CN1235024C - Pressure sensor module - Google Patents
Pressure sensor module Download PDFInfo
- Publication number
- CN1235024C CN1235024C CNB028011732A CN02801173A CN1235024C CN 1235024 C CN1235024 C CN 1235024C CN B028011732 A CNB028011732 A CN B028011732A CN 02801173 A CN02801173 A CN 02801173A CN 1235024 C CN1235024 C CN 1235024C
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- Prior art keywords
- pressure sensor
- pressure
- sensor assembly
- adapter
- sensor chip
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- 239000007788 liquid Substances 0.000 claims abstract description 13
- 230000004224 protection Effects 0.000 claims abstract description 5
- 230000004888 barrier function Effects 0.000 claims description 26
- 238000003466 welding Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000002349 favourable effect Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 210000005239 tubule Anatomy 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0672—Leakage or rupture protection or detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to a pressure sensor module for measuring the pressure of a corrosive medium. Conventional pressure sensor cells are modified by way of a pressure sensor chip for the purpose of corrosion protection, which requires a large volume of the liquid that transmits the pressure. This is disadvantageous for calibration and for a high measuring accuracy. The inventive pressure sensor module (1) uses a conventional sensor cell (5) that is connected to an adapter (21) that has a very small volume for a pressure-transmitting medium.
Description
Technical field
The present invention relates to a kind of pressure sensor assembly, which comprises at least a pressure sensor chip that is used for determining pressure.
Background technology
Pressure sensor assembly comprises for example some piezoresistive transducer elements, and they for example are widely used in the pressure survey of automotive air intake pipe.One of them pressure sensor chip is welded on the base, and this base has the glass lead-in wire that is used for the external electric web member.So available pressure welding silk of the electrical connection of pressure sensor chip and external electric web member are connected.A kind of pressure of medium for example affacts the back side of pressure sensor chip by a metallic sheath with this base welding.When absolute pressure is measured, under vacuum, welding a metal cap on this base.When relative pressure was measured, this lid had an opening.Pressure sensor chip is for example adopted the influence that prevents environment with a kind of gelinite.When the medium of heavy corrosion, can not use this sensor element, because corrosive medium can corrode pressure sensor chip or this gelinite.
From the known a kind of pressure sensor assembly of JP 2,000 046 666 A1; its sensor diaphragm is protected by gelinite in pressure tap; the dielectric corrosion but this gelinite also can be corroded; and because gelinite does not have big chemical-resistance or physical strength; so As time goes on its shape changes, thereby influence test result.
For this reason, prior art with a kind of barrier film and a kind of pressure transmission medium for example silicone oil the pressure indirect transfer to pressure sensor chip.The structure example of pressure sensor assembly with this oil vessel is as learning from 285 to 295 pages of AMA-Seminarband in 1989.In this structure, the oil volume around this pressure sensor chip is quite big.Because the thermic volume expansivity of silicone oil is than the volume expansivity height of sheathing material, when temperature variation, barrier film produces skew.Because the rigidity of can not ignore of this barrier film, so just build-up pressure on the pressure sensor chip of pressure sensor assembly, this pressure only produces and forges test signal by temperature variation.
In order to reduce the oil volume of this known pressure sensors assembly, for example reduce pressure transducer oil volume on every side with a kind of ceramic obturator.For this reason, this obturator needs one independent installation procedure.In this pressure sensor assembly, owing to there is big oil volume greatly in the cavity around the sensor with respect to the manufacturing tolerance of the cavity of barrier film below.
Like this, concerning higher measuring accuracy, just need in the oiling state, carry out the calibration of pressure sensor chip.In this case, it is long taking the required time of temperature measure when calibration, and this is because be present in high thermal capacity.In addition, in above-mentioned known pressure sensors assembly, the defective of pressure sensor chip may be only just be found making under the state.Thereby cause higher cost of spoiled goods, because whole assembly has all become waste product.
