CN218121228U - Pressure sensor applied to low-temperature environment - Google Patents

Pressure sensor applied to low-temperature environment Download PDF

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Publication number
CN218121228U
CN218121228U CN202222663746.3U CN202222663746U CN218121228U CN 218121228 U CN218121228 U CN 218121228U CN 202222663746 U CN202222663746 U CN 202222663746U CN 218121228 U CN218121228 U CN 218121228U
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China
Prior art keywords
pressure sensor
pressure
pressure sensitive
sensitive core
temperature
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CN202222663746.3U
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Chinese (zh)
Inventor
孙巍
陈程
梁建权
冯宇
张健
宫铭辰
李辉
张可心
陈江波
蔡胜伟
张朋
刘贺千
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State Grid Heilongjiang Electric Power Co Ltd Electric Power Research Institute
State Grid Corp of China SGCC
China Electric Power Research Institute Co Ltd CEPRI
State Grid Heilongjiang Electric Power Co Ltd
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State Grid Heilongjiang Electric Power Co Ltd Electric Power Research Institute
State Grid Corp of China SGCC
China Electric Power Research Institute Co Ltd CEPRI
State Grid Heilongjiang Electric Power Co Ltd
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Application filed by State Grid Heilongjiang Electric Power Co Ltd Electric Power Research Institute, State Grid Corp of China SGCC, China Electric Power Research Institute Co Ltd CEPRI, State Grid Heilongjiang Electric Power Co Ltd filed Critical State Grid Heilongjiang Electric Power Co Ltd Electric Power Research Institute
Priority to CN202222663746.3U priority Critical patent/CN218121228U/en
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Abstract

The utility model provides a be applied to low temperature environment's pressure sensor, relates to pressure sensor technical field, the utility model aims at solving the problem that inaccurate and the low reliability of output appears easily in pressure sensor under the present low temperature environment. The outlet of the cylindrical shell is connected with the base, the mounting body is arranged in the cylindrical shell and arranged on the base, the pressure sensitive core and the data processing plate are embedded in the mounting body, the pressure sensitive core is embedded in one side of the mounting body and close to the base, the base is provided with a socket, a measured object is in contact with the pressure sensitive core through the socket, the pressure of the measured object is transmitted to the pressure sensitive core, and the pressure sensitive core is used for detecting the pressure of the measured object; the other side of the mounting body is embedded with a data processing plate, and a containing cavity is formed in the mounting body between the data processing plate and the pressure sensitive core body. The pressure sensor is used for improving the detection accuracy of the pressure sensor.

