CN215984983U - Air pressure sensing device - Google Patents
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- CN215984983U CN215984983U CN202122122786.2U CN202122122786U CN215984983U CN 215984983 U CN215984983 U CN 215984983U CN 202122122786 U CN202122122786 U CN 202122122786U CN 215984983 U CN215984983 U CN 215984983U
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Abstract
The utility model provides an air pressure sensing device which comprises a shell, a substrate, a pressure measuring assembly and a first bonding structure, wherein the shell is provided with a first bonding structure; the shell is fixedly arranged on the substrate to form a packaging structure with an opening structure at least one end; the pressure measuring component comprises a signal collecting part and a signal processing part, the signal collecting part is opposite to the opening structure, the signal collecting part is fixed in the packaging structure through a second bonding structure, the second bonding structure covers at least part of the bottom surface of the signal collecting part and a part of the side wall connected with at least part of the bottom surface of the signal collecting part, the signal processing part passes through the first bonding structure is fixed and arranged in the packaging structure, the hardness of the second bonding structure is not larger than that of the first bonding structure, so that the signal collecting part cannot incline due to the existence of a gap at the bottom of the signal collecting part, the unbalanced pressure of the signal collecting part is avoided, and the accuracy of the detection pressure value of the signal collecting part is effectively guaranteed.
Description
Technical Field
The utility model relates to the technical field of electronic products, in particular to an air pressure sensing device.
Background
The pressure sensor is based on a product internal Micro-Electro-Mechanical System (MEMS) to sense the change of air pressure value, and different air pressures can cause different amounts of deformation of the MEMS surface membrane. Typically, the MEMS device is bonded to the PCB substrate using silicone.
In the air pressure sensor in the prior art, an adhesive is generally used for fixedly supporting an MEMS chip, and the coating area of the adhesive is smaller than the cross-sectional area of the MEMS chip, but it can be known through common knowledge that when the MEMS chip is fixedly connected to a substrate or an ASIC chip, the adhesive near the edge of the MEMS chip absorbs moisture in the external environment relatively more easily, and the adhesive at the center point of the MEMS chip absorbs moisture only after the adhesive near the edge of the MEMS chip absorbs moisture or absorbs more moisture, that is, the adhesive at the center point of the MEMS chip absorbs moisture in the external environment relatively less, the adhesive at the bottom of the MEMS chip absorbs moisture in the external environment relatively more equivalently, and thus irreversible performance drift of the MEMS chip is difficult to avoid; and the coating area of the bonding glue is smaller than the cross-sectional area of the MEMS chip, so that the problem that the MEMS chip is not firmly fixedly connected with the substrate or the ASIC chip is solved, the MEMS chip is easy to incline to a certain degree in the process of sensing pressure because a gap which is not filled with the glue exists at the bottom of the MEMS chip, the membrane is unbalanced in pressure due to the inclination of the MEMS chip, and errors are generated in the detection pressure value.
Moreover, for the manufacture of waterproof air pressure sensing device, the whole cavity needs to be filled with silicone gel, and also because the bottom of the MEMS chip and the ASIC chip, especially the four corners, have unfilled pores, which easily causes the air in the pores to expand at high temperature and generate bubbles in the silicone gel during high temperature use in the subsequent Surface Mount Technology (SMT), thereby affecting the transmission of force.
Therefore, there is a need to provide a novel air pressure sensing device to solve the above problems in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an air pressure sensing device, which aims to solve the problems that the bottom of a signal acquisition part is inclined to a certain degree due to the existence of a gap, so that the signal acquisition part is unbalanced in pressure, and errors are generated in a detection pressure value, and a waterproof air pressure sensing device manufactured by filling silicon gel into a packaging structure also has the defect that bubbles are generated in the heated silicon gel due to the existence of the gap so as to influence the transmission of force, and the detection sensitivity of the signal acquisition part is improved.
