TW201020461A - A thermal module for light source - Google Patents

A thermal module for light source Download PDF

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Publication number
TW201020461A
TW201020461A TW097146413A TW97146413A TW201020461A TW 201020461 A TW201020461 A TW 201020461A TW 097146413 A TW097146413 A TW 097146413A TW 97146413 A TW97146413 A TW 97146413A TW 201020461 A TW201020461 A TW 201020461A
Authority
TW
Taiwan
Prior art keywords
heat
module
dissipating
conducting
heat sink
Prior art date
Application number
TW097146413A
Other languages
Chinese (zh)
Other versions
TWI357479B (en
Inventor
Shien-Kuei Liaw
Yu-Hsiu Lin
Jian-Li Huang
Original Assignee
Univ Nat Taiwan Science Tech
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Filing date
Publication date
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Priority to TW097146413A priority Critical patent/TWI357479B/en
Publication of TW201020461A publication Critical patent/TW201020461A/en
Application granted granted Critical
Publication of TWI357479B publication Critical patent/TWI357479B/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The present invention discloses a thermal module for light source, which comprises a heat-conducting part and a heat-dissipating part engaged therewith. The heat-conducting part is provided with a heat-receiving portion to receive the heat generated by light source, an engaging portion to join with the heat-dissipating part. The heat-dissipating part is provided with a plurality of fin heat sinks for heat dissipation and to join with the engaging portion of heat-conducting part.

