CN218101204U

CN218101204U - Automatic mechanism of uncapping of wafer box

Info

Publication number: CN218101204U
Application number: CN202121815075.7U
Authority: CN
Inventors: 刘世文; 陈亮; 刘艺
Original assignee: Shenzhen Senmei Xieer Technology Co ltd
Current assignee: Shenzhen Senmei Xieer Technology Co ltd
Priority date: 2021-08-04
Filing date: 2021-08-04
Publication date: 2022-12-20
Anticipated expiration: 2031-08-04

Abstract

The utility model belongs to the technical field of automatic uncapping and specifically relates to an automatic mechanism of uncapping of wafer box is related to, and it is including setting up mount table, the lift seat in the frame and being used for locking the movable plate of wafer box lid, and the lift seat passes through lifting unit along vertical direction sliding connection in the frame, and the movable plate passes through the subassembly that moves a little and follows horizontal direction sliding connection in the lift seat. This application has the effect that improves detection efficiency.

Description

Automatic mechanism of uncapping of wafer box

Technical Field

The application relates to the field of automatic uncapping, especially, relate to an automatic mechanism of uncapping of wafer box.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. The silicon crystal bar is ground, polished, sliced, etched and the like to form the wafer.

The whole process of manufacturing semiconductor devices can be divided into wafer manufacturing, wafer probing, and chip packaging. The wafer needle test is to carry out needle test on each chip on a wafer, a tester is connected with a probe needle made of beryllium copper and is contacted with pad points on the chip, the chips which are not qualified can be marked in the test on the electrical function of the chip, the chips which are marked are eliminated, and the next manufacturing process can not be carried out to reduce unnecessary manufacturing cost.

In the related art, before detecting the wafer, the wafer is loaded by using a wafer cassette, which generally includes a box body and a box cover, wherein the box body is detachably connected to the box cover. After the wafer cassette is transported to a testing site, the cover of the wafer cassette is manually opened.

For the related technologies, the inventor thinks that after the wafer box is in place, the inventor needs to wait for manual work to open the wafer box, and if the worker does not open the wafer box in time, subsequent detection cannot continuously supply wafers, so that the detection efficiency is low.

SUMMERY OF THE UTILITY MODEL

In order to improve detection efficiency, this application provides an automatic mechanism of uncapping of wafer box.

The application provides a wafer box automatic cover opening mechanism adopts following technical scheme:

the utility model provides an automatic mechanism of uncapping of wafer box, is including setting up mount table, the lift seat in the frame and the movable plate that is used for locking the wafer box lid, lift seat passes through lifting unit along vertical direction sliding connection in the frame, the movable plate moves the subassembly through declining and follows horizontal direction sliding connection in lift seat.

Through adopting above-mentioned technical scheme, install the mount table to the wafer box on, then fix movable plate and wafer box lid, make the movable plate move towards the direction of keeping away from the wafer box through the micromovement subassembly for wafer box lid and wafer box separation, then make the movable plate toward descending through lifting unit, thereby accomplish the automation of wafer box and uncap, the staff only need with the wafer box install to the mount table on can, convenient and fast, thereby improve detection efficiency.

Optionally, the lifting assembly includes a first driving member, a threaded rod and a lifting seat, the first driving member is connected to the frame, the threaded rod is rotatably connected to the frame, the threaded rod is connected to the first driving member for driving the threaded rod to rotate, and the lifting seat is in threaded connection with the threaded rod; the micro-moving component is connected with the lifting seat.

Through adopting above-mentioned technical scheme, rotate the threaded rod through first driving piece, the lift seat removes along vertical direction thereupon to reach the effect that the automatic position of moving subassembly, movable plate in vertical direction that changes slightly.

Optionally, the lifting component further comprises a transmission part, the transmission part comprises a driving synchronous wheel, a driven synchronous wheel and a synchronous belt, the driving synchronous wheel is connected with a first driving part which drives the driving synchronous wheel to rotate, the driven synchronous wheel is fixedly connected to the threaded rod, and the driving synchronous wheel and the driven synchronous wheel are connected through the synchronous belt.

Through adopting above-mentioned technical scheme, utilize first driving piece to rotate the initiative synchronizing wheel, under the drive of hold-in range, driven synchronizing wheel rotates, and then drives the threaded rod and rotate, and the setting up of driving medium has improved the precision that the lift seat removed.

Optionally, the fine movement assembly comprises a second driving part, the second driving part is an air cylinder, the air cylinder is fixedly connected to the lifting seat, and an output shaft of the air cylinder is connected with the moving plate.

