CN117198956A - Wafer guide mechanism - Google Patents
Wafer guide mechanism Download PDFInfo
- Publication number
- CN117198956A CN117198956A CN202311146286.XA CN202311146286A CN117198956A CN 117198956 A CN117198956 A CN 117198956A CN 202311146286 A CN202311146286 A CN 202311146286A CN 117198956 A CN117198956 A CN 117198956A
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- Prior art keywords
- wafer
- wafer boat
- carrier
- guide mechanism
- bottom plate
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- 230000007246 mechanism Effects 0.000 title claims abstract description 52
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 69
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductors, and particularly discloses a wafer guide mechanism, which comprises a bottom plate, wherein at least one carrier for receiving a wafer is arranged above the bottom plate; a lifting carrying mechanism vertical to the bottom plate is arranged above one side of the bottom plate; the lifting carrying mechanism is in driving connection with a wafer boat supporting table corresponding to the carrier; at least one groove body for allowing the carrier to pass through is formed on the table body of the wafer boat supporting table; the wafer boat carrier comprises a carrier body, a wafer boat supporting table, a wafer boat clamping mechanism, a wafer boat supporting table and a limiting mechanism, wherein the wafer boat supporting table is arranged on the wafer boat supporting table, and the wafer boat supporting table is arranged on the wafer boat supporting table.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer guide mechanism.
Background
Wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits, and the importance of the wafer is increasingly becoming more important with the wide application of integrated circuit chips.
When different semiconductor process procedures are carried out, the wafers are required to be guided out of the wafer boat, and when the wafers are guided, the wafer guiding device in the prior art generally adopts other complex mechanisms to take the wafers out of the wafer boat and place the wafers on the carrier.
In addition, the existing carrier cannot perform oblique insertion detection on the wafer, if the wafer is obliquely inserted into the carrier, the wafer may be damaged, and in severe cases, the wafers on both sides or the whole batch of wafers may be damaged.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention discloses a wafer guide mechanism.
In order to achieve the above purpose, the present invention is realized by the following technical scheme: the wafer guide mechanism comprises a bottom plate, wherein at least one carrier for receiving a wafer is arranged above the bottom plate;
a lifting carrying mechanism perpendicular to the bottom plate is arranged above one side of the bottom plate; the lifting carrying mechanism is in driving connection with a wafer boat supporting table corresponding to the carrier;
the stage body of the wafer boat supporting stage is provided with at least one groove body for the carrier to pass through; the wafer boat supporting table is characterized in that a limiting mechanism used for limiting the wafer boat is arranged on the wafer boat supporting table corresponding to the periphery of the groove body, and a clamping mechanism used for clamping the wafer boat is arranged on one side of the wafer boat supporting table.
As a preferable mode of the invention, a rotary driving cylinder is connected above the bottom plate through a support column, and the carrier is arranged on the output end of the rotary driving cylinder.
As a preferable mode of the invention, the carrier is provided with a plurality of slots for inserting wafers in a linear array.
Wherein the number of the slots is set to 25.
As a preferable mode of the invention, the lifting carrying mechanism comprises a vertical plate vertically arranged on one side of the bottom plate, a screw rod driving sliding table is arranged on the back side of the vertical plate along the height direction of the vertical plate, and the wafer boat supporting table is connected with the sliding table of the screw rod driving sliding table.
The wafer boat supporting table comprises two supporting plates connected with a screw rod driving sliding table on two sides of a vertical plate, linear guide rails are respectively arranged on the outer side walls of the two supporting plates, a rack is connected above the two linear guide rails in a sliding mode, a linear driving cylinder is arranged below the supporting plate corresponding to one linear guide rail, a piston rod of the linear driving cylinder is connected with the rack, and the groove body is formed in the table top of the rack.
Wherein, be connected with at least one reinforcing beam between two risers.
As a preferable mode of the invention, the limiting mechanism comprises four L-shaped limiting blocks, and the four L-shaped limiting blocks are arranged on the table top of the rack corresponding to the periphery of the tank body in a matched mode.