The easier assembly method of known a kind of usefulness is pressed the pressure sensor assembly of the principle work of oil vessel from DE 195 07 143 A1 or US-PS 5,595,939.This moment, a space by the pressure sensor chip in the plastic plug shell replaced reducing the obturator that oil volume is used.For this reason, carry out the sealing of barrier film and plug with an O RunddichtringO or a squeeze sealing member.There is such danger in this class sealing means, is promptly for example adhering under the situation of particle on damage of O RunddichtringO or sealing surface, and oil will flow out from the sensor inner chamber.In this pressure sensor assembly, the residual air that applies a high pressure and be mingled with in sensor when oiling because on barrier film pushes from the plastic material of the penetrable air molecule of sensor element, thereby cause such danger, be the designed pressure sensor chip of little pressure test scope and extrude residual air and cause damaging owing to the high pressure in the shell.
In addition, this pressure sensor chip need take for example to improve with capacitor the measure of Electro Magnetic Compatibility.Under above-mentioned known pressure sensors assembly situation, it is very expensive that these capacitors are integrated in the shell, thereby increases the manufacturing expense of this pressure sensor assembly.
Known a kind of pressure sensor assembly from JP 2,000 009 568 A1, this assembly is connected an adapter on the pressure sensor component, to determine a kind of pressure of liquid.Its structure is very complicated and have a big cumulative volume that transmits medium.
JP 11 316 166 A1 and DE 44 15 984 A1 or US-PS 5,629,538 disclose such pressure sensor chip, and they have layer protecting film on sensor diaphragm, in order to avoid sensor diaphragm is subjected to the corrosion of corrosive atmosphere.This layer diaphragm changes the performance and the test performance of this diaphragm in disadvantageous mode, nor enough protections of long period can be provided, and be thin because this layer diaphragm must be done enough, just can make sensor diaphragm realize good bending.
JP 81 36 380 A1 disclose a kind of pressure sensor assembly, and this assembly is connected on the adapter, in order to avoid pressure sensor chip is subjected to the corrosive medium corrosion.This structure must seal with an O RunddichtringO again, thereby causes the problems referred to above that the O RunddichtringO brings.
Summary of the invention
Compare with it, the present invention is intended to propose a kind of pressure sensor assembly, and it can just can make a kind of pressure sensor assembly cheapness and that have high measurement accuracy that is applicable to corrosion environment with simple methods.This high precision realizes by a large amount of minimizing oil volume.
The technical solution of purpose of the present invention is a kind of pressure sensor assembly that is used for determining the pressure sensor chip of pressure that comprises at least; it is connected with a pressure tap; this pressure tap is delivered to pressure on this pressure sensor chip; wherein; an adapter is connected with this pressure tap; this adapter bears pressure and by pressure tap this pressure is delivered on the pressure sensor chip; with this adapter protection pressure sensor chip; in order to avoid be subjected to damage the effect of the medium of pressure sensor chip; pressure sensor assembly is arranged in of wall and inserts in the hole; has a barrier film with pressure sensor assembly; with wall and a kind of medium adjacency; this medium and barrier film keep in touch and when medium freezed and expands, pressure sensor assembly partly shifted out from inserting in the hole.
So in pressure sensor assembly of the present invention, the thermal expansion of oil volume is very little to the influence of test signal.Therefore, the pressure sensor chip that is installed in the sensor element can be calibrated fast, thereby has avoided the time-consuming and long temperature measure when whole pressure sensor assembly.By the adjustment of sensor element, the waste product cost when pressure sensor assembly is calibrated is very little.Because sensor element specific pressure sensor module is little, can calibrate a plurality of sensor elements simultaneously.
A kind of favourable adapter of this pressure sensor assembly is to have a through hole, this through hole is connected on the pressure tap of sensor element in a side, then by a diaphragm seal, and the volume that is sealed like this injects a kind of liquid by favourable mode at opposite side.This adapter structure is simple, so cheap.
When this adapter has an additional hole, and can inject above-mentioned through hole to liquid by this hole the time, then be favourable.
Printed circuit board that for example has an existing element can be connected to by favourable mode on the external electric web member of pressure sensor chip of sensor element.Like this, other elements that are used to improve Electro Magnetic Compatibility just can be assembled to this printed circuit board by favourable mode.
The pressure sensor assembly shell can be furnished with electrical connectors by favourable mode.
