CN110676234A - Semi-closed spaceborne chip heat dissipation device - Google Patents
Semi-closed spaceborne chip heat dissipation device Download PDFInfo
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- CN110676234A CN110676234A CN201910891610.8A CN201910891610A CN110676234A CN 110676234 A CN110676234 A CN 110676234A CN 201910891610 A CN201910891610 A CN 201910891610A CN 110676234 A CN110676234 A CN 110676234A
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- circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a semi-closed type spaceborne chip heat dissipation device, and belongs to the field of thermal control and chip protection of a space vehicle. The heat dissipation device disclosed by the invention is made of a metal material and comprises a box body with an opening at the top, a plurality of bulges corresponding to chips on a circuit board are arranged at the bottom in the box body, and the edge of the opening at the top of the box body is attached to the circuit board to form a closed structure; the contact surface of the bulge and the chip in the box body and the contact surface of the edge of the box body and the circuit board are coated with heat conducting glue, so that the heat transfer speed is improved. The chip during operation produces the heat, and the heat is conducted to heat abstractor through the arch with the chip contact and the border with the circuit board contact, solves the local overheated problem of chip on the circuit board through the heat abstractor large tracts of land heat dissipation, reaches the high-efficient temperature that reduces the chip, is favorable to preventing each charged particle in space to the influence of chip, promotes chip operational reliability.
Description
Technical Field
The invention belongs to the field of thermal control and chip protection of a spacecraft, and particularly relates to a semi-closed type spaceborne chip heat dissipation device.
Background
In recent years, with the rapid development of micro satellites, with the increasing application requirements of space high-speed data transmission, image processing, intelligent identification, inter-satellite information interaction and the like, the information data among satellites and between satellites and loads are increased in an inevitable explosive manner, and a satellite computer tends to expand and support the running of a multi-task real-time operating system and application software, so that the satellite computer becomes a comprehensive electronic information platform which not only has conventional satellite management capability, but also can process the load data.
Therefore, it is urgently needed to improve the data processing capability of the microsatellite integrated electronic information platform, and the on-orbit use of high-performance chips represented by the GPU, the ARM and the AI chip becomes necessary. The size of a transistor in a chip is continuously reduced, the function density is improved, the performance is enhanced, but the performance is obviously influenced by the effects of threshold voltage drift, leakage current increase and the like, the whole power consumption of the chip is not obviously optimized, the power consumption is often more than 5W during operation in a region of hundreds of square millimeters, the heat productivity of the chip is very large, and the local temperature of a circuit board is overhigh, so that the thermal failure of a local circuit and the thermal damage of the local chip are caused, the failure of the whole voltage control circuit is further caused, and finally the out-of-control of the whole system is caused.
Therefore, the heat dissipation of the satellite-borne high-performance chip in the space environment needs to be optimized, and the normal work of the chip is ensured. Generally, the chip can achieve the purpose of heat dissipation through a convection heat dissipation manner, a conduction heat dissipation manner, a radiation conduction heat dissipation manner or a combination manner thereof. However, the space environment is obviously different from the ground environment, and not only can be influenced by radiation such as total dose and single particles, but also the vacuum environment has no convection, the ground heat dissipation mode combining a fan and a heat conducting fin can not be used, only solid heat transfer and radiation conduction can be realized, and the heat dissipation efficiency of the chip is limited due to the absence of a complete heat dissipation channel.
Publication No. CN201490181U discloses a chip heat dissipation device, which includes a heat conduction base and a heat dissipation body, and adopts a metal case as the heat dissipation body; the heat conducting base is made of metal material with high heat conductivity coefficient, the middle part of the bottom surface of the heat conducting base is provided with a protruded bottom step surface, the surface of the bottom step surface is flat and is positioned corresponding to the position of a chip on the circuit mainboard, and the bottom step surface is tightly abutted to the top surface of the mainboard chip. The device regard the quick-witted box as the radiator, has realized directly conducting the heat that needs radiating chip to produce on the mainboard to the product machine box surface through the heat conduction base, utilizes the surrounding air to take away the direct heat dissipation of heat. The heat dissipation device can only be used for chips of an organic box body, and the application range is severely limited; the heat dissipation device needs to be matched with the chip and the case body in multiple directions, and is inconvenient to install; and the heat dissipation device needs to rely on the convection of ambient air to take away heat to achieve the purpose of heat dissipation, and is not suitable for space environment.
