CN112729659A - Pressure sensor for closed container - Google Patents
Pressure sensor for closed container Download PDFInfo
- Publication number
- CN112729659A CN112729659A CN202011607074.3A CN202011607074A CN112729659A CN 112729659 A CN112729659 A CN 112729659A CN 202011607074 A CN202011607074 A CN 202011607074A CN 112729659 A CN112729659 A CN 112729659A
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- CN
- China
- Prior art keywords
- pressure
- sensing chip
- pressure sensing
- pcb
- corrugated diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007789 sealing Methods 0.000 claims abstract description 33
- 210000004907 gland Anatomy 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000012545 processing Methods 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims abstract description 3
- 238000009530 blood pressure measurement Methods 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 239000003921 oil Substances 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 3
- 239000003513 alkali Substances 0.000 abstract description 3
- 239000003518 caustics Substances 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 2
- 239000013307 optical fiber Substances 0.000 description 12
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 10
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 10
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002360 explosive Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000002828 fuel tank Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/06—Devices or apparatus for measuring differences of two or more fluid pressure values using electric or magnetic pressure-sensitive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
Abstract
The invention relates to a pressure sensor for a closed container in the field of sensors, wherein a ceramic substrate is arranged above a PCB (printed circuit board) in a shell, a pressure sensing chip I and a pressure sensing chip II are arranged on the upper side of the ceramic substrate, an inner pressure measuring hole is arranged on the lower side of the shell and is communicated with an inner pressure measuring cavity arranged on the lower side of the PCB, a lower corrugated diaphragm is arranged in the inner pressure measuring cavity, a sealing gland is arranged at the upper opening of the inner cavity of the shell and is positioned above the PCB, an outer pressure measuring cavity is arranged on the sealing gland, an upper corrugated diaphragm is arranged in the outer pressure measuring cavity, and the upper corrugated diaphragm is packaged and fixed between the upper side of solid crystal glue and the sealing gland; and piezoelectric signals of the first pressure sensing chip and the second pressure sensing chip are subjected to differential pressure processing by the PCB and then are output from the plug terminal. The present invention isolates corrosive substances such as oil, water, acid, alkali, etc., so that the operation of the present invention is more reliable, and the present invention can be used for measuring the pressure of various closed containers.
Description
Technical Field
The present invention relates to a pressure sensor, and more particularly, to a pressure sensor for a sealed container.
Background
In the prior art, a large number of places needing pressure measurement, particularly flammable and explosive places, such as various dangerous chemical pressure storage tanks, have the characteristics of flammability and explosiveness and strong corrosivity, which is a great test for a pressure sensor, and not only is the requirement for no electrostatic spark, but also the requirement for good enough corrosion resistance is met.
In the prior art, there is a bellows type pressure sensor and an automatic controller having the same, and its publication (announcement) no: CN110017938A, publication (public notice) day: 20190716, a sensor shell of the device, a first optical fiber and a second optical fiber, wherein one end of the first optical fiber is arranged in the sensor shell after passing through the sensor shell, and the first optical fiber and the second optical fiber are connected through an optical signal sensor; the corrugated pipe is arranged in the sensor shell and sleeved on the first optical fiber and the second optical fiber; the optical fiber fixing piece is sleeved on the first optical fiber and is fixedly connected with the first optical fiber and the moving end of the corrugated pipe; and the fixed end cover is sleeved on the second optical fiber and fixedly connected with the fixed ends of the second optical fiber and the corrugated pipe, and the fixed end cover is connected with the sensor shell. The device has the advantages of simple structure, good working stability, good repeatability, good reliability and wide application prospect. The disadvantage is that the device needs complex sensing circuit, and is not a traditional piezoelectric sensor, and the manufacturing cost is high.
Disclosure of Invention
The invention aims to provide a pressure sensor for a closed container, which has the advantages of oil resistance, corrosion resistance, static electricity resistance and high reliability.