Through adopting above-mentioned technical scheme, the output shaft extension of cylinder can make the movable plate remove towards the direction of keeping away from the wafer box, and is swift effective to raise the efficiency.

Optionally, the fine movement assembly further comprises a plurality of groups of linear guide rails, the linear guide rails are fixedly connected to the top of the lifting seat, and the top of each linear guide rail is fixedly connected with the bottom of the movable plate.

By adopting the technical scheme, the linear guide rail is additionally arranged, so that the movement of the moving plate is more stable, and the condition that the moving plate deviates from the originally set route is reduced.

Optionally, the linear guide rails are provided with two groups, and the two groups of linear guide rails are symmetrically arranged on two sides of the cylinder.

Through adopting above-mentioned technical scheme, the stability that the price removed has been strengthened the location group to the linear guide that the symmetry set up.

Optionally, the moving plate is provided with a plurality of door opening modules and a plurality of positioning pins, and the door opening modules and the positioning pins are connected with the wafer box cover.

Through adopting above-mentioned technical scheme, utilize the locating pin to carry out the prepositioning to the wafer box lid, then recycle the module of opening the door and lock the wafer box lid to strengthen the joint strength between wafer box lid and the movable plate, the wafer box lid is easier, quick and the separation of wafer box, thereby raises the efficiency.

Optionally, a sucker used for being connected with the wafer box cover is sleeved on the locating pin.

By adopting the technical scheme, the wafer box cover is sucked by the sucker, so that the connection strength between the wafer box cover and the movable plate is further enhanced.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the wafer box is installed on the installing platform, then the movable plate and the cover of the wafer box are fixed, the movable plate is moved towards the direction far away from the wafer box through the micro-moving assembly, the cover of the wafer box is separated from the wafer box, then the movable plate is lowered through the lifting assembly, so that the automatic cover opening of the wafer box is completed, a worker only needs to install the wafer box on the installing platform, and the automatic cover opening device is convenient and quick to use and improves the detection efficiency;

2. the cylinder and the linear guide rail enable the moving plate to move more stably, and meanwhile, the situation that the moving plate deviates from the originally set route is reduced;

3. install the mount table to the wafer box, then fix movable plate and wafer box lid, make the movable plate move towards the direction of keeping away from the wafer box through the micromotion subassembly for wafer box lid and wafer box separation, then make the movable plate toward descending through lifting unit, thereby accomplish the automation of wafer box uncap, the staff only need with the wafer box install to the mount table on can, convenient and fast, thereby improve detection efficiency.

Drawings

Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.

Fig. 2 is an enlarged view of a portion a in fig. 1.

Description of reference numerals: 1. a frame; 11. an installation table; 2. a lifting assembly; 21. a first motor; 22. a driving synchronizing wheel; 23. a driven synchronizing wheel; 24. a synchronous belt; 25. a threaded rod; 3. A micromotion assembly; 31. a cylinder; 32. a linear guide rail; 4. Moving the plate; 5. a lifting seat; 6. a door opening module; 7. positioning pins; 8. a suction cup; 9. and a wafer box.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses automatic mechanism of uncapping of wafer box. Referring to fig. 1, an automatic cover opening mechanism for a wafer cassette includes a mounting table 11, a moving plate 4 and a lifting seat 5, which are arranged on a frame 1, wherein a wafer cassette 9 is mounted on the mounting table 11, and the lifting seat 5 is located below the mounting table 11. Lifting seat 5 and frame 1 sliding connection, lifting seat 5 can move along vertical direction, and lifting seat 5's removal can be realized through lifting unit 2. The moving plate 4 is connected with the lifting seat 5 in a sliding mode, the moving plate 4 moves towards the horizontal direction, and the moving of the moving plate 4 can be achieved through the micro-moving assembly 3.

The lifting assembly 2 comprises a first drive member, a transmission member and a threaded rod 25. In this embodiment, the first driving member is a first motor 21, and the first motor 21 is fixedly connected to the frame 1. The top of the threaded rod 25 is rotatably connected with the bottom of the mounting table 11, the bottom of the threaded rod 25 is connected with the rack 1, and the threaded rod 25 is vertically arranged. The lifting seat 5 is sleeved on and in threaded connection with the outer wall of the threaded rod 25. The driving medium includes initiative synchronizing wheel 22, driven synchronizing wheel 23 and hold-in range 24, and initiative synchronizing wheel 22 passes through shaft coupling fixed connection in the output shaft of

first motor

21, and 23 fixed connection in the outer wall in threaded rod 25 bottoms of driven synchronizing wheel are connected through hold-in range 24 between initiative synchronizing wheel 22 and the driven synchronizing wheel 23. The bottom of the micro-moving component 3 is fixedly connected with the top of the lifting seat 5.

