark detection device according to an embodiment of the present invention, a substrate having a first alignment mark and solder balls to be attached to the substrate are disposed and a second is arranged. A sensing unit having an alignment mark and positioned between the substrate and the template to be spaced apart from each other, for sensing the first alignment mark and the second alignment mark, respectively; and detecting the first alignment mark and the second alignment mark. Comprising: the drive unit for separating the sensing unit between the substrate and the template; by using a variety of materials, the substrate and the template can be used, even if the material of the substrate and the template, the alignment mark of the substrate and the template, respectively Compared with the result of the reduction, the number of attempts to align the substrate and the template can be reduced.

Description

Apparatus for detecting a align mark and method for align using the same}

The present invention relates to an alignment mark detection device and an alignment method using the same, and more particularly, to an alignment mark alignment mark detection device for detecting an alignment mark of a substrate and an alignment mark of a template on which solder balls are arranged, and an alignment method using the same. It is about.

The so-called Chip Scale Packaging ("CSP") technology, which is packaged as thin and small as the size of a finished product like a semiconductor chip, is attracting attention due to the rapid and light shrinking trend of semiconductors. Among the various CSP technologies developed to date, the most attention is the Ball Grid Array (BGA) package.

The BGA package includes substrates circuit-processed on both sides, attaches a semiconductor chip to the surface of the substrate, and attaches solder balls to the back surface of the substrate. Accordingly, the semiconductor chip and the solder ball have an electrically connected structure, and the solder ball serves as a lead of the BGA package.

As such, the BGA package can be configured with many leads even with small components, and has advantages of miniaturization, light weight, and high functionality of products such as various electronic devices and communication devices.

On the other hand, the solder balls are arranged in a grid shape corresponding to the position of the semiconductor chip to be attached to the back surface of the substrate. As a general method of attaching solder balls to a substrate, there is a method using a template in which lattice grooves are arranged in the same manner as the lattice shape corresponding to the position of the semiconductor chip.

That is, in manufacturing a BGA package, a solder ball is placed in a grid groove of a template, the template is brought close to the back of the substrate, and then the solder ball is attached to the back of the substrate.

In this case, the substrate and the template are provided with alignment marks for alignment of the substrate and the template, respectively. The alignment of the substrate and the template includes arranging the photographing module under the template, photographing whether the alignment mark of the substrate is located in the alignment mark of the template, and aligning the substrate and the template based on the photographing result.

Solder ball attachment method using the above-described conventional template, since the alignment mark of the substrate must be photographed through the template, the template should be used only as a transparent material, there is a limit.

In addition, when using the template as an opaque material, the alignment mark of the template should be formed in the form of a hole through the template. Therefore, if the alignment mark of the substrate is not located within the alignment mark of the template, the alignment mark of the substrate is positioned within the alignment mark of the template, and then precise alignment is performed again, thus increasing the number of alignment attempts. There is a problem.

Accordingly, an object of the present invention is to provide an alignment mark detection apparatus and an alignment method using the same, which are capable of diversifying template materials and reducing the number of alignments used in manufacturing a BGA package.

An alignment mark sensing device for sensing a first alignment mark formed on a substrate and a second alignment mark formed on a template on which a solder ball to be attached to the substrate is disposed, the alignment mark sensing apparatus according to an embodiment of the present invention may include: A sensing unit positioned between the substrate and the template to sense the first alignment mark and the second alignment mark, respectively; And a driving unit which separates the sensing unit between the substrate and the template after sensing the first alignment mark and the second alignment mark.

The sensing unit may include a photographing module for photographing any one of the first alignment mark and the second alignment mark, and then photographing the remaining alignment marks.

The rotating unit for rotating the photographing module may be further provided.

The sensing unit may include a first photographing module photographing the first alignment mark; And a second photographing module photographing the second alignment mark when the first photographing module photographs the first alignment mark.

The first alignment mark and the second alignment mark is formed of a material that reflects light, the detection unit, a first light generator for irradiating light to the first alignment mark; detecting the reflected light reflected from the first alignment mark A first photodetector; a second photogenerator for irradiating light with the second alignment mark; And a second photodetector for detecting second reflected light reflected from the second alignment mark.

The first alignment mark and the second alignment mark are formed through the substrate and the template to allow light to pass therethrough, and the sensing unit includes: a first light generator for irradiating light to the first alignment mark; A first photodetector for detecting a first passing light passing through the mark; A second light generator for irradiating light to the second alignment mark; And a second photodetector for detecting a second passing light passing through the second alignment mark.

