CN217983301U - Chip suction nozzle - Google Patents
Chip suction nozzle Download PDFInfo
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- CN217983301U CN217983301U CN202221814887.4U CN202221814887U CN217983301U CN 217983301 U CN217983301 U CN 217983301U CN 202221814887 U CN202221814887 U CN 202221814887U CN 217983301 U CN217983301 U CN 217983301U
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- suction nozzle
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Abstract
The utility model discloses a chip suction nozzle, wherein, contain the suction nozzle seat and can dismantle the adsorption head of connecting in suction nozzle seat one end, the one end that the adsorption head deviates from in the suction nozzle seat is equipped with the adsorption seat, the adsorption seat deviates from the one end of adsorption head and has seted up the absorption groove, set up the air vent that runs through the adsorption head in the absorption groove, the inside through-hole that communicates with the air vent of seting up of suction nozzle seat, the air groove that flows with the absorption groove intercommunication is seted up to the both sides of adsorption seat, when absorbing the chip, although there is vacuum leakage in the air groove that adds, but the velocity of flow of air reaches a definite value, can inhale steady chip equally, and can not cause the harm because of suction is too big to the chip, the air circulation of suction nozzle seat and adsorption head can be guaranteed to air vent and through-hole.
Description
Technical Field
The utility model relates to a chip suction nozzle field, concretely relates to chip suction nozzle.
Background
In the semiconductor industry, electronic packaging is used as a subsequent process in the IC industry, and an IC component having a specific function is formed by connecting and fixing an IC chip to other devices on a package or a substrate. In the semiconductor chip packaging process, a bare chip is required to be picked up from a blue film or a UV film and then placed on a base material, so that subsequent chip detection, integral packaging and other processes are completed. At present, a chip suction mode uses a thimble and a suction nozzle to be matched with each other to separate a chip from a mucosa, and a detection or selection procedure is completed.
The suction nozzle includes with the chip butt joint and the chip can adsorb the adsorption head on it, with the suction nozzle seat of external mechanical arm butt joint, the adsorption head comprises adsorption head body and front end absorption characteristic, its inside switches on can be through the gas flow, it comprises rigid plastic material, the front end of adsorption head docks with the chip, the absorption characteristic is according to specific chip shape, size is adjusted, the plane degree of contact surface and the straightness of hanging down of contact surface and suction nozzle seat body require extremely high, the contact surface also needs to polish, guarantee the roughness, so that better absorption chip does not drop, except contact surface, the characteristic still has the adsorption area, it influences the suction size of chip suction nozzle, need to switch on the gas pocket in the adsorption area, accomplish the absorption of whole air current. The rear end part of the suction nozzle seat is in butt joint with the manipulator, the diameter of the tail part of the suction nozzle seat is high in requirement, the suction nozzle seat needs to be stably installed on the manipulator and cannot slide or loosen, and the suction nozzle seat can be moved by the manipulator after being installed so as to adjust the position;
at present, along with the development of semiconductor trade, the chip size becomes littleer and more, and is breakable, in chip packaging process, the suction nozzle requires corresponding littleer, the pressure that absorbs the chip also reduces thereupon, in actual production, the manual work is got with tweezers clamp and is very labouring, and the suction nozzle size of automation equipment is also generally bigger greatly, cause the self gravity of suction nozzle subassembly bigger greatly, easily crush the chip when picking up and putting tiny chip, can make the chip break and cause production efficiency easily like this, the qualification rate is low, increase cost, at present, in the mode of absorbing the chip, what most adopted is the mode that the vacuum was inhaled, but discover in batch production, the chip can be damaged easily to vacuum suction, influence the availability factor of chip or lead to unable the use.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is in the actual production, artifical getting very hard with tweezers clamp, and the suction nozzle size of automation equipment is also generally bigger, causes the self gravity of suction nozzle subassembly bigger, crushes the chip easily when picking up and putting small chip, can make the chip break easily like this and cause production efficiency, the qualification rate is low, incremental cost, the utility model provides a chip suction nozzle can set up the air current groove with the air vent intercommunication on the absorption seat of adsorption head, realizes the absorbent effect of fluid, has both guaranteed original adsorption area, can not lead to the fact the damage of chip because of the too big suction of vacuum again, has alleviateed self gravity and can not lead to crushing and destruction to the chip because of gravity, adopts micro-structure, simple structure, and safe in utilization avoids causing the chip to be crushed because of gravity, has guaranteed production efficiency and product percent of pass for solve the defect that prior art leads to.