The clamping mechanism comprises a clamping driving cylinder and a clamping block, wherein the clamping driving cylinder is arranged on one side of the table top of the rack, and the clamping block is connected to a piston rod of the clamping driving cylinder.
As a preferable mode of the invention, a portal a and a portal b are respectively arranged on two sides above the outer part of the wafer guide mechanism;
photoelectric sensor transmitters which transmit photoelectric signals towards the direction of the portal b are respectively arranged above the two supporting legs of the portal a;
photoelectric sensor receivers for receiving photoelectric signals are respectively arranged above the two supporting legs of the portal b.
The invention has the following beneficial effects:
1. according to the invention, the wafer boat supporting table is driven to descend by the lifting carrying mechanism, so that wafers in the wafer boat can be inserted into the carrier at one time, and compared with the process of inserting the wafers onto the carrier by adopting other complex mechanisms, the working efficiency can be improved, and the production cost of enterprises can be reduced.
2. According to the invention, the two photoelectric sensor transmitters are matched with the two photoelectric sensor receivers, so that the condition of oblique insertion of the wafer can be found in time, and the damage of the wafer is reduced.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic view of a usage state structure of the present disclosure;
FIG. 2 is a schematic diagram of the overall structure of the present disclosure;
FIG. 3 is a schematic diagram of a carrier structure according to the present disclosure;
in the figure: 10. a bottom plate; 20. a carrier; 21. a slot; 30. lifting the carrying mechanism; 31. a vertical plate; 32. the screw rod drives the sliding table; 40. a wafer boat support; 41. a support plate; 42. a linear guide rail; 43. a linear driving cylinder; 44. a stand; 441. a tank body; 45. reinforcing the cross beam; 50. a limiting mechanism; 51. an L-shaped limiting block; 60. a clamping mechanism; 61. a clamping driving cylinder; 62. a clamping block; 70. a support column; 80. a rotary driving cylinder; 90. a wafer boat; 100. a door frame a; 110. a portal b; 120. a photo sensor emitter; 130. a photo sensor receiver.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "open," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like indicate orientation or positional relationships, merely for convenience in describing the present invention and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Examples
In order to improve wafer guiding efficiency and reduce production cost of enterprises, referring to fig. 1-3, the invention discloses a wafer guiding mechanism, which comprises a bottom plate 10, wherein at least one carrier 20 for receiving wafers is arranged above the bottom plate 10;
a lifting carrying mechanism 30 perpendicular to the bottom plate 10 is arranged above one side of the bottom plate 10; the elevating carrying mechanism 30 is in driving connection with a boat supporting table 40 corresponding to the carrier 20;
at least one groove 441 for allowing the carrier 20 to pass through is formed on the stage body of the wafer boat support 40; the wafer boat supporting table 40 corresponding to the periphery of the groove body 441 is provided with a limiting mechanism 50 for limiting the wafer boat 90, and one side of the wafer boat supporting table 40 is provided with a clamping mechanism 60 for clamping the wafer boat 90.
In actual use, the wafer boat supporting table 40 is driven to descend by the lifting carrying mechanism 30, so that wafers in the wafer boat 90 can be inserted into the carrier 20 at one time, and compared with the process of inserting wafers onto the carrier 20 by using a mechanical arm or manually one by one, the work efficiency can be improved, and the production cost of enterprises is reduced.
As a preferable structure of the invention, the rotary driving cylinder 80 is connected above the bottom plate 10 through the support column 70, the carrier 20 is mounted on the output end of the rotary driving cylinder 80, the direction of the wafer can be adjusted through the rotary driving cylinder 80, and in actual use, the rotary driving cylinder 80 drives the carrier 20 to rotate at 180 degrees, so that the use is flexible, and the use requirements of different material taking modes can be met.
Specifically, a plurality of slots 21 for inserting wafers are arranged in a linear array on the carrier 20, and when a specific choice is made, a carrier 20 with 25 slots 21 is selected, and correspondingly, the number of wafers in the wafer boat 90 must not exceed 25.
Specifically, the lifting carrying mechanism 30 includes a vertical plate 31 vertically disposed on one side of the bottom plate 10, a screw driving sliding table 32 is disposed on the back side of the vertical plate 31 along the height direction thereof, the boat support 40 is connected with the sliding table of the screw driving sliding table 32, and the boat support 40 can move up and down under the driving of the screw driving sliding table 32.
