CN218123392U

CN218123392U - Chip heat dissipation packaging riveting set

Info

Publication number: CN218123392U
Application number: CN202221961217.5U
Authority: CN
Inventors: 薛洪祥; 罗长鸿
Original assignee: Wuxi Maidao Electronic Technology Co ltd
Current assignee: Wuxi Maidao Electronic Technology Co ltd
Priority date: 2022-07-28
Filing date: 2022-07-28
Publication date: 2022-12-23
Anticipated expiration: 2032-07-28

Abstract

The utility model discloses a chip heat dissipation seal dress riveting set, including riveting type platform, the overhead chip die cavity that is used for fixed chip that is provided with of riveting type and is used for fixed fin's fin die cavity, the fin die cavity communicates with each other and sets up in chip die cavity top with the chip die cavity, is provided with in the fin die cavity to be used for carrying out the locating pin of fixing a position to the fin, sets up the locating hole that matches with the locating pin on the fin. The utility model discloses an accurate control to chip and fin for the cooling surface 100% contact between chip and the fin, thereby guarantee that the heat dispersion of chip is good, work efficiency is high, has reduced the defective products and has reprocessed the rate.

Description

Chip heat dissipation packaging riveting set

Technical Field

The utility model belongs to the technical field of the IC integrated chip heat dissipation assembly, concretely relates to chip heat dissipation encapsulation riveting set.

Background

In large-scale integrated circuit design, under the trend of miniaturization, intellectualization and function densification of products, the heat dissipation of the products is more important, and especially for a highly integrated chip which can generate a large amount of heat in the working process, the problem that how to effectively dissipate heat and improve the service life and the stability of the products is that a plurality of research and development personnel mince up the brain juice is solved.

Because materials such as the cooling fin, the integrated chip and the like are in a separated packaging state at the initial purchasing stage and cannot be directly welded on the PCBA, the integrated chip materials generate a large amount of heat in the working process and need to be quickly dissipated to keep the normal working state of a product, the integrated chip materials and the product need to be preprocessed (riveted) together before production, and meanwhile, the size of the chip is small, so that the chip and the cooling fin are difficult to keep flat and are easy to deflect when being bonded, the chip and the cooling fin are difficult to mount in place, and the use performance of the device is influenced.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned prior art, the utility model provides a chip heat dissipation encapsulation riveting set to it is difficult to install the problem that targets in place, influences product service performance with the fin to solve current chip.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a chip heat dissipation encapsulation riveting set, includes riveting type platform, is provided with the chip die cavity that is used for fixed chip and the fin die cavity that is used for fixed fin on the riveting type bench, and the fin die cavity communicates with each other and sets up in chip die cavity top with the chip die cavity, is provided with the locating pin that is used for fixing a position the fin in the fin die cavity, sets up the locating hole that matches with the locating pin on the fin.

This practicality adopts above-mentioned technical scheme's beneficial effect is: the method comprises the steps of firstly placing a chip in a chip cavity on a riveting type table to fix the chip, then coating heat dissipation silica gel on an Exposed Pad area of the chip, then placing a heat dissipation sheet in a heat dissipation sheet type cavity of the riveting type table, utilizing a positioning pin to effectively position the heat dissipation sheet, enabling the chip to be fully contacted with the heat dissipation sheet, and finally fixing the chip and the heat dissipation sheet together through a rivet to realize good riveting of the chip and the heat dissipation sheet.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Furthermore, the shape of the chip cavity is matched with that of the chip, and gaps are arranged between the periphery of the chip cavity and the chip.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: the chip cavity and the chip are designed to be the same, the chip can be better fixed in the chip cavity, and meanwhile, the chip cavity can be conveniently placed in and taken out through the gaps between the periphery of the chip cavity and the chip.

Further, the width of the gap is 0.05 to 0.2mm.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: the width of the gap is controlled to effectively fix the chip by the chip cavity, and meanwhile, the chip is convenient to take and place.

Furthermore, one end of the chip cavity is set to be an open end, and the open end can extend out of the edge of the riveting type table.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: one end of the chip cavity is set to be an open end, so that the chip can be conveniently taken and placed.

Furthermore, the radiating fin cavity is an L-shaped cavity, and the radiating fins are L-shaped radiating fins matched with the radiating fin cavity.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: the L-shaped radiating fins can increase radiating space, and are beneficial to realizing the radiating function of a product, and the L-shaped cavities are matched with the L-shaped radiating fins, so that the radiating fins can be fixed in the radiating fin cavities more stably, and riveting is facilitated.

Further, the riveting type platform is square, and the radiating fin cavity is arranged on the edge of the riveting type platform.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: the square riveting type table can be convenient for the installation and the fixation of the L-shaped radiating fin.

Further, the bottom of the riveting type table is provided with a bottom plate for fixing the riveting type table.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: the bottom plate can realize the fixing of riveting type platform to make whole device more stable.

Further, the riveting type bench top is provided with a plurality of different chip cavities and radiating fin cavities.

This practicality adopts above-mentioned further technical scheme's beneficial effect to be: different chips and radiating fins can be produced through different chip cavities and radiating fin cavities, and the requirements that different radiating fins are needed at different parts of a product are met.

The beneficial effects of the utility model are that:

1. this practicality adopts type groove and reference column fixed, and the location is simple, and easy operation can realize the effective spacing of integrated chip and fin, avoids the riveting process to appear rocking and leads to the skew.

2. This practical operation platform is open design, makes things convenient for the product to get and puts the operation, and the operation space does not occupy more operation mesa for a short time, and device easy operation has reduced product disability rate and cost of labor.

