CN210293501U - Air duct monitoring sensor - Google Patents
Air duct monitoring sensor Download PDFInfo
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- CN210293501U CN210293501U CN201921657645.7U CN201921657645U CN210293501U CN 210293501 U CN210293501 U CN 210293501U CN 201921657645 U CN201921657645 U CN 201921657645U CN 210293501 U CN210293501 U CN 210293501U
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Abstract
An air duct monitoring sensor comprising: the MEMS sensor comprises a plastic shell, a substrate, a stainless steel ring, an MEMS sensor and an ADC chip, wherein the ADC chip is connected with the MEMS sensor, and pouring sealant for packaging parts is arranged in a packaging space. The utility model discloses with MEMS sensor and ADC chip package together, through acquireing disposable coefficient after, only need the temperature compensation that a temperature point can be done the MEMS sensor, greatly improve calibration efficiency, reduce the calibration cost greatly.
Description
Technical Field
The utility model relates to a technical field that the wind channel detected especially relates to a wind channel monitoring sensor.
Background
There are 2 sensors used for testing the air duct on the water heater on the market at present:
(1) a mechanical sensor: the device mainly comprises a round thin silica gel sheet, a spring and a switch, wherein the spring which needs more force is calculated by utilizing the relation between pressure and area; when the air outlet channel is not smooth, the pressure is increased, and the switch is triggered.
(2) A pulse output sensor: mainly comprises a circular thin silica gel piece, a spring, a coil and a magnetic ring, and the principle of the sensor is similar to that of a mechanical sensor.
The mechanical sensor only has two states of opening and closing, the pressure cannot be judged, and the thin silicon rubber sheet, the spring and the switch are aged to cause sensor failure; the pulse output sensor also has the problem of aging of the thin silicon film and the spring, and the output error is large due to temperature compensation.
It can be seen that the prior art has at least the following disadvantages: the traditional water heater has low detection precision, short service life and larger output error.
Therefore, it is necessary to provide a technical means to solve the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's defect, provide a wind channel monitoring sensor to solve among the prior art traditional water heater's detection precision not high, the life-span is short, the great problem of output error.
The utility model discloses a realize like this, a wind channel monitoring sensor, include:
the plastic shell is used for packaging each part; the plastic shell is provided with a mounting groove for accommodating each part, and the central position of the mounting groove is communicated with the outside;
a substrate for mounting a component; the base plate is arranged in the mounting groove, a first position on the base plate corresponds to the center of the mounting groove, and the first position is communicated with the outside;
the stainless steel ring is used for forming a packaging space for packaging each part together with the substrate; the stainless steel ring is arranged on the substrate and surrounds the first position;
a MEMS sensor for detecting a pressure signal; the MEMS sensor is arranged at the first position of the packaging space and is communicated with the outside;
the ADC chip is used for converting the analog signal into a digital signal; the ADC chip is arranged on the substrate in the packaging space; wherein the content of the first and second substances,
the ADC chip is connected with the MEMS sensor, and pouring sealant used for packaging all parts is arranged in the packaging space.
Preferably, the MEMS sensor is arranged on the substrate in a surface-mounted manner by adopting silk-screen glue.
Preferably, the substrate is a circuit board.
Preferably, the circuit board is of a material grade FR-4.
Preferably, the MEMS sensor is a diffused silicon piezoresistive pressure chip sensor.
Preferably, the output of the MEMS sensor is an I2C bus and has 4 pins, with a distance of 2.54 pitch between two adjacent pins.
Preferably, the pouring sealant is an antiseptic sealant.
Preferably, the plastic casing is provided with the one side of mounting groove is provided with the accessory, the accessory with adopt silica gel O type circle sealed between the plastic casing.
The utility model discloses with MEMS sensor and ADC chip package together, through acquireing disposable coefficient after, only need the temperature compensation that a temperature point can be done the MEMS sensor, very big improvement calibration efficiency, great reduction calibration cost.
Drawings
Fig. 1 is a schematic overall structure diagram of an air duct monitoring sensor according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of an air duct monitoring sensor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a substrate in an air duct monitoring sensor according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a circuit connection of the air duct monitoring sensor according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1 to 4, in order to provide a preferred embodiment of the present invention, an air duct monitoring sensor in the embodiment includes: the plastic shell 1 is used for packaging each part; the plastic shell 1 is provided with a mounting groove 2, the mounting groove 2 is used for accommodating various parts, and the center of the mounting groove 2 is communicated with the outside; a substrate 3 for mounting a component; the base plate 3 is arranged in the mounting groove 2, a first position 4 on the base plate 3 corresponds to the center of the mounting groove 2, and the first position 4 is communicated with the outside; the stainless steel ring 5 is used for forming a packaging space for packaging each part together with the substrate 2; the stainless steel ring 5 is arranged on the substrate 3 and surrounds the first position 4; a MEMS sensor 6 for detecting a pressure signal; the MEMS sensor 6 is arranged at the first position 4 of the packaging space, and the MEMS sensor 6 is communicated with the outside; an ADC chip 7 for converting an analog signal into a digital signal; the ADC chip 7 is arranged on the substrate 3 in the packaging space; the ADC chip 7 is connected with the MEMS sensor 6, and a pouring sealant 8 for packaging each part is arranged in the packaging space.