Description of drawings
Some embodiments of the present invention schematically illustrate in the accompanying drawings and are elaborated in the following description.Accompanying drawing is depicted as:
Fig. 1 is a kind of axial cross section of sensor element with prior art of a pressure sensor chip;
Fig. 2 is the xsect of a kind of pressure sensor assembly of prior art;
Fig. 3 is the axial cross section of an adapter;
Fig. 4 a be have that a printed circuit board and one are electrically connected and the unassembled state of an adapter under sensor element;
Fig. 4 b is that whole elements of Fig. 4 a have been in the state that assembles;
Fig. 5 a is that an embodiment of a pressure sensor assembly constituting by the present invention is in knocked-down state;
Fig. 5 b is of the pressure sensor assembly that constitutes by the present invention shown in Fig. 5 a
The axial cross section of embodiment;
Fig. 5 c is another embodiment of a pressure sensor assembly that constitutes by the present invention of no printed circuit board; With
Fig. 6 is the axial cross section by another pressure sensor assembly of the present invention's formation.
Embodiment
Fig. 1 represents the axial cross section of a sensor element 5, and this sensor element has a pressure sensor chip 7 and for example is used for pressure sensor assembly 1 of the present invention (Fig. 5).Pressure sensor chip 7 for example is assembled on the glass substrate 11 with the anode pressure welding.Sensor element 5 has a for example dimeric shell 9, and glass substrate 11 for example is fixed in this shell by welding method.Pressure sensor chip 7 in pressure sensor housing 9 is electrically connected with sensor electrical Connection Element 15 by pressure welding silk 13, and these electrical connecting elements stretch out sensor outer housing 9.Pressure sensor chip 7 has for example diaphragm 17, and this diaphragm is subjected to a kind of medium effect at downside 49, and this medium is by for example additional metal tubule introducing as shown in phantom in FIG. of a pressure tap 19.Diaphragm 17 since this pressure action of medium thereon and flexible, thereby it produces a measuring-signal by crooked, this measuring-signal transmits by pressure welding silk 13.For sensor element 5, also can use other pressure sensor chip 7.In sensor outer housing 9, for example keep vacuum, measure so sensor element 5 can be used for absolute pressure.
Fig. 2 represents a pressure sensor assembly of prior art.
In this pressure sensor assembly, a kind of liquid 28 acts on as a kind of medium that transmits pressure on the diaphragm upside 47 of pressure sensor chip 7, also is provided with the electric contact of band pressure welding silk 13 at this upside.Liquid 28 is by 29 sealings of a barrier film, so pressure sensor chip 7 also can not be subjected to the effect of corrosive medium here.But the volume of the medium 28 of transmission pressure is quite big, because it comprises the whole surface of pressure sensor chip 7 and sensor Connection Element 15.In addition, for barrier film 29 does not contact pressure welding silk 13 or pressure sensor chip 7,7 must exist certain distance from barrier film 29 to pressure sensor chip.The so big volume that particularly transmits the medium 28 of pressure can cause above-mentioned problem.
Fig. 3 represents the axial cross section of an adapter 21, and this adapter is for example cylindrical, and the heart has a through hole 23 therein.Adapter 21 is connected in sensor side 25 on the pressure tap 19 of sensor element 5 (Fig. 5).Side on its opposite is then by a barrier film 29 these through holes 23 of sealing on the side medium 27.Between barrier film 29 and side medium 27, very little distance is arranged.
Fig. 4 a represent sensor element 5 will with adapter 21 and the situation that printed circuit board 36 is assembled successively.For example be furnished with printed circuit board 34 between sensor element 5 and adapter 21, this printed circuit board for example is electrically connected with at least one contact pilotage 37, and this contact pilotage then also for example is electrically connected (Fig. 5) with plug connector 39.
Each parts of Fig. 4 b presentation graphs 4a have been in the state that assembles.Hole 23 on the sensor side 25 of pressure tap 19 and adapter 21 is tightly connected.Adapter 21 protection diaphragms 17 are not subjected to the effect of corrosive medium.Printed circuit board 36 is connected with sensor Connection Element 15 conductions of sensor element 5 and for example passes through lead and the contact pilotage 37 on the printed circuit board 36 or for example directly be electrically connected (Fig. 5 c) with plug connector 39, so by external plug 43 (Fig. 5 a, b c) just can outwards set up electrical connection from sensor element 5.Printed circuit board 36 is not the essential parts of pressure sensor assembly 1 of the present invention.For example also available punching press grid replaces printed circuit board 36.