Description

201020461 VI. Description of the Invention: [Technical Field] The present invention generally relates to a heat dissipation structure of a light source, and more particularly to a heat dissipation module structure formed by bonding a heat conducting member and a heat dissipating member, and having excellent heat conduction properties. With a cooling effect. ~ [Prior Art] Light emitting diodes (LEDs) have many advantages, including high fineness, high luminance, high color reproducibility, etc., and are compatible with the environmental characteristics of mercury-free public hazards. Compared with general lighting or illuminating technology, LED can be made into a thin and compact design, which cannot be achieved by conventional bulb, cold cathode fluorescent lamp (CCFL), or fluorescent tube. In recent years, due to the continuous improvement of brightness and luminous efficiency of LEDs, it has made good development in the application of more elements, from the most basic LED indicators in the early days to all kinds of LED lighting products, such as LED lamps. , lighting, outdoor signboards, display backlight modules, etc., can be said that led has replaced the current 5 types of lighting technology to become the next generation of mainstream lighting technology. Since the input power of high-power LEDs is currently only 15~2〇%, the remaining 80~85% of the energy will be converted into heat. If these heats are not properly removed, many problems will arise. For example: First, excessive waste heat will cause the junction temperature of the LED die to be too high, which will affect its luminous efficiency and service life. First, the fluorescent powder of the LED will be subjected to high heat to reduce the efficiency and cause the color of the output to change, which affects its color quality. Third, the packaging of the LED components of the rubber material such as epoxy resin (ep〇xy) and other materials, will be due to temperature rise and deterioration caused by the local wavelength of light is absorbed, resulting in color shift or light attenuation is now 201020461. 4. If the epoxy resin package reaches its glass transition temperature (Tg), the resin material will rapidly expand to generate thermal stress, which will weaken or even break the contact between the LED die and the solder joint, resulting in failure of the LED. Therefore, in the design of heat exchange, an effective heat dissipation structure is needed to discharge the LED module in the tropics to avoid the above problems. Early Lamp Type LED packages dissipated heat from only two wires to the substrate. Small wires caused considerable thermal resistance, followed by advanced surface-mount device (SMD) LED packages. With the advent of the device, it can be exported by bonding the substrate to the plastic substrate with a large contact area. Since the local heat generated by the high-brightness LED components is quite large, the heat dissipation capability of the conventional heat sink device cannot be applied to the white LED components which are gradually developing to a high power, and the heat dissipation speed cannot keep up with the waste heat generated by the white LEDs. Therefore, if the LED should completely replace the general lighting technology to become a new generation of lighting technology, it must have a suitable heat dissipation design, otherwise the LED luminous efficiency and life shortening problems will be the drawback. Especially for lighting applications that need to be set up in a high-density manner, the breakthrough in LED heat dissipation capability is an urgent problem that the industry needs to overcome. LED lamps are not suitable for heat dissipation by adding fan devices under the consideration of volume, maintenance and extra power consumption. Therefore, there are many different levels of heat dissipation for LED components, such as replacing the substrate directly at the bare die level. The material, Flip-Chip, or a copper heat sink directly under the LED die to enhance its heat dissipation. The LED heat dissipation module is similar to the CPU heat dissipation module. It is a patent of the heat sink fin (fin) and the heat 4 201020461 heat sink. The method of improving the heat dissipation performance is mostly to change the design of the heat sink fin to improve the heat dissipation area or Add a heat pipe to make the heat more evenly distributed. For example, in Taiwan Patent No. M325445, a coffee lamp with a heat dissipating structure is disclosed, in which a plurality of fins are disposed to dissipate heat. This patent is characterized by its heat dissipation, and the fins are wave-shaped, which increases the heat dissipation area per unit volume and forms a heat dissipation flow path between adjacent heat sinks. Although the ginseng is designed to strengthen the pure hot wire, there is no good contact and thermal interface between the luminaire and the heat dissipation structure, so that the heat generated by the luminaire cannot be effectively transmitted to the heat dissipation structure. In order to improve this problem, the concept of the thermal interface structure is such as oysters. As disclosed in Taiwan's new patent 帛M297441, a type of light source module is used, which utilizes a thermal interface material with a high thermal conductivity (four) t-axis such as coefficient. To improve the efficiency of rumbling between the luminaire and the heat dissipation structure. Reading the interface material to enhance the principle of heat can effectively improve the dispersion of the die, but the lesson is that the material (4) welding type to join the heat transfer material and the heat dissipation structure, most of the welding materials (such as tin Does not have good thermal conductivity properties. In this way, the soldered surface between the heat transfer material and the heat dissipating structure generates a high thermal resistance, thereby impairing the advantages of its heat dissipation design. To this end, the industry still needs a new thermal module design to solve the above-mentioned problems that cannot be overcome by the prior art, and provide a good heat dissipation solution for the coffee components. SUMMARY OF THE INVENTION In view of the shortcomings of the prior art, the present invention proposes a novel heat dissipation module design that provides good heat dissipation and avoids the occurrence of high thermal resistance of the material interface. The heat dissipating module of the present invention is formed by combining a heat conducting member and a heat dissipating member having a heated portion to contact with the light source body to receive and conduct heat energy generated at the light source; a joint portion from the other side of the heat receiving portion Extending out of the joint portion, a plurality of clip grooves are arranged along the outer peripheral surface of the extending end thereof to form a sandwich fixing effect with the heat sink. The heat dissipating component of the present invention is formed by radiating outwardly from a plurality of heat dissipating fins, wherein the heat dissipating fin has a clamping groove and a corresponding clamping slot on the heat conducting component is inserted and fixed with the heat conducting component and received by the heat conducting component. The heat. In the present invention, the heat conductive member is made of a material having a high thermal conductivity, and its function is to conduct heat generated by the light source to the heat sink quickly and uniformly. The heat sink is also made of a material having a high heat transfer coefficient, but its heat transfer coefficient must be lower than that of the heat conductive member to allow heat energy to be conducted from the heat conductive member to the heat sink member. The structure of the heat dissipating member of the present invention can provide a wide range of heat dissipating areas for the effect. One of the following: a point of view is to provide a heat-conducting junction with a high heat transfer coefficient, which can conduct heat to the cold air exchange, in order to solve the problem of joining in the prior art by welding. High thermal resistance problem to achieve better heat dissipation performance. Example: The advantages of the invention are further understood by the following embodiments of the invention and the drawings. [Embodiment] ==Definite implementation details '俾 阅 阅 — — — — — 。 。 。 。 。 。 。 。 。 。 。 。 。 。 