CN111060236A - Silicon piezoresistive pressure sensor packaging assembly structure - Google Patents
Silicon piezoresistive pressure sensor packaging assembly structure Download PDFInfo
- Publication number
- CN111060236A CN111060236A CN201811208601.6A CN201811208601A CN111060236A CN 111060236 A CN111060236 A CN 111060236A CN 201811208601 A CN201811208601 A CN 201811208601A CN 111060236 A CN111060236 A CN 111060236A
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- tube shell
- pressure sensor
- piezoresistive pressure
- temperature
- silicon piezoresistive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
Abstract
The invention discloses a silicon piezoresistive pressure sensor packaging assembly structure, wherein heating sheets are pasted between two substrates pasted with silicon piezoresistive pressure sensor chips, bonding leads, pins, a temperature measuring element and a temperature control tube shell and are arranged at two ends of a heat insulation tube shell, one surface with an air duct of the heat insulation tube shell is pasted with a first mechanical support tube shell, and the first mechanical support tube shell is connected with a second mechanical support tube shell and a third mechanical support tube shell. The advantages are that: (1) according to the invention, through the structure of the substrate and the three layers of tube shells, the integrated packaging and assembly aiming at the temperature control of the silicon piezoresistive pressure sensor chip and the multi-range chip composite scheme are realized; (2) the sensor chip and the temperature measuring probe are covered in a small space by the temperature control tube shell processed by the heat conducting material, and the periphery of the sensor chip is insulated by the heat insulation tube shell, so that the temperature control performance and the temperature measuring precision are improved, and a stable constant temperature environment can be provided for the sensor chip.
Description
Technical Field
The invention belongs to a microelectronic machine and a pressure sensor, and particularly relates to a packaging assembly structure of a silicon piezoresistive pressure sensor.
Background
The silicon piezoresistive pressure sensor is the most mature technology in silicon micro-pressure sensors, has the advantages of small volume, high sensitivity, small process difficulty and low cost, and is widely applied to the fields of aerospace, industrial control, consumer electronics and the like. By utilizing micromachining and integration technologies, silicon piezoresistive pressure sensors have been miniaturized, integrated, intelligentized, serialized and standardized, and developed in the direction of high reliability.
However, the silicon piezoresistive pressure sensor has large temperature drift in the working temperature range (commonly-45-85 ℃), which affects the comprehensive precision of the sensor used under the full-temperature condition, and a temperature control system can be introduced to maintain the sensor chip in a relatively stable temperature environment, so that the temperature drift is reduced, and the performance of the sensor in the full-temperature range is improved. In addition, because the accuracy of the sensor is usually calculated according to the full-scale numerical value, the reading accuracy of a single sensor in a low-pressure range is relatively low, and the other sensor in the low-pressure range is specially used for measuring the pressure in the low-pressure range, and then multi-range chip composite measurement is carried out, so the reading accuracy of the test in the whole pressure range is improved.
As described above, the scheme of combining chip temperature control with multi-range chip composition can improve the comprehensive accuracy of the silicon piezoresistive pressure sensor, and at least two sensor chips with different ranges are required for implementation, one temperature control system for each chip, and other mechanical and gas circuit connection structures, and the structure is more complex than that of the conventional silicon piezoresistive pressure sensor, and there is no package assembly structure form that can be effectively compatible with two design schemes, so that it is necessary to provide a package assembly structure scheme to implement reliable package and assembly of each part structure.
Disclosure of Invention
The invention aims to provide a silicon piezoresistive pressure sensor packaging assembly structure which can package a plurality of complicated parts into a smaller volume, and has the advantages of simple process, good performance and low cost.
The technical scheme of the invention is as follows: a silicon piezoresistive pressure sensor packaging assembly structure comprises a substrate, a silicon piezoresistive pressure sensor chip is arranged on the substrate, a bonding lead connects the input and output ends of the silicon piezoresistive pressure sensor chip to pins on the substrate, a temperature measuring element is arranged near the silicon piezoresistive pressure sensor chip on the substrate, a temperature control tube shell is sleeved outside the substrate, a heating sheet is arranged on the upper surface of the temperature control tube shell, heating sheets are attached to the middle of two substrates attached with the silicon piezoresistive pressure sensor chip, the bonding lead, the pins, the temperature measuring element and the temperature control tube shell and arranged at two ends of the heat insulation tube shell, the pins on the two substrates are connected with leads, the temperature measuring element and the heating sheet on the two substrates are connected with the leads and penetrate through lead holes of the heat insulation tube shell, one surface of the heat insulation tube shell with an air guide tube is adhered to a first mechanical support tube shell, the first mechanical support tube shell and a second mechanical, And the leads of the silicon piezoresistive pressure sensor chip, the heating sheet and the temperature measuring element are connected with the measurement and control circuit board, and the leads of power input, signal output and the like are led out through a lead hole of the third mechanical support tube shell.
