CN218243487U - Crystal oscillator with excellent heat dissipation performance - Google Patents

Crystal oscillator with excellent heat dissipation performance Download PDF

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Publication number
CN218243487U
CN218243487U CN202221369643.XU CN202221369643U CN218243487U CN 218243487 U CN218243487 U CN 218243487U CN 202221369643 U CN202221369643 U CN 202221369643U CN 218243487 U CN218243487 U CN 218243487U
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China
Prior art keywords
heat dissipation
crystal oscillator
dissipation plate
heat
heating panel
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CN202221369643.XU
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Chinese (zh)
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王金堂
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Beijing Aijielong Science & Technology Co ltd
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Beijing Aijielong Science & Technology Co ltd
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Abstract

The utility model discloses a crystal oscillator that heat dispersion is good, include: go up heating panel and lower heating panel, go up the heating panel and install crystal oscillator body down between the heating panel, go up the heating panel and fix through the connecting piece between the heating panel down, transmit the heating panel through the heat conduction coating through the heat that gives off the crystal oscillator body, lower heating panel and heat conduction card frame, by last heating panel, the heating panel effectively dispels the heat down, can be effectively quick dispels the heat to the body oscillator body, improve the performance and the life of oscillator body.

Description

Crystal oscillator with excellent heat dissipation performance
Technical Field
The utility model relates to a crystal oscillator technical field specifically is a crystal oscillator that heat dispersion is good.
Background
The crystal oscillator is an electronic element which utilizes the piezoelectric effect of quartz crystal (also called crystal) to generate high-precision oscillation frequency, belonging to passive element. The element mainly comprises quartz crystal wafer, base, shell, silver glue, silver and other components. The lead wire can be classified into a direct insertion type (with lead wire) and a surface mounting type (without lead wire) according to the lead wire condition.
The existing crystal oscillator has poor heat resistance in the using process and cannot effectively discharge heat in time, so that the using performance of the crystal oscillator is affected, heat accumulation affects the service life, and the using requirements of people cannot be met.
The chinese patent publication No. CN216699963U, the granted publication date is 2022, 6 months and 7 days, which discloses a crystal oscillator convenient for internal heat dissipation, and the published specification of the crystal oscillator convenient for internal heat dissipation is explicitly written, and the technical problems thereof are:
when general crystal oscillator installs and uses in the product for a long time, inside heat accumulation can not be evacuated fast, influences holistic result of use, and temperature accumulation shortens holistic life, is convenient for dispel the heat fast to inside.
Therefore, from the above-mentioned patent documents, the heat resistance of the crystal oscillator is poor during the use process, and the heat cannot be effectively discharged in time, which may affect the service life.
In order to solve the above-mentioned technical problems, a crystal oscillator with excellent heat dissipation performance is proposed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a crystal oscillator that heat dispersion is good through installing heating panel and lower heating panel, solves crystal oscillator and is relatively poor at the in-process heat resistance of use, can't effectually in time discharge the heat to cause the influence to crystal oscillator's performance, lead to heat gathering to influence life problem.
In order to achieve the above object, the utility model discloses a main technical scheme include:
a crystal oscillator excellent in heat dissipation performance includes:
the crystal oscillator comprises an upper heat dissipation plate and a lower heat dissipation plate, wherein a crystal oscillator body is installed between the upper heat dissipation plate and the lower heat dissipation plate, and the upper heat dissipation plate and the lower heat dissipation plate are fixed through a connecting piece.
As a preferred technical scheme, the bottom of the upper heat dissipation plate and the upper part of the lower heat dissipation plate are respectively and fixedly provided with a heat conduction clamping frame;
when the upper heat dissipation plate and the lower heat dissipation plate are connected and fixed, the crystal oscillator body can be attached and inserted into the heat conducting clamping frames distributed up and down.
Preferably, the upper heat dissipation plate and the lower heat dissipation plate are both copper plates.
As a preferred technical scheme, the heat-conducting clamping frame is a copper frame.
According to a preferable technical scheme, the connecting piece is a bolt, a first threaded hole is formed in the four corners of the upper heat dissipation plate, a second threaded hole is formed in the four corners of the lower heat dissipation plate, and one end of the bolt penetrates through the first threaded hole and is in threaded connection with the inside of the second threaded hole.
Preferably, the upper heat dissipation plate and the lower heat dissipation plate are respectively provided with a plurality of heat dissipation holes.
According to a preferable technical scheme, a heat conduction coating is coated on the crystal oscillator body, and the heat conduction coating is attached to contact surfaces of the heat conduction clamping frame and the upper heat dissipation plate and the lower heat dissipation plate.
As a preferred technical solution, the heat conducting coating is a heat conducting silicone layer.
The utility model discloses possess following beneficial effect at least:
