CN218039115U - Cleaning device and wafer thinning equipment - Google Patents

Abstract

The utility model discloses a belt cleaning device and wafer attenuate equipment belongs to wafer manufacturing technical field. The cleaning device comprises a box body, a first cleaning mechanism and a second cleaning mechanism, wherein the first cleaning mechanism and the second cleaning mechanism are arranged on the box body, are respectively positioned at a first end and a second end of the box body, and can move on the box body along a first direction; the cleaning device further comprises: the first cover body is arranged between the first end of the box body and the first cleaning mechanism; the second cover body is arranged between the second end of the box body and the second cleaning mechanism; and the third cover body is arranged between the first cleaning mechanism and the second cleaning mechanism. The wafer thinning equipment comprises the cleaning device. The utility model discloses a setting of the first cover body, the second cover body and the third cover body is carried out abundant cover to the box and is established, avoids flying bits or water smoke to get into inside the box, protects wiper mechanism's relevant mechanical and electrical components, guarantees the smooth realization of belt cleaning device cleaning function.

Description

Cleaning device and wafer thinning equipment

Technical Field

The utility model relates to a wafer manufacturing technology field especially relates to a belt cleaning device and wafer attenuate equipment.

Background

After the wafer is thinned, a lot of small-particle silicon slag adheres to the surface of the wafer, and needs to be preliminarily cleaned, so that the silicon slag is beneficial to being grabbed by a sucker of a transfer conveying hand, and the silicon slag is prevented from falling off in the transfer process to pollute other mechanisms; after the wafer is taken away, the silicon slag falling off in the wafer thinning process can block the air hole of the chuck workbench, so that the chuck workbench is required to be cleaned, and subsequent use is not influenced.

The cleaning device can move to the position of the working table surface during cleaning and return to the original position after the cleaning is finished, the movement of the cleaning device is realized by a mechanical guide rail, and the accurate positioning of the mechanical guide rail is realized by a circuit control system and a sensor. The cleaning device inevitably has flying chips and water mist splashing during cleaning, which can damage mechanical and electrical elements in the cleaning device and influence the service life of the cleaning device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a belt cleaning device and wafer attenuate machine can realize wafer and chuck workstation abluent while, protects the inside mechanical electrical element of belt cleaning device, avoids water smoke or impurity to get into.

In order to realize the purpose, the following technical scheme is provided:

a cleaning device comprises a box body, a first cleaning mechanism and a second cleaning mechanism, wherein the first cleaning mechanism and the second cleaning mechanism are arranged on the box body, the box body is provided with a first end and a second end along a first direction, the first cleaning mechanism and the second cleaning mechanism are respectively positioned at the first end and the second end of the box body, and both the first cleaning mechanism and the second cleaning mechanism can move on the box body along the first direction; the cleaning device further comprises:

the first cover body is arranged between the first end of the box body and the first cleaning mechanism;

the second cover body is arranged between the second end of the box body and the second cleaning mechanism;

and the third cover body is arranged between the first cleaning mechanism and the second cleaning mechanism.

Furthermore, the first cover body, the second cover body and the third cover body have the same structure and respectively comprise a bidirectional coil spring, a first cover body and a second cover body; the bidirectional coil springs comprise intermediate shafts, upstream coil springs and downstream coil springs, after the upstream coil springs and the downstream coil springs are overlapped, one ends of the upstream coil springs and the downstream coil springs are all connected to the intermediate shafts in a rolling mode, the upstream coil springs, the other ends of which are positioned on the outer sides, extend above the intermediate shafts, the downstream coil springs, the other ends of which are positioned on the inner sides, extend below the intermediate shafts, and the extending directions of the upstream coil springs and the downstream coil springs are opposite to each other; the first covering body is arranged on the upward coil spring, and the second covering body is arranged on the downward coil spring.

Further, the extending directions of the upper coil springs and the lower coil springs are parallel to the first direction.