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 In addition, the rational explanation. The terminology used in the detailed description will be in the most generalized mutual:::::The thermal module is mainly used by a heat-conducting component and a heat-dissipating component. Heat dissipation performance. In the invention, the guide member has the heat energy generated by the light source at the level of the light source, so that the heat conduction heat portion can be directly contacted with the respective light source portions, and the shape plane and the like can be seen on the It surface. Shape, such as a circle Long rectangle, or irregular contact with the light source, another ^:::. The part of the heated part is used to extend into the joint part from the upper part, the joint part: medium, heat conductive parts It is the same as the plane shape of the cross-sectional shape of the tubular joint, and the joint shape of the tubular joint and each of the contact areas can be Allocation: The same amount of heat energy.” Another: aspects, the function of the heat sink is to conduct heat; 1== gas for r, so its heat contact with the atmosphere is the same as the heat sink The outward structure has a specific clamping groove on the heat-dissipating splicing plate that can be connected with the guiding position to make the heat-dissipating member and the heat-conducting member are fixedly fixed. In this way, the thermal energy received by the member can be quickly and evenly transmitted to each of the scattered (four) sheets. : controlling the flow of heat, the heat transfer coefficient of the heat conductive member of the present invention (4) is higher than the heat transfer coefficient of the heat sink to ensure that 7 201020461 * t * the overall heat energy flows toward the heat sink portion. Please refer to FIG. 1 , which is a schematic diagram of a heat conducting member 1 〇〇 and a dispersing member 110 according to an embodiment of the invention. As shown in the figure, the heat conducting member rigid structure and the heat dissipating member 110 in the present embodiment have a cylindrical shape. The heat conducting member 100 has a circular heat receiving portion 1 〇 2 plane for direct contact with the light source to receive the heat energy generated therefrom. The size of the location of the heated portion 1 〇 2 plane may vary depending on the number and configuration of the light source elements to save the fabrication of the required material and optimize the thermal conductivity of the circular joint portion 104 from the other side of the heated portion 102. Extending out, the interior is hollow to save material usage and facilitate the combination of the heat conductive member 100 and the heat sink 1 . The joint portion i (10) has a plurality of clip grooves 106 arranged along the outer peripheral surface of the extending end thereof for contacting the heat dissipating member 110 so that the heat dissipating member 110 can be annularly fixed to the outer edge of the joint portion 104. The number of the clamping slots 1〇6 on the heat conducting member 100 depends on the number of the heat dissipating fins m disposed on the heat dissipating member, and the more the number of the clamping slots 106 and the fins 2 are disposed, the heat conduction between the heat conducting member 100 and the heat dissipating member 110 The better the fruit, the better the heat can be conducted more evenly and quickly to the heat sink 110 for the heat exchange step. As shown in the figure, the heat sink 110 in the embodiment of the present invention is a cylindrical structure having a plurality of sheets U2. The heat dissipating fins 112 are self-aligned, and the cylindrical portion 114 at the center of the heat dissipating member 110 radiates outward. Each of the heat dissipating tabs 112 has the same spacing to achieve uniform heat dissipation properties. In addition, each of the heat sinking films 112 has a central slot formed therein. The dimension of the slot m is designed to be mated with the corresponding slot 106 of the heat conducting member 9 (9) so that the heat conducting member 100 and the heat sink no can be closely connected. In this way, the heat energy received by the heat conducting member 1 from the light source can be conducted to the fins 112 for heat dissipation. In the present invention, the more the number of the heat dissipating fins 112 is disposed, the larger the heat dissipating area that can provide heat exchange with the outside cold air, and the better heat dissipating performance can be achieved. - Figure 1 is a schematic view of heat dissipation in an embodiment of the present invention. The heat sink Korean film 112 is provided with a clamping groove 116 for engaging, and the basin m is not disposed in the middle portion of the heat sink 'fin 112 so that heat is evenly distributed on the heat radiating fins. In the present invention, the groove widths w ❹ φ of the slit grooves 106 and 116 are dimensioned so as to achieve a close fit between the grooves, and the groove depth D can be changed depending on the design. The arrows in the figure represent the travel of the heat flow on the heat sink fins 112: 'It is known that the hot chuck slot 116 is disposed in the middle section to achieve the hottest effect. One of the v耿: ^乍, the heat-conducting member 1〇0 of the present invention can be formed by a scale (-) filament method, which uses a material of thermal conductivity to form a material such as silver, gold or a highly conductive composite material. Increase the rate of execution. On the other hand, the heat dissipating member 110 of the present invention can be formed by using a material of a heat transfer coefficient, such as a material of a heat transfer coefficient, and a material such as a high-conductivity composite material to enhance the heat transfer and heat dissipation member 110. The slot is based on the appropriate scale: the cutter cuts out. It should be noted that in order to control the flow of heat, the present invention guides; the conduction coefficient is higher than the heat transfer coefficient of the heat sink 110 - and the resident thermal energy flow # moves toward the heat sink 11G portion. The formula is as follows: the first two T joints on the metal material are welded by the welding method. If the welding method is used in the present invention, the tin is significantly improved between the heat conducting member (10) and the heat dissipating member 110. The interface enforces the resistance of 201020461, which in turn affects its thermal conductivity properties. Therefore, this issue
The splicing method is used to insert the splicing method into the squirrel J, and the bonding material does not need to use the solder material ’’ to achieve the tight joint by physical clamping. In the joining step of the present invention, the heat conducting member 100 or the heat dissipating member u will be first placed in the heating furnace to rise to a certain temperature. Since the metal has a phenomenon of significant thermal expansion and contraction, the groove width 106 of the upper groove 106 or 116 is increased as it is heated, so that it can be inserted into the corresponding groove. The structure of the heat-dissipating component 100 and the heat-dissipating component 11 is not shown in FIG. 3, which is a schematic diagram of a complete heat-dissipating module 300 according to an embodiment of the invention. After the two components are inserted, when the heat dissipation module 300 is cooled to room temperature, the upper groove width W is reduced to the original width, and the effect of tight clamping is achieved. Therefore, the structural design of the present invention can achieve the same bonding effect without maintaining the use of the tantalum material and maintain good heat transfer properties. As shown in Fig. 3, the heat dissipation module 3 of the second rear receives the thermal energy generated by the light source through the heated portion 1〇2, and then the thermal energy is transmitted to the tubular joint receiving portion 1〇4 extended therefrom. By means of a tight clamping fit, the joints 1 〇 4 can be effectively and uniformly hooked onto each of the heat sink fins 112 that are in contact therewith. Heat dissipation. Fin H2 provides a large and dispersed heat dissipation area. The fins _ heat flow channel allows the heat energy on the slab to exchange heat with the cold air with low ambient temperature to dissipate the waste heat generated by the light source. The invention is not limited to the specific details described herein. Many different inventive variations that are related to the foregoing description and drawings are permitted in the spirit and scope of the present invention. Therefore, the invention is intended to be limited by the scope of the invention, and the scope of the invention is defined by the above description. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a heat conducting member and a heat dissipating member according to an embodiment of the present invention: FIG. 2 is a schematic view showing a heat dissipating fin and a clamping groove thereof according to an embodiment of the present invention; A schematic diagram of a complete heat dissipation module in the embodiment. [Main component symbol description] 100 Heat conductor 102 Heated part Reference 104 Jointed part 106 Clamping groove 110 Heat sink 112 Heat sink fin 114 Cylinder part 116 Clamping groove 300 Heat sink _ W Slot width ❹ D Groove depth 11

