WO2020228700A1

WO2020228700A1 - Sensor and sensor manufacturing method

Info

Publication number: WO2020228700A1
Application number: PCT/CN2020/089796
Authority: WO
Inventors: 聂泳忠
Original assignee: 西人马联合测控（泉州）科技有限公司
Priority date: 2019-05-13
Filing date: 2020-05-12
Publication date: 2020-11-19
Also published as: CN110319956A; CN110319956B

Abstract

A sensor and a sensor manufacturing method. The sensor comprises two or more pressure sensing chips arranged in parallel in a first direction. The two or more pressure sensing chips comprise: a first pressure sensing chip (100) comprising a first pressure sensing film (110) and a first side wall (120) connected to the periphery of the first pressure sensing film (110), the first side wall (120) enclosing a first opening (130); and a second pressure sensing chip (200) comprising a second pressure sensing film (210) and a second side wall (220) connected to the periphery of the second pressure sensing film (210), the second side wall (220) enclosing a second opening (230), the second opening (230) facing toward the first pressure sensing chip (100), and the first opening (130) facing away from the second pressure sensing chip (200). A pressure sensing beam (240) is further connected to the second pressure sensing film (210), the pressure sensing beam (240) extends out of the second opening (230) in the first direction, and the pressure sensing beam (240) and the first pressure sensing film (110) are arranged at a preset distance interval to enable the first pressure sensing film (110) to be in contact and connection with the pressure sensing beam (240) when deformed under force. The sensor and the sensor manufacturing method avoid the phenomenon of measuring a small pressure by using a relatively thick pressure sensing film, and thus the measurement precision of the sensor can be effectively improved.

Description

Sensor and manufacturing method of sensor

Cross references to related applications

This application claims the priority of Chinese Patent Application No. 201910395482.8 entitled "Sensor and Sensor Manufacturing Method" filed on May 13, 2019, and the entire content of this application is incorporated herein by reference.

Technical field

This application relates to the technical field of detection equipment, and in particular to a sensor and a manufacturing method of the sensor.

Background technique

Metal film pressure sensors have the advantages of good stability, high accuracy, and suitable for harsh environments. They are widely used in the measurement of pressure parameters in various fields such as national defense, aerospace, industrial production and automatic control. Metal thin-film pressure sensors basically use metal materials for their sensitive components and structural parts. Because metal materials have high elastic modulus and yield strength, they are compared with silicon-based pressure sensors based on piezoresistance and resonance. , It has great advantages in the measurement of large-range pressure (greater than 10MPa). At present, the measurement of large-range pressure parameters basically uses metal film pressure sensors.

At this stage, the metal film pressure sensor basically realizes the design of pressure sensors with different ranges by changing the thickness of the pressure-sensitive film of the sensitive element. That is, the larger the sensor range, the thickness of the pressure-sensitive film is relatively thicker, and vice versa. However, if the sensor has a large range, when the product has a small pressure measurement requirement, a thicker pressure-sensitive film will be used to measure the small pressure, which reduces the linearity of the pressure sensor, which leads to a decrease in the accuracy of the sensor.

Therefore, there is an urgent need for a new sensor and sensor manufacturing method.

Application content

The embodiments of the present application provide a sensor and a method for manufacturing the sensor, aiming to solve the problem of low measurement accuracy of the sensor.

One aspect of the embodiments of the present application provides a sensor, which includes two or more pressure-sensitive chips arranged side by side along a first direction. The two or more pressure-sensitive chips include: a first pressure-sensitive chip, including a first pressure-sensitive film and a connection On the first side wall on the peripheral side of the first pressure-sensitive film, the first side wall encloses a first opening; the second pressure-sensitive chip includes a second pressure-sensitive film and a second pressure-sensitive film connected to the peripheral side of the second pressure-sensitive film A side wall, the second side wall is enclosed to form a second opening, the second opening is disposed toward the first pressure-sensitive chip, and the first opening is disposed away from the second pressure-sensitive chip; wherein, the second pressure-sensitive film is also connected with a pressure-sensitive beam , The pressure-sensitive beam protrudes from the second opening in the first direction, and the pressure-sensitive beam and the first pressure-sensitive film are arranged at a predetermined distance apart, so that the first pressure-sensitive film can contact and connect with the pressure-sensitive beam when deformed under force .

Another aspect of the present application also provides a method for manufacturing a sensor, including:

Prepare two or more pressure-sensitive chips, the two or more pressure-sensitive chips include a first pressure-sensitive chip and a second pressure-sensitive chip, the first pressure-sensitive chip includes a first pressure-sensitive film and is connected to the peripheral side of the first pressure-sensitive film The first side wall is enclosed to form a first opening, the second pressure-sensitive chip includes a second pressure-sensitive film and a second side wall connected to the peripheral side of the second pressure-sensitive film, and the second side wall encloses A second opening is formed, a pressure sensitive beam is also connected to the second pressure sensitive film, and the pressure sensitive beam extends from the second opening;

Connect the first pressure-sensitive chip and the second pressure-sensitive chip, and arrange the first pressure-sensitive chip and the second pressure-sensitive chip side by side so that the first opening is set away from the second pressure-sensitive chip, and the second opening is arranged toward the first pressure-sensitive chip , The pressure-sensitive beam and the first pressure-sensitive film are set at a preset distance apart.

In the present application, the sensor includes two or more pressure-sensitive chips arranged side by side along a first direction, and the two or more pressure-sensitive chips include a first pressure-sensitive chip and a second pressure-sensitive chip that are cascaded. During the use of the sensor , The first pressure-sensitive chip is first subjected to force to perform pressure detection. When the first pressure-sensitive chip is forced, the first pressure-sensitive film of the first pressure-sensitive chip is deformed by force. When the deformation of the first pressure-sensitive film is greater than or equal to When the distance is preset, the first pressure-sensitive film and the pressure-sensitive beam of the second pressure-sensitive chip are in contact and connected, and the pressure is transmitted to the second pressure-sensitive film through the pressure-sensitive beam, so that pressure detection can continue through the second pressure-sensitive chip . This application does not increase the range of the sensor by changing the thickness of the pressure-sensitive film of the sensitive element. This application uses the method of cascading two or more pressure-sensitive chips to measure the pressure in sections. When the pressure is lower, the range is smaller. When the pressure is high, two or more pressure-sensing chips are used for cascade measurement, which avoids the phenomenon of measuring small pressures with a thicker pressure-sensitive film, and can effectively improve the measurement accuracy of the sensor.

Description of the drawings

By reading the following detailed description of the non-limiting embodiments with reference to the accompanying drawings, other features, purposes and advantages of the present application will become more apparent, wherein the same or similar reference signs represent the same or similar features.

Fig. 1 is a schematic structural diagram of a sensor according to an embodiment of the present application;

2 is a schematic structural diagram of a second pressure-sensing chip of a sensor according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of an adapter plate of a sensor according to an embodiment of the present application

Fig. 4 is a schematic flow diagram of a sensor manufacturing method of the present application.

Description of reference signs:

100. The first pressure-sensitive chip;

110. First pressure sensitive film; 120, first side wall; 121, first outer wall surface, 122, second outer wall surface; 123, stop surface; 130, first opening; 140, first circuit board; 141, The first through hole; 150, the first connecting line;

200. The second pressure-sensitive chip;

210. The second pressure-sensitive film; 220, the second side wall; 230, the second opening; 240, the pressure-sensitive beam; 250, the second circuit board; 251, the second through hole; 260, the second connecting line;

300. Electrical connectors;

400. Adapter board;

410. The first relief hole; 420. The second relief hole; 430. The first inner wall surface, 440, the second inner wall surface; 450, the supporting surface;

500. Shell;

510. Top plate; 511. Connecting hole; 520. Side plate; 521. Support part; 522. First branch; 523. Second branch;

600. Wire.

Detailed ways

The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are proposed in order to provide a comprehensive understanding of this application. However, it is obvious to those skilled in the art that this application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application. In the drawings and the following description, at least part of the well-known structures and technologies are not shown in order to avoid unnecessary obscurity of the application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

In the description of this application, it should be noted that, unless otherwise specified, "plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", and " The orientation or positional relationship indicated by “outside” is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a reference to the present application. Application restrictions. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.

The orientation words appearing in the following description are all directions shown in the figure, and do not limit the specific structure of the embodiments of the present application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Integrally connected; it can be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in this application can be understood according to the specific circumstances.

In order to better understand the present application, the sensor and the manufacturing method of the sensor according to the embodiments of the present application will be described in detail below with reference to FIGS. 1 to 4.

Fig. 1 is a schematic structural diagram of a sensor provided by an embodiment of the application, and Fig. 2 is a schematic structural diagram of a part of Fig. 1. It can be seen from Fig. 1 and Fig. 2 that the sensor includes two or more sensors along the first direction (the Y direction in Fig. 1 ) Pressure-sensitive chips arranged in parallel, two or more pressure-sensitive chips include: a first pressure-sensitive chip 100, including a first pressure-sensitive film 110 and a first sidewall 120 connected to the peripheral side of the first pressure-sensitive film 110, A side wall 120 encloses the first opening 130; the second pressure-sensitive chip 200 includes a second pressure-sensitive film 210 and a second side wall 220 connected to the peripheral side of the second pressure-sensitive film 210. The second side wall 220 surrounds The second opening 230 is formed together, and the second opening 230 is disposed toward the first pressure-sensitive chip 100, and the first opening 130 is disposed away from the second pressure-sensitive chip 200; wherein, the second pressure-sensitive film 210 is also connected with a pressure-sensitive beam 240, The pressure-sensitive beam 240 protrudes from the second opening 230 in the first direction, and the pressure-sensitive beam 240 and the first pressure-sensitive film 110 are arranged at a predetermined distance apart, so that the first pressure-sensitive film 110 can be deformed by force. The pressure beam 240 is in contact and connection.

Wherein, the arrangement of more than two pressure-sensitive chips is not limited to this. The two or more pressure-sensitive chips may also include a third pressure-sensitive chip. The overall structure of the third pressure-sensitive chip is the same as that of the second pressure-sensitive chip 200. The three pressure-sensitive chips are located on the side of the second pressure-sensitive chip 200 away from the first pressure-sensitive chip 100, the third pressure-sensitive chip is also provided with a pressure-sensitive beam 240, and the pressure-sensitive beam 240 and the second pressure-sensitive chip on the third pressure-sensitive chip The two pressure sensitive films 210 are arranged at a predetermined distance apart. In addition, the two or more pressure-sensitive chips may also include a fourth pressure-sensitive chip disposed on the side of the third pressure-sensitive chip away from the second pressure-sensitive chip 200, and the like.

The specific value of the preset distance is not limited here, as long as the first pressure-sensitive film 110 can contact and connect with the pressure-sensitive beam 240 when the first pressure-sensitive film 110 is deformed under force. Preferably, the preset distance is less than or equal to the maximum deformation amount of the first pressure-sensitive film 110. Here, the pressure-sensitive beam 240 can not only realize the cascade connection of the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200, but also can protect the first pressure-sensitive film 110 to prevent excessive deformation of the first pressure-sensitive film 110. If it is damaged, the service life of the first pressure-sensitive chip 100 is increased.

In the embodiment of the present application, the sensor includes two or more pressure-sensitive chips arranged side by side along a first direction, and the two or more pressure-sensitive chips include a first pressure-sensitive chip 100 and a second pressure-sensitive chip 200 that are cascaded. During the use of the sensor, the first pressure-sensitive chip 100 first receives force and performs pressure detection. When the first pressure-sensitive chip 100 is stressed, the first pressure-sensitive film 110 of the first pressure-sensitive chip 100 is deformed by force. When the deformation of the first pressure-sensitive film 110 is greater than or equal to the preset distance, the first pressure-sensitive film 110 and the pressure-sensitive beam 240 of the second pressure-sensitive chip 200 are in contact and connected, and the pressure is transmitted to the second pressure-sensitive film through the pressure-sensitive beam 240. The pressure-sensitive film 210 can continue to perform pressure detection through the second pressure-sensitive chip 200. This application does not increase the range of the sensor by changing the thickness of the pressure-sensitive film of the sensitive element. This application uses the method of cascading two or more pressure-sensitive chips to measure the pressure in sections. When the pressure is lower, the range is smaller. When the pressure is high, two or more pressure-sensing chips are used for cascade measurement, which avoids the phenomenon of measuring small pressures with a thicker pressure-sensitive film, and can effectively improve the measurement accuracy of the sensor.

The range of the first pressure-sensitive film 110 and the second pressure-sensitive film 210 is not limited herein. Preferably, the range of the first pressure-sensitive film 110 is smaller than the range of the second pressure-sensitive film 210. During the use of the sensor, the first pressure sensing chip 100 is first used to perform pressure detection. The first pressure sensing film 110 has a small range, making the sensor suitable for detecting small pressure measurement. When the pressure to be measured is large, the first pressure-sensitive film 110 and the pressure-sensitive beam 240 contact each other, and the second pressure-sensitive chip 200 is used to perform pressure detection through the pressure-sensitive beam 240, so that the sensor is also suitable for detecting large pressure.

The specific range of the first pressure-sensitive film is not limited here, for example, the range of the first pressure-sensitive film is less than or equal to 10Mpa, and the range of the second pressure-sensitive film is greater than 10MPa.