Disclosure of Invention
The invention aims to provide a semi-closed heat dissipation device capable of efficiently conducting heat for a satellite-borne chip, an effective heat conduction channel is established between the surface of the chip and a circuit board through the heat dissipation device, the temperature of the chip is reduced, and meanwhile, the semi-closed heat dissipation device has a space particle protection function and improves the reliability of on-orbit work of the chip.
In order to achieve the purpose, the invention adopts the technical scheme that: a semi-enclosed type satellite-borne chip heat dissipation device comprises a box body with an opening at the top, wherein a plurality of bulges corresponding to chips on a circuit board are arranged at the bottom in the box body; the edge of the top opening of the box body is attached to the circuit board to form a closed structure; the heat dissipation device is made of metal materials.
Preferably, the thickness of the side wall of the box body is 1-5 mm.
The depth of the box body is the sum of the protruding height and the thickness of the chip on the circuit board, the error is less than 0.5mm, and a closed structure is formed when the box body is attached to the circuit board.
Preferably, the height of the protrusion is 1-10 mm.
Further preferably, the upper surface of the protrusion is coated with a heat-conducting adhesive, so that the contact stress between the chip and the contact surface of the protrusion can be enhanced, and the heat-conducting speed of the contact surface can be improved.
Further preferably, the top opening edge of the box body is provided with an extension part, and the extension part is tightly attached to the circuit board, so that the heat transfer efficiency is improved.
Further preferably, the extension part is fixedly attached to the circuit board through screws or bolts.
Further preferably, the contact surface of the extension part and the circuit board is coated with heat conducting glue, so that the contact stress and the heat conducting speed of the contact surface are improved.
Preferably, the metal material is aluminum, and the heat dissipation device made of the metal material is beneficial to shielding space particles and improving the stability of a core electronic system.
Preferably, the heat conductive rubber is heat conductive silicone rubber.
The working principle of the heat dissipation device is as follows: the chip work generates heat, and the heat conducts the box body through the arch rather than the contact on, and on extension and the circuit board laminating part at box body border conducted the heat on the circuit board to the box body simultaneously, solved the local overheated problem of chip on the circuit board through the heat dissipation of box body large tracts of land, reached and show the purpose that reduces the chip temperature.
Compared with the prior art, the invention has the following beneficial effects:
(1) the heat dissipation device provided by the invention establishes an effective heat conduction path between the chip and the circuit board through the box body, and efficiently conducts the heat of the chip to the heat dissipation device.
(2) The heat sink provided by the invention is tightly connected with the circuit board to form a sealing device, and the heat sink is made of metal material, so that space particles can be shielded, and the stability of a core electronic system can be improved.
(3) The shape and the size of the heat dissipation device provided by the invention can be freely set according to needs, and the heat dissipation device has general transportability; the thickness can also be fine tuned according to particle protection requirements, overall weight, and heat dissipation efficiency.
(4) The heat dissipation device provided by the invention can be used for heat dissipation of scenes such as a single chip, a single circuit board and the like, is also suitable for heat dissipation of multiple chips or a clamping plate packaged by SiP, and has wide applicability.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device in embodiment 1.
Fig. 2 is a schematic structural diagram of the heat dissipation device in embodiment 2.
Fig. 3 is a temperature distribution image of a circuit board when a chip of a heat dissipating device of the present invention is not mounted.
Fig. 4 is a temperature distribution image of a circuit board when a chip operates after the heat dissipation device of the present invention is mounted.
Wherein, 1, a box body; 2. a protrusion; 3. an edge; 4. a side wall; 5. an extension portion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Those skilled in the art should understand that they can make modifications and equivalents without departing from the spirit and scope of the present invention, and all such modifications and equivalents are intended to be included within the scope of the present invention.
Example 1
As shown in figure 1, the semi-closed type satellite-borne chip heat dissipation device is made of aluminum and comprises a box body 1 with an open top, a protrusion 2 corresponding to a chip on a circuit board is arranged at the bottom in the box body, the edge 3 of the open top of the box body 1 is attached to the circuit board to form a closed structure, and heat conduction silicon rubber is coated on the upper surface and the edge 3 of the protrusion 2. The thickness of the side wall 4 of the box body 1 is 3mm, the height of the bulge 2 is 6mm, the depth of the box body 1 is the sum of the height of the bulge 2 and the thickness of a chip on a circuit board, and the error is less than 0.5 mm.