3. The utility model discloses an accurate control to chip and fin for the cooling surface 100% contact between chip and the fin, thereby guarantee that the heat dispersion of chip is good, work efficiency is high, has reduced the defective products and has reprocessed the rate.

Drawings

FIG. 1 is a schematic structural diagram of the present invention;

the riveting die comprises a base plate, a riveting die table 1, a chip die cavity 2, a radiating fin die cavity 3, a positioning pin 4, a positioning pin 5 and a bottom plate.

Detailed Description

The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.

In the embodiment of the present invention, as shown in fig. 1, a riveting apparatus for heat dissipation packaging of a chip is provided, which includes a riveting table 1. The bottom of the riveting type table 1 is provided with a bottom plate 5 for fixing the riveting type table 1, so that the riveting type table 1 can be fixed more stably. In this embodiment, the bottom surface area of the bottom plate 5 is larger than the bottom surface area of the caulking type stage 1.

The riveting type platform 1 is provided with a chip cavity 2 for fixing a chip and a radiating fin cavity 3 for fixing a radiating fin, and the radiating fin cavity 3 is communicated with the chip cavity 2 and is arranged above the chip cavity 2, so that the chip and the radiating fin are fixed and installed, and the radiating silica gel is convenient to paint. The top of the riveting type table 1 is provided with a plurality of different chip cavities 2 and radiating fin cavities 3, so that chips and radiating fins with different shapes can be produced, and the requirements of different parts of products are met. In this embodiment, the top of the riveting die table 1 is provided with two different chip cavities 2 and heat sink cavities 3.

The chip cavity 2 is matched with the chip in shape, and gaps are formed between the periphery of the chip cavity 2 and the chip, so that the chip can be conveniently taken and placed. Preferably, the width of the gap is 0.05 to 0.2mm. The width of the gap in this embodiment is 0.1mm. One end of the chip cavity 2 is set to be an open end, and the open end can extend out of the edge of the riveting type table 1, so that the chip can be conveniently taken and placed.

Be provided with in the fin die cavity 3 and be used for carrying out the locating pin 4 of fixing a position to the fin, set up the locating hole that matches with locating pin 4 on the fin, can realize the accurate location to the fin. Preferably, the radiating fin cavity 3 is an L-shaped cavity, and the radiating fins are L-shaped radiating fins matched with the radiating fin cavity 3, so that the radiating space of the product can be increased. Preferably, the riveting type platform 1 is square, and the radiating fin cavity 3 is arranged on the edge of the riveting type platform 1, so that the L-shaped radiating fin can be conveniently installed. In this embodiment, the cooling fin cavity 3 is an L-shaped cavity, the riveting-type table 1 is a square-shaped cavity, and the cooling fin cavity 3 is disposed on the edge of the riveting-type table 1.

In this embodiment, the riveting type table 1, the chip, the heat sink and the bottom plate 5 are made of aluminum alloy, and the surface is subjected to a hard anodizing process to enhance the hardness of the device.

When the riveting type platform is installed, a chip is firstly placed in a chip cavity 2 on the riveting type platform 1, so that the chip is fixed, then radiating silica gel is smeared in an Exposed Pad area of the chip, then a radiating fin is placed in a radiating fin cavity 3 of the riveting type platform 1, effective positioning of the radiating fin is achieved through a positioning pin 4, the chip is fully contacted with the radiating fin, and finally the chip and the radiating fin are fixed together through a rivet, so that good riveting of the chip and the radiating fin is achieved.

While the present invention has been described in detail and with reference to the accompanying drawings, it is not to be considered as limited to the scope of the invention. Various modifications and changes may be made by those skilled in the art without inventive step within the scope of the appended claims.

Claims

1. The utility model provides a chip heat dissipation encapsulation riveting set which characterized in that: including riveting type platform (1), be provided with chip die cavity (2) that are used for fixed chip and fin die cavity (3) that are used for fixed fin on riveting type platform (1), fin die cavity (3) with chip die cavity (2) communicate with each other and set up in chip die cavity (2) top, be provided with in fin die cavity (3) and be used for carrying out locating pin (4) of fixing a position to the fin, set up on the fin with the locating hole that locating pin (4) match.

2. The die heat dissipation package riveting apparatus of claim 1, wherein: the chip die cavity (2) is matched with the chip in shape, and gaps are formed between the periphery of the chip die cavity (2) and the chip.

3. The die heat dissipation package riveting apparatus of claim 2, wherein: the width of the gap is 0.05 to 0.2mm.

4. The die heat dissipation package riveting apparatus of claim 1 or 2, wherein: one end of the chip cavity (2) is set to be an open end, and the open end can extend out of the edge of the riveting type table (1).

5. The die heat dissipation package riveting apparatus of claim 1, wherein: the radiating fin cavity (3) is an L-shaped cavity, and the radiating fin is an L-shaped radiating fin matched with the radiating fin cavity (3).

6. The die heat dissipation package riveting apparatus of claim 5, wherein: the riveting type platform (1) is square, and the radiating fin cavity (3) is formed in the edge of the riveting type platform (1).

7. The die heat dissipation package riveting apparatus of claim 1, wherein: the bottom of the riveting type table (1) is provided with a bottom plate (5) used for fixing the riveting type table (1).

8. The die heat dissipation package riveting apparatus of claim 1, wherein: the top of the riveting type table (1) can be provided with a plurality of different chip cavities (2) and radiating fin cavities (3).