Further, one of the first cover body and the second cover body of the first cover body is connected with the first end of the box body, and the other is connected with the first cleaning mechanism;

one of the first cover body and the second cover body of the second cover body is connected with the second end of the box body, and the other one of the first cover body and the second cover body is connected with the second cleaning mechanism;

one of the first cover body and the second cover body of the third cover body is connected with the first cleaning mechanism, and the other is connected with the second cleaning mechanism.

Further, the first cleaning mechanism comprises a first workbench and a first cleaning piece arranged on the first workbench, and the first cleaning piece comprises a first driving piece, an oilstone grinding wheel arranged at the output end of the first driving piece, a second driving piece and a first brush body arranged at the output end of the second driving piece;

the first cover body is connected between the box body and the first workbench.

Furthermore, the second cleaning mechanism comprises a second workbench and a second cleaning piece arranged on the second workbench, and the second cleaning piece comprises a third driving piece and a second brush body arranged at the output end of the third driving piece;

the second cover body is connected between the box body and the second workbench; the third cover body is connected between the first workbench and the second workbench.

Further, the first driver, the second driver and the third driver are all used for outputting torque.

A wafer thinning device comprises a machine table, and a wafer box, a feeding and discharging device and a thinning device which are sequentially arranged on the machine table along a second direction, wherein the feeding and discharging device is used for feeding wafers in the wafer box to the thinning device or discharging thinned wafers into the wafer box by the thinning device; the thinning device comprises a rotary worktable and a chuck worktable arranged on the rotary worktable, and a wafer is arranged on the chuck worktable; the wafer thinning equipment is also provided with any one of the cleaning devices, and the cleaning devices are used for cleaning the chuck workbench and the wafer on the chuck workbench.

Further, wafer attenuate equipment still includes the frame, the frame is located go up unloader with between the attenuate device, belt cleaning device locates in the frame, and be located swivel work head top.

Further, the first direction is perpendicular to the second direction.

Compared with the prior art, the beneficial effects of the utility model are that:

make the first end of box and the region between the first wiper mechanism to be covered through the first cover body and establish, the second cover body makes the second end of box and the region between the second wiper mechanism to be covered and establishes, the third cover body then covers the region between two wiper mechanisms, and then no matter how wiper mechanism moves, can have the cover body to fully cover on the box and establish, avoid flying chips or water smoke to get into inside the box, protect wiper mechanism's relevant mechanical electrical component, guarantee the smooth realization of belt cleaning device cleaning function.

Drawings

Fig. 1 is a schematic structural view of a cleaning device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a cover according to an embodiment of the present invention;

fig. 3 is a first schematic structural diagram of a wafer thinning apparatus according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a wafer thinning apparatus according to an embodiment of the present invention.

Reference numerals are as follows:

100. a cleaning device; 200. a wafer cassette; 300. a loading and unloading device; 400. a thinning device; 500. a machine platform; 600. a frame; 401. a rotary table; 402. a chuck table;

10. a box body; 20. a first cleaning mechanism; 30. a second cleaning mechanism; 40. a first cover body; 50. a second cover body; 60. a third cover body;

21. a first table; 22. a first cleaning member; 221. a first driving member; 222. a whetstone wheel; 223. a second driving member; 224. a first brush body; 31. a second table; 32. a second cleaning member; 321. a third driving member; 322. a second brush body; 41. a bidirectional coil spring; 411. an intermediate shaft; 412. an upward coil spring; 413. a downward coil spring; 42. a first cover body; 43. a second cover body.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when used, and are only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

Referring to fig. 1-4, the present embodiment provides a cleaning apparatus 100, which is mainly used for a wafer thinning device to clean a thinned wafer and a chuck table 402; specifically, referring to fig. 1, the cleaning apparatus 100 includes a tank 10, a first cleaning mechanism 20 and a second cleaning mechanism 30 provided on the tank 10; the tank 10 has a first end and a second end along a first direction (i.e., X direction in the drawing), and the first cleaning mechanism 20 and the second cleaning mechanism 30 are respectively located at the first end and the second end of the tank 10 and both are movable on the tank 10 along the first direction. In this embodiment, the first cleaning mechanism 20 is used for cleaning the chuck table 402, and the second cleaning mechanism 30 is used for cleaning the thinned wafer on the chuck table 402.