The purpose of the invention is realized as follows: a pressure sensor for a closed container comprises a shell, wherein an explosion-proof socket is arranged on one side of the shell, a socket terminal is arranged in the explosion-proof socket, a PCB is arranged in an inner cavity of the shell, the socket terminal is electrically connected with the PCB, a ceramic substrate is arranged above the PCB, a pressure sensing chip I and a pressure sensing chip II are arranged on the upper side of the ceramic substrate, the pressure sensing chip I and the pressure sensing chip II are integrally positioned in a plastic package frame, the pressure sensing chip I and the pressure sensing chip II are fixed in the plastic package frame through crystal fixing glue, an inner pressure hole is arranged on the lower side of the shell, the inner pressure hole is communicated with an inner pressure measurement cavity arranged on the lower side of the PCB, a lower corrugated diaphragm is arranged in the inner pressure measurement cavity, the lower corrugated diaphragm is packaged and connected below the PCB, a sealing gland is arranged at the upper opening position of the inner cavity of the shell, the sealing gland is positioned above the, an upper corrugated diaphragm is arranged in the outer pressure measuring cavity, the upper corrugated diaphragm is packaged and fixed between the upper side of the die bonding glue and the sealing gland, a lower pressure measuring channel is arranged on the PCB and the ceramic substrate, the upper end of the lower pressure measuring channel is connected to a pressure measuring surface of the first pressure sensing chip, and the lower end of the lower pressure measuring channel is communicated with an inner cavity space of the lower corrugated diaphragm; an upper pressure measuring channel communicated with a pressure measuring surface of the second pressure sensing chip is reserved on the die bond adhesive water, and the upper end of the upper pressure measuring channel is communicated with an inner cavity of the upper corrugated diaphragm; and piezoelectric signals of the first pressure sensing chip and the second pressure sensing chip are subjected to differential pressure processing by the PCB and then are output from the plug terminal.
When the device works, the external environment pressure acts on the pressure sensing chip II through the upper corrugated diaphragm and the upper pressure measuring channel, the pressure in the sealed container acts on the pressure sensing chip I through the lower corrugated diaphragm and the lower pressure measuring channel, pressure changes generated on the pressure sensing chip I and the pressure sensing chip II are converted into electric signals, and after being processed on the PCB, analog signals or digital signals which are in one-to-one correspondence with the actual pressure in the tank body are formed to be output for display and control. The pressure difference measured by the first pressure sensing chip and the second pressure sensing chip can eliminate the influence of the environment, such as measurement error caused by temperature change, so that the measurement accuracy is higher. In the working process, substances in the sealed container are isolated from the pressure sensing chip I, so that the pressure sensing chip I cannot be polluted and corroded, and meanwhile, oxygen or other gases, rainwater and the like in the external environment cannot contact the pressure sensing chip II, so that the pressure sensing chip I and the pressure sensing chip II cannot contact the external environment and the environment in the sealed container from the inner side and the outer side, and corrosive substances such as oil, water, acid, alkali and the like are isolated, and the work of the pressure sensing chip I is more reliable. In addition, because the PCB and other electronic components are sealed in the shell, static electricity is not easy to generate, and compared with the prior art, the invention has the advantages of oil resistance, corrosion resistance, static electricity resistance and high reliability. It can be used for measuring the pressure of various inflammable, explosive and high-corrosivity closed containers.
The invention is further improved in that a connecting column for connecting with the wall of the closed container is arranged at the lower side of the shell, and the pressure measuring hole is positioned at the center of the connecting column. Which facilitates the installation. Furthermore, the periphery of the connecting column is provided with a non-return bulge. This solution allows the invention as a whole to be fitted by injection moulding onto a closed container, for example a plastic fuel tank.
Further, the PCB and the ceramic substrate are sealed and bonded through an adhesive. The connection is firm and the sealing is reliable.
And when the die bonding glue is used for packaging the pressure sensing chip I and the pressure sensing chip II, the pressure sensing surface of the pressure sensing chip II and the die bonding glue are isolated by the guide pipe, and an upper pressure measuring channel is formed in an inner cavity of the guide pipe.