The shapes of the first pressure-sensitive film 110 and the first side wall 120 are not limited here. For example, the first pressure-sensitive film 110 is circular, the first side wall 120 is circular, and the ring-shaped first side wall 120 is connected At the edge of the circular first pressure-sensitive film 110, the entire first pressure-sensitive chip 100 has a "cup" shape. The component under test applies pressure to the first pressure-sensitive film 110 from the first opening 130, so that the first pressure-sensitive film 110 is deformed in a direction toward the pressure-sensitive beam 240.

The shapes of the second pressure-sensitive film 210 and the second side wall 220 are also not limited. For example, the second pressure-sensitive film 210 is circular, the second side wall 220 is circular, and the circular second side wall 220 is connected to The edges of the circular second pressure-sensitive film 210 make the first pressure-sensitive chip 100 a "cup" shape as a whole. The pressure-sensitive beam 240 is forced to deform the second pressure-sensitive film 210 in a direction away from the first pressure-sensitive chip 100.

Furthermore, the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200 are further provided with functional layers, and the functional layers are lithographically formed to form a Wheatstone bridge. When there is a pressure change, that is, the first pressure-sensitive film 110 or the second pressure-sensitive film When the membrane 210 is deformed under a force, the resistance of the Wheatstone bridge changes, which causes the output of the Wheatstone bridge to change, thereby converting the pressure signal into an electrical signal output and completing the pressure detection.

The position of the pressure-sensitive beam 240 on the second pressure-sensitive film 210 is not limited. For example, the pressure-sensitive beam 240 is connected to the middle part of the second pressure-sensitive film 210 in the transverse direction (the X direction shown in FIG. 1 ). When the second pressure-sensitive film 210 is circular, the pressure-sensitive beam 240 is connected to the middle position of the second pressure-sensitive film 210 in the radial direction. The force of the second pressure-sensitive membrane 210 is more balanced, and the accuracy of the detection result is ensured.

In some optional embodiments, the first pressure-sensitive chip 100 further includes: a first circuit board 140 disposed on the side of the first pressure-sensitive film 110 close to the second pressure-sensitive chip 200, and the first circuit board 140 is disposed through There is a first through hole 141, and the pressure-sensitive beam 240 extends from the first through hole 141; the first connecting line 150 passes through the first through hole 141 and is connected to the first pressure-sensitive film 110 and the first circuit board 140 between.

In these alternative embodiments, the first circuit board 140 is disposed between the first pressure-sensitive film 110 and the second pressure-sensitive chip 200, and the first circuit board 140 is provided with a first through hole 141 to make the pressure-sensitive beam 240 can pass through the first through hole 141, and will not prevent the first pressure-sensitive film 110 from contacting and connecting with the pressure-sensitive beam 240 when deformed under force. The first connecting wire 150 passes through the first through hole 141 and is connected between the first pressure-sensitive film 110 and the first circuit board 140, so that the output signal on the first pressure-sensitive film 110 can be transmitted to the first circuit board 140.

Further, the second pressure-sensitive chip 200 further includes: a second circuit board 250 disposed on the side of the second pressure-sensitive film 210 away from the first pressure-sensitive chip 100, and a second through hole is formed through the second circuit board 250 251; a second connecting wire 260, passing through the second through hole 251 and connected between the second pressure-sensitive film 210 and the second circuit board 250; the sensor also includes an electrical connector 300, connected to the first circuit board 140 and Between the second circuit board 250.

In these alternative embodiments, the second pressure-sensitive chip 200 includes a second circuit board 250 and a second connecting wire 260. The second circuit board 250 is provided with a second through hole 251 so that the second connecting wire 260 can pass through. The second through hole 251 is connected between the second pressure-sensitive film 210 and the second circuit board 250 to transmit the output signal on the second pressure-sensitive film 210 to the second circuit board 250. In addition, the sensor also includes an electrical connector 300, which is connected between the first circuit board 140 and the second circuit board 250, so that the signals between the first circuit board 140 and the second circuit board 250 can be mutually transmitted, The external wire 600 only needs to be connected to the second circuit board 250 or the first circuit board 140 to receive the output signals on the first circuit board 140 and the second circuit board 250 at the same time, so as to facilitate the connection between the sensor and the external wire 600.

The arrangement of the electrical connector 300 is not limited here. For example, the electrical connector 300 is a wire 600 or a rod-shaped conductive rod. Preferably, the electrical connector 300 is rod-shaped and supports and connects to the first circuit board 140 and Between the second circuit boards 250, the electrical connectors 300 can provide support to the second circuit board 250 or the second circuit board 250, as long as the support is provided at one of the first circuit board 140 or the second circuit board 250 The frame (not shown in the figure) can simultaneously support the first circuit board 140 and the second circuit board 250 through the electrical connector 300.