The chip of the silicon piezoresistive pressure sensor is fixed by coating a proper amount of silicon rubber at the position of the substrate on which the chip is arranged.
The thickness of the silicon rubber is 0.3 mm-0.5 mm.
The temperature control tube shell is processed by pure copper and is in a circular cap shape, and two through holes are reserved on the side wall of the temperature control tube shell for leading out a lead of a temperature measuring probe and leading in external air pressure.
The temperature control tube shell is bonded with the substrate through silicon rubber.
And one surface with the air duct in the heat insulation pipe shell is bonded and solidified with the first mechanical support pipe shell through epoxy resin structural adhesive.
The heat insulation pipe shell is processed by PA engineering plastics, and is cylindrical, one side of the heat insulation pipe shell is provided with a gas guide pipe, the opposite side of the heat insulation pipe shell is provided with a lead hole, and two ends of the cylinder are of a step structure and are convenient to assemble.
The invention has the beneficial effects that: (1) according to the invention, through the structure of the substrate and the three layers of tube shells, the integrated packaging and assembly aiming at the temperature control of the silicon piezoresistive pressure sensor chip and the multi-range chip composite scheme are realized; (2) according to the invention, the sensor chip and the temperature measurement probe are covered in a very small space through the temperature control tube shell processed by the heat conduction material, and the periphery of the sensor chip is insulated by the heat insulation tube shell, so that the temperature control performance and the temperature measurement precision are improved, and a stable constant temperature environment can be provided for the sensor chip; (3) the invention compounds the chips with different measuring ranges into the same heat insulation pipe shell, and uniformly introduces pressure, thereby realizing the combination of the chips with different measuring ranges, having very compact structure and being beneficial to the control of the volume; (4) the invention fully utilizes common materials and components, has simple structure, convenient implementation and low cost, and can be widely applied to the packaging assembly process of the silicon piezoresistive pressure sensor which needs complex structural designs such as chip temperature control, core body compounding and the like.
Drawings
FIG. 1 is a schematic diagram of a silicon piezoresistive pressure sensor chip, a temperature measuring element and a substrate;
FIG. 2 is a schematic cross-sectional view of the structure after attachment of the temperature control enclosure with the heater chip;
FIG. 3 is a schematic cross-sectional view of the structure after the insulating shell has been affixed;
fig. 4 is a cross-sectional view of the package assembly structure after the mechanical support structure is attached.
In the figure: 1 silicon piezoresistive pressure sensor chip, 2 substrates, 3 bonding leads, 4 pins, 5 temperature measuring elements, 6 temperature control tube shells, 7 heating plates, 8 heat insulation tube shells, 9 first mechanical support tube shells, 10 second mechanical support tube shells, 11 third mechanical support tube shells, 12 measurement and control circuit boards and 13 wires.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
As shown in fig. 1, a package assembly structure of a silicon piezoresistive pressure sensor comprises a substrate 2, a silicon piezoresistive pressure sensor chip 1 is mounted in the center of the substrate 2, the silicon piezoresistive pressure sensor chip 1 is fixed by coating a proper amount of silicon rubber at the position of the chip mounted on the substrate 2, the thickness of the silicon rubber is about 0.3mm to 0.5mm, an input/output end of the silicon piezoresistive pressure sensor chip 1 is connected to a pin 4 on the substrate 2 by a bonding lead 3, and a temperature measuring element 5 is mounted on the substrate 2 near the mounted chip by the silicon rubber.