In order to achieve the purpose, the air pressure sensing device comprises a shell, a substrate, a pressure measuring assembly and a first bonding structure;
the shell is fixedly arranged on the substrate to form a packaging structure with an opening structure at least one end;
the pressure measuring assembly with the base plate electricity is connected, the pressure measuring assembly includes signal acquisition portion and signal processing portion, the signal acquisition portion with open structure is relative, the signal acquisition portion is fixed in through second adhesive structure in the packaging structure, second adhesive structure covers the at least partial bottom surface of signal acquisition portion and with the partial lateral wall that the at least partial bottom surface of signal acquisition portion meets, the signal processing portion passes through first adhesive structure fixed set up in the packaging structure, second adhesive structure's hardness is not more than first adhesive structure's hardness.
The air pressure sensing device has the beneficial effects that: the pressure measuring assembly is electrically connected with the substrate and comprises a signal acquisition part and a signal processing part, and the signal acquisition part is opposite to the opening structure, so that the detection sensitivity of the signal acquisition part is improved; the signal acquisition part is fixed in the packaging structure through a second bonding structure, the second bonding structure covers at least part of the bottom surface of the signal acquisition part and part of the side wall connected with at least part of the bottom surface of the signal acquisition part, the signal processing part is fixedly arranged in the packaging structure through the first bonding structure, and the hardness of the second bonding structure is not more than that of the first bonding structure, so that the signal acquisition part cannot incline to a certain degree due to the existence of a gap at the bottom of the signal acquisition part, the unbalanced pressure of the signal acquisition part is avoided, and the accuracy of the pressure value detection of the signal acquisition part is effectively guaranteed; meanwhile, for the waterproof air pressure sensing device manufactured by pouring the silicone gel into the packaging structure, the second bonding structure covers at least part of the bottom surface of the signal acquisition part and part of the side wall connected with at least part of the bottom surface of the signal acquisition part, so that no gap exists at the bottom of the signal acquisition part, and no air bubble is generated in the heated silicone gel, thereby avoiding the transmission of influence.
Preferably, the height of the part of the side wall of the second adhesive structure contacting the contact bottom surface does not exceed 1/2 of the side wall height of the signal collecting part. The beneficial effects are that: the bottom of the signal acquisition part is not provided with a gap, and the second bonding structure is effectively prevented from being stuck to the top surface of the signal acquisition part to influence the use of the signal acquisition part due to the fact that the second bonding structure is stuck to the top surface of the signal acquisition part due to the phenomenon of glue climbing.
Preferably, the second adhesive structure is a flexible adhesive structure, and the height of the part of the side wall, which is covered by the second adhesive structure and is connected with the contact bottom surface, does not exceed 1/2 of the height of the side wall of the signal acquisition part.
Preferably, at least part of the space in the shell is filled with pouring sealant, the pressure measuring assembly is embedded by the pouring sealant, and the hardness of the pouring sealant is smaller than that of the second bonding structure. The beneficial effects are that: the air pressure sensing device is waterproof, detection sensitivity is improved, gaps do not exist at the bottoms of the signal acquisition part and the signal processing part, no bubbles are generated in the pouring sealant after heating, and transmission of influence is avoided.
Further preferably, the shell still includes epitaxial structure, epitaxial structure set up in open structure end just epitaxial structure's epitaxial surface pass through the arc inside wall with the inside wall of shell meets, the top surface of casting glue is not higher than the arc inside wall. The beneficial effects are that: avoid the pouring sealant takes place "to climb and glues" and leads to the colloid adhesion in extension portion, and in the sealed test of influence follow-up test procedure, this colloid can be in the same place product and test lid stick to and when absorbing in surface assembly technique in-process, the colloid can be in the same place product and suction nozzle stick to etc..
Preferably, the signal acquisition unit is electrically connected to the signal processing unit, and the first adhesive structure fixes the signal processing unit to the substrate.