In order to solve the technical problem, the utility model provides a following technical scheme:
first aspect, a chip suction nozzle, wherein, contain the suction nozzle seat and can dismantle connect in the adsorption head of suction nozzle seat one end, the adsorption head deviate from in the one end of suction nozzle seat is equipped with the adsorption seat, the adsorption seat deviate from the adsorption tank has been seted up to the one end of adsorption head, set up in the adsorption tank and run through the air vent of adsorption head, the suction nozzle seat inside seted up with the through-hole of air vent intercommunication, the both sides of adsorption seat seted up with the air current groove of adsorption tank intercommunication, when absorbing the chip, add the air current groove has vacuum gas leakage, but the velocity of flow of air reaches a definite value, just can inhale steady chip equally, and can not cause the harm because of suction is too big to the chip, the air vent with the through-hole can be guaranteed the suction nozzle seat with the circulation of air of adsorption head.
In the chip suction nozzle, the suction nozzle base is provided with the connecting base connected with the suction head, and the suction head is provided with the connecting groove connected with the connecting base.
The chip suction nozzle is characterized in that one end of the suction head, which is connected with the suction nozzle base, is of a cylindrical structure, the other end of the suction head is of a circular truncated cone structure, and the suction base is arranged at the top of the circular truncated cone structure.
In the chip suction nozzle, the periphery of one side of the cylindrical suction nozzle seat close to the suction head is fixedly connected with the annular limiting seat, and the cylindrical suction nozzle seat is mainly used for being in butt joint with an external manipulator.
In the chip suction nozzle, the suction head is a cuboid, and the suction groove is oval.
In the chip suction nozzle, the two air flowing grooves are arranged on two sides of the suction head at a short distance.
In the chip suction nozzle, the vent hole is circular.
The second aspect, a chip suction nozzle, wherein, contain the suction nozzle seat and can dismantle connect in the adsorption head of suction nozzle seat one end, the adsorption head deviate from in the one end of suction nozzle seat is equipped with the adsorption seat, the adsorption seat deviate from the adsorption tank has been seted up to the one end of adsorption head, set up in the adsorption tank and run through the air vent of adsorption head, the suction nozzle seat inside seted up with the through-hole of air vent intercommunication, the both sides of adsorption seat seted up with the air current groove of adsorption tank intercommunication, when absorbing the chip, add the air current groove has vacuum gas leakage, but the velocity of flow of air reaches a definite value, just can inhale steady chip equally, and can not cause the harm because of suction is too big to the chip, the air vent with the through-hole can be guaranteed the suction nozzle seat with the circulation of air of adsorption head.
In the chip suction nozzle, the suction nozzle base is provided with the connecting base connected with the suction head, and the suction head is provided with the connecting groove connected with the connecting base.
The chip suction nozzle is characterized in that one end of the suction head connected with the suction nozzle base is of a cylindrical structure, the other end of the suction head is of a circular truncated cone structure, and the suction base is arranged at the top of the circular truncated cone structure.
In the chip suction nozzle, the periphery of one side of the cylindrical suction nozzle seat close to the suction head is fixedly connected with the annular limiting seat, and the cylindrical suction nozzle seat is mainly used for being in butt joint with an external manipulator.
In the chip suction nozzle, the suction head is a cuboid, and the suction groove is oval.
In the chip suction nozzle, the two air flowing grooves are arranged on two sides of the suction head at a short distance.
In the chip suction nozzle, the vent hole is in an oval shape consistent with the adsorption groove.
According to the aforesaid the utility model relates to a technical scheme that chip suction nozzle provided has following technological effect:
set up the air current groove with the air vent intercommunication on the absorption seat of adsorption head, realize the absorbent effect of fluid, both guaranteed original adsorption area, can not lead to the fact the damage of chip because of the too big suction of vacuum again, alleviateed self gravity and can not lead to crushing and destruction to the chip because of gravity, adopt microstructure, simple structure, it is safe in utilization avoids causing the chip to be crushed because of gravity, has guaranteed production efficiency and product percent of pass.