As shown in fig. 2, a temperature control tube shell 6 is sleeved outside a substrate 2, the temperature control tube shell 6 is made of pure copper and is in a circular cap shape, and two through holes are reserved on the side wall for leading out a lead of a temperature measuring probe and leading in external air pressure. The temperature control tube shell 6 covers the silicon piezoresistive pressure sensor chip 1 and the temperature measuring element 5 and is directly buckled on the step of the pre-processed substrate 2, then the bonding between the temperature control tube shell 6 and the substrate 2 is realized by silicon rubber, and the heating sheet 7 is adhered to the center of the upper surface of the temperature control tube shell 6 by heat conduction double-sided adhesive.
As shown in figure 3, a heating plate 7 is pasted between two substrates 2 pasted with a silicon piezoresistive pressure sensor chip 1, a bonding lead 3, a pin 4, a temperature measuring element 5 and a temperature control tube shell 6 and is buckled at two ends of a heat insulation tube shell 8, the heat insulation tube shell 8 is processed by PA engineering plastics, and is cylindrical, an air guide tube is reserved at one side, a lead hole is reserved at the opposite side, and two ends of the cylinder are of a step structure and are convenient to assemble. The pins 4 on the two substrates 2 are connected with the conducting wires, and the temperature measuring elements 5 and the heating plates 7 on the two substrates 2 are connected with the conducting wires and penetrate through the lead holes of the heat insulation pipe shell 8.
As shown in fig. 4, one side of the heat insulation pipe shell 8 with the air duct is bonded and solidified with the first mechanical support pipe shell 9 through epoxy structural adhesive, the first mechanical support pipe shell 9 is connected with the second mechanical support pipe shell 10 and the third mechanical support pipe shell 11, the measurement and control circuit board 12 is fixed in the third mechanical support pipe shell 11, the sensor chip, the heating plate, the lead 13 of the temperature measurement element is connected with the measurement and control circuit board 12, the lead 13 of the power input and signal output is led out through the lead hole of the third mechanical support pipe shell 11, the first mechanical support pipe shell 9 is used for fixing the internal structure and the air duct, the third mechanical support pipe shell 11 is used for installing the circuit board and leading the power line and the signal line, and the second mechanical support pipe shell 10 is used for supporting the whole structure.
A packaging assembly structure of a silicon piezoresistive pressure sensor comprises a substrate, a silicon piezoresistive pressure sensor chip, a bonding lead, a pin, a heating element, a temperature measuring element, a temperature control tube shell, a heat insulation tube shell, a mechanical support tube shell, a measurement and control circuit board, a double-sided adhesive tape, a bonding adhesive, a structural adhesive and the like. The sensor chip is attached to the substrate, the temperature measuring element is arranged beside the sensor chip, the temperature control tube shell with the heating sheet attached to the sensor chip covers the periphery of the chip and the temperature measuring element, the temperature control tube shell is embedded in the heat insulation tube shell to achieve unified introduction of heat insulation and pressure, the mechanical support tube shell is arranged on the outermost layer to achieve internal structure fixing and external connection, and the measurement and control circuit board is arranged inside the mechanical support tube shell to achieve measurement and control of the temperature control system and the sensor.
The substrate is made of ceramic insulating material and is used for adhering the sensor chip, arranging pins and erecting other structures; the silicon piezoresistive pressure sensor chip is fixed in the center of the substrate through bonding glue and is connected with pins on the substrate through gold wire bonding wires; the heating element is a soft heating sheet, and the organic material is coated with insulation and is attached to the temperature control pipe shell; the temperature measuring element is a platinum resistance temperature probe, and a lead wire of the probe is subjected to insulation treatment and is pasted in the temperature control tube shell and near the sensor chip; the temperature control tube shell is made of pure metal with good heat conductivity, covers the periphery of the sensor chip, is provided with air inlets and lead holes, and is adhered with a heating sheet for heating so as to provide a stable constant temperature environment in the tube shell; the heat insulation pipe shells are made of engineering plastics with poor heat conductivity and are arranged outside the temperature control pipe shells, the plurality of temperature control pipe shells are nested in the heat insulation pipe shells, and the air guide pipes and the lead holes are designed to isolate the external temperature and be connected and fixed with an external mechanical support structure; the mechanical support tube shell is processed by a metal structure material, is arranged on the outermost layer, and is provided with a lead nozzle and a lead hole for fixing the internal structure of the sensor, connecting the internal structure of the sensor with the outside and the like; the measurement and control circuit board is fixed in the mechanical support tube shell, is connected with the heating element and the temperature measuring element and is used for controlling the work of the temperature control system; the double-sided adhesive tape is used for bonding the heating sheet on the temperature control pipe shell, and the selected double-sided adhesive tape has the performances of high temperature resistance, good heat conduction and the like; the bonding glue is silicon rubber and is used for mounting the pressure sensor chip and the temperature measuring element on the substrate, sealing and sticking the temperature control tube shell, the heat insulation tube shell and the substrate and the like; the structural adhesive is an epoxy resin structural adhesive and is used for sealing and fixing the sensor structure and the mechanical support tube shell, bonding all parts of the mechanical support tube shell and the like.