On the other hand, in the alignment method for aligning the substrate and the template by detecting the first alignment mark formed on the substrate and the second alignment mark formed on the template on which the solder ball to be attached to the substrate is disposed, an embodiment of the present invention The alignment method may include: a sensing step of sensing the first alignment mark and the second alignment mark, respectively; a comparing step of comparing a sensing result of the first alignment mark and a sensing result of the second alignment mark; And an alignment step of performing alignment of the substrate and the template according to the comparison result.

The alignment mark detection apparatus and the alignment method using the same according to the present invention can use the substrate and the template as a variety of materials, even if the material of the substrate and the template is opaque, by detecting the alignment marks of the substrate and the template, respectively, and compare the results In addition, there is an effect of reducing the number of attempts to align the substrate and the template.

Hereinafter, an alignment mark detection apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present invention, the defined terms are defined in consideration of the function of the present invention, and should not be understood in a limiting sense of the technical elements of the present invention.

First embodiment

1 is an exploded perspective view showing an alignment mark detection apparatus according to a first embodiment of the present invention, Figure 2 is a side view showing an alignment mark detection apparatus according to a first embodiment of the present invention. 1 to 2, the alignment mark sensing apparatus 100a includes a sensing unit 110a and a driving unit 130.

Here, in order to align the substrate S with the template T, the first alignment mark Sa and the second alignment mark Ta are formed on the substrate S and the template T, respectively.

The first and second alignment marks Sa and Ta may be printed and formed on the substrate S and the template T. In another embodiment, the first alignment marks Sa and Ta may be formed of a substrate S for forming a circuit. ) May be etched together with the circuit pattern during the etching process, and the second alignment mark Ta is etched together with the grid groove Tb during the etching process of the template T for forming the grid groove Tb. Can be.

At this time, when the substrate (S) and the template (T) is provided as an opaque material, the first and second alignment marks (Sa, Ta), the color of the substrate (S) and the template (T) to ensure visibility It is preferable to be formed to have a contrast ratio difference. For example, if the colors of the substrate S and the template T are black, the colors of the first and second alignment marks Sa and Ta are white.

The substrate S and the template T have a surface on which the grid groove Tb of the template T is formed by an attachment device (not shown) for attaching the solder ball SB to the rear surface of the substrate S. It is spaced apart and supported to face the back surface of the substrate (S).

The sensing unit 110a is provided to detect the first alignment mark Sa and the second alignment mark Ta, respectively. The sensing unit 110a includes a photographing module 111 positioned between the substrate S and the template T spaced apart from each other.

The driving unit 130 is provided to separate the photographing module 111 having completed the photographing of the first alignment mark Sa and the second alignment mark Ta from between the substrate S and the template T. The drive unit 130 is a ball screw 133, a ball screw is coupled to the guide rail 131, the photographing module 111 is installed on the inner wall of the attachment device (not shown) and has the same axial direction as the guide rail 131 It is provided with a rotary motor 135 for rotating (133).

Here, in the above description, the driving unit 130 is described in the form of an LM guide (LM-Guide) having a guide rail 131, a screw 133, and a rotation motor 135, but the sensing unit 110a is linear. It may include all the driving means for reciprocating driving.

On the other hand, the alignment mark detection device 100a further includes a rotating part 150. The rotation unit 150 photographs the alignment mark of any one of the first alignment mark Sa and the second alignment mark Ta by the photographing module 111 coupled to the driving unit 130, and then the remaining alignment marks. Rotate the shooting module 111 to take a picture. The rotating unit 150 includes a hinge shaft 151 axially coupled to the photographing module 111 and a support member 153 supporting the hinge shaft 151.

The alignment mark detection apparatus 100a as described above photographs the first alignment mark Sa and the second alignment mark Ta, respectively, and captures images of the first alignment mark Sa and the second alignment mark Ta. to provide.

That is, when the substrate S and the template T are spaced apart from each other and supported, the photographing module 111 is positioned between the substrate S and the template T, and photographs the first alignment mark Sa. Towards the substrate (S) side. The photographing module 111 first photographs the first alignment mark Sa, and is then rotated by the pivoting part 150 to face the template T side. Subsequently, the photographing module 111 photographs the second alignment mark Ta.