The invention is further improved in that an upper sealing element is arranged between the upper corrugated diaphragm and the sealing gland, and a lower sealing element is arranged between the lower corrugated diaphragm and the shell. The upper sealing element and the lower sealing element thoroughly isolate a channel for communicating the inner cavity of the shell with the outside, and simultaneously play a good role in fixing the upper corrugated diaphragm and the lower corrugated diaphragm.
As a further improvement of the invention, heat-conducting silicone grease is packaged in the inner cavity of the upper corrugated diaphragm, the upper pressure measuring channel, the inner cavity of the lower corrugated diaphragm and the lower pressure measuring channel. The heat-conducting silicone grease is a high-heat-conducting insulating organic silicon material, is almost never cured, can keep a grease state in use at the temperature of minus 50 ℃ to plus 230 ℃ for a long time, has excellent electrical insulation and thermal conductivity, has low oil separation, is resistant to high and low temperature, water, ozone and weather aging, has a large thermal expansion coefficient, can be filled at a low temperature, can form certain base pressure in an inner cavity of an upper corrugated diaphragm and an inner cavity of a lower corrugated diaphragm after being packaged at normal temperature, and avoids errors caused by the elasticity of the upper corrugated diaphragm and the lower corrugated diaphragm to the maximum extent. Because the inner cavity of the upper corrugated diaphragm and the inner cavity of the lower corrugated diaphragm are sealed spaces, pressure changes can be more accurately and rapidly transmitted to the first pressure sensing chip and the second pressure sensing chip under the action of external pressure.
The upper corrugated diaphragm and the lower corrugated diaphragm are both cylinders with one ends open, the outer circumference of each cylinder is provided with a wave-shaped ring groove, and the bottom of each cylinder is provided with an easily-deformed concave part. When the pressure sensing device works, the concave parts and the wave-shaped ring grooves are easy to deform, so that pressure changes formed in the inner cavities of the upper corrugated diaphragm and the lower corrugated diaphragm are more sensitively transmitted to the first pressure sensing chip and the second pressure sensing chip.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
Fig. 2 is a partially enlarged view of a in fig. 1.
In the figure, 1 an explosion-proof interface, 2 a plug terminal, 3 a shell, 4 a PCB (printed Circuit Board), 5 a sealing gland, 6 an outer pressure measuring cavity, 7 an upper corrugated diaphragm, 8 sealant, 9 an upper sealing element, 10 a plastic package frame, 11 die bonding glue, 12 a lower pressure measuring channel, 13 a lower sealing element, 14 a lower corrugated diaphragm, 15 a connecting column, 16 an inner pressure measuring hole, 17 a non-return bulge, 18 a sealed container wall, 19 a conduit, 20 a ceramic substrate, 21 an inner pressure measuring cavity, 22 an adhesive, 23 a pressure sensing chip I, 24 a pressure sensing chip II and 25 an upper pressure measuring channel.
Detailed Description
As shown in fig. 1-2, a pressure sensor for a closed container comprises a housing 3, an explosion-proof socket 1 is provided at one side of the housing 3, a socket terminal 2 is provided in the explosion-proof socket 1, a PCB 4 is installed in an inner cavity of the housing 3, the socket terminal 2 is electrically connected to the PCB 4, a ceramic substrate 20 is provided above the PCB 4, a first pressure sensing chip 23 and a second pressure sensing chip 24 are provided on an upper side of the ceramic substrate 20, the first pressure sensing chip 23 and the second pressure sensing chip 24 are integrally located in a plastic package frame 10, the first pressure sensing chip 23 and the second pressure sensing chip 24 are fixed inside the plastic package frame 10 by a die attach glue 11, an inner pressure measuring hole 16 is provided at a lower side of the housing 3, the inner pressure measuring hole 16 is communicated to an inner pressure measuring cavity 21 provided at a lower side of the PCB 4, a lower corrugated diaphragm 14 is provided in the inner pressure measuring cavity 21, the lower corrugated diaphragm, a sealing gland 5 is arranged at the upper opening of an inner cavity of the shell 3, the periphery of the sealing gland 5 is in sealing connection with the shell 3 through sealing glue 8, the sealing gland 5 is positioned above the PCB 4, an outer pressure measuring cavity 6 is arranged on the sealing gland 5, an upper corrugated diaphragm 7 is arranged in the outer pressure measuring cavity 6, the upper corrugated diaphragm 7 is packaged and fixed between the upper side of the die bonding glue 11 and the sealing gland 5, a lower pressure measuring channel 12 is arranged on the PCB 4 and the ceramic substrate 20, the upper end of the lower pressure measuring channel 12 is connected to a pressure measuring surface of a pressure sensing chip I23, and the lower end of the lower pressure measuring channel 12 is communicated with an inner cavity space of a lower corrugated diaphragm 14; an upper pressure measuring channel 25 communicated with the pressure measuring surface of the second pressure sensing chip 24 is reserved on the die bonding glue 11, and the upper end of the upper pressure measuring channel 25 is communicated with an inner cavity of the upper corrugated diaphragm 7; piezoelectric signals of the first pressure sensing chip 23 and the second pressure sensing chip 24 are subjected to differential pressure processing by the PCB 4 and then are output from the plug terminal 2.