Drawings
Fig. 1 is a schematic structural diagram of a chip suction nozzle according to the present invention;
fig. 2 is a schematic view of a partial enlarged structure of an adsorption seat in a first embodiment of a chip suction nozzle according to the present invention;
fig. 3 is a schematic diagram of a second embodiment of the chip suction nozzle according to the present invention showing a partially enlarged structure of the suction base.
Wherein the reference numbers are as follows:
the suction nozzle comprises a nozzle base 100, an adsorption head 200, an annular limiting base 101, an adsorption base 201, an adsorption groove 202, a vent hole 203, a gas flowing groove 204, a cylindrical structure 205 and a circular truncated cone structure 206.
Detailed Description
In order to make the technical means, the inventive features, the objectives and the functions of the present invention easy to understand, the present invention will be further described with reference to the following specific drawings.
It should be understood that the structure, proportion, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions of the present invention, so that the present invention does not have the substantial technical significance, and the modification of any structure, the change of the proportion relation or the adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention.
In addition, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are used for clarity of description only, and are not used to limit the scope of the present invention, and the relative relationship between the terms may be changed or adjusted without substantial technical changes.
The utility model provides a chip suction nozzle, the purpose is offered the air current groove with the air vent intercommunication on the absorption seat of adsorption head, realize the absorbent effect of fluid, original adsorption area had both been guaranteed, can not cause the damage of chip because of the too big suction of vacuum again, the gravity that has alleviateed self just can not lead to crushing and destruction to the chip because of gravity, adopt microstructure, moreover, the steam generator is simple in structure, high safety in utilization, avoid causing the chip to be crushed because of gravity, and the production efficiency and the product percent of pass have been guaranteed.
As shown in fig. 1-2, in a first aspect, a first embodiment is a chip suction nozzle, which includes a nozzle base 100 and an adsorption head 200 detachably connected to one end of the nozzle base 100, an adsorption base 201 is disposed at one end of the adsorption head 200 away from the nozzle base 100, an adsorption groove 202 is disposed at one end of the adsorption base 201 away from the adsorption head 200, an air vent 203 penetrating through the adsorption head 200 is disposed in the adsorption groove 202, a through hole communicating with the air vent 203 is disposed in the nozzle base 100, air flow grooves 204 communicating with the adsorption groove 202 are disposed at two sides of the adsorption base 201, when a chip is sucked, the added air flow grooves 204 have vacuum air leakage, but the flow rate of air reaches a certain value, the chip can be stably sucked, and the chip is not damaged due to excessive suction force, and the air circulation between the nozzle base 100 and the adsorption head 200 can be ensured by the air vent 203 and the through hole.
In the chip suction nozzle, the suction nozzle base 100 is provided with a connecting base connected with the suction head 200, and the suction head 200 is provided with a connecting groove connected with the connecting base.
In the chip suction nozzle, one end of the suction head 200 connected to the suction nozzle base 100 is a cylindrical structure 205, the other end of the suction head 200 is a truncated cone structure 206, and the suction base 201 is disposed on the top of the truncated cone structure 206.
In the chip suction nozzle, the periphery of the cylindrical suction nozzle base 100 near the suction head 200 is fixedly connected with the annular limiting base 101, and the cylindrical suction nozzle base 100 is mainly used for being butted with an external manipulator.
In the chip suction nozzle, the suction head 200 is a rectangular parallelepiped, and the suction groove 202 is an oval.
In the chip suction nozzle, the two air flowing grooves 204 are disposed at two sides of the suction head 200 at a short distance.
In the chip suction nozzle, the vent holes 203 are circular.
As shown in fig. 1 and 3, in a second aspect, a chip suction nozzle includes a nozzle base 100 and an adsorption head 200 detachably connected to one end of the nozzle base 100, an adsorption base 201 is disposed at one end of the adsorption head 200 away from the nozzle base 100, an adsorption groove 202 is disposed at one end of the adsorption base 201 away from the adsorption head 200, an air vent 203 penetrating through the adsorption head 200 is disposed in the adsorption groove 202, a through hole communicated with the air vent 203 is disposed in the nozzle base 100, and air flow grooves 204 communicated with the adsorption groove 202 are disposed on two sides of the adsorption base 201.
In the chip suction nozzle, the suction nozzle base 100 is provided with a connecting base connected with the suction head 200, and the suction head 200 is provided with a connecting groove connected with the connecting base.