As shown in FIG. 1, as long as the first circuit board 140 is provided with a support frame for supporting the first circuit board 140, the support frame can simultaneously support the first circuit board 140 and the second circuit board 250 through the electrical connector 300.

The number of electrical connectors 300 is also not limited. Preferably, the number of electrical connectors 300 is more than four, and more than four electrical connectors 300 are distributed at intervals on the peripheral side of the second pressure-sensitive chip 200 and are directed toward the second circuit board. 250 provides more stable support.

Please also refer to FIG. 3, in order to ensure the stability of the relative position between the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200, the sensor further includes an adapter plate 400 which is disposed on the first pressure-sensitive chip 100 And the second pressure-sensitive chip 200 to support the second pressure-sensitive chip 200; the adapter plate 400 is provided with a first relief hole 410 and a second relief hole 420 located on the peripheral side of the first relief hole 410, The pressure-sensitive beam 240 protrudes from the first relief hole 410, and the electrical connection member 300 is disposed through the second relief hole 420.

In these alternative embodiments, the second pressure-sensitive chip 200 can be supported by the adapter plate 400, thereby ensuring the stability of the relative position between the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200. The adapter plate 400 is provided with a first relief hole 410 and a second relief hole 420, so that the pressure-sensitive beam 240 can pass through the first relief hole 410, and the electrical connector 300 can be installed through the second relief hole 420 , It will not affect the contact connection between the pressure-sensitive beam 240 and the first pressure-sensitive film 110, nor will it affect the connection between the first circuit board 140 and the second circuit board 250.

Further, in order not to affect the contact connection between the pressure-sensitive beam 240 and the first pressure-sensitive film 110, the aperture of the first relief hole 410 is relatively large, so that the pressure-sensitive beam 240 and the adapter plate 400 face the first relief hole The inner walls of 410 are arranged at intervals.

In other optional embodiments, in order to improve the supporting strength of the electrical connector 300, the electrical connector 300 is fixed in the second relief hole 420, and an insulating layer, such as a glass insulator, is provided in the second relief hole 420. , The electrical connector 300 is sintered or bonded in the second relief hole 420.

There are many ways to arrange the adapter plate 400. In some optional embodiments, the adapter plate 400 has a first inner wall surface 430 facing the inner wall of the first relief hole 410, which is convex in the radial direction of the first relief hole 410. Out of the second inner wall surface 440 of the first inner wall surface 430 and the supporting surface 450 connected between the first inner wall surface 430 and the second inner wall surface 440, the second inner wall surface 440 is located on the first inner wall surface 430 close to the first pressure sensitive On one side of the chip 100, the second pressure-sensitive chip 200 is supported on the supporting surface 450 through the second side wall 220.

In these alternative embodiments, the first inner wall surface 430 and the second inner wall surface 440 have different sizes in the radial direction of the first relief hole 410, so that the connection between the first inner wall surface 430 and the second inner wall surface 440 The supporting surface 450 can extend along the radial direction of the first relief hole 410, so that the supporting surface 450 can provide support to the second side wall 220 of the second pressure-sensitive chip 200 to ensure that the second pressure-sensitive chip 200 and the adapter plate 400 are opposite The stability of the location.

In order to better protect the first pressure-sensitive chip 100, the second pressure-sensitive chip 200 and the adapter board 400 from external damage, the sensor further includes a housing 500, which includes a top plate 510 and a side connected to the peripheral side of the top plate 510 The housing 500 is sleeved outside the first pressure-sensitive chip 100, the second pressure-sensitive chip 200 and the adapter board 400 through the side plate 520, and is connected to the first pressure-sensitive chip 100, the second pressure-sensitive chip 200 and the adapter The board 400 provides protection.

The shapes of the top plate 510 and the side plate 520 are not limited here. In some alternative embodiments, in order to be compatible with the circular first pressure sensitive film 110 and the second pressure sensitive film 210, and the circular first side The wall 120 and the second side wall 220 are matched, the top plate 510 is circular, the side plate 520 is circular, and the circular side plate 520 is connected to the edge of the top plate 510.

In some optional embodiments, the top plate 510 is also provided with a through connection hole 511 so that the wire 600 can pass through the connection hole 511 to connect to the second circuit board 250.