Claims (1)

  1. 201020461 VII. Patent application scope: 1. A heat dissipation module for a light source, comprising: a heat-conducting member having a heated portion for receiving money. The utility model comprises: a plurality of clamping grooves arranged along the extending end thereof; ❹-heat dissipating member having a plurality of heat dissipating fins extending outwardly, the interlacing Γ having a clamping groove, and corresponding to the joint portion of the heat conducting member The heat sink ring is fixed on the outer edge of the joint portion, and the heat energy transmitted from the heat conductive member is connected; and the heat transfer coefficient of the heat conductive member is lower than the heat conduction coefficient of the heat sink member. The cylindrical, square-shaped heat module 'the heat-conducting member and the heat-dissipating member or the symmetrical shape thereof are joined in a concentric manner. 3. If the request item is dimmed ^ Φ by the thermal expansion and contraction of the 'square, the heat module, wherein the heat transfer member is slotted and the clamping groove of the heat sink is tightly engaged. The module 'where the heat-conducting member is casted 4.: J is the first source of heat dissipation 5. If the request item 丨 is formed by extrusion. The heat dissipating module of the crucible, wherein the heat dissipating component is as claimed in the silver, gold, or high heat dissipation module, wherein the heat conducting component is made of a material such as copper, aluminum or a fusible composite material. 12 201020461 7, as in the request item 1 to increase its thermal heating module, wherein the heat sink fin can be wave 8. As requested in item 1 april, the heat sink module disposed in the heat sink fin, wherein the heat sink fin The fins are provided with heat sink fins I·, , , . The middle section of the sheet is such that the transmitted heat is evenly dispersed. 9. As required, i. You support the thermal module, where the light source is a light-emitting diode %
    13
TW097146413A 2008-11-28 2008-11-28 A thermal module for light source TWI357479B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
TW097146413A TWI357479B (en) 2008-11-28 2008-11-28 A thermal module for light source
US12/490,744 US20100132931A1 (en) 2008-11-28 2009-06-24 Thermal module for light source

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TW201020461A true TW201020461A (en) 2010-06-01
TWI357479B TWI357479B (en) 2012-02-01

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102818237A (en) * 2011-06-10 2012-12-12 强茂股份有限公司 Manufacturing method of heat conductive device for light-emitting diode
TWI393527B (en) * 2010-10-01 2013-04-11
US9255743B2 (en) 2010-09-30 2016-02-09 Zhongshan Weiqiang Technology Co., Ltd. Finned heat dissipation module