Specifically, the first cleaning mechanism 20 includes a first worktable 21 and a first cleaning member 22 disposed on the first worktable 21, and the first cleaning member 22 includes a first driving member 221, a whetstone grinding wheel 222 disposed at an output end of the first driving member 221, a second driving member 223, and a first brush 224 disposed at an output end of the second driving member 223. The first brush 224 is used to remove large silicon slag from the chuck table 402, and the oilstone grinding wheel 222 is used to remove fine silicon slag. The second cleaning mechanism 30 includes a second worktable 31 and a second cleaning member 32 disposed on the second worktable 31, and the second cleaning member 32 includes a third driving member 321 and a second brush 322 disposed at an output end of the third driving member 321. The second brush body 322 is used to remove impurities on the wafer. Further, the first driving member 221, the second driving member 223 and the third driving member 321 are used for outputting torque, i.e. the whetstone 222 or the brush body is rotated by itself to rub against the wafer or the chuck table 402 for cleaning.

The cleaning apparatus 100 further includes a displacement drive mechanism (not shown in the drawings) for driving the first table 21 and the second table 31 to move in the first direction; generally, the displacement drive mechanism includes a mechanical guide rail, a peripheral circuit control system, a sensor, and other electrical components. In order to facilitate the arrangement of the cleaning mechanism and the displacement driving mechanism thereof, the tank 10 is generally provided with an opening, so that impurities such as flying chips or water mist are prevented from entering the tank 10 to influence the driving of the displacement driving mechanism when the cleaning operation is carried out. Therefore, the cleaning device 100 in this embodiment further includes a first enclosure 40, a second enclosure 50, and a third enclosure 60; the first cover body 40 is arranged between the first end of the box body 10 and the first cleaning mechanism 20 and is used for covering the area between the first end of the box body 10 and the first cleaning mechanism 20 so as to prevent impurities from entering the area; the second cover body 50 is arranged between the box body 10 and the second cleaning mechanism 30 and is used for covering the area between the second end of the box body 10 and the second cleaning mechanism 30 so as to prevent impurities from entering the area; the third housing 60 is provided between the first cleaning mechanism 20 and the second cleaning mechanism 30, and is configured to house an area between the first cleaning mechanism 20 and the second cleaning mechanism 30, so as to prevent impurities from entering therein. Therefore, even if the box body 10 is provided with an opening, the arrangement of the first cover body 40, the second cover body 50 and the third cover body 60 enables the cover bodies to cover different areas of the box body 10 fully no matter how the cleaning mechanism moves, flying chips or water mist is prevented from entering the inside of the box body 10, relevant mechanical and electrical components of the cleaning mechanism are protected, and smooth realization of the cleaning function of the cleaning device 100 is ensured.

Further, referring to fig. 2, the first cover 40, the second cover 50, and the third cover 60 are identical in structure, and each includes a bidirectional coil spring 41, a first cover 42, and a second cover 43; the bidirectional coil spring 41 comprises an intermediate shaft 411, an upper coil spring 412 and a lower coil spring 413, after the upper coil spring 412 and the lower coil spring 413 are overlapped, one ends of the upper coil spring 412 and the lower coil spring 413 are both connected to the intermediate shaft 411 in a rolling mode, the upper coil spring 412 with the other end positioned on the outer side extends out above, the lower coil spring 413 positioned on the inner side extends out below, and the extending directions of the upper coil spring 412 and the lower coil spring 413 are opposite; the first shutter body 42 is provided on the upper coil spring 412, and the second shutter body 43 is provided on the lower coil spring 413. In specific implementation, when an external force pulls the free ends of the first cover 42 and/or the second cover 43, the upper coil spring 412 and the lower coil spring 413 are unfolded, the free ends of the first cover 42 and the second cover 43 are far away from each other, and the larger the unfolding range of the coil springs is, the larger the covering range of the whole cover is; when the external force is released, the upper coil spring 412 and the lower coil spring 413 gradually recover the winding state by the self-elastic force, the free ends of the first shutter body 42 and the second shutter body 43 approach each other, and the shielding range of the cover bodies becomes small.