The relative position between the housing 500 and the first pressure-sensitive chip 100 is not limited here. In order to ensure the stability of the relative position between the first pressure-sensitive chip 100 and the housing 500, in some optional embodiments, The outer peripheral surface of the first side wall 120 includes a first outer wall 121, a second outer wall 122 protruding from the first outer wall 121 in the radial direction of the first pressure-sensitive film 110, and a second outer wall 122 connected to the first outer wall 121 and the second outer wall 121. The stop surface 123 between the outer wall surfaces 122 and the end of the side plate 520 away from the top plate 510 stop at the stop surface 123 to ensure the stability of the relative position between the housing 500 and the first pressure sensitive chip 100.

Further, the inner surface of the side plate 520 is provided with a supporting portion 521, and the supporting portion 521 protrudes from the inner surface of the side plate 520, and the adapter plate 400 is overlapped on the side of the supporting portion 521 away from the first pressure-sensitive chip 100. The adapter board 400 is supported between the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200 through the supporting portion 521.

Wherein, the side plate 520 and the top plate 510 enclose a accommodating cavity for accommodating the first pressure-sensitive chip 100, the second pressure-sensitive chip 200 and the adapter plate 400, and the inner side of the side plate 520 means that the side plate 520 faces the accommodating cavity The inner side.

The arrangement of the supporting portion 521 is not limited here. For example, when the side plate 520 is annular, the supporting portion 521 is annular, and the annular supporting portion 521 protrudes from the inner surface of the side plate 520, and the adapter plate 400 is entirely overlapped on the supporting portion 521 to protect the stability of the relative position between the adapter plate 400 and the supporting portion 521.

The shape of the adapter plate 400 is also not limited. In order to fit the shape of the second sensor chip and the support portion 521, the adapter plate 400 is in the shape of a circular plate, and the round plate-shaped adapter plate 400 overlaps the ring. -Shaped support portion 521 on. Furthermore, the cross-section of the first relief hole 410 is circular, and the supporting surface 450 is annular, so that the ring-shaped second side wall 220 is clamped on the supporting surface 450 of the first relief hole 410.

The arrangement of the side plate 520 of the housing 500 is not limited here. The side plate 520 may be an integral type, and the side plate 520 and the top plate 510 can be detachably connected, so that the first pressure-sensitive chip 100 can be connected to the housing 500 from the housing 500. The opposite opening of the top plate 510 is placed in the housing 500, and the second pressure-sensitive chip 200 and the adapter plate 400 can be placed in the housing 500 from the position of the top plate 510.

In some preferred embodiments, the side plate 520 includes a first part 522 and a second part 523 that are successively distributed in the first direction, the first part 522 is connected to the top plate 510, and the second part 523 and the first part The division part 522 is detachably connected, the second division part 523 is stopped on the stopping surface 123, and the support part 521 is disposed on the second division part 523.

In these alternative embodiments, since the side plate 520 is divided into the first part 522 and the second part 523, and the support part 521 is provided in the second part 523, during the sensor assembly process, Assemble the first sensor chip on the side of the second part 523 away from the first part 522, then continue to assemble the second sensor chip of the adapter board 400 on the second part 523, and finally connect the first part 522 and The top plate 510 is arranged on the second sensor chip to facilitate the assembly and molding of the sensor.

There are many ways to detachably connect the first part 522 and the second part 523. For example, the first part 522 is provided with a protrusion facing the end surface of the second part 523, and the second part 523 faces the first part 522. The end surface is provided with a groove, and the protrusion and the groove are matched, so that the first part 522 and the second part 523 are snap-connected to each other through the groove and the protrusion.

The second embodiment of the present application also provides a method for manufacturing a sensor, including:

Prepare two or more pressure-sensitive chips. The two or more pressure-sensitive chips include a first pressure-sensitive chip 100 and a second pressure-sensitive chip 200. The first pressure-sensitive chip 100 includes a first pressure-sensitive film 110 and is connected to the first pressure-sensitive chip. The first side wall 120 on the peripheral side of the pressure film 110 encloses the first side wall 120 to form a first opening 130. The second pressure sensitive chip 200 includes a second pressure sensitive film 210 and a peripheral side of the second pressure sensitive film 210. A second side wall 220, the second side wall 220 is enclosed to form a second opening 230, the second pressure sensitive film 210 is also connected with a pressure sensitive beam 240, and the pressure sensitive beam 240 extends from the second opening 230;

Connect the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200, and arrange the first pressure-sensitive chip 100 and the second pressure-sensitive chip 200 in parallel, so that the first opening 130 is set away from the second pressure-sensitive chip 200, and the second opening 230 Disposed toward the first pressure-sensitive chip 100, the pressure-sensitive beam 240 and the first pressure-sensitive film 110 are arranged at a predetermined distance apart.

Please also refer to Fig. 4 to briefly describe the manufacturing method of the sensor shown in Fig. 1. The manufacturing method of the sensor includes:

Step S01: Prepare parts.