Fig. 1-4 show schematic views of the structure after completion of the steps of the packaging assembly. In the embodiment, two silicon piezoresistive pressure sensor chips with different pressure range ranges are selected for compounding, and a high-power heating sheet is adopted to heat the temperature control tube shells on two sides.
As shown in fig. 1, the substrate in this embodiment is processed from a ceramic material, and is in a cylindrical step shape, so as to facilitate assembly and sealing of the subsequent package. Firstly, coating a proper amount of silicon rubber at the position of a chip placed in the center of a substrate 2, wherein the thickness is about 0.3-0.5 mm, the area is similar to the size of the chip, then lightly pasting and installing a silicon piezoresistive pressure sensor chip 1, airing and curing for 24 hours at room temperature, and finishing the pasting and installing of the chip. Then, the input and output ends of the sensor are connected to the pins 4 on the substrate through the bonding wires 3, the temperature measuring element 5 is pasted by silicon rubber near the pasted chip, in the embodiment, a conventional temperature measuring probe with a miniature Pt1000 resistor is selected, and the pin of the probe is subjected to insulation treatment in advance. Because the present embodiment uses two chips with different measuring ranges, the above steps are repeated, and then another sensor chip and the temperature measuring probe are mounted on another substrate.
As shown in figure 2, a temperature control tube shell 6 is arranged, in the embodiment, the temperature control tube shell is processed by pure copper and is in a circular cap shape, and two through holes are reserved on the side wall for leading out a lead of a temperature measuring probe and leading in external air pressure. The sensor chip 5 and the temperature probe 5 are covered by the temperature control tube shell 6 and directly buckled on the pre-processed base plate step, then the bonding between the temperature control tube shell and the base plate is realized by silicon rubber, the temperature control tube shell is dried and cured for 24 hours at room temperature, and then the heating plate 7 is adhered to the center of the upper surface of the temperature control tube shell by heat conduction double-sided adhesive.
As shown in fig. 3, the heat insulation tube shell 8 is installed, the heat insulation tube shell in this embodiment is made of PA engineering plastics, and is designed into a cylinder shape, one side of the heat insulation tube shell is provided with a gas guide tube, the other side of the heat insulation tube shell is provided with a lead hole, and two ends of the cylinder are designed with a step structure to facilitate assembly. Two substrates adhered with a sensor chip 1, a temperature control tube shell 6 and the like are buckled at two ends of a heat insulation tube shell 8, a temperature measuring element 5 and a lead of a heating plate 7 are led out through a lead hole, then connecting gaps and open pores of the whole heat insulation tube shell except for an air guide hole are sealed by coating silicon rubber, the whole heat insulation tube shell is dried and cured for 24 hours at room temperature, then the leak rate of a packaging structure is tested by a leak detector, and if the leak rate cannot meet the requirement, multiple layers of silicon rubber are continuously coated for sealing.
As shown in fig. 4, the above-mentioned encapsulated structure is enclosed in a mechanical supporting package, the mechanical supporting package in this embodiment is made of stainless steel and is divided into three parts, the first mechanical supporting package 9 is used to fix the internal structure and air guide, the third mechanical supporting package 11 is used to mount the circuit board and guide the power and signal wires, and the second mechanical supporting package 10 is used to support the whole structure. The one side of taking the air duct in thermal-insulated tube 8 is glued through the epoxy structure and is bonded and the solidification with first mechanical support tube 9, notices air duct department and makes sealedly, needs to pass through leak hunting of leak hunting appearance and verify. And then fixing a measurement and control circuit board 12 in a third mechanical support tube shell 11, connecting wires 13 of a sensor chip, a heating sheet and a temperature measuring element with the circuit board 12, leading out the wires 13 of power input, signal output and the like through a lead hole of the third mechanical support tube shell 11, finally adhering all parts of the three mechanical support tube shells together through epoxy resin structural adhesive and curing to complete a packaging assembly.