Referring to the circuit diagram of fig. 4, when the air channel monitoring sensor works, the plastic shell 1 and the fitting 9 are installed in a matching manner, and the fitting 9 and the plastic shell 1 are sealed by a silicone O-ring 10. Because the MEMS sensor 6 on the substrate 3 is communicated with the outside, the MEMS sensor 6 can detect an outside pressure signal, the ADC chip 7 connected with the MEMS sensor 6 obtains a digital quantity by PGA amplification, filtering and AD conversion of a smaller analog signal, and after calibration and compensation, the MEMS sensor 6 can obtain data after temperature compensation and transmits the data to the outside through a bus.
In the embodiment of the application, the MEMS sensor 6 is mounted on the substrate 3 by silk-screen glue, the substrate 3 is a circuit board, and the circuit board has a material grade of FR-4. So select, the problem of hard power has been solved to the thickness that 6 paster of control MEMS sensor are glued that can be effectual to BLT uniformity problem has been solved in batch production process, makes MEMS sensor 6's performance uniformity promote greatly, still great reduction material cost.
In the embodiment of the application, the MEMS sensor 6 is a diffused silicon piezoresistive pressure chip sensor, the output of the MEMS sensor 6 is an I2C bus and has 4 pins, and the distance between two adjacent pins is 2.54. The connector with the 2.54-pitch space has low cost and can be matched with 4 pins to transmit signals. The ADC chip 7 selects a 24-bit ADC chip.
In the embodiment of the application, the potting adhesive 8 is an anti-corrosion adhesive, and can effectively protect the MEMS sensor 6 and the ADC chip 7.
The utility model discloses with MEMS sensor and ADC chip package together, through acquireing disposable coefficient after, only need the temperature compensation that a temperature point can be done the MEMS sensor, very big improvement calibration efficiency, great reduction calibration cost.
The above description is only for the preferred embodiment of the present invention, and the structure is not limited to the above-mentioned shape, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. An air duct monitoring sensor, comprising:
the plastic shell is used for packaging each part; the plastic shell is provided with a mounting groove for accommodating each part, and the central position of the mounting groove is communicated with the outside;
a substrate for mounting a component; the base plate is arranged in the mounting groove, a first position on the base plate corresponds to the center of the mounting groove, and the first position is communicated with the outside;
the stainless steel ring is used for forming a packaging space for packaging each part together with the substrate; the stainless steel ring is arranged on the substrate and surrounds the first position;
a MEMS sensor for detecting a pressure signal; the MEMS sensor is arranged at the first position of the packaging space and is communicated with the outside;
the ADC chip is used for converting the analog signal into a digital signal; the ADC chip is arranged on the substrate in the packaging space; wherein the content of the first and second substances,
the ADC chip is connected with the MEMS sensor, and pouring sealant used for packaging all parts is arranged in the packaging space.
2. The air duct monitoring sensor according to claim 1, wherein the MEMS sensor is mounted on the substrate by silk-screen glue.
3. The wind channel monitoring sensor of claim 1 or 2, wherein the substrate is a circuit board.
4. The wind channel monitoring sensor of claim 3, wherein the circuit board is rated for FR-4.
5. The wind channel monitoring sensor of claim 1 or 2, wherein the MEMS sensor is a diffused silicon piezoresistive pressure chip sensor.
6. The wind channel monitoring sensor of claim 1, wherein the output of the MEMS sensor is an I2C bus and has 4 pins, and the distance between two adjacent pins is 2.54 pitch.
7. The air channel monitoring sensor according to claim 1, wherein the potting adhesive is an anti-corrosive adhesive.
8. The air channel monitoring sensor according to claim 1, wherein a fitting is disposed on a surface of the plastic shell having the mounting groove, and the fitting and the plastic shell are sealed by a silicone O-ring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921657645.7U CN210293501U (en) | 2019-09-30 | 2019-09-30 | Air duct monitoring sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921657645.7U CN210293501U (en) | 2019-09-30 | 2019-09-30 | Air duct monitoring sensor |
Publications (1)
Publication Number | Publication Date |
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CN210293501U true CN210293501U (en) | 2020-04-10 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201921657645.7U Active CN210293501U (en) | 2019-09-30 | 2019-09-30 | Air duct monitoring sensor |
Country Status (1)
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CN (1) | CN210293501U (en) |
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2019
- 2019-09-30 CN CN201921657645.7U patent/CN210293501U/en active Active
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Address after: 518000 room 3001, room 3002, room 3003, room 3004, room 3005, block a, block 8, block C, Wanke Yuncheng phase III, Liuxin Fourth Street, Xili community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Huapu Microelectronics Co.,Ltd. Address before: 518000 East Floor 2, Building 3, Pingshan Private Enterprise Science Park, Taoyuan Street, Nanshan District, Shenzhen, Guangdong Patentee before: Shenzhen Huapu Microelectronics Co.,Ltd. |