The attachment device (not shown) compares the photographed images of the first and second alignment marks Ta, moves one of the substrate S and the template T, and thus, between the substrate S and the template T. You can do the sorting. When the alignment between the substrate S and the template T is performed, the driver 130 separates the photographing module 111 between the substrate S and the template T, so that the template T is the substrate S. Keep close to

In the above description, the photographing module 111 is described as photographing the first alignment mark Sa, and then rotated to photograph the second alignment mark Ta, although the photographing order is changed, the operation and The action may be similar to each other.

Hereinafter, an alignment mark detection apparatus according to another embodiment of the present invention will be described with reference to the accompanying drawings. Here, in the following description, components similar to those of the alignment mark sensing apparatus according to the first embodiment will be denoted by the same names and the same reference numerals, and detailed description thereof will be omitted. Therefore, components that have not been described in detail will be understood with reference to the above description.

Second embodiment

3 is a side view showing the alignment mark detection apparatus according to a second embodiment of the present invention. Referring to FIG. 3, the alignment mark detecting apparatus 100b includes a sensing unit 110b and a driving unit 130.

The sensing unit 110b includes a first photographing module 113 for photographing the first alignment mark Sa and a second photographing module 115 for photographing the second alignment mark Ta. The first photographing module 113 faces the substrate S side and the second photographing module 115 faces the template T side. The first photographing module 113 and the second photographing module 115 may be coaxial.

The detection unit 110b, the first photographing module 113 photographs the first alignment mark (Sa) and at the same time the second photographing module 115 photographs the second alignment mark (Ta), the first alignment The captured image of the mark Sa and the captured image of the second alignment mark Ta are acquired simultaneously.

Accordingly, the alignment mark detecting apparatus 110b simultaneously acquires the captured image of the first alignment mark Sa and the captured image of the second alignment mark Ta, and the attachment device (not shown) is the first and second. By comparing the photographed image of the alignment marks (Sa, Ta), any one of the substrate (S) and the template (T) is moved to perform the alignment between the substrate (S) and the template (T).

When the alignment between the substrate S and the template T is performed, the driver 130 separates the first and second photographing modules 113 and 115 from the substrate S and the template T, thereby removing the template ( Let T) approach the substrate S.

Third embodiment

4 is a side view showing the alignment mark detection apparatus according to a third embodiment of the present invention. Referring to FIG. 4, the alignment sensing unit 100c includes a sensing unit 110c and a driving unit 130.

Here, the first and second alignment marks Sa 'and Ta' formed on the substrate S and the template T may be formed of a material that reflects light. The first and second alignment marks Sa 'and Ta' may be formed by applying a metal thin film such as aluminum to the substrate S and the template T.

The sensing unit 110c includes first and second light generators 117a and 119a for irradiating light to the first and second alignment marks Sa 'and Ta', and the first and second alignment marks ( And first and second photodetectors 117ab and 119ab for detecting the first and second reflected light beams L1 and L2 reflected from Sa 'and Ta'.

The first and second photodetectors 117ab and 119ab may be adopted as photodiodes for detecting light intensities of the first and second reflected light beams L1 and L2. The photodiode has an advantage of low cost compared to an image pickup device or a charge coupling device provided in a general photographing module.

The detection unit 110c detects the first and second reflected light beams L1 and L2 reflected from the first and second alignment marks Sa 'and Ta', and detects the light intensity of the first reflected light L1. The light intensity of the second reflected light L2 is provided.

Accordingly, the alignment mark detection device 100c simultaneously acquires the light intensity of the first reflected light L1 and the light intensity of the second reflected light L2, so that the attachment device (not shown) is used to display the first and second reflected light ( The light intensity of L1 and L2) can be compared.

That is, the first and second light generators 117a and 119a irradiate light to the first and second alignment marks Sa 'and Ta', respectively. At this time, if light enters out of the first and second alignment marks Sa 'and Ta', the first and second reflected lights L1 and L2 are directed to the first and second photodetectors Sa 'and Ta'. Not detected. In addition, if light is incident on the first and second alignment marks Sa 'and Ta', but is not incident to the correct position, the first and second reflected light beams L1 and L2 are the first and second photodetectors 117ab. , 119ab, but the predetermined light intensity value and the light intensity of the first and second reflected light (L1, L2) has a difference.