Referring to fig. 1 and 2, the micro-moving unit 3 drives the moving plate 4 to reciprocate in a horizontal direction. The micro-moving assembly 3 includes a second driving member and a plurality of linear guide rails 32, in this embodiment, the second driving member is an air cylinder 31, the air cylinder 31 and the linear guide rails 32 are respectively and fixedly connected to the top of the lifting seat 5, the output end of the air cylinder 31 is fixedly connected to the moving plate 4, and the top of the linear guide rails 32 is fixedly connected to the bottom of the moving plate 4.

Referring to fig. 1, the lid of the wafer box 9 abuts against the movable plate 4, the movable plate 4 is provided with a plurality of door opening modules 6 and a plurality of positioning pins 7, each door opening module 6 comprises a rotatable latch rod, and one end of each latch rod can extend into the lid of the wafer box 9 to be unlocked. In the present embodiment, the number of the door opening modules 6 is 2, and the two latch levers are synchronously rotated by the linkage mechanism. The positioning pin 7 can be inserted into the side surface of the cover of the wafer box 9 to position the cover of the wafer box 9. The positioning pin 7 is also sleeved with a sucker 8, and the sucker 8 can be attached to the cover of the wafer box 9. The positioning pin 7 is provided with a negative pressure suction port to discharge air.

The implementation principle of the automatic mechanism of uncapping of this application embodiment of wafer box is: after the worker installs the wafer box 9, the movable plate 4 and the lid of the wafer box 9 are fixed together by the positioning pin 7 and the latch rod, then the output shaft of the cylinder 31 is extended to move the movable plate 4 in the direction away from the wafer box 9, the lid of the wafer box 9 is separated from the wafer box 9, the position of the movable plate 4 in the vertical direction is changed by the lifting assembly 2, so that the movable plate 4 and the lid of the wafer box 9 are lowered, and the automatic opening of the wafer box 9 is completed.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides an automatic mechanism of uncapping of wafer box which characterized in that: including mount table (11), lift seat (5) and the movable plate (4) that is used for locking wafer box (9) lid that set up in frame (1), lift seat (5) are in frame (1) through lifting unit (2) along vertical direction sliding connection, movable plate (4) are in lift seat (5) along horizontal direction sliding connection through slightly moving subassembly (3).

2. The automatic wafer cassette uncovering mechanism according to claim 1, characterized in that: the lifting assembly (2) comprises a first driving piece and a threaded rod (25), the first driving piece is connected with the rack (1), the threaded rod (25) is rotatably connected to the rack (1), the threaded rod (25) is connected with the first driving piece which drives the threaded rod (25) to rotate, and the lifting seat (5) is in threaded connection with the threaded rod (25); the micro-moving component (3) is connected with the lifting seat (5).

3. The automatic wafer cassette uncovering mechanism according to claim 2, characterized in that: lifting unit (2) still include the driving medium, and the driving medium includes initiative synchronizing wheel (22), driven synchronizing wheel (23) and hold-in range (24), and initiative synchronizing wheel (22) are connected rather than pivoted first driving piece with driving, and driven synchronizing wheel (23) fixed connection is in threaded rod (25), is connected through hold-in range (24) between initiative synchronizing wheel (22) and the driven synchronizing wheel (23).

4. The automatic wafer cassette uncovering mechanism according to claim 1, characterized in that: the micro-moving assembly (3) comprises a second driving piece, the second driving piece is an air cylinder (31), the air cylinder (31) is fixedly connected to the lifting seat (5), and an output shaft of the air cylinder (31) is connected with the moving plate (4).

5. The automatic wafer cassette uncovering mechanism according to claim 4, characterized in that: the micro-moving assembly (3) further comprises a plurality of groups of linear guide rails (32), the linear guide rails (32) are fixedly connected to the top of the lifting seat (5), and the top of each linear guide rail (32) is fixedly connected with the bottom of the moving plate (4).

6. The automatic mechanism of uncapping of wafer cassette of claim 5, characterized in that: two groups of linear guide rails (32) are arranged, and the two groups of linear guide rails (32) are symmetrically arranged on two sides of the air cylinder (31).

7. The automatic wafer cassette uncovering mechanism according to claim 1, characterized in that: the movable plate (4) is provided with a plurality of door opening modules (6) and a plurality of positioning pins (7) which are connected with the box cover of the wafer box (9).

8. The automatic wafer cassette uncovering mechanism according to claim 7, characterized in that: and a sucker (8) used for being connected with a box cover of the wafer box (9) is sleeved on the positioning pin (7).