It includes the preparation of structural components such as the first pressure-sensitive chip 100, the second pressure-sensitive chip 200, the adapter board 400, the housing 500, and the electrical connection member 300 by mechanical or manual methods. After preparing the parts, clean the parts for later use.

Step S02: Connect the electrical connector and the adapter board.

The electrical connector 300 is fixed in the first relief hole 410 of the adapter plate 400 by means of sintered glass insulators or bonding, to complete the connection between the electrical connector 300 and the adapter plate 400.

Step S03: Connect the first pressure-sensitive chip 100, the second subsection 523 of the side plate 520, and the adapter plate 400.

The second sub-part 523 is sleeved outside the first side wall 120 of the first pressure sensitive chip 100, and the second sub-part 523 is fixed on the stop surface 123 outside the first side wall 120 by welding or the like. Then, the adapter plate 400 is fixed to the supporting portion 521 in the second sub-part 523 by welding, etc., thereby completing one of the first pressure-sensitive chip 100, the second sub-section 523 of the side plate 520, and the adapter plate 400. The connection between.

It can be understood that, before step S03, the first connecting wire 150 can also be connected between the first circuit board 140 and the first pressure-sensitive film 110.

Step S04: Connect the second pressure sensing chip and the adapter board.

The second pressure-sensitive chip 200 is fixed on the supporting surface 450 in the first relief hole 410 of the adapter board 400 by welding or the like to complete the connection between the second pressure-sensitive chip 200 and the adapter board 400.

Step S05: Connect the second circuit board and the electrical connector.

The second circuit board 250 and the electrical connector 300 are connected by soldering or the like.

It is understandable that the sequence of the above steps S03 and steps S04 and S05 can be exchanged, that is, the second pressure-sensitive chip 200 can be fixed to the adapter board 400, and the second circuit board 250 and the electrical connector 300 can be connected afterwards. The adapter plate 400 is fixed on the supporting part 521 of the second sub-part 523.

Step S06: Connect the wires and the second circuit board, and connect the first subsection and the second subsection.

Connect the wire 600 to the second circuit board 250, then cover the first sub-part 522 and the top plate 510 outside the second pressure-sensitive chip 200, and connect the first sub-part 522 and the second sub-part 523 to complete the whole Assembly of the sensor.

It is understandable that, during the entire manufacturing process, each component can be prepared in advance, or the component can be temporarily prepared before the component is used, as long as it does not affect the processing of the sensor.

The sensor prepared by this method includes a first pressure-sensitive chip 100 and a second pressure-sensitive chip 200 that are cascaded by a pressure-sensitive beam 240. When the first pressure-sensitive chip 100 is overstressed and exceeds the pressure of the first pressure-sensitive chip 100 In the range, the first pressure-sensitive film 110 of the first pressure-sensitive chip 100 and the pressure-sensitive beam 240 are in contact and connected, so that the second pressure-sensitive chip 200 starts to perform detection through the pressure-sensitive beam 240. This application does not increase the range of the sensor by changing the thickness of the pressure-sensitive film of the sensitive element. The sensor manufactured in this application cascades two or more pressure-sensitive chips, and uses a method of segmented measurement of pressure. The pressure sensing chip with a smaller range is used for measurement. When the pressure is large, two or more pressure sensing chips are used for cascading measurement, which avoids the phenomenon of measuring small pressures with a thicker pressure sensing film and can effectively improve the measurement accuracy of the sensor.

This application can be implemented in other specific forms without departing from its spirit and essential characteristics. For example, the algorithm described in a specific embodiment can be modified, and the system architecture does not deviate from the basic spirit of the application. Therefore, the current embodiments are regarded as illustrative rather than restrictive in all aspects, and the scope of this application is defined by the appended claims rather than the foregoing description, and falls within the meaning and equivalents of the claims. All changes within the scope are thus included in the scope of this application.