In particular, when assembling, for the first cover 40, one of the first covering body 42 and the second covering body 43 is connected to the first end of the case 10, and the other is connected to the first cleaning mechanism 20; for the second cover 50, one of the first cover 42 and the second cover 43 is connected to the second end of the tank 10, and the other is connected to the first cleaning mechanism 20; as for the third cover 60, one of the first and second covering bodies 42 and 43 is connected to the first cleaning mechanism, and the other is connected to the second cleaning mechanism 30. That is, when the cover is connected between two objects, the positions of the first covering member 42 and the second covering member 43 can be interchanged, and the covering function and the related operation are not affected. Specifically, the covering member of the enclosure is connected to the table of the washing mechanism, i.e., the first enclosure 40 is connected between the cabinet 10 and the first table 21; the second cover 50 is connected between the box body 10 and the second worktable 31; the third cover 60 is connected between the first table 21 and the second table 31.

During specific implementation, the distance between the first cleaning mechanism 20 and the first end of the box 10, the distance between the second cleaning mechanism 30 and the second end of the box 10, and the distance between the first cleaning mechanism 20 and the second cleaning mechanism 30 can all be changed, so that the required covering range can be changed. In this embodiment, the extending directions of the lower coil springs 413 of the upper coil springs 412 are all parallel to the first direction, that is, the direction is the same as the moving direction of the cleaning mechanism, so that the cover body can be stretched more conveniently when the cleaning mechanism moves.

Referring to fig. 3 and fig. 4, the present embodiment further provides a wafer thinning apparatus, which includes a machine 500, and a wafer box 200, a feeding and discharging device 300, and a thinning device 400 sequentially disposed on the machine 500 along a second direction (i.e., Y direction in the drawing), wherein the feeding and discharging device 300 is configured to feed a wafer in the wafer box 200 to the thinning device 400 or feed a thinned wafer into the wafer box 200 by the thinning device 400; specifically, the thinning apparatus 400 includes a rotary table 401 and a chuck table 402 provided on the rotary table 401, and the wafer is placed on the chuck table 402. The wafer thinning equipment further comprises the cleaning device 100, and the cleaning device 100 is used for cleaning the chuck worktable 402 and the wafer on the chuck worktable 402.

Specifically, when the thinning process needs to be performed, the rotary worktable 401 rotates to move the chuck worktable 402 with the wafer to the thinning station, after the thinning process is completed, the rotary worktable 401 rotates to move the wafer to the cleaning station, at this time, the second cleaning mechanism 30 of the cleaning device 100 moves to the cleaning station to clean the wafer, after the cleaning is completed, the second cleaning mechanism 30 returns to the original point, and the wafer is taken away by the loading and unloading device 300; then the first cleaning mechanism 20 moves to the cleaning station to clean the chuck table 402, and after the cleaning is completed, the first cleaning mechanism 20 returns to the original point.

Further, the wafer thinning equipment further comprises a frame 600, the frame 600 is arranged between the loading and unloading device 300 and the thinning device 400, and the cleaning device 100 is arranged on the frame 600 and located above the rotary worktable 401. In specific implementation, the box 10 of the cleaning device 100 is disposed on the rack 600, and the first cleaning mechanism 20 and the second cleaning mechanism 30 are disposed vertically downward, that is, the rotation axes of the oilstone grinding wheel 222, the first brush 224 and the second brush 322 are all along the vertical direction, so as to increase the contact area with the wafer or the chuck table 402 and improve the cleaning efficiency. Further, the first direction is perpendicular to the second direction.

It should be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles applied thereto. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. A cleaning device is characterized by comprising a box body (10), a first cleaning mechanism (20) and a second cleaning mechanism (30) which are arranged on the box body (10), wherein the box body (10) is provided with a first end and a second end along a first direction, the first cleaning mechanism (20) and the second cleaning mechanism (30) are respectively arranged at the first end and the second end of the box body (10) and can move along the first direction on the box body (10); the cleaning device further comprises:

a first cover (40), said first cover (40) being disposed between said first end of said tank (10) and said first cleaning mechanism (20);

the second cover body (50), the said second cover body (50) locates between second end and the said second cleaning mechanism (30) of the said container body (10);

a third cover (60), wherein the third cover (60) is arranged between the first cleaning mechanism (20) and the second cleaning mechanism (30).

