CN218069895U - LED packaging support plate - Google Patents

Abstract

The utility model discloses a LED packaging support plate, including the packaging support plate base plate, the top of packaging support plate base plate is provided with heat sink layer, heat sink layer's top is provided with the heat-conducting glue layer, the top of heat-conducting glue layer is provided with heat dissipation aluminum plate, heat dissipation aluminum plate's top is provided with the insulating layer, the top of insulating layer is provided with the copper, be provided with the heat conduction bar copper between the bottom of copper and heat sink layer's the top, the top central point department of putting of copper has seted up the encapsulation recess, the inside bottom of encapsulation recess is provided with the LED bottom plate. This LED encapsulation support plate mutually supports through LED bottom plate and thermal expansion layer in the copper top encapsulation recess, and the assurance LED lamp pearl base that can the maximize diminishes with the thermal expansion coefficient difference value between the copper, guarantees that the heat that LED lamp pearl during operation produced can not cause the not hard up problem that drops of LED lamp pearl encapsulation support plate base plate junction, guarantees the stability of LED work.

Description

LED packaging support plate

Technical Field

The utility model relates to an encapsulation technology field specifically is a LED encapsulation support plate.

Background

Encapsulation is the process of assembling integrated circuit into chip end product, and in brief, just put the integrated circuit bare chip that foundry produced on a packaging carrier plate base plate that plays the bearing effect, draw the pin out, then fixed package becomes a whole, and LED needs bear through the carrier plate when the encapsulation, and current packaging carrier plate is most integrative, is not convenient for peel off.

In order to realize the characteristic that the package carrier has the capability of being stripped, the Chinese patent 'a package carrier' (patent number: 201811285030.6) has the characteristics of simple structure and stripping, and can improve the production efficiency, reduce the cost and be more environment-friendly.

However, the package carrier in the above patent will have a problem of poor heat dissipation capability when encapsulating the LED, and since the LED will generate a certain amount of heat energy during operation, the heat energy will be transferred to the package carrier, the thermal expansion coefficients of the package carrier and the LED lamp bead base are different, when the difference between the thermal expansion coefficients of the two materials is too large, the connection between the LED lamp bead base and the package carrier will be loosened and fall off, thereby causing the problem that the LED cannot work when damaged, and the package carrier itself has poor heat dissipation capability, and cannot rapidly transfer the heat energy to the air.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED packaging support plate, with the packaging support plate who proposes among the above-mentioned background art in solving and encapsulating the poor problem of heat-sinking capability will appear when encapsulating LED, because LED work can produce an amount of heat energy, these heats can transmit to packaging support plate, packaging support plate and LED lamp pearl base the thermal expansion coefficient is different, will cause the not hard up problem that drops of junction of LED lamp pearl base and packaging support plate when the expansion coefficient difference of two kinds of materials is too big, and then cause the unable problem of working of LED damage, packaging support plate self's heat-sinking capability is also relatively poor, unable quick problem of transmitting heat energy to the air kind.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a LED encapsulation support plate, includes encapsulation support plate base plate, the top of encapsulation support plate base plate is provided with heat sink layer, heat sink layer's top is provided with the heat conduction glue film, heat conduction glue film's top is provided with heat dissipation aluminum plate, heat dissipation aluminum plate's top is provided with the insulating layer, the top of insulating layer is provided with the copper, be provided with the heat conduction bar copper between the bottom of copper and heat sink layer's the top, the encapsulation recess has been seted up to the top central point department of putting of copper, the inside bottom of encapsulation recess is provided with the LED bottom plate, and is provided with the thermal expansion layer on one side inner wall of encapsulation recess, first water conservancy diversion hole has been seted up on one side outer wall on heat sink layer, and the heat sink layer has seted up second water conservancy diversion hole on the adjacent one side outer wall in first water conservancy diversion hole.

Preferably, the heat conducting copper rod sequentially penetrates through the heat conducting adhesive layer, the heat radiating aluminum plate and the insulating layer from top to bottom.

Preferably, the number of the heat conduction copper rods is four, and the four heat conduction copper rods are symmetrically arranged between the copper plate and the heat sink layer.

Preferably, the cross section of the thermal expansion layer is a rectangular frame structure.

Preferably, the LED bottom plate is made of the same material as the LED lamp bead base.