Preferably, the first adhesive structure covers a bottom surface of the signal processing unit and a part of a side wall in contact with the bottom surface of the signal processing unit. The beneficial effects are that: the connection stability and firmness of the signal processing part and the substrate are ensured, for the waterproof air pressure sensing device manufactured by filling the silicon gel into the packaging structure, the first bonding structure covers the bottom of the signal processing part, so that no gap exists at the bottom of the signal processing part, no air bubble is generated in the heated silicon gel, and the transmission of influence is avoided.
Preferably, the signal acquisition part is fixed on the top surface of the signal processing part through the second bonding structure, and the second bonding structure covers the bottom surface of the signal acquisition part and a part of the side wall connected with the bottom surface of the signal acquisition part.
Preferably, the signal acquisition part is fixed to the substrate through the second bonding structure, and the second bonding structure covers the bottom surface of the signal acquisition part and a part of the side wall connected to the bottom surface of the signal acquisition part.
Preferably, the substrate is provided with a hollow structure, the signal acquisition part is opposite to the hollow structure, the signal acquisition part spans the hollow structure and is fixed on the top surface of the substrate through the second bonding structure so as to form a sealing structure surrounding the top opening of the hollow structure, and the signal acquisition part senses the pressure outside the substrate through the hollow structure. The beneficial effects are that: the detection sensitivity of the signal acquisition part is improved.
Preferably, the air pressure sensing device further comprises an electrical transmission structure, wherein the electrical transmission structure is arranged on the outer shell so as to be electrically connected with a grounding end and facilitate static electricity derivation. The beneficial effects are that: the static charge accumulated on the surface of the shell can be quickly released, and the antistatic capability of the device can be improved.
Drawings
FIG. 1 is a longitudinal cross-sectional view of a first air pressure sensing device of the present invention;
FIG. 2 is a top view of the first air pressure sensing device shown in FIG. 1;
FIG. 3 is a longitudinal cross-sectional view of a second air pressure sensing device of the present invention;
FIG. 4 is a top view of the second air pressure sensing device shown in FIG. 2;
fig. 5 is a longitudinal sectional view of a third air pressure sensing apparatus according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
In order to solve the problems in the prior art, embodiments of the present invention provide an air pressure sensing device, so as to solve the problems that the bottom of a signal acquisition portion is inclined to a certain extent due to a gap, so that the signal acquisition portion is unbalanced in pressure, an error occurs in a detected pressure value, and a waterproof air pressure sensing device manufactured by filling silicone gel into a packaging structure also affects transmission of force due to bubbles generated in the heated silicone gel due to the gap, and the detection sensitivity of the signal acquisition portion is improved.
In some embodiments of the present invention, the air pressure sensing device includes a housing, a substrate, a load cell assembly, and a first bonding structure;
the shell is fixedly arranged on the substrate to form a packaging structure with an opening structure at least one end;
the pressure measuring assembly is electrically connected with the substrate, the pressure measuring assembly comprises a signal collecting part and a signal processing part, the signal collecting part is opposite to the opening structure, the signal collecting part is fixed in the packaging structure through a second bonding structure, the second bonding structure covers at least part of the bottom surface of the signal collecting part and part of the side wall connected with at least part of the bottom surface of the signal collecting part, the signal processing part is fixedly arranged in the packaging structure through the first bonding structure, and the hardness of the second bonding structure is not greater than that of the first bonding structure, so that the signal collecting part cannot incline to a certain degree due to the existence of a gap at the bottom of the signal collecting part, the unbalanced pressure of the signal collecting part is avoided, and the accuracy of the pressure value detected by the signal collecting part is effectively guaranteed; meanwhile, for the waterproof air pressure sensing device manufactured by pouring the silicone gel into the packaging structure, the second bonding structure covers at least part of the bottom surface of the signal acquisition part and part of the side wall connected with at least part of the bottom surface of the signal acquisition part, so that no gap exists at the bottom of the signal acquisition part, no air bubble is generated in the heated silicone gel, the transmission of influence force is avoided, the hardness of the second bonding structure is not more than that of the first bonding structure, the detection sensitivity of the signal acquisition part is ensured, and the signal processing part does not have the requirement on the detection sensitivity, so that the signal processing part is only required to be stably fixed in the packaging structure.