Fig. 5 a represents to be in the pressure sensor assembly of the present invention 1 of part confined state.Now a pressure sensor assembly shell 45 is installed on the structure shown in Fig. 4 b, and this shell for example mechanically is connected on the adapter 21.Sensor element 5 for example remains between sensor element 5 and the shell 45 with bonding agent by pressure sensor housing 45.Plug connector 39 for example is cast in and for example remains in the shell 45.In addition, the part of shell 45 and plug connector 39 constitute a plug 43, and plug connector 39 can insert this plug from the outside.
For example be provided with at least one electric device 41 on printed circuit board 36, this electric device for example is used for improving Electro Magnetic Compatibility.This class electric device for example is a capacitor.
Fig. 5 b represents the axial cross section of a pressure sensor assembly 1 that assembles by the present invention.Contact pilotage 37 is connected with plug connector 39 conductions a contact 57, for example by being welded to connect.Contact 57 also can prevent external corrosion by gelinite or bonding agent.When an external pressure affacted on the barrier film 29, this just produced crooked around the fixing barrier film 29 in its edge.
Fig. 5 c represents not have another embodiment of the pressure sensor assembly of the present invention 1 of printed circuit board 36.The wherein for example direct and sensor Connection Element 15 electricity connections of plug connector 39.Shell 45 for example can center on sensor element 5 and plug connector 39 injection mouldings or cast.
The advantage of pressure sensor assembly 1 of the present invention is that available commercially available sensor element 5 is measured the pressure of corrosive medium.
Fig. 6 represents the axial cross section of another pressure sensor assembly 1 of the present invention, and this pressure sensor assembly for example has a fixed head 51 and for example is fixed on the wall 53 with it.Pressure sensor assembly 1 imports in the patchhole 69 of this wall 53.Wall 53 is parts of pipeline 61 or receiver 61, and a kind of for example mordant medium 59 flows in this pipeline 61 or saves in this receiver 61.
Medium 59 can freeze, and because it directly in abutting connection with barrier film 29, so can make pressure become very big by barrier film 29 on diaphragm 17 by the expansion of the medium 59 that freezes, causes diaphragm 17 to break.So in the scope of barrier film 29, keep the volume of as far as possible little medium 59, be far reaching, keep very little so that the increase of the volume of the medium that freezes 59 is same.For fear of rupture of diaphragm, it is favourable freezing uniformly.This for example freeze uniformly can by the pressure of a side introduce 72 and the bottom outlet on diaphragm 29 and its opposite bottom uniform distance between 74 realize.
In addition, for fear of rupture of diaphragm, pressure sensor assembly 1 answers flexible fastening on wall 53.For example have certain elasticity and can reach this purpose by fixed head 51 is made.At this moment, fixed head 51 for example with resilient material for example latch plate make and be fixed at least two point of fixity 63, between these 2, fixed head 51 can be crooked.
Fig. 6 represents another kind of possibility.With a spring 55 and T shape part 66 for example a screw 66 pressure sensor assembly 1 flexibly is fixed on the wall 53.Screw 66 passes a hole of fixed head 51 and is screwed in the wall 53.Spring 55 is arranged between the fixed head 51 and screw 66 of rigidity.Its medi-spring 55 acts on screw 66 and the fixed head 51 like this, makes under the situation of spring 55 compressions in power of effect, can extrude pressure sensor assembly 1 to come from patchhole 69.The elastic force of its medi-spring 55 is to regulate like this, and promptly when the medium 59 that freezes expanded, spring 55 just was compressed.This is equally applicable to rubber-like fixed head 51.
O-ring seal 33 be positioned at barrier film 29 tops any axially so that reduce the friction of the medium that freezes between the inwall of adapter 21 and wall 53.
For the principle of work of pressure sensor assembly 1, this medium needn't necessarily have corrosivity.