The lower side of the shell 3 is provided with a connecting column 15 used for connecting with the wall 18 of the closed container, and the pressure measuring hole is positioned at the center of the connecting column 15. Which facilitates the installation. Further, the connecting post 15 is provided at the outer circumference thereof with a non-return protrusion 17. This solution allows the invention as a whole to be fitted by injection moulding onto a closed container, for example a plastic fuel tank.
The PCB 4 and the ceramic substrate 20 are hermetically bonded by an adhesive 22. The connection is firm and the sealing is reliable.
For convenience of packaging, a guide pipe 19 is arranged on the upper side of the pressure measuring surface of the second pressure sensing chip 24, when the first pressure sensing chip 23 and the second pressure sensing chip 24 are packaged by the die bonding glue 11, the guide pipe 19 isolates the pressure measuring surface of the second pressure sensing chip 24 from the die bonding glue 11, and an upper pressure measuring channel 25 is formed in an inner cavity of the guide pipe 19.
An upper sealing element 9 is arranged between the upper corrugated diaphragm 7 and the sealing gland 5, and a lower sealing element 13 is arranged between the lower corrugated diaphragm 14 and the shell 3. The upper sealing element 9 and the lower sealing element 13 thoroughly isolate the passage of the inner cavity of the shell 3 from the outside, and simultaneously, the upper corrugated diaphragm 7 and the lower corrugated diaphragm 14 are well fixed.
And heat-conducting silicone grease is packaged in the inner cavity of the upper corrugated diaphragm 7, the inner cavity of the upper pressure measuring channel 25, the inner cavity of the lower corrugated diaphragm 14 and the lower pressure measuring channel 12. The heat-conducting silicone grease is a high-heat-conducting insulating organic silicon material, is almost never cured, can keep a grease state in use at the temperature of minus 50 ℃ to plus 230 ℃ for a long time, has excellent electrical insulation and thermal conductivity, has low oil separation, is resistant to high and low temperature, water, ozone and weather aging, has a large thermal expansion coefficient, can be filled at a low temperature, can be used at normal temperature after being packaged, can form certain base pressure in the inner cavity of the upper corrugated diaphragm 7 and the inner cavity of the lower corrugated diaphragm 14, and avoids errors caused by the elasticity of the upper corrugated diaphragm 7 and the lower corrugated diaphragm 14 to the maximum extent. Because the inner cavity of the upper corrugated diaphragm 7 and the inner cavity of the lower corrugated diaphragm 14 are sealed spaces, under the action of external pressure, pressure changes can be more accurately and rapidly transmitted to the first pressure sensing chip 23 and the second pressure sensing chip 24 through internal media, such as gas, liquid, pressure-transmitting solid and the like.