In some embodiments of the utility model, the second bonded structure is the same structure as the first bonded structure, and the second bonded structure has a hardness equal to the hardness of the first bonded structure.
In other embodiments of the present invention, the second bonded structure has a different structure from the first bonded structure, and the second bonded structure has a hardness less than that of the first bonded structure.
In some embodiments of the present invention, the substrate is a conductive substrate, and specifically, the substrate 12 is a PCB substrate.
In some embodiments of the utility model, the housing is a conductive housing.
In some embodiments of the present invention, the second adhesive structure covers a portion of the sidewall that is adjacent to the contact bottom surface, the portion of the sidewall having a height that does not exceed 1/2 the height of the sidewall of the signal collection part.
In some embodiments of the present invention, the second adhesive structure is a flexible adhesive structure, and the height of the portion of the sidewall, which is covered by the second adhesive structure and is connected to the contact bottom surface, does not exceed 1/2 of the height of the sidewall of the signal collection part. Optionally, the second bonding structure is a hard bonding structure, and the height of the portion of the side wall, which is covered by the hard bonding structure and is connected with the contact bottom surface, is less than the height of the portion of the side wall, which is covered by the flexible bonding structure and is connected with the contact bottom surface, because the flexible bonding structure is more prone to generate a "glue climbing" phenomenon than the hard bonding structure.
In some embodiments of the present invention, the second adhesive structure is a soft adhesive, and has elasticity after being cured. Optionally, the second bonding structure is Si-based glue.
In some embodiments of the present invention, the first adhesive structure is a hard adhesive glue with a hardness of D50-D80. Optionally, the first bonding structure is an epoxy glue.
In some embodiments of the utility model, at least part of the space in the housing is filled with the pouring sealant, the pressure measuring assembly is embedded by the pouring sealant, the hardness of the pouring sealant is less than that of the second bonding structure, so as to manufacture a waterproof air pressure sensing device, improve the detection sensitivity, avoid gaps at the bottoms of the signal acquisition part and the signal processing part, avoid bubbles in the pouring sealant after heating, and avoid transmission of influence.
Optionally, the taper of the potting adhesive is 100-400 mm.
Further, the shell still includes epitaxial structure, epitaxial structure set up in open structure end just epitaxial structure's epitaxial surface pass through the arc inside wall with the inside wall of shell meets, the top surface of casting glue is not higher than the arc inside wall avoids the casting glue takes place "to climb glue" and leads to the colloid adhesion in epitaxial portion, and in the sealed test of influence follow-up test procedure, this colloid can be in the same place product and test lid to and when absorbing in the surface mounting technique in-process, the colloid can be in the same place product and suction nozzle gluing etc..
In some embodiments of the present invention, the signal collecting part is electrically connected to the signal processing part, and the first bonding structure fixes the signal processing part to the substrate.
In some embodiments of the present invention, the first adhesive structure covers a bottom surface of the signal processing part and a portion of the sidewall connected to the bottom surface of the signal processing part. The connection stability and firmness of the signal processing part and the substrate are ensured, for the waterproof air pressure sensing device manufactured by filling the silicon gel into the packaging structure, the first bonding structure covers the bottom of the signal processing part, so that no gap exists at the bottom of the signal processing part, no air bubble is generated in the heated silicon gel, and the transmission of influence is avoided.
In other embodiments of the present invention, the first adhesive structure is disposed on at least a portion of the bottom surface of the signal processing portion, and the coating area of the first adhesive structure is smaller than that of the bottom surface of the signal processing portion.
In some embodiments of the present invention, the first bonding structures are symmetrically distributed about an X-axis and/or a Y-axis passing through a center point of the signal processing part.