Claims (13)
1. comprise a pressure sensor assembly that is used for determining the pressure sensor chip of pressure at least; it is connected with a pressure tap; this pressure tap is delivered to pressure on this pressure sensor chip; wherein; an adapter (21) is connected with this pressure tap (19); this adapter bears pressure and by pressure tap (19) this pressure is delivered on the pressure sensor chip (7); with this adapter protection pressure sensor chip (7); in order to avoid be subjected to damage the effect of the medium of pressure sensor chip (7); this pressure sensor assembly (1) has a barrier film (29); it is characterized by: this pressure sensor assembly (1) is arranged in the patchhole (69) of wall (53); this wall (53) and a kind of medium (59) adjacency; this medium and barrier film (29) keep in touch; when medium (59) freezed and expands, pressure sensor assembly (1) partly shifted out from patchhole (69).
2. by the pressure sensor assembly of claim 1, it is characterized by, adapter (21) has a through hole (23), and this through hole is gone up to be communicated with pressure tap (19) and to go up in medium one side (27) in sensor one side (25) and passed through a barrier film (29) and seal.
3. by the pressure sensor assembly of claim 2, it is characterized by, the through hole (23) and the filling orifice (32) of pressure tap (19) and adapter (21) all use a kind of liquid to fill in.
4. by the pressure sensor assembly of claim 1, it is characterized by, pressure sensor chip (7) has a upside (47), and pressure welding silk (13) is connected electrically on this upside, and the downside (49) of pressure sensor chip (7) then is connected with pressure tap (19).
5. by the pressure sensor assembly of claim 2 or 3, it is characterized by, adapter (21) has a filling orifice (32), and this filling orifice is communicated with hole (23), and injects liquid by hole (23).
6. press the pressure sensor assembly of claim 1, it is characterized by, pressure sensor chip (7) is arranged in the sensor element (5), this sensor element has sensor external electric Connection Element (15), and goes up an electrical connection printed circuit board (36) at this sensor Connection Element (15).
7. press the pressure sensor assembly of claim 6, it is characterized by: printed circuit board (36) is electrically connected with electrical connectors (39), and pressure sensor assembly (1) has a pressure sensor assembly shell (45), and electrical connectors (39) constitutes a plug (43) with pressure sensor assembly shell (45).
8. press the pressure sensor assembly of claim 1, it is characterized by: pressure sensor chip (7) is connected with electrical connectors (39), and pressure sensor assembly (1) has a pressure sensor assembly shell (45), and electrical connectors (39) constitutes a plug (43) with pressure sensor assembly shell (45).
9. by claim 1,4 or 8 pressure sensor assembly, it is characterized by, pressure sensor chip (7) is arranged in the prefabricated sensor element (5), and this sensor element has sensor external electric Connection Element (15).
10. by claim 1,4,6,8 or 9 pressure sensor assembly, it is characterized by, pressure sensor chip (7) has a diaphragm (17), and this diaphragm produces a measuring-signal that depends on pressure.
11. the pressure sensor assembly by claim 7 or 8 is characterized by, pressure sensor assembly (1) has an adapter (21), and pressure sensor assembly shell (45) is connected with adapter (21).
12. pressure sensor assembly by claim 1, it is characterized by, pressure sensor assembly (1) is arranged on the rubber-like fixed head (51), so fixed head (51) can move at least in part with respect to wall (53), and pressure sensor assembly (1) can partly shift out from patchhole (69).
