CN218006600U - HDI circuit board that soft or hard combines - Google Patents
HDI circuit board that soft or hard combines Download PDFInfo
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- CN218006600U CN218006600U CN202221614920.9U CN202221614920U CN218006600U CN 218006600 U CN218006600 U CN 218006600U CN 202221614920 U CN202221614920 U CN 202221614920U CN 218006600 U CN218006600 U CN 218006600U
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- circuit board
- line way
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- board
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Abstract
The utility model discloses a HDI circuit board that soft or hard combines, including rigid circuit board and flexible line way board, the circuit layer is all installed to rigid circuit board and flexible line way board upper end, installation damping device is all installed to rigid circuit board left end and flexible line way board right-hand member, heat-transfer device is installed to rigid line way board lower extreme, the enhancement device is installed to flexible line way board lower extreme. A HDI circuit board that soft or hard combines, cushion about carrying out through installation damping device upper end spring and No. two springs to the circuit board, and then reduce rocking that the circuit board received, have excellence intensity, high-modulus and high temperature resistant, acid and alkali resistant, fine performance such as light in weight through strengthening device aramid fiber layer to improved the performance of flexible line way board, dispel the heat with heat transfer to below radiating fin through heat conduction device upper end heat conduction copper sheet, thereby improved the heat dispersion of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field, in particular to HDI circuit board that soft or hard combines.
Background
Although the rigid circuit board has a good heat dissipation effect, the rigid circuit board cannot be bent and is easily damaged, and although the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, the flexible circuit board has a poor heat dissipation effect, and is insecure in installation due to the characteristic of good bending property. However, the flexible-rigid printed circuit board combines the flexible board and the rigid board, and has both the flexibility of the flexible circuit board and the strength of the rigid circuit board, so the development and use of the flexible-rigid printed circuit board are important nowadays.
1. Although the existing HDI circuit board combined by the soft board and the hard board is formed by combining the soft board and the hard board, the existing HDI circuit board is fixedly installed through screws, so that the circuit board is easy to shake from the outside, the using effect of the HDI circuit board combined by the soft board and the hard board is influenced, and meanwhile, the connecting part of the soft board and the hard board is also easy to influence to a certain extent; 2. the soft board part of the existing HDI circuit board combined by soft and hard has the characteristics of light weight, thin thickness and good bending property, but is easy to be damaged when being stretched, thereby influencing the service life of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a HDI circuit board that soft or hard combines can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a HDI circuit board that soft or hard combines, includes rigid line way board and flexible line way board, the circuit layer is all installed to rigid line way board and flexible line way board upper end, installation damping device is all installed to rigid line way board left end and flexible line way board right-hand member, heat conduction device is installed to rigid line way board lower extreme, the device is strengthened to flexible line way board lower extreme installation.
Preferably, installation damping device includes mounting bracket and fixed plate, open mounting bracket upper end left part has a plurality of mounting hole, the chucking screw is all installed at mounting bracket upper end front portion and upper end rear portion, two the cardboard is all installed to the chucking screw lower extreme, two springs are all installed to the cardboard lower extreme, two springs are all installed under the mounting bracket behind the inner wall front portion and the lower inner wall, four draw-in grooves have all been opened to fixed plate upper end and lower extreme, the mounting bracket is through a spring, and No. two spring mounting are at the fixed plate left end, the fixed plate is installed at rigid circuit board left end. Install the left end at hard circuit board through the fixed plate of installation damping device on, when the circuit board need be installed, only need aim at No. two springs with the especially last draw-in groove of fixed plate, the chucking screw of rotating this moment again, make the chucking screw promote the cardboard downwards, thereby the cardboard drives a spring card and goes into in the fixed plate, thereby accomplish the fixed to the circuit board, and when the HDI circuit board installation that soft or hard combines received the influence of rocking of outside, because the HDI circuit board that soft or hard combines is through a spring and No. two spring chucking at the mounting bracket, cushion about going on through a spring and No. two springs, and then reduce rocking that the circuit board received.
Preferably, strengthen the device and include the polyimide layer, aramid fiber layer is installed to polyimide layer lower extreme, low density polyethylene layer is installed to aramid fiber layer lower extreme, the polyimide layer is installed at the flexible line way board lower extreme. Aramid fiber layer through strengthening on the device is a novel high-tech synthetic fiber, has fine properties such as superhigh intensity, high-modulus and high temperature resistant, resistant acid and alkali-proof, light in weight, and its intensity is 5 to 6 times of steel wire, and the modulus is 2 to 3 times of steel wire or glass fiber, and toughness is 2 times of steel wire, and weight only is about 1/5 of steel wire, under 560 degrees of temperature, does not decompose, does not melt. The flexible printed circuit board has good insulation and ageing resistance, and has a long life cycle, so that the performance of the flexible printed circuit board is improved.
Preferably, the heat conducting device comprises a heat conducting copper sheet, the upper end of the heat conducting copper sheet is provided with insulating heat conducting glue, the lower end of the heat conducting copper sheet is provided with a plurality of radiating fins, and the heat conducting copper sheet is arranged at the lower end of the rigid circuit board through the insulating heat conducting glue. The heat conducting copper sheets on the heat conducting device are attached to the lower end of the hard circuit board through the insulating heat conducting glue, and when the hard circuit board generates heat, the heat is transferred to the lower radiating fins through the heat conducting copper sheets to be radiated, so that the radiating performance of the circuit board is improved.
Preferably, the first spring and the second spring correspond to each other in position from top to bottom, and the sizes of the first spring and the second spring are consistent with the size of the clamping groove.
Preferably, a plurality of the radiating fins are equidistantly arranged at the lower end of the heat conducting copper sheet.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. install the left end at hard circuit board through the fixed plate of installation damping device on, when the circuit board need be installed, only need align No. two springs with the especially last draw-in groove of fixed plate, rotating the chucking screw again this moment, make the chucking screw promote the cardboard downwards, thereby the cardboard drives a spring card and goes into in the fixed plate, thereby accomplish the fixed to the circuit board, and when the HDI circuit board installation that combines soft or hard receives the outside influence of rocking, because the HDI circuit board that combines soft or hard is through a spring and No. two spring chucking at the mounting bracket, cushion about going on through a spring and No. two springs, and then reduce rocking that the circuit board received.
2. Aramid fiber layer through strengthening on the device is a novel high-tech synthetic fiber, has fine properties such as superhigh intensity, high-modulus and high temperature resistant, resistant acid and alkali-proof, light in weight, and its intensity is 5 to 6 times of steel wire, and the modulus is 2 to 3 times of steel wire or glass fiber, and toughness is 2 times of steel wire, and weight only is about 1/5 of steel wire, under 560 degrees of temperature, does not decompose, does not melt. The flexible printed circuit board has good insulation and ageing resistance, and has a long life cycle, so that the performance of the flexible printed circuit board is improved.
3. The heat conducting copper sheet on the heat conducting device is attached to the lower end of the rigid circuit board through the insulating heat conducting glue, and when the rigid circuit board generates heat, the heat is transferred to the radiating fins below through the heat conducting copper sheet to be radiated, so that the radiating performance of the circuit board is improved.
Drawings
Fig. 1 is a schematic view of an overall structure of a HDI circuit board with a combination of soft and hard components according to the present invention;
fig. 2 is a schematic overall structure diagram of a mounting damping device of a HDI circuit board combined by soft and hard components according to the present invention;
fig. 3 is a schematic overall structural diagram of a reinforcing device of a HDI circuit board combined by soft and hard according to the present invention;
figure 4 is the utility model relates to a heat conduction device of HDI circuit board that soft or hard combines's overall structure schematic diagram.
In the figure: 1. a hard circuit board; 2. installing a damping device; 3. a reinforcement device; 4. a heat conducting device; 5. a flexible circuit board; 6. a circuit layer; 20. a mounting frame; 21. a fixing plate; 22. mounting holes; 23. clamping the screw; 24. clamping a plate; 25. a first spring; 26. a second spring; 27. a card slot; 30. a polyimide layer; 31. an aramid fiber layer; 32. a low density polyethylene layer; 40. a thermally conductive copper sheet; 41. insulating heat-conducting glue; 42. and (4) radiating fins.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 4, the HDI circuit board combining the hard circuit board and the soft circuit board comprises a hard circuit board 1 and a flexible circuit board 5, wherein circuit layers 6 are installed at the upper ends of the hard circuit board 1 and the flexible circuit board 5, installation damping devices 2 are installed at the left end of the hard circuit board 1 and the right end of the flexible circuit board 5, a heat conducting device 4 is installed at the lower end of the hard circuit board 1, and a reinforcing device 3 is installed at the lower end of the flexible circuit board 5.
The mounting damping device 2 comprises a mounting frame 20 and a fixing plate 21, a plurality of mounting holes 22 are formed in the left part of the upper end of the mounting frame 20, clamping screws 23 are mounted on the front part of the upper end and the rear part of the upper end of the mounting frame 20, clamping plates 24 are mounted at the lower ends of the two clamping screws 23, two first springs 25 are mounted at the lower ends of the two clamping plates 24, two second springs 26 are mounted on the front part of the lower inner wall and behind the lower inner wall of the mounting frame 20, four clamping grooves 27 are formed in the upper end and the lower end of the fixing plate 21, the mounting frame 20 is mounted at the left end of the fixing plate 21 through the first springs 25 and the second springs 26, and the fixing plate 21 is mounted at the left end of the rigid circuit board 1; the first spring 25 and the second spring 26 are in up-and-down correspondence, and the sizes of the first spring 25 and the second spring 26 are consistent with the size of the clamping groove 27. Install the left end at rigid circuit board 1 through fixed plate 21 on the installation damping device 2, when the circuit board needs to be installed, only need to aim at No. two spring 26 with the especially draw-in groove 27 of fixed plate 21, at this moment rotating clamping screw 23 again, make clamping screw 23 promote cardboard 24 downwards, thereby cardboard 24 drives a spring 25 card and goes into in the fixed plate 21, thereby accomplish the fixed to the circuit board, and when the HDI circuit board installation that combines soft or hard receives the outside influence of rocking, because the HDI circuit board that combines soft or hard is through a spring 25 and No. two spring 26 chucking at mounting bracket 20, cushion from top to bottom through a spring 25 and No. two spring 26, and then reduce rocking that the circuit board receives.
Strengthen device 3 and include polyimide layer 30, aramid fiber layer 31 is installed to polyimide layer 30 lower extreme, and low density polyethylene layer 32 is installed to aramid fiber layer 31 lower extreme, and polyimide layer 30 is installed at flexible line way board 5 lower extreme. Aramid fiber layer 31 through strengthening on the device 3 is a novel high-tech synthetic fiber, has excellent properties such as superhigh strength, high-modulus and high temperature resistant, acid and alkali resistant, light in weight, and its intensity is 5 to 6 times of steel wire, and the modulus is 2 to 3 times of steel wire or glass fiber, and toughness is 2 times of steel wire, and weight only is about 1/5 of steel wire, under 560 degrees of temperature, does not decompose, does not melt. The flexible printed circuit board has good insulation and ageing resistance, and has a long life cycle, so that the performance of the flexible printed circuit board 5 is improved.
The heat conducting device 4 comprises a heat conducting copper sheet 40, the upper end of the heat conducting copper sheet 40 is provided with an insulating heat conducting adhesive 41, the lower end of the heat conducting copper sheet 40 is provided with a plurality of radiating fins 42, and the heat conducting copper sheet 40 is arranged at the lower end of the hard circuit board 1 through the insulating heat conducting adhesive 41; a plurality of heat dissipation fins 42 are equidistantly installed at the lower end of the heat conductive copper sheet 40. The heat conducting copper sheet 40 on the heat conducting device 4 is attached to the lower end of the hard circuit board 1 through the insulating heat conducting glue 41, and when the hard circuit board generates heat, the heat is transferred to the lower radiating fins 42 through the heat conducting copper sheet 40 for heat dissipation, so that the heat dissipation performance of the circuit board is improved.
It should be noted that, the utility model is a soft and hard combined HDI circuit board, which is installed at the left end of the hard circuit board 1 by installing the fixing plate 21 on the damping device 2, when the circuit board needs to be installed, only the clamping groove 27 on the fixing plate 21 especially needs to be aligned with the second spring 26, at this moment, the clamping screw 23 is rotated, the clamping screw 23 pushes the clamping plate 24 downwards, the clamping plate 24 drives the first spring 25 to be clamped into the fixing plate 21, thereby completing the fixation of the circuit board, and when the installation of the soft and hard combined HDI circuit board is affected by the external shaking, because the soft and hard combined HDI circuit board is clamped on the installation frame 20 by the first spring 25 and the second spring 26, and the soft and hard combined HDI circuit board is buffered up and down by the first spring 25 and the second spring 26, and then reduce the rocking that the circuit board received, and the heat conduction copper sheet 40 through heat conduction device 4 is laminated at 1 lower extreme of hard circuit board by insulating heat conduction glue 41, when it generates heat, dispel the heat with heat transfer to below radiating fin 42 through heat conduction copper sheet 40, thereby the heat dispersion of circuit board has been improved, aramid fiber layer 31 through strengthening on the device 3 is a novel high-tech synthetic fiber, have super high strength, high modulus and high temperature resistance, acid and alkali resistance, light in weight etc. excellent performance, its intensity is 5 to 6 times of steel wire, the modulus is 2 to 3 times of steel wire or glass fiber, toughness is 2 times of steel wire, and weight is only about 1/5 of steel wire, under 560 degrees of temperature, do not decompose, do not melt. The flexible circuit board has good insulation and ageing resistance, and has a long life cycle, so that the performance of the flexible circuit board 5 is improved.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a HDI circuit board of soft or hard combination, includes hard circuit board (1) and flexible line way board (5), its characterized in that: circuit layer (6) are all installed to rigid line way board (1) and flexible line way board (5) upper end, installation damping device (2) are all installed to rigid line way board (1) left end and flexible line way board (5) right-hand member, heat-transfer device (4) are installed to rigid line way board (1) lower extreme, reinforcing means (3) are installed to flexible line way board (5) lower extreme.
2. A HDI circuit board according to claim 1 in which: installation damping device (2) are including mounting bracket (20) and fixed plate (21), mounting bracket (20) upper end left part is opened there are a plurality of mounting hole (22), mounting bracket (20) upper end front portion and upper end rear portion all install clamping screw (23), two clamping plate (24), two are all installed to clamping screw (23) lower extreme two spring (25) are all installed to clamping plate (24) lower extreme, mounting bracket (20) lower inner wall front portion and lower inner wall back all install two No. two spring (26), four draw-in grooves (27) have all been opened to fixed plate (21) upper end and lower extreme, mounting bracket (20) are installed at fixed plate (21) left end through spring (25) and No. two spring (26), install at hard circuit board (1) left end fixed plate (21).
3. A HDI circuit board according to claim 1 characterised in that: strengthen device (3) and include polyimide layer (30), aramid fiber layer (31) are installed to polyimide layer (30) lower extreme, low density polyethylene layer (32) are installed to aramid fiber layer (31) lower extreme, polyimide layer (30) are installed at flexible line way board (5) lower extreme.
4. A HDI circuit board according to claim 1 characterised in that: the heat conduction device (4) comprises a heat conduction copper sheet (40), insulating heat conduction glue (41) is installed at the upper end of the heat conduction copper sheet (40), a plurality of radiating fins (42) are installed at the lower end of the heat conduction copper sheet (40), and the heat conduction copper sheet (40) is installed at the lower end of the hard circuit board (1) through the insulating heat conduction glue (41).
5. A HDI circuit board according to claim 2 wherein: the first spring (25) and the second spring (26) are in up-and-down correspondence, and the sizes of the first spring (25) and the second spring (26) are consistent with the size of the clamping groove (27).
6. A HDI circuit board that soft or hard combines of claim 4, characterized by: the plurality of radiating fins (42) are equidistantly arranged at the lower end of the heat conducting copper sheet (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221614920.9U CN218006600U (en) | 2022-06-27 | 2022-06-27 | HDI circuit board that soft or hard combines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221614920.9U CN218006600U (en) | 2022-06-27 | 2022-06-27 | HDI circuit board that soft or hard combines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218006600U true CN218006600U (en) | 2022-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221614920.9U Active CN218006600U (en) | 2022-06-27 | 2022-06-27 | HDI circuit board that soft or hard combines |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218006600U (en) |
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2022
- 2022-06-27 CN CN202221614920.9U patent/CN218006600U/en active Active
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