The specific embodiments of the present invention have been described in detail, but the present invention is only the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-described embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (7)
1. The utility model provides a silicon piezoresistive pressure sensor encapsulation assembly structure which characterized in that: the temperature-measuring device comprises a substrate (2), wherein a silicon piezoresistive pressure sensor chip (1) is arranged on the substrate (2), a bonding lead (3) connects the input and output ends of the silicon piezoresistive pressure sensor chip (1) to a pin (4) on the substrate (2), a temperature-measuring element (5) is arranged near the silicon piezoresistive pressure sensor chip (1) on the substrate (2), a temperature-controlling tube shell (6) is sleeved outside the substrate (2), a heating sheet (7) is arranged on the upper surface of the temperature-controlling tube shell (6), the two silicon piezoresistive pressure sensor chips (1), the bonding lead (3), the pin (4), the temperature-measuring element (5) and the temperature-controlling tube shell (6) are adhered with heating sheets (7) in the middle of the substrate (2) and are arranged at two ends of a heat-insulating tube shell (8), the pins (4) on the two substrates (2) are connected with leads, the temperature-measuring element (5) on the substrate (2) and the heating sheets (7) are connected with the leads and penetrate through lead holes, one side of taking the air duct in thermal-insulated tube shell (8) bonds with first mechanical support tube shell (9), first mechanical support tube shell (9) and second mechanical support tube shell (10), third mechanical support tube shell (11) are connected, wire (13) and observing and controlling circuit board (12) of silicon piezoresistive pressure sensor chip (1), heating plate (7), temperature measuring element (5) link to each other, wire (13) such as power input and signal output are drawn forth through the pin hole of third mechanical support tube shell (11).
2. The silicon piezoresistive pressure sensor package assembly structure of claim 1, wherein: the silicon piezoresistive pressure sensor chip (1) is fixed by coating a proper amount of silicon rubber at the position of the substrate (2) where the chip is arranged.
3. The silicon piezoresistive pressure sensor package assembly structure of claim 2, wherein: the thickness of the silicon rubber is 0.3 mm-0.5 mm.
4. The silicon piezoresistive pressure sensor package assembly structure of claim 1, wherein: the temperature control tube shell (6) is processed by pure copper and is in a circular cap shape, and two through holes are reserved on the side wall for leading out a lead of a temperature measuring probe and leading in external air pressure.
5. The silicon piezoresistive pressure sensor package assembly structure of claim 4, wherein: the temperature control tube shell (6) is bonded with the substrate (2) through silicon rubber.
6. The silicon piezoresistive pressure sensor package assembly structure of claim 1, wherein: and one surface with the air duct in the heat insulation pipe shell (8) is bonded and solidified with the first mechanical support pipe shell (9) through epoxy resin structural adhesive.
7. The silicon piezoresistive pressure sensor package assembly structure of claim 1, wherein: the heat insulation pipe shell (8) is made of PA engineering plastics, and is cylindrical, an air guide pipe is reserved on one side, a lead hole is reserved on the opposite side, and two ends of the cylinder are of a step structure and are convenient to assemble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811208601.6A CN111060236A (en) | 2018-10-17 | 2018-10-17 | Silicon piezoresistive pressure sensor packaging assembly structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811208601.6A CN111060236A (en) | 2018-10-17 | 2018-10-17 | Silicon piezoresistive pressure sensor packaging assembly structure |
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| CN111060236A true CN111060236A (en) | 2020-04-24 |
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| CN201811208601.6A Pending CN111060236A (en) | 2018-10-17 | 2018-10-17 | Silicon piezoresistive pressure sensor packaging assembly structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112345127A (en) * | 2020-09-30 | 2021-02-09 | 北京自动化控制设备研究所 | Data fusion method for double-core composite silicon piezoresistive pressure sensor |
| CN112378553A (en) * | 2020-11-06 | 2021-02-19 | 北京自动化控制设备研究所 | Silicon piezoresistive pressure sensor with online temperature control calibration and temperature calibration method thereof |
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Application publication date: 20200424 |
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