CN219644419U - High-order soft and hard combined HDI circuit board - Google Patents
High-order soft and hard combined HDI circuit board Download PDFInfo
- Publication number
- CN219644419U CN219644419U CN202223509715.9U CN202223509715U CN219644419U CN 219644419 U CN219644419 U CN 219644419U CN 202223509715 U CN202223509715 U CN 202223509715U CN 219644419 U CN219644419 U CN 219644419U
- Authority
- CN
- China
- Prior art keywords
- mounting
- circuit board
- mounting seat
- hdi circuit
- hard combined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 230000000694 effects Effects 0.000 abstract description 11
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a high-order soft and hard combined HDI circuit board which comprises a mounting seat, wherein mounting plates are fixedly arranged at the lower part of the left end and the lower part of the right end of the mounting seat, a group of mounting holes penetrating up and down are formed in the front part of the upper end and the rear part of the upper end of the mounting plates, the two groups of mounting holes are symmetrically distributed in front-back mode, each group of mounting holes is two, a main body plate is arranged at the upper end of the mounting seat, and limiting plates are movably arranged at the upper part of the left end and the upper part of the right end of the mounting seat. According to the high-order soft and hard combined HDI circuit board, the heat radiating component is arranged, when heat generated by the main body board needs to be treated, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the fixing frame from the air inlet, the fan blades can convey the wind power to the lower part of the main body board under the driving of the motor, and the heat generated by the main body board is conveniently and rapidly discharged from the heat radiating groove under the action of the wind power, so that the heat radiating effect is enhanced.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-order soft and hard combined HDI circuit board.
Background
The rigid circuit board has good heat dissipation effect, but can not be bent and is easy to damage, and the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, but has poor heat dissipation effect and is not firm to install due to the characteristic of good bending property. However, the soft and hard combined printed circuit board combines the soft board and the hard board, and has both the flexibility of the soft circuit board and the strength of the hard circuit board, so the development and use of the soft and hard combined printed circuit board are important at present.
The prior art (patent number: CN 218006600U) discloses a soft and hard combined HDI circuit board, which comprises a hard circuit board and a flexible circuit board, wherein circuit layers are arranged at the upper ends of the hard circuit board and the flexible circuit board, a damping device is arranged at the left end of the hard circuit board and the right end of the flexible circuit board, a heat conducting device is arranged at the lower end of the hard circuit board, and a reinforcing device is arranged at the lower end of the flexible circuit board. The utility model has the beneficial effects that: install the left end at the hard circuit board through the fixed plate on the installation damping device, when the circuit board needs to install, only need aim at No. two springs with the draw-in groove on the fixed plate especially, at this moment again the screw that screws, thereby make the clamping screw promote the cardboard downwards, thereby the cardboard drives spring card in the fixed plate, thereby accomplish the fixed to the circuit board, when the HDI circuit board installation that combines the hardness in addition receives outside to rock the influence, because the HDI circuit board that combines the hardness is through spring and No. two spring chucking at the mounting bracket, buffer from top to bottom through spring and No. two springs, and then reduce the rocking that the circuit board receives.
The existing high-order soft and hard combined HDI circuit board has the following defects that a large amount of heat can be generated when the existing high-order soft and hard combined HDI circuit board works, but the heat dissipation effect can be influenced only by the heat dissipation grooves, so that the service efficiency is reduced, and therefore, a novel high-order soft and hard combined HDI circuit board is provided.
Disclosure of Invention
The utility model mainly aims to provide a high-order soft and hard combined HDI circuit board which can effectively solve the problem that the HDI circuit board is convenient to dissipate heat.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a HDI circuit board that high order softness and hardness combined, includes the mount pad, the equal fixed mounting of mount pad left end lower part and right-hand member lower part has the mounting panel, two a set of mounting hole of punching through from top to bottom has all been seted up to mounting panel upper end front portion and upper end rear portion, two sets of the mounting hole is front and back symmetric distribution and every group sets up to two, the mount pad upper end is provided with the main part board, the equal movable mounting in mount pad left end upper portion and right-hand member upper portion has the limiting plate, the mounting groove of punching through about having been seted up at mount pad left end middle part, mounting groove internally mounted has radiator unit, a plurality of radiating grooves of punching through about having been seted up to the mount pad right-hand member.