In this way, the attachment device (not shown) compares the preset light intensity value with the light intensity of the first and second reflected light (L1, L2) detected, and moves one of the substrate (S) and the template (T). In this case, alignment between the substrate S and the template T may be performed.

Fourth embodiment

5 is a side view showing the alignment mark detection apparatus according to a fourth embodiment of the present invention. Referring to FIG. 4, the alignment sensing unit 100d includes a sensing unit 110d and a driver 130.

Here, the first and second alignment marks Sa "and Ta" formed on the substrate S and the template T may be formed through the substrate S and the template T to allow light to pass therethrough. .

The sensing unit 110d includes first and second light generators 117b and 119b for irradiating light to the first and second alignment marks Sa ″ and Ta ″, and the first and second alignment marks The paths of light passing through Sa ″ and Ta ″ are provided with first and second photodetectors 117bb and 119bb for detecting the first and second passing lights L1 'and L2'. In this case, the first and second light generators 117b and 119b and the first and second photodetectors 117bb and 119bb preferably have coaxial axes.

Here, the first and second photodetectors 117bb and 119bb may be coupled together with the first and second photogenerators 117b and 119b to be linearly moved by the driver 130. In another embodiment, The first and second photodetectors 117bb and 119bb may be installed and fixed on an inner wall of the attachment device (not shown).

The detection unit 110d detects the first and second passing lights L1 'and L2' passing through the first and second alignment marks Sa "and Ta", and thus, the first passing light L1 '. ) And the light intensity of the second passing light L2 ′.

Accordingly, the alignment mark detection device 110d simultaneously acquires the light intensity of the first pass light L1 'and the light intensity of the second pass light L2', so that the attachment device (not shown) is first, It is possible to compare the light intensities of the second passing light (L1 ', L2').

That is, the first and second light generators 117b and 119b irradiate light to the first and second alignment marks Sa "and Ta", respectively. At this time, if light enters out of the first and second alignment marks Sa "and Ta", the first and second pass light L1 'and L2' are respectively the first and second photodetectors 117bb and 119bb. Is not detected. In addition, when the light is incident on the first and second alignment marks Sa "and Ta", the first and second passing lights L1 'and L2' do not have a predetermined light intensity value. The light intensities of the first and second passing lights L1 'and L2' have a difference.

As described above, the attachment device (not shown) compares the predetermined light intensity value with the light intensity of the first and second pass light L1 ′ and L2 ′, thereby selecting one of the substrate S and the template T. By moving, alignment between the substrate S and the template T may be performed.

As described above, the alignment mark detection apparatuses 100a, 100b, 100c, and 100d according to the first to fourth embodiments of the present invention may be formed even if the materials of the substrate S and the template T are opaque. Since the alignment mark can be detected, the substrate S and the template T can be used as various materials.

In addition, the alignment mark sensing apparatuses 100a and 100b according to the first and second exemplary embodiments may use the first alignment mark Sa in one shot even if the substrate S and the template T are opaque. The photographed image of the photographed image and the photographed image of the second alignment mark Ta can be obtained, thereby reducing the number of alignment attempts.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, The present invention may be modified in various ways. Therefore, modifications of the embodiments of the present invention will not depart from the scope of the present invention.

1 is an exploded perspective view showing an alignment mark detection apparatus according to a first embodiment of the present invention.

2 is a side view showing the alignment mark detection apparatus according to the first embodiment of the present invention.

3 is a side view showing the alignment mark detection apparatus according to a second embodiment of the present invention.

4 is a side view showing the alignment mark detection apparatus according to a third embodiment of the present invention.

5 is a side view showing the alignment mark detection apparatus according to a fourth embodiment of the present invention.

100a: alignment mark detection device 110a: detection unit

130: driving unit 150: rotating unit

Claims

The first alignment mark is located between the substrate including a first alignment mark and a solder ball spaced apart from the substrate and to which the solder ball to be attached to the substrate is disposed, the template including a second alignment mark opposite to the first alignment mark. In the alignment mark detection device and the second alignment mark,

A photographing module disposed between the substrate and the template to photograph one of the first alignment mark and the second alignment mark;

A rotating unit supporting the photographing module and rotating the photographing module to photograph the other one of the first alignment mark and the second alignment mark which is not photographed by the photographing module;

And a driving unit supporting the rotating unit and separating the photographing module photographing both the first alignment mark and the second alignment mark from between the substrate and the template.

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