the utility model provides a crystal oscillator that heat dispersion is good, the heat through giving off the crystal oscillator body gives last heating panel, lower heating panel and heat conduction card frame through the heat conduction coating, by last heating panel, lower heating panel effectively dispels the heat, can be effectively quick dispel the heat to the crystal oscillator body, improves the performance and the life of oscillator body.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a perspective view of a crystal oscillator with excellent heat dissipation performance according to the present invention;
fig. 2 is an exploded view of a crystal oscillator with excellent heat dissipation performance according to the present invention;
fig. 3 is an enlarged schematic view of a portion a of fig. 2 according to the present invention.
The reference numbers illustrate:
1. an upper heat dissipation plate; 2. a lower heat dissipation plate; 3. a crystal oscillator body; 4. a heat-conducting clamping frame; 5. a first threaded hole; 6. a bolt; 7. a second threaded hole; 8. heat dissipation holes; 9. a thermally conductive coating.
Detailed Description
Embodiments of the present application will be described in detail with reference to the drawings and examples, so that how to implement technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.
Referring to fig. 1 to 3, in the embodiment of the present invention,
the present embodiment provides a crystal oscillator with excellent heat dissipation performance, including: go up heating panel 1 and lower heating panel 2, go up heating panel 1 and install crystal oscillator body 3 down between the heating panel 2, go up heating panel 1 and fix through the connecting piece between the heating panel 2 down, the connecting piece is bolt 6, first screw hole 5 has been seted up to the four corners department of going up heating panel 1, second screw hole 7 has been seted up to the four corners department of heating panel 2 down, 5 threaded connection in the inside of second screw hole 7 are passed to first screw hole 5 to the one end of bolt 6, bolt 6 is convenient for carry out the dismouting to last heating panel 1 and lower heating panel 2, easy access crystal oscillator body 3, bolt 6 can set up to the copper bolt, help the heat conduction heat dissipation.
Wherein, the bottom of the upper heat-dissipating plate 1 and the upper part of the lower heat-dissipating plate 2 are respectively fixedly provided with a heat-conducting clamping frame 4; when the upper heat dissipation plate 1 and the lower heat dissipation plate 2 are connected and fixed, the crystal oscillator body 3 can be attached and inserted inside the heat conduction clamping frames 4 which are distributed up and down, the heat conduction clamping frames 4 which are distributed up and down can limit and fix the crystal oscillator body 3, and heat emitted by the crystal oscillator body 3 is absorbed through the heat conduction clamping frames 4, the upper heat dissipation plate 1 and the lower heat dissipation plate 2; the upper heat dissipation plate 1 and the lower heat dissipation plate 2 are both copper plates which can effectively conduct heat conduction and dissipate heat; the heat conducting clamping frame 4 is a copper frame, and the copper frame can effectively conduct heat conduction and heat dissipation; a plurality of heat dissipation holes 8 are respectively formed in the upper heat dissipation plate 1 and the lower heat dissipation plate 2, and the heat dissipation holes 8 can further improve the heat dissipation effect and contribute to improving the practicability of the device; scribble the brush on crystal oscillator body 3 and have heat conduction coating 9, heat conduction coating 9 and heat conduction card frame 4, go up the contact surface laminating of heating panel 1 and lower heating panel 2, heat conduction coating 9 can further improvement heat conduction effect, helps quick heat conduction heat dissipation, helps the use of this device.
The heat-conducting silicone grease layer is also called as heat-radiating grease, heat-radiating oil, silicone grease and heat-conducting grease, belongs to a paste formed by compounding organic silicon heat-conducting materials, has the characteristics of excellent heat conductivity, environmental protection, no odor, electric insulation, high and low temperature resistance and the like, has high stability, no solidification at high temperature, keeps pasty state, does not contain toxicity, is harmless to human bodies, has good compatibility with materials such as plastic and metal, has no corrosion and swelling phenomena, has low oil separation degree, and can be safely applied to electronic and electric appliance products. The heat-conducting silicone grease layer is used as a heat transfer medium of the heating element and the radiator, and can play a role in heat dissipation and filling.
The working principle is as follows: when the crystal oscillator is installed, the crystal oscillator body 3 is aligned and clamped inside the heat conducting clamping frames 4 which are distributed up and down, the bolts 6 penetrate through the first threaded holes 5 and are connected inside the second threaded holes 7 in a threaded mode, and the upper heat dissipation plate 1 and the lower heat dissipation plate 2 are connected and fixed;
when the crystal oscillator body 3 is started to operate, heat emitted by the crystal oscillator body 3 is transferred to the upper heat dissipation plate 1, the lower heat dissipation plate 2 and the heat conduction clamping frame 4 through the heat conduction coating 9, and the upper heat dissipation plate 1 and the lower heat dissipation plate 2 effectively dissipate heat;
the heat dissipation holes 8 can further improve the heat dissipation effect and contribute to quick heat dissipation;
the heat-conducting card frame 4 can fix the crystal oscillator body 3 on one hand and is helpful for heat conduction and heat dissipation on the other hand.
While the foregoing description shows and describes several preferred embodiments of the invention, it is to be understood, as noted above, that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims (7)