Claims

A sensor, comprising more than two pressure-sensitive chips arranged side by side along a first direction, and the two or more pressure-sensitive chips include:

The first pressure-sensitive chip includes a first pressure-sensitive film and a first side wall connected to the peripheral side of the first pressure-sensitive film, and the first side wall encloses a first opening;

The second pressure-sensitive chip includes a second pressure-sensitive film and a second side wall connected to the peripheral side of the second pressure-sensitive film. The second side wall encloses a second opening, and the second opening faces the The first pressure-sensitive chip is arranged, and the first opening is arranged away from the second pressure-sensitive chip;

Wherein, the second pressure-sensitive film is further connected with a pressure-sensitive beam, the pressure-sensitive beam protrudes from the second opening in the first direction, and the pressure-sensitive beam and the first The pressure film is arranged at a preset distance so that the first pressure sensitive film can be in contact with the pressure sensitive beam when deformed under a force.
The sensor according to claim 1, wherein the pressure-sensitive beam is connected to the middle part of the second pressure-sensitive film in the transverse direction.
The sensor according to claim 1, wherein the first pressure-sensitive chip further comprises:

The first circuit board is arranged on the side of the first pressure-sensitive film close to the second pressure-sensitive chip, a first through hole is formed through the first circuit board, and the pressure-sensitive beam is formed by the first Protruding from the through hole;

The first connecting wire passes through the first through hole and is connected between the first pressure-sensitive film and the first circuit board.
The sensor according to claim 3, wherein the second pressure sensing chip further comprises:

The second circuit board is arranged on a side of the second pressure-sensitive film away from the first pressure-sensitive chip, and a second through hole is penetrated through the second circuit board;

A second connecting wire, passing through the second through hole and connected between the second pressure-sensitive film and the second circuit board;

The sensor also includes an electrical connector connected between the first circuit board and the second circuit board.
The sensor according to claim 4, wherein the electrical connector is rod-shaped and is supported and connected between the first circuit board and the second circuit board, and there are more than four electrical connectors, More than four electrical connectors are distributed at intervals on the peripheral side of the second pressure sensitive chip.
The sensor according to claim 4, further comprising:

An adapter board is arranged between the first pressure-sensitive chip and the second pressure-sensitive chip to support the second pressure-sensitive chip;

The adapter plate is provided with a first relief hole and a second relief hole located on the peripheral side of the first relief hole, the pressure sensitive beam extends from the first relief hole, and the electrical The connecting piece is disposed through the second relief hole.
The sensor according to claim 6, wherein the inner wall of the adapter plate facing the first relief hole has a first inner wall surface, and the first relief aperture protrudes upward from the first inner wall surface The second inner wall surface and the supporting surface connected between the first inner wall surface and the second inner wall surface, the second inner wall surface is located on the first inner wall surface close to the first pressure-sensitive chip On the side, the second pressure-sensitive chip is supported on the supporting surface through the second side wall.
The sensor according to claim 6, wherein:

The outer peripheral surface of the first side wall includes a first outer wall surface, a second outer wall surface protruding from the first outer wall surface in the radial direction of the first pressure-sensitive diaphragm, and a second outer wall surface connected to the first outer wall surface and The stop surface between the second outer wall surfaces;

The sensor further includes a housing including a top plate and a side plate connected to the peripheral side of the top plate, and the housing is sleeved on the first pressure-sensitive chip and the second pressure-sensitive chip through the side plate. The pressure-sensitive chip and the adapter plate are outside, and the end of the side plate away from the top plate is stopped at the stop surface, and the top plate is provided with a through connecting hole so that the wire can pass through the The connecting hole is connected to the second circuit board.
The sensor according to claim 8, wherein the inner surface of the side plate is provided with a support part, the support part protrudes from the inner surface of the side plate, and the adapter plate overlaps the support A side away from the first pressure-sensitive chip, so as to support the adapter board between the first pressure-sensitive chip and the second pressure-sensitive chip through the supporting portion.
The sensor according to claim 9, wherein the side plate comprises a first part and a second part that are successively distributed in the first direction, the first part is connected to the top plate, and the The second sub-section and the first sub-section are detachably connected, and the second sub-section is stopped on the stopping surface, and the supporting portion is arranged on the second sub-section.
A method for manufacturing a sensor, including:

Prepare two or more pressure-sensitive chips, the two or more pressure-sensitive chips include a first pressure-sensitive chip and a second pressure-sensitive chip, and the first pressure-sensitive chip includes a first pressure-sensitive film and is connected to the first pressure-sensitive chip. A first side wall on the peripheral side of the pressure film, the first side wall encloses a first opening, and the second pressure-sensitive chip includes a second pressure-sensitive film and a first side wall connected to the second pressure-sensitive film Two side walls, the second side wall encloses to form a second opening, the second pressure sensitive film is further connected with a pressure sensitive beam, and the pressure sensitive beam extends from the second opening;

Connect the first pressure-sensitive chip and the second pressure-sensitive chip, and arrange the first pressure-sensitive chip and the second pressure-sensitive chip side by side so that the first opening faces away from the second pressure-sensitive chip The second opening is arranged toward the first pressure-sensitive chip, and the pressure-sensitive beam and the first pressure-sensitive film are arranged at a predetermined distance apart.