The upper corrugated diaphragm 7 and the lower corrugated diaphragm 14 are both in a cylinder shape with one end open, a wave-shaped ring groove is arranged on the outer circumference of the cylinder shape, and an easily deformed concave part is arranged at the bottom of the cylinder shape. When the pressure sensing diaphragm works, the concave parts and the wavy ring grooves are easy to deform, so that pressure changes formed in the inner cavities of the upper corrugated diaphragm 7 and the lower corrugated diaphragm 14 are more sensitively transmitted to the first pressure sensing chip 23 and the second pressure sensing chip 24.
When the device works, the external environment pressure acts on the second pressure sensing chip 24 through the upper corrugated diaphragm 7 and the upper pressure measuring channel 25, the pressure in the sealed container acts on the first pressure sensing chip 23 through the lower corrugated diaphragm 14 and the lower pressure measuring channel 12, pressure changes generated on the first pressure sensing chip 23 and the second pressure sensing chip 24 are converted into electric signals, and after the pressure changes are processed on the PCB 4, analog signals or digital signals which are in one-to-one correspondence with the actual pressure in the tank body are formed and output for display and control. The pressure difference measured by the first pressure sensing chip 23 and the second pressure sensing chip 24 can eliminate the influence of the environment, such as measurement error caused by temperature change, so that the measurement accuracy is higher. In the working process, substances in the sealed container are isolated from the pressure sensing chip I23, the pressure sensing chip I23 cannot be polluted and corroded, and meanwhile, oxygen or other gases, rainwater and the like in the external environment cannot contact the pressure sensing chip II 24, so that the pressure sensing device ensures that the pressure sensing chip I23 and the pressure sensing chip II 24 cannot contact the external environment and the environment in the sealed container from the inner side and the outer side, and isolates corrosive substances such as oil, water, acid, alkali and the like, and the working is more reliable. In addition, because the PCB 4 and other electronic components are sealed in the shell 3, static electricity is not easy to generate, and compared with the prior art, the invention has the advantages of oil resistance, corrosion resistance, static electricity resistance and high reliability. It can be used for measuring the pressure of various inflammable, explosive and high-corrosivity closed containers.
The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (8)
1. A pressure sensor for a closed container, comprising a housing, characterized in that: an explosion-proof interface is arranged on one side of the shell, an insertion terminal is arranged in the explosion-proof interface, a PCB is arranged in an inner cavity of the shell, the insertion terminal is electrically connected with the PCB, a ceramic substrate is arranged above the PCB, a pressure sensing chip I and a pressure sensing chip II are arranged on the upper side of the ceramic substrate, the pressure sensing chip I and the pressure sensing chip II are integrally positioned in a plastic package frame, the pressure sensing chip I and the pressure sensing chip II are fixed in the plastic package frame through crystal fixing glue, an inner pressure hole is arranged on the lower side of the shell and is communicated with an inner pressure measurement cavity arranged on the lower side of the PCB, a lower corrugated diaphragm is arranged in the inner pressure measurement cavity and is connected below the PCB in a packaging manner, a sealing gland is arranged at the upper opening position of the inner cavity of the shell and is positioned above the PCB, an outer pressure measurement cavity is arranged on the sealing gland, an upper corrugated diaphragm is arranged in the outer pressure measurement cavity and is packaged and fixed between the, a lower pressure measuring channel is arranged on the PCB and the ceramic substrate, the upper end of the lower pressure measuring channel is connected to a pressure measuring surface of the first pressure sensing chip, and the lower end of the lower pressure measuring channel is communicated with the inner cavity space of the lower corrugated diaphragm; an upper pressure measuring channel communicated with a pressure measuring surface of the second pressure sensing chip is reserved on the die bond adhesive water, and the upper end of the upper pressure measuring channel is communicated with an inner cavity of the upper corrugated diaphragm; and piezoelectric signals of the first pressure sensing chip and the second pressure sensing chip are subjected to differential pressure processing by the PCB and then are output from the plug terminal.
2. A pressure sensor for a containment vessel as claimed in claim 1, wherein: the lower side of the shell is provided with a connecting column which is used for being connected with the wall of the closed container, and the pressure measuring hole is positioned in the center of the connecting column.