Preferably, the upper part of the left end and the upper part of the right end of the mounting seat are provided with left and right through moving grooves, the left part of the upper end and the right part of the upper end of the mounting seat are provided with through holes, and the left side and the right side between the mounting seats are provided with placing grooves.
Preferably, the heat dissipation assembly comprises a fixing frame, a plurality of left and right through air inlets are formed in the left end of the fixing frame, a motor is fixedly connected inside the fixing frame, a rotating column is fixedly connected to the output end of the motor, fan blades are fixedly connected to the right end of the rotating column, and the fixing frame is fixedly inserted into a mounting groove.
Preferably, the plurality of air inlets are distributed in an annular array, and the plurality of fan blades are distributed in an annular array.
Preferably, the upper end of the limiting plate is provided with a limiting hole, and a limiting pin is movably inserted and connected in the limiting hole.
Preferably, the limiting plate is movably inserted and connected in the moving groove, and the limiting pin penetrates through the through hole and is movably inserted and connected in the limiting hole.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the heat dissipation effect of the main body plate can be improved by arranging the heat dissipation assembly, when the heat generated by the main body plate needs to be treated in use, the motor drives the rotating column, and then the rotating column drives the fan blades, so that wind power is sucked into the fixing frame from the air inlet hole, the fan blades can convey the wind power to the lower part of the main body plate under the driving of the motor, and the heat generated by the main body plate is conveniently and rapidly discharged from the heat dissipation groove under the action of the wind power, so that the heat dissipation effect is enhanced;
2. according to the utility model, the stability of the main body plate can be improved by arranging the limiting plate, when the main body plate is used, the upper end of the mounting seat is provided with the placing groove, the main body plate is placed in the placing groove, the limiting plate penetrates through the moving groove and limits the main body plate, and the limiting pin is used for reinforcing the limiting plate, so that the stability of the main body plate is enhanced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a high-order soft-hard combined HDI circuit board according to the present utility model;
FIG. 2 is a schematic diagram of the overall structure of a mounting base of a high-order soft and hard combined HDI circuit board according to the present utility model;
FIG. 3 is a schematic diagram showing the overall structure of a heat dissipating assembly of a high-order soft/hard combined HDI circuit board according to the present utility model;
fig. 4 is a schematic diagram of the overall structure of a limiting plate of the high-order soft and hard combined HDI circuit board according to the present utility model.
In the figure: 1. a mounting base; 2. a mounting plate; 3. a mounting hole; 4. a main body plate; 5. a heat dissipation assembly; 6. a limiting plate; 7. a heat sink; 8. a mounting groove; 9. a placement groove; 10. a moving groove; 11. perforating; 51. a fixing frame; 52. an air inlet hole; 53. a motor; 54. rotating the column; 55. a fan blade; 61. a limiting hole; 62. and a limiting pin.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, a high-order soft and hard combined HDI circuit board comprises a mounting seat 1, wherein mounting plates 2 are fixedly mounted at the lower part of the left end and the lower part of the right end of the mounting seat 1, a group of mounting holes 3 penetrating up and down are formed at the front part of the upper ends and the rear part of the upper ends of the two mounting plates 2, the two groups of mounting holes 3 are symmetrically distributed front and back and are arranged in two groups, a main body plate 4 is arranged at the upper end of the mounting seat 1, a limiting plate 6 is movably mounted at the upper part of the left end and the upper part of the right end of the mounting seat 1, a mounting groove 8 penetrating left and right is formed in the middle part of the left end of the mounting seat 1, a heat dissipation assembly 5 is fixedly mounted in the mounting groove 8, and a plurality of heat dissipation grooves 7 penetrating left and right are formed at the right end of the mounting seat 1; the upper part of the left end and the upper part of the right end of the mounting seat 1 are provided with a left-right through moving groove 10, the left part of the upper end and the right part of the upper end of the mounting seat 1 are provided with through holes 11, and the left side and the right side between the mounting seats 1 are provided with a placing groove 9.