13. pressure sensor assembly by claim 1, it is characterized by, pressure sensor assembly (1) is arranged on the fixed head (51), this fixed head acts on the spring (55) like this, promptly when certain masterpiece is used spring (55), fixed head (51) can move with respect to wall (53), so pressure sensor assembly (1) partly shifts out in the patchhole (69).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10107813.7 | 2001-02-20 | ||
| DE10107813A DE10107813A1 (en) | 2001-02-20 | 2001-02-20 | Pressure sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1461406A CN1461406A (en) | 2003-12-10 |
| CN1235024C true CN1235024C (en) | 2006-01-04 |
Family
ID=7674635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028011732A Expired - Fee Related CN1235024C (en) | 2001-02-20 | 2002-02-14 | Pressure sensor module |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6871546B2 (en) |
| EP (1) | EP1269135B1 (en) |
| JP (1) | JP4268802B2 (en) |
| KR (1) | KR100968055B1 (en) |
| CN (1) | CN1235024C (en) |
| DE (2) | DE10107813A1 (en) |
| WO (1) | WO2002066948A1 (en) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003294666A1 (en) * | 2002-12-12 | 2004-06-30 | Danfoss A/S | A pressure sensor |
| DE20219732U1 (en) * | 2002-12-18 | 2003-03-06 | Dbt Autom Gmbh | Pressure transducers for measuring hydraulic pressures |
| JP4774678B2 (en) * | 2003-08-29 | 2011-09-14 | 富士電機株式会社 | Pressure sensor device |
| US20070231485A1 (en) * | 2003-09-05 | 2007-10-04 | Moffat William A | Silane process chamber with double door seal |
| US20050050970A1 (en) * | 2003-09-08 | 2005-03-10 | Delphi Technologies, Inc. | Cap assembly for sealing system and method of assembling same |
| US7036381B2 (en) * | 2004-06-25 | 2006-05-02 | Rosemount Inc. | High temperature pressure transmitter assembly |
| DE102004031582A1 (en) * | 2004-06-29 | 2006-02-09 | Endress + Hauser Gmbh + Co. Kg | Duckaufnehmer |
| CN100408992C (en) * | 2006-03-10 | 2008-08-06 | 哈尔滨工业大学 | Experimental pressure measuring device in adverse environment |
| DE102007049446A1 (en) * | 2007-10-16 | 2009-04-23 | Cequr Aps | Catheter introducer |
| DE102008017871B4 (en) * | 2008-04-09 | 2014-09-25 | Hella Kgaa Hueck & Co. | Pressure sensor module and method for its production |
| KR101013186B1 (en) * | 2008-07-16 | 2011-02-10 | 주식회사 케이이씨 | Pressure sensor device and manufacturing method thereof |
| DE102008054382A1 (en) | 2008-12-08 | 2010-06-10 | Robert Bosch Gmbh | Pressure sensor module for mounting in opening of wall of pipe to measure pressure of medium in pipe, has fastening unit allowing movement of module relative to fastening flange, and plug part including resilient electrical connections |
| US8547239B2 (en) | 2009-08-18 | 2013-10-01 | Cequr Sa | Methods for detecting failure states in a medicine delivery device |
| US8672873B2 (en) | 2009-08-18 | 2014-03-18 | Cequr Sa | Medicine delivery device having detachable pressure sensing unit |
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-
2001
- 2001-02-20 DE DE10107813A patent/DE10107813A1/en not_active Withdrawn
-
2002
- 2002-02-14 JP JP2002566623A patent/JP4268802B2/en not_active Expired - Fee Related
- 2002-02-14 US US10/257,894 patent/US6871546B2/en not_active Expired - Lifetime
- 2002-02-14 DE DE50214382T patent/DE50214382D1/en not_active Expired - Lifetime
- 2002-02-14 WO PCT/DE2002/000519 patent/WO2002066948A1/en active Application Filing
- 2002-02-14 EP EP02708245A patent/EP1269135B1/en not_active Expired - Lifetime
- 2002-02-14 KR KR1020027013842A patent/KR100968055B1/en active IP Right Grant
- 2002-02-14 CN CNB028011732A patent/CN1235024C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1269135B1 (en) | 2010-04-21 |
| US20030151126A1 (en) | 2003-08-14 |
| DE10107813A1 (en) | 2002-09-05 |
| KR100968055B1 (en) | 2010-07-08 |
| WO2002066948A1 (en) | 2002-08-29 |
| EP1269135A1 (en) | 2003-01-02 |
| JP2004518973A (en) | 2004-06-24 |
| US6871546B2 (en) | 2005-03-29 |
| KR20030003256A (en) | 2003-01-09 |
| DE50214382D1 (en) | 2010-06-02 |
| CN1461406A (en) | 2003-12-10 |
| JP4268802B2 (en) | 2009-05-27 |
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