The chip generates heat when working, and the heat is conducted to the box body 1 of the heat dissipation device through the bulge 2 contacted with the chip on one hand, and is conducted to the box body 1 through the edge 3 contacted with the circuit board on the other hand; the problem of local overheating of the chip on the circuit board is solved through large-area heat dissipation of the box body 1, and the purpose of remarkably reducing the temperature of the chip is achieved.
Example 2
As shown in figure 2, the semi-closed type satellite-borne chip heat dissipation device is made of aluminum and comprises a box body 1 with an open top, three protrusions 2 corresponding to chips on a circuit board are arranged at the bottom in the box body, an extension part 5 is arranged at the edge of the open top of the box body 1 and is attached to the circuit board to form a closed structure, and heat conduction silicon rubber is coated on the upper surface of each protrusion 2 and the extension part 5. The thickness of the side wall 4 of the box body 1 is 4mm, the height of the bulge 2 is 6mm, the depth of the box body 1 is the sum of the height of the bulge 2 and the thickness of a chip on a circuit board, and the error is less than 0.5 mm.
The chip generates heat when working, and the heat is conducted to the box body 1 of the heat dissipation device through the bulge 2 contacted with the chip on one hand, and is conducted to the box body 1 through the extension part 5 contacted with the circuit board on the other hand; the problem of local overheating of the chip on the circuit board is solved through large-area heat dissipation of the box body 1, and the purpose of remarkably reducing the temperature of the chip is achieved.
Heat dissipation device for detecting working state of chip
As shown in fig. 3-4, the heat dissipation device provided by the present invention was simulated for heat conduction based on the COMSOL numerical simulation tool. In a vacuum environment, an object can only conduct heat transfer through a solid and a radiation mechanism, the radiation heat transfer adopts a surface-to-surface radiation heat transfer mechanism, and the following relational expression is satisfied:
wherein Q is a heat source, and is set to be 5W in the test, rho is the material density, Cp is the constant-pressure specific heat capacity, u is the diffusion velocity, Q is the heat flow density, T is the absolute temperature, and k is the thermal conductivity coefficient of the material.
The circuit board is in the installation of satellite, the edge will contact with the satellite frame, therefore the circuit board edge can be regarded as the isothermal body with the satellite frame, sets up to 273.15K, can't be with heat-conduction to vacuum through the traditional heat conduction mode of solid, consequently other faces with vacuum contact set up to thermal insulation, and the heat radiation can be with heat radiation solid out, therefore its thermal insulation face sets up in the vacuum distance.
According to the high-performance chip, taking the great-performance GPU as an example, the great-performance GPU is tested, the heat dissipation device is not assembled, the temperature distribution of a circuit board when the chip works and the temperature distribution of the circuit board when the chip works after the heat dissipation device provided by the invention is assembled. When the GPU runs without a calculation task, the power consumption of the English Wigner GPU is 1.5W, when the GPU runs at full speed, the power consumption can reach 7.5W, the requirement for heat dissipation of a chip is increased sharply along with the increase of the power consumption, when the GPU runs at 5W, the middle temperature of the chip reaches 750K, and a temperature distribution image is shown in fig. 3.
After the semi-closed heat dissipation device provided by the invention is installed, the temperature distribution of the circuit board is obviously changed when the chip works, the central temperature of the chip is reduced to 295K, and the temperature distribution image is shown in fig. 4, which shows that the temperature of the chip establishes an effective heat conduction channel through the heat dissipation device, the heat is conducted to the circuit board by the heat dissipation device, the edge of the circuit board is in contact with the frame of the satellite frame, and further, the heat is conducted to the satellite frame through the circuit board and is emitted into space through radiation, so that the temperature of the chip is reduced.
Claims (10)
1. A semi-enclosed type satellite-borne chip heat dissipation device comprises a box body with an opening at the top, and is characterized in that a plurality of bulges corresponding to chips on a circuit board are arranged at the bottom in the box body; the edge of the top opening of the box body is attached to the circuit board to form a closed structure; the heat dissipation device is made of metal materials.