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8262255B1 (en) * 2009-11-20 2012-09-11 Hamid Rashidi Small sized LED lighting luminaire having replaceable operating components and arcuate fins to provide improved heat dissipation
US8696157B2 (en) * 2010-10-11 2014-04-15 Cool Lumens Heat sink and LED cooling system
US20130235596A1 (en) * 2012-03-12 2013-09-12 Tai-Her Yang Cup-shaped heat dissipation member applicable in electric-powered light emitting unit
US9163824B2 (en) 2012-05-07 2015-10-20 Technical Consumer Products, Inc. Lamp heat sink
KR101652161B1 (en) * 2014-06-25 2016-08-29 엘지전자 주식회사 Lighting apparatus
CN105276550B (en) * 2015-11-05 2020-08-25 漳州立达信光电子科技有限公司 Heat radiation lamp cup
FR3064341B1 (en) 2017-03-21 2021-06-25 Valeo Vision LIGHT SOURCE COOLING DEVICE

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844341A (en) * 1972-05-22 1974-10-29 Us Navy Rotatable finned heat transfer device
US5000254A (en) * 1989-06-20 1991-03-19 Digital Equipment Corporation Dynamic heat sink
US5615084A (en) * 1995-06-30 1997-03-25 International Business Machines Corporation Enhanced flow distributor for integrated circuit spot coolers
US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
US5835347A (en) * 1997-08-01 1998-11-10 Asia Vital Components Co., Ltd. CPU heat dissipating device
US6109345A (en) * 1997-08-28 2000-08-29 Giacomel; Jeffrey A. Food preparation and storage device
DE20006937U1 (en) * 2000-04-14 2000-08-17 Hsieh Hsin Mao Arrangement for dissipating heat
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
US6411514B1 (en) * 2001-03-08 2002-06-25 Rally Manufacturing, Inc. Power inverter with heat dissipating assembly
US6386275B1 (en) * 2001-08-16 2002-05-14 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator
TW520146U (en) * 2002-06-13 2003-02-01 Hon Hai Prec Ind Co Ltd Heat pipe assembly
US6650541B1 (en) * 2002-06-25 2003-11-18 Hewlett-Packard Development Company, L.P. Fan-securing device for use with a heat transfer device
US20040118552A1 (en) * 2002-12-24 2004-06-24 Wen-Shi Huang Heat-dissipating device
US6789610B1 (en) * 2003-08-28 2004-09-14 Hewlett-Packard Development Company, L.P. High performance cooling device with vapor chamber
US20050211416A1 (en) * 2003-10-17 2005-09-29 Kenya Kawabata Heat sink with fins and a method for manufacturing the same
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US7040389B2 (en) * 2004-05-12 2006-05-09 Hul-Chun Hsu Integrated heat dissipation apparatus
US6948555B1 (en) * 2004-06-22 2005-09-27 Hewlett-Packard Development Company, L.P. Heat dissipating system and method
US7120019B2 (en) * 2004-08-18 2006-10-10 International Business Machines Corporation Coaxial air ducts and fans for cooling and electronic component
US20070029068A1 (en) * 2005-08-03 2007-02-08 Ming-Jen Cheng Heat sink
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
US7475718B2 (en) * 2006-11-15 2009-01-13 Delphi Technologies, Inc. Orientation insensitive multi chamber thermosiphon
US8256258B2 (en) * 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US20110012494A1 (en) * 2007-07-05 2011-01-20 Fawoo Technology Co., Ltd. Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device
US7746647B2 (en) * 2007-12-18 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Clip and heat dissipation assembly using the same
TW200934361A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipater and structure thereof
TWI353212B (en) * 2008-01-16 2011-11-21
TWM337229U (en) * 2008-02-01 2008-07-21 Neng Tyi Prec Ind Co Ltd Heat dissipating element and heat radiator containing the same
US20090279314A1 (en) * 2008-05-06 2009-11-12 Chung Wu Heat dissipating device with protection function and heat dissipating fins thereof
US8297341B2 (en) * 2008-09-08 2012-10-30 Getac Technology Corp. Heat dissipating structure and method of forming the same
US7918587B2 (en) * 2008-11-05 2011-04-05 Chaun-Choung Technology Corp. LED fixture and mask structure thereof
USD618634S1 (en) * 2009-07-21 2010-06-29 Foxsemicon Integrated Technology, Inc. Heat dissipation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9255743B2 (en) 2010-09-30 2016-02-09 Zhongshan Weiqiang Technology Co., Ltd. Finned heat dissipation module
TWI393527B (en) * 2010-10-01 2013-04-11
CN102818237A (en) * 2011-06-10 2012-12-12 强茂股份有限公司 Manufacturing method of heat conductive device for light-emitting diode
CN102818237B (en) * 2011-06-10 2014-07-23 强茂股份有限公司 Manufacturing method of heat conductive device for light-emitting diode

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