3. A pressure sensor for a containment vessel as claimed in claim 2, wherein: the periphery of the connecting column is provided with a non-return bulge.
4. A pressure sensor for a closed vessel according to any one of claims 1 to 3, wherein: and the PCB and the ceramic substrate are sealed and bonded through an adhesive.
5. A pressure sensor for a closed vessel according to any one of claims 1 to 3, wherein: and when the die bond glue encapsulates the pressure sensing chip I and the pressure sensing chip II, the pressure sensing surface of the pressure sensing chip II and the die bond glue are isolated by the guide pipe, and an upper pressure measuring channel is formed in an inner cavity of the guide pipe.
6. A pressure sensor for a closed vessel according to any one of claims 1 to 3, wherein: an upper sealing element is arranged between the upper corrugated diaphragm and the sealing gland, and a lower sealing element is arranged between the lower corrugated diaphragm and the shell.
7. A pressure sensor for a closed vessel according to any one of claims 1 to 3, wherein: and heat-conducting silicone grease is packaged in the inner cavity of the upper corrugated diaphragm, the upper pressure measuring channel, the inner cavity of the lower corrugated diaphragm and the lower pressure measuring channel.
8. A pressure sensor for a closed vessel according to any one of claims 1 to 3, wherein: the upper corrugated diaphragm and the lower corrugated diaphragm are both cylinders with one ends open, the outer circumference of each cylinder is provided with a wave-shaped ring groove, and the bottom of each cylinder is provided with an easily-deformed concave part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011607074.3A CN112729659A (en) | 2020-12-30 | 2020-12-30 | Pressure sensor for closed container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011607074.3A CN112729659A (en) | 2020-12-30 | 2020-12-30 | Pressure sensor for closed container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112729659A true CN112729659A (en) | 2021-04-30 |
Family
ID=75610757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011607074.3A Pending CN112729659A (en) | 2020-12-30 | 2020-12-30 | Pressure sensor for closed container |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112729659A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102435378A (en) * | 2011-10-28 | 2012-05-02 | 山东昌润科技有限公司 | Compound type temperature pressure sensor |
| CN105547576A (en) * | 2015-12-08 | 2016-05-04 | 苏州敏芯微电子技术有限公司 | Medium-isolated pressure sensor packaging structure |
| CN107643145A (en) * | 2016-07-22 | 2018-01-30 | 上海域丰传感仪器有限公司 | One kind diffusion silicon high static pressure little differential pressure sensor |
| CN209400120U (en) * | 2018-12-26 | 2019-09-17 | 联合汽车电子有限公司 | Pressure sensor |
| CN111289167A (en) * | 2020-04-09 | 2020-06-16 | 江苏奥力威传感高科股份有限公司 | Sensor for measuring internal pressure of tank for storing volatile liquid |
| CN210953211U (en) * | 2019-12-17 | 2020-07-07 | 上海文襄汽车传感器有限公司 | Pressure sensor assembly |
-
2020
- 2020-12-30 CN CN202011607074.3A patent/CN112729659A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102435378A (en) * | 2011-10-28 | 2012-05-02 | 山东昌润科技有限公司 | Compound type temperature pressure sensor |
| CN105547576A (en) * | 2015-12-08 | 2016-05-04 | 苏州敏芯微电子技术有限公司 | Medium-isolated pressure sensor packaging structure |
| CN107643145A (en) * | 2016-07-22 | 2018-01-30 | 上海域丰传感仪器有限公司 | One kind diffusion silicon high static pressure little differential pressure sensor |
| CN209400120U (en) * | 2018-12-26 | 2019-09-17 | 联合汽车电子有限公司 | Pressure sensor |
| CN210953211U (en) * | 2019-12-17 | 2020-07-07 | 上海文襄汽车传感器有限公司 | Pressure sensor assembly |
| CN111289167A (en) * | 2020-04-09 | 2020-06-16 | 江苏奥力威传感高科股份有限公司 | Sensor for measuring internal pressure of tank for storing volatile liquid |
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