In the chip suction nozzle, one end of the suction head 200 connected to the suction nozzle base 100 is a cylindrical structure 205, the other end of the suction head 200 is a truncated cone structure 206, and the suction base 201 is disposed on the top of the truncated cone structure 206.
In the chip suction nozzle, the periphery of the cylindrical suction nozzle base 100 near the suction head 200 is fixedly connected with the annular limiting base 101, and the cylindrical suction nozzle base 100 is mainly used for being butted with an external manipulator.
In the chip suction nozzle, the suction head 200 is a rectangular parallelepiped, and the suction groove 202 is an oval.
In the chip suction nozzle, the two air flowing grooves 204 are disposed at two sides of the suction head 200 at a short distance.
In the chip suction nozzle, the vent hole 203 has an oval shape corresponding to the suction groove 202.
To sum up, the utility model discloses a chip suction nozzle can set up the air current groove with the air vent intercommunication on the absorption seat of absorption head, realizes the absorptive effect of fluid, has both guaranteed original adsorption area, can not lead to the fact the damage of chip because of the too big vacuum suction again, has alleviateed the gravity of self and can not lead to crushing and destruction to the chip because of gravity, adopts microstructure, simple structure, and safe in utilization avoids causing the chip to be broken because of gravity, has guaranteed production efficiency and product percent of pass.
The above description has been made of specific embodiments of the present invention. It is to be understood that the invention is not limited to the specific embodiments described above, and that equipment and structures not described in detail are understood to be practiced in a manner that is conventional in the art; various changes or modifications may be made by those skilled in the art without departing from the scope of the claims, and the scope of the invention is not to be limited to the embodiments described in the claims.
Claims (8)
1. The utility model provides a chip suction nozzle, its characterized in that contains the suction nozzle seat and can dismantle connect in the adsorption head of suction nozzle seat one end, the adsorption head deviate from in the one end of suction nozzle seat is equipped with the absorption seat, the absorption seat deviate from the absorption groove has been seted up to the one end of absorption head, set up in the absorption groove and run through the air vent of absorption head, the suction nozzle seat inside seted up with the through-hole of air vent intercommunication, the both sides of absorption seat seted up with the air current groove of absorption groove intercommunication.
2. The chip suction nozzle as claimed in claim 1, wherein the nozzle base is provided with a connecting seat connected with the suction head, and the suction head is provided with a connecting groove connected with the connecting seat.
3. The chip suction nozzle according to claim 2, wherein one end of the suction head connected with the suction nozzle base is of a cylindrical structure, the other end of the suction head is of a circular truncated cone structure, and the suction base is arranged at the top of the circular truncated cone structure.
4. The chip suction nozzle as claimed in claim 3, wherein an annular limiting seat is fixedly connected to the periphery of one side of the cylindrical suction nozzle seat close to the suction head.
5. The chip suction nozzle as claimed in any one of claims 1 to 4, wherein the suction head is a rectangular parallelepiped and the suction groove is an oval shape.
6. The chip suction nozzle as set forth in claim 5, wherein two of said air flow grooves are provided on both sides of said suction head at a short distance.
7. A chip suction nozzle according to any of claims 1-4, 6, wherein the vent holes are circular.
8. The chip suction nozzle as set forth in claim 6, wherein said vent hole has an oval shape in conformity with said suction groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221814887.4U CN217983301U (en) | 2022-07-13 | 2022-07-13 | Chip suction nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221814887.4U CN217983301U (en) | 2022-07-13 | 2022-07-13 | Chip suction nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217983301U true CN217983301U (en) | 2022-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221814887.4U Active CN217983301U (en) | 2022-07-13 | 2022-07-13 | Chip suction nozzle |
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| Country | Link |
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| CN (1) | CN217983301U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116058168A (en) * | 2023-02-10 | 2023-05-05 | 西北农林科技大学 | Air-suction push-pull type medlar picking device |
-
2022
- 2022-07-13 CN CN202221814887.4U patent/CN217983301U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116058168A (en) * | 2023-02-10 | 2023-05-05 | 西北农林科技大学 | Air-suction push-pull type medlar picking device |
| CN116058168B (en) * | 2023-02-10 | 2024-05-10 | 西北农林科技大学 | Air-suction push-pull type medlar picking device |
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