Description

Pressure sensor applied to low-temperature environment
Technical Field
The utility model relates to a pressure sensor technical field, more specifically relates to a be applied to low temperature environment's pressure sensor.
Background
The pressure sensor is the most commonly used sensor in industrial practice and instrument control, and is widely applied to various industrial automatic control environments. However, temperature variations severely affect the proper operation of the pressure sensor. In particular, in a low-temperature environment, factors such as the resistivity, the piezoresistive coefficient, the poisson's ratio, the elastic modulus and the like of the pressure sensor change, so that the electrical signal of the sensor cannot be output correctly.
In order to improve the reliability and stability of the operation of the pressure sensor in a low-temperature environment, the pressure sensor needs to be designed and improved, and most of the existing improvement measures of the low-temperature pressure sensor are used for enhancing the sealing performance of the pressure sensor on a package so as to reduce the influence of low temperature on internal components. The existing packaging method adopts stainless steel materials to protect a circuit board and a core body of the sensor, but the stainless steel materials have high thermal conductivity and can quickly transfer the external environment temperature to the interior of the pressure sensor, so that the temperature in the interior of the sensor suddenly drops, the reliability of a conditioning circuit board is reduced, and even the pressure sensor fails.
There is therefore a need to improve the thermal conductivity defects of the sealing material and reduce the effects of low temperatures on the pressure sensor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that inaccurate and the low reliability of output appears easily in the pressure sensor under the present low temperature environment, providing a be applied to low temperature environment's pressure sensor.
A pressure sensor applied to low-temperature environment comprises a base, a pressure sensitive core body, a data processing board, an accommodating cavity, a mounting body and a cylindrical shell,
the outlet of the cylindrical shell is connected with the base, the mounting body is arranged in the cylindrical shell and arranged on the base, the pressure sensitive core and the data processing plate are embedded in the mounting body, the pressure sensitive core is embedded in one side of the mounting body and close to the base, the base is provided with a socket, a measured object is in contact with the pressure sensitive core through the socket, the pressure of the measured object is transmitted to the pressure sensitive core, and the pressure sensitive core is used for detecting the pressure of the measured object;
the other side of the mounting body is embedded with a data processing board which is used for converting the analog signal of the pressure output by the pressure sensitive core body into a digital signal; the mounting body between the data processing board and the pressure sensitive core body is provided with an accommodating cavity which is used for slowing down the transmission of temperature from the pressure sensitive core body to the data processing board.
Preferably, the pressure sensor further comprises a positioning member,
set up the setting element between base and the pressure sensitive core, be provided with the pore on the setting element and be connected with the base pore for transmit the measured object to the pressure sensitive core.
Preferably, the temperature control body is made of polyimide.
The utility model has the advantages that:
the design of this application vacuum holding chamber and scribbling the low temperature colloid has strengthened the low temperature protection to pressure sensor core components and parts to reduce the influence of low temperature to the inside device of sensor, improve pressure sensor's reliability under the low temperature environment, this application is the pressure sensor who is applied to the low temperature environment, can be at normal operating under the low temperature operating mode of-60 ℃ to 0 ℃.
The temperature control body is arranged between the shell and the data processing board, the material is polyimide, the service temperature range of the polyimide is-200-300 ℃, the mechanical property is good in the low-temperature environment, the temperature control body has low thermal conductivity, and the data processing board and the external temperature can be well isolated. The difference between the thermal expansion coefficient of the polyimide and the thermal expansion coefficient of stainless steel is small, and the polyimide and the stainless steel have small thermal stress under the temperature change, so that the polyimide and stainless steel have better long-term stability. The inside holding chamber that is provided with of installed part, the inside atmospheric pressure that keeps below 1Pa of holding intracavity to slow down the low temperature and follow the transmission of temperature control body to data processing board.
The temperature protection layer can enhance the sealing performance and the low-temperature protection performance. Consequently this application is kept apart the temperature of sensor inside and outside to further strengthen the low temperature protection to pressure sensor core components and parts through the design of vacuum holding chamber with scribble the low temperature colloid, in order to reduce the influence of low temperature to the inside device of sensor, improve pressure sensor's under the low temperature environment reliability and the accuracy that detects.
Drawings
Fig. 1 is a schematic structural diagram of a pressure sensor applied to a low-temperature environment.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive efforts based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
The first embodiment is as follows: the embodiment is described with reference to fig. 1, and the pressure sensor applied to the low-temperature environment in the embodiment comprises a base 1, a pressure sensitive core 3, a data processing board 4, a containing cavity 2, a mounting body 7 and a cylindrical shell 6,
the outlet of the cylindrical shell 6 is connected with the base 1, the mounting body 7 is arranged in the cylindrical shell 6, the mounting body 7 is arranged on the base 1, the mounting body 7 is used for embedding the pressure sensitive core 3 and the data processing board 4, the pressure sensitive core 3 is embedded at one side of the mounting body 7 and is close to the side of the base 1, the base 1 is provided with a socket, a measured object is in contact with the pressure sensitive core 3 through the socket, the pressure of the measured object is transmitted to the pressure sensitive core 3, and the pressure sensitive core 3 is used for detecting the pressure of the measured object;
the other side of the installation body 7 is embedded with a data processing board 4, and the data processing board 4 is used for converting an analog signal of the pressure output by the pressure sensitive core body 3 into a digital signal; the mounting body between the data processing board 4 and the pressure sensitive core body 3 is provided with an accommodating cavity 2, and the accommodating cavity 2 is used for slowing down the transmission of temperature from the pressure sensitive core body 3 to the data processing board 4.
In this embodiment, a groove can be formed in the bottom of the base, so that the object to be measured can be conveniently fixed.
The second embodiment is as follows: this embodiment is further defined by the pressure sensor for use in a low temperature environment as set forth in the first embodiment, wherein the pressure sensor further comprises a positioning member,
a positioning piece is arranged between the base 1 and the pressure sensitive core body 3, and a pore is arranged on the positioning piece, connected with the pore of the base 1 and used for transmitting a measured object to the pressure sensitive core body 3.
In this embodiment, this application sets up the setting element and can make the measured object pass through setting element contact pressure sensitive chip for the measured object inserts setting element and base and pressure sensitive chip contact, and 2 objects are for setting element and base to the male degree of depth, and what the measured object was connected like this is more firm, is difficult to break away from, has increased the stability that detects.
The third concrete implementation mode: in this embodiment, the pressure sensor applied to a low-temperature environment is further limited to the one described in the first embodiment, and in this embodiment, the temperature control member 5 is made of polyimide.
The fourth concrete implementation mode is as follows: this embodiment is further defined by the pressure sensor for low temperature environments of the first embodiment, wherein the pressure sensor further comprises a temperature protection layer,
the temperature protection layer is arranged on the outer surface of the mounting body 7 and used for isolating the influence of the external temperature on the temperature inside the mounting body 7.
In the embodiment, the temperature protection layer is low-temperature colloid, and the sealing performance and the low-temperature protection performance are enhanced by coating the low-temperature colloid.
The fifth concrete implementation mode: in this embodiment, the pressure sensor applied to a low-temperature environment is further defined, and in this embodiment, the temperature protection layer is formed by applying a colloid on the outer surface of the mounting body 7.
The sixth specific implementation mode: in the present embodiment, the pressure sensor applied to a low-temperature environment according to the first embodiment is further limited, and in the present embodiment, the air pressure inside the housing chamber 2 is maintained at 1Pa or less.
The seventh concrete implementation mode: the present embodiment is further limited to the pressure sensor applied to a low-temperature environment according to the first embodiment, and in the present embodiment, the pressure sensor further includes a temperature control body 5;
the temperature control body 5 is embedded on the installation body 7, and the temperature control body 5 is connected with the data processing board 4; and the temperature control body 5 is used for isolating the data processing board 4 from the external temperature.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.