2. The cleaning device according to claim 1, wherein the first cover (40), the second cover (50) and the third cover (60) are identical in structure and each include a bidirectional coil spring (41), a first shutter body (42) and a second shutter body (43);

the bidirectional coil spring (41) comprises an intermediate shaft (411), an ascending coil spring (412) and a descending coil spring (413), after the ascending coil spring (412) and the descending coil spring (413) are overlapped, one ends of the ascending coil spring (412) and the descending coil spring (413) are all connected to the intermediate shaft (411) in a rolling mode, the ascending coil spring (412) with the other end located on the outer side extends out from the upper part, the descending coil spring (413) located on the inner side extends out from the lower part, and the extending directions of the ascending coil spring (412) and the descending coil spring (413) are opposite;

the first cover body (42) is arranged on the upper coil spring (412), and the second cover body (43) is arranged on the lower coil spring (413).

3. The cleaning device according to claim 2, wherein the projecting directions of said upward coil spring (412) and said downward coil spring (413) are parallel to said first direction.

4. The washing device according to claim 2, characterized in that one of the first shutter body (42) and the second shutter body (43) of the first cover body (40) is connected to the first end of the tank (10), and the other is connected to the first washing means (20);

one of the first cover body (42) and the second cover body (43) of the second cover body (50) is connected with the second end of the box body (10), and the other is connected with the second cleaning mechanism (30);

one of the first covering body (42) and the second covering body (43) of the third cover body (60) is connected to the first cleaning mechanism (20), and the other is connected to the second cleaning mechanism (30).

5. The cleaning device according to claim 1, wherein the first cleaning mechanism (20) comprises a first worktable (21) and a first cleaning member (22) arranged on the first worktable (21), the first cleaning member (22) comprises a first driving member (221), an oilstone grinding wheel (222) arranged at the output end of the first driving member (221), a second driving member (223) and a first brush body (224) arranged at the output end of the second driving member (223);

the first cover (40) is connected between the box body (10) and the first workbench (21).

6. The cleaning device according to claim 5, characterized in that the second cleaning mechanism (30) comprises a second worktable (31) and a second cleaning piece (32) arranged on the second worktable (31), and the second cleaning piece (32) comprises a third driving piece (321) and a second brush body (322) arranged at the output end of the third driving piece (321);

the second cover (50) is connected between the box body (10) and the second workbench (31); the third cover (60) is connected between the first workbench (21) and the second workbench (31).

7. A cleaning device according to claim 6, characterized in that the first drive element (221), the second drive element (223) and the third drive element (321) are each for outputting a torque.

8. A wafer thinning device comprises a machine table (500), and a wafer box (200), a feeding and discharging device (300) and a thinning device (400) which are sequentially arranged on the machine table (500) along a second direction, wherein the feeding and discharging device (300) is used for feeding wafers in the wafer box (200) to the thinning device (400) or discharging thinned wafers into the wafer box (200) through the thinning device (400); the thinning device (400) comprises a rotary worktable (401) and a chuck worktable (402) arranged on the rotary worktable (401), and a wafer is arranged on the chuck worktable (402); the wafer thinning apparatus is characterized in that the wafer thinning apparatus further comprises a cleaning device according to any one of claims 1 to 7, wherein the cleaning device is used for cleaning the chuck table (402) and the wafer on the chuck table (402).

9. The wafer thinning apparatus according to claim 8, further comprising a frame (600), wherein the frame (600) is disposed between the loading and unloading device (300) and the thinning device (400), and the cleaning device is disposed on the frame (600) and above the rotary worktable (401).

10. The wafer thinning apparatus of claim 9, wherein the first direction is perpendicular to the second direction.

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