2. The semi-enclosed spaceborne chip heat dissipation device as recited in claim 1, wherein the thickness of the side wall of the box body is 1-5 mm.
3. The semi-enclosed satellite-borne chip heat dissipation device according to claim 1, wherein the depth of the box body is the sum of the height of the protrusion and the thickness of the chip on the circuit board, and the error is less than 0.5 mm.
4. The semi-enclosed spaceborne chip heat dissipation device as recited in claim 1, wherein the height of the bump is 1-10 mm.
5. The semi-enclosed space-borne chip heat dissipation device according to claim 1, wherein the upper surface of the protrusion is coated with a heat conductive adhesive.
6. The semi-enclosed space-borne chip heat dissipation device as recited in claim 1, wherein an extension portion is disposed at the edge of the top opening of the case, and the extension portion is tightly attached to the circuit board.
7. The semi-enclosed space-borne chip heat dissipation device according to claim 6, wherein the extension portion is fixedly attached to the circuit board by screws or bolts.
8. The semi-enclosed space-borne chip heat dissipation device according to claim 6, wherein a surface of the extension portion contacting the circuit board is coated with a thermal conductive adhesive.
9. The semi-enclosed space-borne chip heat dissipation device according to claim 1, wherein the metal material is aluminum.
10. The semi-enclosed satellite-borne chip heat dissipation device according to claim 5 or 8, wherein the heat conductive adhesive is a heat conductive silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910891610.8A CN110676234A (en) | 2019-09-20 | 2019-09-20 | Semi-closed spaceborne chip heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910891610.8A CN110676234A (en) | 2019-09-20 | 2019-09-20 | Semi-closed spaceborne chip heat dissipation device |
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| Publication Number | Publication Date |
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| CN110676234A true CN110676234A (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910891610.8A Pending CN110676234A (en) | 2019-09-20 | 2019-09-20 | Semi-closed spaceborne chip heat dissipation device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225982A (en) * | 2021-04-06 | 2021-08-06 | 中国科学院国家空间科学中心 | Satellite-borne high-performance processing circuit reinforcing and heat radiating device |
| CN114173540A (en) * | 2021-12-13 | 2022-03-11 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
| CN115520410A (en) * | 2022-08-19 | 2022-12-27 | 中国科学院空间应用工程与技术中心 | Thermal control device and spacecraft laser time-frequency transmission load thermal control system |
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| US5909056A (en) * | 1997-06-03 | 1999-06-01 | Lsi Logic Corporation | High performance heat spreader for flip chip packages |
| US20020149098A1 (en) * | 2001-04-13 | 2002-10-17 | Fujitsu Limited | Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate |
| CN102906870A (en) * | 2010-06-18 | 2013-01-30 | 夏普株式会社 | Heat dissipation structure for electronic device |
| CN103456699A (en) * | 2013-09-29 | 2013-12-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | Integrated circuit packaging structure and packaging method thereof |
-
2019
- 2019-09-20 CN CN201910891610.8A patent/CN110676234A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909056A (en) * | 1997-06-03 | 1999-06-01 | Lsi Logic Corporation | High performance heat spreader for flip chip packages |
| US20020149098A1 (en) * | 2001-04-13 | 2002-10-17 | Fujitsu Limited | Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate |
| CN102906870A (en) * | 2010-06-18 | 2013-01-30 | 夏普株式会社 | Heat dissipation structure for electronic device |
| CN103456699A (en) * | 2013-09-29 | 2013-12-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | Integrated circuit packaging structure and packaging method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225982A (en) * | 2021-04-06 | 2021-08-06 | 中国科学院国家空间科学中心 | Satellite-borne high-performance processing circuit reinforcing and heat radiating device |
| CN113225982B (en) * | 2021-04-06 | 2023-03-21 | 中国科学院国家空间科学中心 | Satellite-borne high-performance processing circuit reinforcing and heat radiating device |
| CN114173540A (en) * | 2021-12-13 | 2022-03-11 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
| CN115520410A (en) * | 2022-08-19 | 2022-12-27 | 中国科学院空间应用工程与技术中心 | Thermal control device and spacecraft laser time-frequency transmission load thermal control system |
| CN115520410B (en) * | 2022-08-19 | 2023-08-08 | 中国科学院空间应用工程与技术中心 | Spacecraft laser time-frequency transfer load thermal control system |
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Application publication date: 20200110 |