As a preferable structure of the present invention, the boat supporting table 40 includes two supporting plates 41 connected to the screw driving sliding table 32 at both sides of the vertical plate 31, the outer side walls of the two supporting plates 41 are respectively provided with a linear guide rail 42, a table frame 44 is slidingly connected above the two linear guide rails 42, wherein a linear driving cylinder 43 is arranged below the supporting plate 41 corresponding to one linear guide rail 42, a piston rod of the linear driving cylinder 43 is connected to the table frame 44, the tank body 441 is opened on the table surface of the table frame 44, in an initial state, the linear driving cylinder 43 is in a retracted state, and when the mechanical arm or the manual work is about to take the boat 90 from the table frame 44, the linear driving cylinder 43 is in an extended state, based on the arrangement, the mechanical arm or the manual work is convenient to transport the boat 90;
in addition, at least one reinforcing beam 45 is connected between the two vertical plates 31, so that the boat support 40 can have high stability.
In one embodiment, the limiting mechanism 50 includes four L-shaped limiting blocks 51, the four L-shaped limiting blocks 51 are cooperatively disposed on the table surface of the rack 44 corresponding to the periphery of the slot body 441, and in actual use, the four corners of the wafer boat 90 will be located in the four L-shaped limiting blocks 51, so that the wafer boat 90 can be ensured not to move on the table surface of the rack 44.
In cooperation with the above-mentioned limit mechanism 50, the clamping mechanism 60 includes a clamping driving cylinder 61 and a clamping block 62, the clamping driving cylinder 61 is disposed on one side of the table surface of the table 44, the clamping block 62 is connected to the piston rod of the clamping driving cylinder 61, when the wafer boat 90 is limited in the above-mentioned four L-shaped limit blocks 51, the clamping driving cylinder 61 will extend with the clamping block 62, and at this time, the clamping block 62 cooperates with two L-shaped limit blocks 51 far away therefrom to fix the wafer boat 90.
In order to prevent the wafer from being inserted into the slot 21 of the carrier 20 in an inclined way, a portal a100 and a portal b110 are respectively arranged on two sides above the outer part of the wafer guide mechanism;
photoelectric sensor transmitters 120 which transmit photoelectric signals towards the direction of the portal b110 are respectively arranged above the two supporting legs of the portal a 100;
above the two legs of the gantry b110 are respectively provided a photo sensor receiver 130 for receiving photo signals.
It will be appreciated that when a wafer is normally inserted into the slot 21, the height of the wafer is lower than the height of the wafer inserted obliquely into the slot 21, and during the inspection process, if the wafer is inserted in the slot 21, the photoelectric signals sent by the two photoelectric sensor transmitters 120 can be received by the two photoelectric sensor receivers 130, and if the wafer is not inserted in the slot 21, the photoelectric signals sent by at least one photoelectric sensor transmitter 120 of the two photoelectric sensor transmitters 120 will be blocked by the wafer, and at this time, the corresponding photoelectric sensor receiver 130 will not receive the photoelectric signals, which means that the wafer in the carrier 20 has an oblique insertion condition, in which case, the signal can be sent to the staff by means of the external controller to request the signal to be adjusted in time, thereby avoiding the situation that the wafer is damaged.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing embodiments are merely illustrative of the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and to implement the same according to the present invention, not to limit the scope of the present invention. All changes and modifications that come within the meaning and range of equivalency of the invention are to be embraced within their scope.
Claims (10)
1. The wafer guide mechanism is characterized by comprising a bottom plate (10), wherein at least one carrier (20) for receiving a wafer is arranged above the bottom plate (10);
a lifting carrying mechanism (30) perpendicular to the bottom plate (10) is arranged above one side of the bottom plate; the lifting carrying mechanism (30) is in driving connection with a wafer boat supporting table (40) corresponding to the carrier (20);
the stage body of the wafer boat supporting stage (40) is provided with at least one groove body (441) for allowing the carrier (20) to pass through; the wafer boat supporting table (40) corresponding to the periphery of the groove body (441) is provided with a limiting mechanism (50) used for limiting the wafer boat (90), and one side of the wafer boat supporting table (40) is provided with a clamping mechanism (60) used for clamping the wafer boat (90).