In other embodiments of the present invention, the first bonding structure is a hollow square-shaped structure, a hollow annular structure, a square-shaped structure, or a square-shaped structure.
In some specific embodiments of the present invention, the first bonding structure covers the bottom surface of the signal processing portion and a portion of the side wall connected to the bottom surface of the signal processing portion, and the second bonding structure covers at least a portion of the bottom surface of the signal collecting portion and a portion of the side wall connected to at least a portion of the bottom surface of the signal collecting portion, so that the signal collecting portion and the signal processing portion do not incline to a certain extent due to a gap existing at the bottom thereof, pressure imbalance of the signal collecting portion is avoided, and accuracy of pressure value detection of the signal collecting portion is effectively guaranteed; meanwhile, for the waterproof air pressure sensing device manufactured by pouring silicone gel into the packaging structure, the first bonding structure covers the bottom of the signal processing part, and the second bonding structure covers the bottom of the signal acquisition part, so that no gap exists between the signal acquisition part and the bottom of the signal processing part, no air bubble is generated in the heated silicone gel, and the transmission of influence is avoided.
In some embodiments of the present invention, the signal collecting part is fixed to the top surface of the signal processing part by the second adhesive structure, and the second adhesive structure covers the bottom surface of the signal collecting part and a part of the side wall connected to the bottom surface of the signal collecting part.
In some embodiments of the present invention, the load cell assembly further includes a lead, and the signal processing unit is electrically connected to the signal collecting unit and the substrate through the lead, respectively. Optionally, the wire is an alloy wire.
Fig. 1 is a longitudinal sectional view of a first air pressure sensing apparatus according to the present invention, and fig. 2 is a plan view of the first air pressure sensing apparatus shown in fig. 1.
In some embodiments of the present invention, referring to fig. 1 and fig. 2, a first air pressure sensing device 1 includes a housing 11 and a substrate 12, where the housing 11 is fixedly disposed on the substrate 12 to form a package structure (not shown) having an opening structure (not shown) at least at one end, the pressure measuring assembly (not shown) includes a signal processing portion 14 and a signal collecting portion 15, the signal collecting portion 15 is fixed on the top of the signal processing portion 14 through a second bonding structure 16, the second bonding structure 16 covers a bottom surface of the signal collecting portion 15 and a portion of a side wall connected to the bottom surface of the signal collecting portion 15, and the signal processing portion 14 and the signal collecting portion 15 are electrically connected through a first alloy wire 17; the bottom of the signal processing unit 14 is fixed to the substrate 12 by a first adhesive structure 18, and the signal processing unit 14 is electrically connected to the substrate 12 by a second alloy wire 19, specifically, the first adhesive structure 18 covers the bottom surface of the signal processing unit 14 and a part of the side wall contacting the bottom surface of the signal processing unit 14.
In other embodiments of the present invention, the air pressure sensing device is different from the first air pressure sensing device 1 in that the first adhesive structure 18 is disposed on at least a portion of the bottom surface of the signal processing portion 14, and the first adhesive structure 18 has a smaller coating area than the bottom surface of the signal processing portion 14.
In some embodiments of the present invention, referring to fig. 1, the housing 11 is a structure with two open ends, one open end is fixedly connected to the substrate 12, the other open end is provided with the annular extension structures 111, the open structures (not labeled in the figure) are formed between the extension structures 111, and the extension surfaces of the extension structures 111 are connected to the inner side wall 113 of the housing through the arc-shaped inner side wall 112.
In some specific embodiments of the present invention, referring to fig. 1, the first air pressure sensing device 1 is a waterproof barometer, the potting adhesive 13 filled in the housing 11 embeds the signal processing portion 14, the signal acquisition portion 15, the first alloy wire 17 and the second alloy wire 19, the potting adhesive 13 is solid and has elasticity, a top surface of the potting adhesive 13 is not higher than the arc-shaped inner side wall 112, when the first air pressure sensing device 1 works, the potting adhesive 13 can deform in response to a change in pressure, and after the signal acquisition portion 15 and the signal processing portion 14 detect the deformation, the sensed pressure information is transmitted to an external circuit structure through the substrate 12, so as to achieve measurement of air pressure.