Claims (7)

1. A pressure sensor applied to low-temperature environment is characterized by comprising a base (1), a pressure sensitive core body (3), a data processing board (4), an accommodating cavity (2), a mounting body (7) and a cylindrical shell (6),
the outlet of the cylindrical shell (6) is connected with the base (1), the mounting body (7) is arranged inside the cylindrical shell (6), the mounting body (7) is arranged on the base (1), the mounting body (7) is used for embedding the pressure sensitive core (3) and the data processing board (4), the pressure sensitive core (3) is embedded at one side of the mounting body (7) and is close to the side of the base (1), the base (1) is provided with a socket, a measured object is in contact with the pressure sensitive core (3) through the socket, the pressure of the measured object is transmitted to the pressure sensitive core (3), and the pressure sensitive core (3) is used for detecting the pressure of the measured object;
the other side of the mounting body (7) is embedded with a data processing board (4), and the data processing board (4) is used for converting an analog signal of the pressure output by the pressure sensitive core body (3) into a digital signal;
the mounting body between the data processing board (4) and the pressure sensitive core body (3) is provided with a containing cavity (2), and the containing cavity (2) is used for slowing down the transmission of temperature from the pressure sensitive core body (3) to the data processing board (4).
2. The pressure sensor for low temperature environment according to claim 1, wherein the pressure sensor further comprises a positioning member,
a positioning piece is arranged between the base (1) and the pressure sensitive core body (3), and a pore is arranged on the positioning piece and connected with the pore of the base (1) for transmitting a measured object to the pressure sensitive core body (3).
3. The pressure sensor applied to low-temperature environment as claimed in claim 1, wherein the temperature control body (5) is made of polyimide.
4. The pressure sensor for application in a cryogenic environment of claim 1, wherein the pressure sensor further comprises a temperature protection layer,
the temperature protection layer is arranged on the outer surface of the installation body (7) and used for isolating the influence of the external temperature on the temperature inside the installation body (7).
5. A pressure sensor for application in a cryogenic environment according to claim 1, wherein the temperature protection is provided by a gel applied to the outer surface of the mounting body (7).
6. A pressure sensor for application in a cryogenic environment according to claim 1, wherein the pressure inside the housing chamber (2) is kept below 1 Pa.
7. A pressure sensor for application in a cryogenic environment according to claim 1, wherein the pressure sensor further comprises a temperature control body (5);
the temperature control body (5) is embedded on the mounting body (7), and the temperature control body (5) is connected with the data processing board (4); and the temperature control body (5) is used for isolating the data processing board (4) from the external temperature.
CN202222663746.3U 2022-10-09 2022-10-09 Pressure sensor applied to low-temperature environment Active CN218121228U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222663746.3U CN218121228U (en) 2022-10-09 2022-10-09 Pressure sensor applied to low-temperature environment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222663746.3U CN218121228U (en) 2022-10-09 2022-10-09 Pressure sensor applied to low-temperature environment

Publications (1)

Publication Number Publication Date
CN218121228U true CN218121228U (en) 2022-12-23

Family

ID=84496819

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222663746.3U Active CN218121228U (en) 2022-10-09 2022-10-09 Pressure sensor applied to low-temperature environment

Country Status (1)

Country Link
CN (1) CN218121228U (en)

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