2. A wafer guide mechanism according to claim 1, characterized in that the upper part of the base plate (10) is connected with a rotary driving cylinder (80) through a support column (70), and the carrier (20) is mounted on the output end of the rotary driving cylinder (80).
3. Wafer guide mechanism according to claim 1, characterized in that the carrier (20) is provided with a number of slots (21) for wafer insertion in a linear array.
4. A wafer guide according to claim 3, characterized in that the number of slots (21) is set to 25.
5. Wafer guide mechanism according to claim 1, characterized in that the lifting carrying mechanism (30) comprises a vertical plate (31) vertically arranged at one side of the bottom plate (10), the back side of the vertical plate (31) is provided with a screw driving sliding table (32) along the height direction thereof, and the wafer boat supporting table (40) is connected with the sliding table of the screw driving sliding table (32).
6. The wafer guide mechanism according to claim 5, wherein the wafer boat supporting table (40) comprises two supporting plates (41) connected with the screw driving sliding table (32) at two sides of the vertical plate (31), linear guide rails (42) are respectively arranged on the outer side walls of the two supporting plates (41), a table frame (44) is slidingly connected above the two linear guide rails (42), a linear driving cylinder (43) is arranged below the supporting plate (41) corresponding to the linear guide rails (42), a piston rod of the linear driving cylinder (43) is connected with the table frame (44), and the groove body (441) is formed on the table surface of the table frame (44).
7. Wafer guide mechanism according to claim 6, characterized in that at least one stiffening beam (45) is connected between the two uprights (31).
8. The wafer guide mechanism of claim 6, wherein the limiting mechanism (50) comprises four L-shaped limiting blocks (51), and the four L-shaped limiting blocks (51) are cooperatively disposed on a table surface of a rack (44) corresponding to the periphery of the groove body (441).
9. The wafer guide mechanism of claim 6, wherein the clamping mechanism (60) comprises a clamping drive cylinder (61) and a clamping block (62), the clamping drive cylinder (61) being disposed on a table side of the table (44), the clamping block (62) being connected to a piston rod of the clamping drive cylinder (61).
10. The wafer guide mechanism according to claim 1, wherein a door frame a (100) and a door frame b (110) are respectively arranged on two sides above the outer part of the wafer guide mechanism;
photoelectric sensor transmitters (120) for transmitting photoelectric signals towards the direction of the portal b (110) are respectively arranged above the two supporting legs of the portal a (100);
photoelectric sensor receivers (130) for receiving photoelectric signals are respectively arranged above the two supporting legs of the portal b (110).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311146286.XA CN117198956A (en) | 2023-09-06 | 2023-09-06 | Wafer guide mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311146286.XA CN117198956A (en) | 2023-09-06 | 2023-09-06 | Wafer guide mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117198956A true CN117198956A (en) | 2023-12-08 |
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ID=89002855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311146286.XA Pending CN117198956A (en) | 2023-09-06 | 2023-09-06 | Wafer guide mechanism |
Country Status (1)
| Country | Link |
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| CN (1) | CN117198956A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878042A (en) * | 2024-03-11 | 2024-04-12 | 无锡琨圣智能装备股份有限公司 | Wafer inserting mechanism and method |
| CN118610133A (en) * | 2024-08-09 | 2024-09-06 | 苏州智程半导体科技股份有限公司 | Batch wafer transfer device |
-
2023
- 2023-09-06 CN CN202311146286.XA patent/CN117198956A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878042A (en) * | 2024-03-11 | 2024-04-12 | 无锡琨圣智能装备股份有限公司 | Wafer inserting mechanism and method |
| CN117878042B (en) * | 2024-03-11 | 2024-06-04 | 无锡琨圣智能装备股份有限公司 | Wafer inserting mechanism and method |
| CN118610133A (en) * | 2024-08-09 | 2024-09-06 | 苏州智程半导体科技股份有限公司 | Batch wafer transfer device |
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