In some embodiments of the present invention, referring to fig. 1, an opening structure (not shown) is disposed at the top of the housing 11 for facilitating pressurization, and the opening structure (not shown) is opposite to the signal acquisition portion 15, so that the pressure can be directly transmitted to the signal acquisition portion 15 through the potting adhesive 13, and the detection sensitivity of the signal acquisition portion 15 is improved.
In some specific embodiments of the present invention, the signal collecting unit 15 is an MEMS chip, that is, an electromechanical system manufactured on a silicon chip by using a semiconductor technology, and is used for converting external physical and chemical signals into electrical signals.
In some embodiments of the present invention, the signal processing unit 14 is an ASIC chip, i.e., an Application Specific Integrated Circuit.
Fig. 3 is a longitudinal sectional view of a second air pressure sensing apparatus according to the present invention, and fig. 4 is a plan view of the second air pressure sensing apparatus shown in fig. 2.
In other embodiments of the present invention, the signal collecting part is fixed to the substrate by the second adhesive structure, and the second adhesive structure covers a bottom surface of the signal collecting part and a portion of a sidewall connected to the bottom surface of the signal collecting part.
Specifically, referring to fig. 1, 3 and 4, the second air pressure sensing device 2 differs from the first air pressure sensing device 1 in that: the signal acquisition part 15 is fixed in through the second adhesive structure 16 the top surface of base plate 12, just the second adhesive structure 16 covers the bottom surface of signal acquisition part 15 and with the partial lateral wall that the bottom surface of signal acquisition part 15 meets, signal acquisition part 15 with the opening structure (not marked in the figure) at shell 11 top is relative to improve detectivity, signal processing part 14 passes through first binder 18 is fixed the top surface of base plate 12, specifically, first adhesive structure 18 covers the bottom surface of signal processing part 14 and with the partial lateral wall that the bottom surface of signal processing part 14 meets.
In other embodiments of the present invention, the air pressure sensing device is different from the second air pressure sensing device 2 in that the first adhesive structure 18 is disposed on at least a portion of the bottom surface of the signal processing portion 14, and the first adhesive structure 18 has a smaller coating area than the bottom surface of the signal processing portion 14.
Fig. 5 is a longitudinal sectional view of a third air pressure sensing apparatus according to the present invention.
In still other embodiments of the present invention, referring to fig. 5 and 3, the third air pressure sensing device 3 is different from the second air pressure sensing device 2 in that: the substrate 12 is provided with a hollow structure 121, the signal acquisition part 15 is opposite to the hollow structure 121, the signal acquisition part 15 spans the hollow structure 121 and is fixed on the top surface of the substrate 12 through the second bonding structure 16 to form a sealing structure surrounding an opening at the top of the hollow structure 121, so that the sealing structure isolates the packaging structure from an external environment, and the second bonding structure 16 covers part of the bottom surface of the signal acquisition part 15 and part of the side wall connected with part of the bottom surface of the signal acquisition part.
Further, referring to fig. 5, the top of the signal collecting part 15 is opposite to an opening structure (not shown) at the top of the housing 11, so that the signal collecting part 15 senses the pressure near one side of the top of the housing 11 through the opening structure (not shown), and the bottom of the signal collecting part 15 is opposite to the hollow structure 121, so that the signal collecting part 15 senses the pressure outside the substrate 12 through the hollow structure 121, that is, the signal collecting part 15 can receive the pressure change condition from the top and the bottom at the same time, thereby improving the detection sensitivity.
In some embodiments of the utility model, the first bonding structure and the second bonding structure are the same type of bonding structure, so that the bonding structure does not need to be replaced during construction, the operation is simple and convenient, and the investment cost is low.
In some embodiments of the present invention, the pressure measuring device further includes an electrical transmission structure disposed on the housing to electrically connect to a ground terminal and facilitate the discharge of static electricity, so that static charges accumulated on the surface of the housing can be rapidly discharged, and the antistatic capability of the device can be improved.
In some embodiments of the present invention, the electrical transmission structure is a metal wire, one end of which is connected to the housing, and the other end of which is electrically connected to a ground terminal.
Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the utility model as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (11)
1. The air pressure sensing device comprises a shell and a base plate, and is characterized by further comprising a pressure measuring assembly and a first bonding structure;
the shell is fixedly arranged on the substrate to form a packaging structure with an opening structure at least one end;
the pressure measuring assembly with the base plate electricity is connected, the pressure measuring assembly includes signal acquisition portion and signal processing portion, the signal acquisition portion with open structure is relative, the signal acquisition portion is fixed in through second adhesive structure in the packaging structure, second adhesive structure covers the at least partial bottom surface of signal acquisition portion and with the partial lateral wall that the at least partial bottom surface of signal acquisition portion meets, the signal processing portion passes through first adhesive structure fixed set up in the packaging structure, second adhesive structure's hardness is not more than first adhesive structure's hardness.
2. The pressure sensing device of claim 1, wherein the second adhesive structure covers a portion of the sidewall that is adjacent to the bottom surface, the portion of the sidewall having a height that does not exceed 1/2 the height of the sidewall of the signal collection portion.
3. The air pressure sensor according to claim 1, wherein the second adhesive structure is a flexible adhesive structure, and the height of the sidewall of the portion connected to the bottom surface covered by the second adhesive structure is not more than 1/2 of the height of the sidewall of the signal collecting part.
4. The pressure sensing device of claim 3, wherein at least a portion of the space within the housing is filled with a potting adhesive, the potting adhesive embedding the load cell assembly, the potting adhesive having a hardness less than a hardness of the second adhesive structure.
5. The pressure sensing device of claim 4, wherein the housing further comprises an extension structure, the extension structure is disposed at the opening structure end, an extension surface of the extension structure is connected to an inner sidewall of the housing through an arc-shaped inner sidewall, and a top surface of the potting adhesive is not higher than the arc-shaped inner sidewall.
6. The air pressure sensing device according to claim 2, wherein the signal collecting portion is electrically connected to the signal processing portion, and the first adhesive structure fixes the signal processing portion to the substrate.
7. The air pressure sensor according to claim 6, wherein the first adhesive structure covers a bottom surface of the signal processing unit and a portion of a side wall that is in contact with the bottom surface of the signal processing unit.
8. The air pressure sensor according to claim 6, wherein the signal collecting part is fixed to the top surface of the signal processing part by the second adhesive structure, and the second adhesive structure covers the bottom surface of the signal collecting part and a part of the side wall connected to the bottom surface of the signal collecting part.
9. The air pressure sensor according to claim 6, wherein the signal collecting portion is fixed to the substrate by the second adhesive structure, and the second adhesive structure covers a bottom surface of the signal collecting portion and a portion of a side wall of the signal collecting portion that is in contact with the bottom surface.
10. The air pressure sensing device according to claim 1, wherein the substrate is provided with a hollow structure, the signal collecting part is opposite to the hollow structure, the signal collecting part spans the hollow structure and is fixed on the top surface of the substrate through the second bonding structure to form a sealing structure surrounding an opening at the top of the hollow structure, and the signal collecting part senses the pressure outside the substrate through the hollow structure.
11. The air pressure sensing device according to claim 1, further comprising an electrical transmission structure disposed in the housing to electrically connect to ground and facilitate static electricity dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122122786.2U CN215984983U (en) | 2021-09-03 | 2021-09-03 | Air pressure sensing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122122786.2U CN215984983U (en) | 2021-09-03 | 2021-09-03 | Air pressure sensing device |
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| CN215984983U true CN215984983U (en) | 2022-03-08 |
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