Preferably, the thermal expansion layer has a thermal expansion coefficient between the copper plate and the LED submount.

Preferably, through holes matched with the heat conduction copper bars are formed in the outer walls of one sides of the heat conduction adhesive layer, the heat dissipation aluminum plate and the insulating layer.

Preferably, the first diversion hole and the second diversion hole are vertically crossed, and the first diversion hole is communicated with the second diversion hole.

Compared with the prior art, the beneficial effects of the utility model are that: this LED encapsulation support plate, mutually support through LED bottom plate and thermal expansion layer in the copper top encapsulation recess, the thermal expansion coefficient difference value between assurance LED lamp pearl base that can maximize and the copper diminishes, guarantee that the heat that LED lamp pearl during operation produced can not cause the not hard up problem that drops of LED lamp pearl encapsulation support plate base plate junction, guarantee the stability of LED work, through the direct transmission of heat conduction copper bar to heat energy, and can form the air convection through first water conservancy diversion hole and second water conservancy diversion hole on the heat sink layer, can also let the air in four directions flow, improve the speed that the air passed the heat sink layer, and then improve the heat-sinking capability on heat sink layer.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is an exploded view of the present invention;

fig. 3 is a bottom view of the heat sink layer of the present invention;

fig. 4 is a top view of the copper plate of the present invention.

In the figure: 1. a package carrier substrate; 2. a heat sink layer; 3. a heat-conducting adhesive layer; 4. a heat dissipation aluminum plate; 5. an insulating layer; 6. a copper plate; 7. a heat conductive copper bar; 8. packaging the groove; 9. an LED backplane; 10. a thermal expansion layer; 11. a first flow guide hole; 12. and the second diversion hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: an LED packaging carrier plate comprises a packaging carrier plate substrate 1, wherein a heat sink layer 2 is arranged on the top of the packaging carrier plate substrate 1, heat can be transferred to the air through the heat sink layer 2, the heat on LED lamp beads (not shown in the figure) is reduced, and the LED lamp beads are arranged on a copper plate 6, so that the working stability of the LED lamp beads is ensured, a heat conducting adhesive layer 3 is arranged on the top of the heat sink layer 2, a heat radiating aluminum plate 4 is arranged on the top of the heat conducting adhesive layer 3, an insulating layer 5 is arranged on the top of the heat radiating aluminum plate 4, a copper plate 6 is arranged on the top of the insulating layer 5, a heat conducting copper rod 7 is arranged between the bottom of the copper plate 6 and the top of the heat sink layer 2, through holes matched with the heat conducting copper rod 7 are formed in the outer walls of one side of the heat conducting adhesive layer 3, the heat radiating aluminum plate 4 and the insulating layer 5, so that the heat conducting copper rod 7 can penetrate through the heat conducting adhesive layer 3, the heat radiating aluminum plate 4 and the insulating layer 5, thereby realizing the transfer and heat conduction, thereby directly reducing the heat energy of the copper plate 6 and further reducing the heat on the LED lamp bead, the heat conducting copper rod 7 sequentially penetrates through the heat conducting adhesive layer 3, the heat radiating aluminum plate 4 and the insulating layer 5 from top to bottom, the number of the heat conducting copper rods 7 is four, the four heat conducting copper rods 7 are symmetrically arranged between the copper plate 6 and the heat sink layer 2, the heat on the copper plate 6 can be uniformly guided to the heat sink layer 2, the central position of the top of the copper plate 6 is provided with a packaging groove 8, the bottom of the inside of the packaging groove 8 is provided with an LED bottom plate 9, the LED bottom plate 9 is made of the same material as the LED lamp bead base, the LED bottom plate 9 and the LED lamp bead base are ensured to have the same thermal expansion coefficient, the expansion difference of the LED bottom plate 9 and the LED lamp bead base after being heated is small, the problem that the LED lamp bead base falls off and falls off is further avoided, and the connection stability and firmness of the LED lamp bead base are ensured, the inner wall of one side of the packaging groove 8 is provided with a thermal expansion layer 10, the cross section of the thermal expansion layer 10 is of a rectangular frame structure, the thermal expansion coefficient of the thermal expansion layer 10 is between the copper plate 6 and the LED bottom plate 9, the change of the expansion coefficient between the copper plate 6 and the LED bottom plate 9 is reduced, the problem that the joint is loosened and falls off due to overlarge expansion coefficient difference is avoided, the outer wall of one side of the heat sink layer 2 is provided with a first flow guide hole 11, the outer wall of one side of the heat sink layer 2 adjacent to the first flow guide hole 11 is provided with a second flow guide hole 12, the first flow guide hole 11 is vertically crossed with the second flow guide hole 12, the first flow guide hole 11 is communicated with the second flow guide hole 12, not only air convection can be formed, but also air in four directions can flow, the speed of the air passing through the heat sink layer 2 is improved, the heat dissipation capability of the heat sink layer 2 is further improved, when the heat sink is assembled, the packaging carrier plate substrate 1, the heat sink layer 2, the heat conducting glue layer 3, the heat radiating aluminum plate 4, the insulating layer 5 and the copper plate 6 are assembled and connected together, the LED lamp bead base is adhered and fixed on an LED bottom plate 9 at the bottom inside the packaging groove 8, the outer side of the LED lamp bead is attached to the outer wall of the thermal expansion layer 10, the LED lamp bead is installed and fixed inside the packaging groove 8, heat generated by the work of the LED lamp bead is transferred to the copper plate 6, the heat is transferred to the heat sink layer 2 under the heat transfer of the heat conducting copper rod 7 and is also transferred to the heat radiating aluminum plate 4 under the transfer of the heat conducting glue layer 3, heat energy is transferred to the air through the heat radiating aluminum plate 4 and the heat sink layer 2, so that the temperature of the heat sink layer 2 and the heat radiating aluminum plate 4 is reduced, the working temperature of the LED lamp bead is further reduced, the working stability of the LED lamp bead is ensured, air convection can be formed by the first flow guiding holes 11 and the second flow guiding holes 12, and air in four directions can also flow, the speed of air passing through the heat sink layer 2 is improved, and the heat dissipation capacity of the heat sink layer 2 is further improved.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. An LED package carrier, comprising a package carrier substrate (1), characterized in that: the top of encapsulation support plate base plate (1) is provided with heat sink layer (2), the top on heat sink layer (2) is provided with heat conduction glue film (3), the top of heat conduction glue film (3) is provided with heat dissipation aluminum plate (4), the top of heat dissipation aluminum plate (4) is provided with insulating layer (5), the top of insulating layer (5) is provided with copper (6), be provided with heat conduction copper bar (7) between the bottom of copper (6) and the top on heat sink layer (2), the top central point department of putting of copper (6) has seted up encapsulation recess (8), the inside bottom of encapsulation recess (8) is provided with LED bottom plate (9), and is provided with thermal energy layer (10) on the inner wall of one side of encapsulation recess (8), first water conservancy diversion hole (11) has been seted up on the outer wall of one side of heat sink layer (2), and has seted up second water conservancy diversion hole (12) on heat sink layer (2) the outer wall of one side adjacent to first water conservancy diversion hole (11).

2. The LED package carrier of claim 1, wherein: the heat-conducting copper rod (7) sequentially penetrates through the heat-conducting adhesive layer (3), the heat-radiating aluminum plate (4) and the insulating layer (5) from top to bottom.

3. The LED package carrier of claim 1, wherein: the number of the heat conduction copper rods (7) is four, and the four heat conduction copper rods (7) are symmetrically arranged between the copper plate (6) and the heat sink layer (2).

4. The LED package carrier according to claim 1, wherein: the cross section of the thermal expansion layer (10) is of a rectangular frame structure.

5. The LED package carrier of claim 1, wherein: the LED bottom plate (9) is made of the same material as the LED lamp bead base.

6. The LED package carrier according to claim 1, wherein: the thermal expansion coefficient of the thermal expansion layer (10) is between that of the copper plate (6) and the LED bottom plate (9).

7. The LED package carrier of claim 1, wherein: and through holes matched with the heat-conducting copper bars (7) are formed in the outer wall of one side of the heat-conducting adhesive layer (3), the heat-radiating aluminum plate (4) and the insulating layer (5).

8. The LED package carrier of claim 1, wherein: the first flow guide holes (11) and the second flow guide holes (12) are vertically crossed, and the first flow guide holes (11) are communicated with the second flow guide holes (12).

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