1. A crystal oscillator excellent in heat dissipation performance, comprising:
the crystal oscillator comprises an upper heat dissipation plate (1) and a lower heat dissipation plate (2), wherein a crystal oscillator body (3) is installed between the upper heat dissipation plate (1) and the lower heat dissipation plate (2), and the upper heat dissipation plate (1) and the lower heat dissipation plate (2) are fixed through a connecting piece;
the bottom of the upper heat dissipation plate (1) and the upper part of the lower heat dissipation plate (2) are respectively and fixedly provided with a heat conduction clamping frame (4);
when the upper heat dissipation plate (1) and the lower heat dissipation plate (2) are connected and fixed, the crystal oscillator body (3) can be attached and inserted into the heat conduction clamping frames (4) which are distributed up and down.
2. The crystal oscillator according to claim 1, wherein: the upper heat dissipation plate (1) and the lower heat dissipation plate (2) are both copper plates.
3. A crystal oscillator excellent in heat dissipation performance according to claim 1, characterized in that: the heat-conducting clamping frame (4) is a copper frame.
4. The crystal oscillator according to claim 1, wherein: the connecting piece is bolt (6), first screw hole (5) have been seted up to the four corners department of going up heating panel (1), second screw hole (7) have been seted up to the four corners department of lower heating panel (2), the one end of bolt (6) is passed first screw hole (5) threaded connection in the inside of second screw hole (7).
5. A crystal oscillator excellent in heat dissipation performance according to claim 1, characterized in that: the upper heat dissipation plate (1) and the lower heat dissipation plate (2) are respectively provided with a plurality of heat dissipation holes (8).
6. The crystal oscillator according to claim 1, wherein: the crystal oscillator is characterized in that a heat conduction coating (9) is coated on the crystal oscillator body (3), the heat conduction coating (9) is attached to the heat conduction clamping frame (4) and the contact surface of the upper heat dissipation plate (1) and the lower heat dissipation plate (2).
7. The crystal oscillator according to claim 6, wherein: the heat-conducting coating (9) is a heat-conducting silicone layer.
CN202221369643.XU 2022-06-02 2022-06-02 Crystal oscillator with excellent heat dissipation performance Active CN218243487U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221369643.XU CN218243487U (en) 2022-06-02 2022-06-02 Crystal oscillator with excellent heat dissipation performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221369643.XU CN218243487U (en) 2022-06-02 2022-06-02 Crystal oscillator with excellent heat dissipation performance

Publications (1)

Publication Number Publication Date
CN218243487U true CN218243487U (en) 2023-01-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221369643.XU Active CN218243487U (en) 2022-06-02 2022-06-02 Crystal oscillator with excellent heat dissipation performance

Country Status (1)

Country Link
CN (1) CN218243487U (en)

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