The heat dissipation assembly 5 comprises a fixing frame 51, a plurality of left and right through air inlets 52 are formed in the left end of the fixing frame 51, a motor 53 is fixedly connected inside the fixing frame 51, a rotating column 54 is fixedly connected to the output end of the motor 53, fan blades 55 are fixedly connected to the right end of the rotating column 54, and the fixing frame 51 is fixedly connected to the mounting groove 8 in a penetrating mode; the plurality of air inlets 52 are distributed in an annular array, and the fan blades 55 are arranged in a plurality of annular arrays; when the heat generated by the main body plate 4 needs to be processed, the motor 53 drives the rotating column 54, and then the rotating column 54 drives the fan blades 55, so that wind force is sucked into the fixing frame 51 from the air inlet hole 52, and under the driving of the motor 53, the fan blades 55 can convey the wind force to the lower part of the main body plate 4, and under the action of the wind force, the heat generated by the main body plate 4 is conveniently and rapidly discharged from the heat dissipation groove 7, so that the heat dissipation effect is enhanced.
The upper end of the limiting plate 6 is provided with a limiting hole 61, and a limiting pin 62 is movably inserted and connected in the limiting hole 61; the limiting plate 6 is movably inserted and connected in the moving groove 10, and the limiting pin 62 penetrates through the through hole 11 and is movably inserted and connected in the limiting hole 61; firstly, a placing groove 9 is formed in the upper end of the mounting seat 1, the main body plate 4 is placed in the placing groove 9, the limiting plate 6 penetrates through the moving groove 10 and limits the main body plate 4, and the limiting pin 62 is used for reinforcing the limiting plate 6, so that the stability of the main body plate 4 is enhanced.
It should be noted that, the present utility model is a high-order soft and hard combined HDI circuit board, by arranging the heat dissipation component 5, the heat dissipation effect of the main body board 4 can be improved, when the heat generated by the main body board 4 needs to be processed in use, the motor 53 drives the rotating column 54, and then the rotating column 54 drives the fan blades 55, so that wind force is sucked into the fixing frame 51 from the air inlet hole 52, and the fan blades 55 can convey the wind force to the lower part of the main body board 4 under the driving of the motor 53, and under the effect of the wind force, the heat generated by the main body board 4 is conveniently and rapidly discharged from the heat dissipation groove 7, thereby enhancing the heat dissipation effect; through setting up limiting plate 6, can improve the steadiness of main part board 4, when using, at first offered standing groove 9 in mount pad 1 upper end to place main part board 4 in standing groove 9, and run through movable groove 10 and carry out spacingly to main part board 4 with limiting plate 6, consolidate limiting plate 6 by spacer pin 62 again, thereby strengthen the steadiness of main part board 4.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a HDI circuit board that high order soft or hard combines, includes mount pad (1), its characterized in that: the lower parts of the left end and the right end of the mounting seat (1) are fixedly provided with mounting plates (2), the front parts of the upper ends and the rear parts of the upper ends of the two mounting plates (2) are provided with a group of mounting holes (3) which are vertically penetrated, the two groups of mounting holes (3) are symmetrically distributed in front-back mode, each group of mounting holes is two, the upper end of the mounting seat (1) is provided with a main body plate (4), the novel heat dissipation device is characterized in that limiting plates (6) are movably mounted on the upper portion of the left end and the upper portion of the right end of the mounting seat (1), a left-right through mounting groove (8) is formed in the middle of the left end of the mounting seat (1), a heat dissipation assembly (5) is fixedly mounted in the mounting groove (8), and a plurality of left-right through heat dissipation grooves (7) are formed in the right end of the mounting seat (1).
2. The high-order soft and hard combined HDI circuit board of claim 1, wherein: the left and right through moving grooves (10) are formed in the upper portion of the left end and the upper portion of the right end of the mounting seat (1), through holes (11) are formed in the left portion of the upper end and the right portion of the upper end of the mounting seat (1), and placing grooves (9) are formed in the left side and the right side between the mounting seats (1).
3. The high-order soft and hard combined HDI circuit board of claim 2, wherein: the heat dissipation assembly (5) comprises a fixing frame (51), a plurality of left and right through air inlets (52) are formed in the left end of the fixing frame (51), a motor (53) is fixedly connected inside the fixing frame (51), a rotating column (54) is fixedly connected to the output end of the motor (53), fan blades (55) are fixedly connected to the right end of the rotating column (54), and the fixing frame (51) is fixedly connected to the inside of the mounting groove (8).
4. A high-order soft and hard combined HDI circuit board according to claim 3, further comprising: the air inlets (52) are distributed in an annular array, and the fan blades (55) are arranged in a plurality and distributed in an annular array.
5. The high-order soft and hard combined HDI circuit board of claim 4, wherein: the upper end of the limiting plate (6) is provided with a limiting hole (61), and a limiting pin (62) is movably inserted into the limiting hole (61).
6. The high-order soft and hard combined HDI circuit board of claim 5, further comprising: the limiting plate (6) is movably inserted and connected in the moving groove (10), and the limiting pin (62) penetrates through the through hole (11) and is movably inserted and connected in the limiting hole (61).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223509715.9U CN219644419U (en) | 2022-12-26 | 2022-12-26 | High-order soft and hard combined HDI circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223509715.9U CN219644419U (en) | 2022-12-26 | 2022-12-26 | High-order soft and hard combined HDI circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219644419U true CN219644419U (en) | 2023-09-05 |
Family
ID=87813482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202223509715.9U Active CN219644419U (en) | 2022-12-26 | 2022-12-26 | High-order soft and hard combined HDI circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219644419U (en) |
-
2022
- 2022-12-26 CN CN202223509715.9U patent/CN219644419U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN219644419U (en) | High-order soft and hard combined HDI circuit board | |
CN219124598U (en) | PCB (printed circuit board) with back drill | |
CN215072036U (en) | Stepping motor driver with protection structure | |
CN210781885U (en) | Novel switching power supply's heat dissipation package assembly | |
CN212906103U (en) | Portable modularized multi-unit reinforcing server | |
CN211454481U (en) | Computer fan that heat dispersion is good | |
CN219437216U (en) | PTFE high-frequency mixed-voltage PCB | |
CN220755318U (en) | Nested printed circuit board | |
CN219644181U (en) | Multilayer printed wiring board | |
CN219351977U (en) | PCB high-level plate with small layer bias | |
CN219146008U (en) | High-speed circuit board with blind holes | |
CN219499832U (en) | High-density multilayer gold-plated printed PCB | |
CN218998388U (en) | Soft and hard combined plate | |
CN218998644U (en) | Efficient heat dissipation multilayer circuit board | |
CN219437406U (en) | High-frequency high-density interconnection multilayer circuit board | |
CN218570686U (en) | High-impedance rigid-flexible combined circuit board | |
CN219164976U (en) | Multilayer high-density circuit board | |
CN213342150U (en) | Solar photoelectric system | |
CN219476326U (en) | Solid state disk of high-efficient heat dissipation shock protection | |
CN215979775U (en) | Corrosion-resistant vacuum pump of integral type | |
CN218678632U (en) | Permanent magnet motor with protection mechanism | |
CN219437378U (en) | High-frequency microwave printing high-density HDI circuit board | |
CN215935156U (en) | High-efficient mounting structure of high density blind hole 5G circuit board | |
CN219627985U (en) | High heat conduction PCB circuit board | |
CN218332440U (en) | OPS shell |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |