WO2023065445A1

WO2023065445A1 - Material pick-up device

Info

Publication number: WO2023065445A1
Application number: PCT/CN2021/131367
Authority: WO
Inventors: 孙丰; 张宝峰; 吴斌; 刘斌
Original assignee: 苏州赛腾精密电子股份有限公司
Priority date: 2021-10-18
Filing date: 2021-11-18
Publication date: 2023-04-27
Also published as: CN113772418B; CN113772418A

Abstract

A material pick-up device configured to pick up materials, the material pick-up device comprising: a base table (200), which is provided with a material cavity for holding materials; a first material pick-up member (100), which is arranged on the base table, has a first working end surface (110) provided with a plurality of first material pick-up holes (120), and is configured to adsorb the materials in the material cavity through the plurality of first material pick-up holes; and an air spray assembly (300), which is configured to spray airflow towards the first working end surface such that materials located on the region of the first working end surface outside the plurality of first material pick-up holes can be blown off, wherein the first material pick-up member can move up and down relative to the material cavity, so that the first working end surface has a first state of being located above a material surface of the material cavity and a second state of being located below the material surface of the material cavity; and the air spray assembly sprays airflow towards the first working end surface in response to the change of the first working end surface from the second state to the first state.

Description

a pick-up device

This application claims priority to a Chinese patent application with application number 202111209264.4 filed with the China Patent Office on October 18, 2021, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of intelligent manufacturing, for example, to a material retrieving device.

Background technique

Flexible circuit boards, also known as flexible circuit boards, are printed circuits made of flexible insulating substrates. When welding the flexible circuit board, it is necessary to coat a layer of flux on the flexible circuit board, put the tin ball into the pad of the circuit board to melt, and then connect the components to the pad through the melted tin.

In related technologies, workers usually place solder balls manually, and the solder balls used for soldering are small in size, which leads to problems of low accuracy and low work efficiency.

Contents of the invention

The present application provides a material picking device, which can automatically pick up materials, and effectively improves the accuracy of material picking and work efficiency.

The application provides a pick-up device, which is set to pick up materials, including: a base, provided with a material cavity for accommodating the materials; a first pick-up part, set on the base, the first pick-up The piece has a first working end surface, and a plurality of first material-retrieving holes are arranged on the first working end surface, and the first material-retrieving component is configured to absorb the material in the material cavity through the plurality of first material-taking holes. the material; and an air injection assembly, the air injection assembly is configured to inject airflow toward the first working end surface so that the first working end surface is located on the material on the area outside the plurality of first material extraction holes Blown off; wherein, the first pick-up member can be raised and lowered relative to the material cavity, so that the first working end surface has a first state above the material surface of the material cavity and is located in the material cavity The second state below the material surface; the air injection assembly injects airflow toward the first working end surface in response to the change of the first working end surface from the second state to the first state.

Description of drawings

Fig. 1 is the perspective view of the reclaiming device provided by the present application in the front view direction;

Fig. 2 is a perspective view of the reclaiming device provided by the application in the rear view direction;

Fig. 3 is a schematic diagram of the positional relationship between the first retrieving part and the abutment in Fig. 1;

Fig. 4 is a schematic structural view of the cover plate in Fig. 1;

Fig. 5 is the structural representation of movable plate among Fig. 1;

Fig. 6 is a schematic structural view of the first retrieving part in Fig. 1;

Fig. 7 is a schematic cross-sectional structure diagram of Fig. 6;

Fig. 8 is a schematic diagram of the enlarged structure of the I region in Fig. 7;

Fig. 9 is a schematic diagram of the air jet assembly of the material reclaiming device provided by the present application when blowing air.

Explanation of reference signs:

100-the first retrieving part; 110-the first working end surface; 120-the first retrieving hole; 121-flare part; 130-installation part; 200-abutment; 210-groove; -through hole; 222-guiding surface; 300-jet assembly; 310-movable plate; 311-air inlet; 312-air outlet; 320-first driving member; 330-vacuum filter; Second drive member; 420 - connecting plate.

Detailed ways

The specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. It should be understood that the words "up", "down", "top", "bottom" and other words indicating orientation or positional relationship described below are only based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and The description is simplified, rather than indicating or implying that the device/element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the application.

Please refer to Figures 1 to 9, the present application provides a pick-up device, which is set to pick up materials, including: a base 200, which is provided with a cavity for storing materials; On the platform 200, the first retrieving member 100 has a first working end face 110, and the first working end face 110 is provided with a plurality of first retrieving holes 120, and the first retrieving member 100 is configured to pass through a plurality of first retrieving holes 120. The hole 120 absorbs the material in the material cavity; and the air injection assembly 300, the air injection assembly 300 is configured to inject airflow toward the first working end surface 110 so that the first working end surface 110 is located on the area outside the plurality of first material extraction holes 120 The material is blown off; wherein, the first pick-up member 100 can be raised and lowered relative to the material cavity, so that the first working end surface 110 has a first state above the material surface of the material cavity and a second state below the material surface of the material cavity. Two states: the air jet component 300 jets air toward the first working end surface 110 in response to the change of the first working end surface 110 from the second state to the first state. The above-mentioned material level of the material cavity refers to the height of a plurality of tin balls stacked in the material cavity, which is similar to the liquid level of a liquid.

In the material retrieving device provided by the application, the first material retrieving part can be lifted and set in the material cavity, and the material in the material cavity is sucked through the first material retrieving hole on the first material retrieving part. The excess material on the end surface is blown away, which has the advantages of convenient material picking, high material picking accuracy and high work efficiency.

In a schematic scenario, the above-mentioned material is a solder ball, and the material picking device of the present application is configured to pick up the solder ball. It is worth noting that the picking device in the above example is used to pick up solder balls, which is only a feasible application scenario of this device. In other possible scenarios that cannot be explicitly excluded, the reclaimer can also be used for picking up other types of material.

The following will mainly set the reclaiming device to pick up solder balls as the main scenario. However, based on the above description, it can be seen that the protection scope of the embodiments of the present application is not limited thereby.

In this application, please refer to FIG. 3 and as shown in FIG. 9 , the first pick-up member 100 is in the shape of a column, which may be a cylinder, a square cylinder, an ellipse cylinder, etc. Considering the convenience of production, processing and installation, optionally, the first pick-up member 100 is in the shape of a cylinder. The first working end surface 110 is formed on the top end of the first material picking member 100 . In the present application, the first material extraction holes 120 are distributed in a circular array, and the number of the first material extraction holes 120 is determined according to the actual situation.

Please refer to Figs. 6 to 8, the first retrieving member 100 is hollow inside, the hollow cavity of the first retrieving member 100 extends along the axial direction of the first retrieving member 100, and is connected to the first retrieving hole 120 connected. The hollow cavity of the first material extraction part 100 is connected with an external negative pressure generator (not shown in the figure), so that the first material extraction hole 120 is formed with a negative pressure. Therefore, the first pick-up member 100 uses the suction force formed by the negative pressure to suck the solder balls in the cavity, which has the advantages of convenient pick-up and high work efficiency.

A flared portion 121 is provided at the port where the first material extraction hole 120 is in contact with the solder ball. In the moving direction along the first working end surface 110 from the first state to the second state (from top to bottom), the inner diameter of the flaring portion 121 gradually decreases. The above-mentioned flaring portion 121 is set to increase the contact area between the first material extraction hole 120 and the solder ball, thereby increasing the adsorption force of the first material extraction hole 120, thus, the tin ball can be firmly adsorbed on the first material extraction hole 120. Hole 120.

There are various shapes of the hole wall of the flaring portion 121, which can be a conical surface, a spherical surface, or a broken line surface. When the hole wall of the flaring portion 121 is a conical surface, the value range of the cone angle M of the flaring portion 121 is: 110°～126°, and the cone angle M can be an angle of 110°, 118°, 126°, etc. It can also be that the angle of the cone angle M increases between 110° and 126° at intervals of 1°, 2°, 3°, 4°, 5°, 6°, 7°, 8°, and 9°.

The positional relationship between the first retrieving part 100 and the material cavity is as follows: the first retrieving part 100 can be completely arranged in the material cavity; the first retrieving part 100 can also be partially arranged in the material cavity, and partly located outside the material cavity . In this application, in order to reduce the occupancy rate of the material chamber space by the first material picking member 100, in one embodiment, please refer to FIG. The bottom of the cavity is formed with a through hole for the first material picking member 100 to pass through. Thus, a part of the first picking member 100 is located inside the material cavity, and another part is located outside the material cavity.

The position of the first working end surface 110 relative to the material cavity depends on the working conditions. When the first working end surface 110 is in the first state, the first working end surface 110 is located in the cavity. When the first working end surface 110 is in the second state, the first working end surface 110 has the following three positions: the first one, the first working end surface 110 is located in the material cavity; the second one, the first working end surface 110 is located in the material cavity The bottom of the cavity; the third type, the first working end surface 110 is located in the through hole, that is, the first working end surface 110 is located outside the material cavity.

In the present application, the position of the first working end surface 110 in the second state is determined according to the number of solder balls in the cavity. When the number of solder balls in the material cavity is large, the material surface of the material cavity is higher. The higher material surface can be understood as: the material surface of the material cavity is far away from the bottom of the material cavity. At this time, the first working end surface 110 is located at the bottom of the material cavity. The material can be retrieved in the cavity. When the number of tin balls in the material cavity is small, the material surface of the material cavity is relatively low. The above-mentioned low material surface can be understood as: the material surface of the material cavity is close to the cavity bottom of the material cavity. At this time, the first working end surface 110 needs to Descend to the bottom of the material cavity or locate in the through hole to realize material reclaiming. Thus, it can effectively ensure that all the solder balls in the cavity can be picked up.

When the first working end surface 110 is located in the through hole, the first working end surface 110 is lower than the cavity bottom of the material cavity. Optionally, there is a height difference of 0.2 mm between the first working end surface 110 and the bottom of the cavity.

In this application, the cavity can be open or closed. The above-mentioned open type means that when the air jet assembly 300 sprays airflow towards the first working end surface 110, the solder balls are in an open environment. internal splash into the external environment. The closed type means that when the jetting assembly 300 sprays airflow toward the first working end surface 110 , the solder balls are in a relatively closed environment, and the solder balls are not easily affected by the jetting airflow and splashed into the external environment.

In one embodiment, please refer to FIG. 1 and as shown in FIG. 3 , a recess 210 is formed on the abutment 200, and a cover plate 220 is provided on the top of the groove 210, and the groove 210 and the cover plate 220 are surrounded to form a Material chamber. The cover plate 220 is provided with a through hole 221 , and the air flow injected by the air injection assembly 300 enters the material cavity through the through hole 221 . Thus, a closed cavity can be formed, which can effectively prevent the tin balls from splashing into the external environment when the air jet assembly 300 jets the air.

In the present application, the groove 210 is configured with an open top, and the groove 210 extends from top to bottom. The top opening of the groove 210 is a notch, and the bottom of the groove 210 forms the bottom of the groove. Wherein, the size of the opening of the groove 210 is larger than the size of the bottom of the groove 210 , and the cross section of the groove 210 gradually decreases along the direction from the opening to the bottom of the groove. The above "section" refers to the section in the horizontal direction in Fig. 3 . Thus, the solder balls in the groove 210 have a moving state of gathering toward the center of the groove 210 , so as to facilitate the first pick-up member 100 to absorb the solder balls.

The shape of groove 210 has multiple, for example, the notch of groove 210 is square, and the groove bottom of groove 210 is also square, and the groove wall of groove 210 is inclined plane; The groove bottom of the groove 210 is also circular to form a funnel structure; the groove opening of the groove 210 can also be square, the groove bottom of the groove 210 is circular, and the groove wall of the groove 210 is a curved surface. It can be understood that the shape of the above-mentioned groove 210 includes but is not limited to the above-mentioned situation, and other schemes that utilize the difference in the size of the notch and the bottom of the groove to get the solder balls to gather toward the center of the groove 210 are within the protection scope of the present application.

The cover plate 220 is fixed above the groove 210 , and the cover plate 220 is detachably connected to the abutment 200 . The cover plate 220 may be detachably connected by bolts, or may be detachably connected by buckles. In this application, the cover plate 220 and the abutment 200 are connected by bolts, so that workers can conveniently check the condition of the solder balls in the groove 210 , and it is also convenient for inspection and maintenance.

In this application, the air jet assembly 300 can remove redundant solder balls on the first working end surface 110, thus, the air jet assembly 300 can ensure that the number of solder balls picked up by the first working end surface 110 is equal each time, effectively improving the efficiency of retrieving. reliability and precision.

In this application, please refer to FIG. 1 to FIG. 3 , the air injection assembly 300 includes a movable plate 310 movably arranged on the base 200 and a first driving member 320 that drives the movable plate 310 to make a linear reciprocating motion. The driving member 320 is connected with the movable plate 310 . The movable plate 310 is located on the side of the cover 220 away from the base 200 , and the side of the cover 220 away from the base 200 is above the cover 220 , that is, the movable plate 310 is disposed above the cover 220 .

Please refer to FIG. 5 , the movable plate 310 is provided with an air inlet 311 and an air outlet 312 , and the air inlet 311 is configured to communicate with an external air source and the air outlet 312 . Wherein, an air channel for communicating with the air inlet 311 and the air outlet 312 is formed inside the movable plate 310 , and the air outlet 312 communicates with an external air source through the air channel and the air inlet 311 in turn.

The aperture of the air outlet 312 is smaller than the aperture of the air inlet 311 , and there are multiple air outlets 312 . In the present application, the purpose of setting the number of air outlets 312 to be multiple is to use for uniform wind, so that the air flow can evenly blow to the first working end surface 110, and ensure that the redundant solder balls on the first working end surface 110 are eliminated. While blowing off, prevent the airflow from blowing off the solder balls at the first material extraction hole 120 due to excessive air flow.

The air outlet 312 is close to the through hole 221 or away from the through hole 221 in response to the movement of the movable plate 310 . When the movable plate 310 is away from the cover plate 220 , it drives the air outlet 312 away from the through hole 221 . At this time, there is no shield above the through hole 221 , and the through hole 221 is in an open state. In this state, workers can add solder balls to the cavity through the through hole 221.

When the first working end surface 110 needs to remove excess solder balls after taking material, the movable plate 310 can be driven close to the cover plate 220 by the first driving member 320 so that the air outlet 312 is close to the through hole 221 . In order to smoothly blow off excess solder balls on the first working end surface 110 , the first working end surface 110 is located directly below the through hole 221 .

When blowing air, the air outlet 312 is infinitely close to the through hole 221 , and the projections of the air outlet 312 and the through hole 221 at least partially overlap in the axial direction of the through hole 221 . Optionally, projections of the air outlet 312 and the through hole 221 completely overlap in the axial direction of the through hole 221 .

Considering that the airflow jetted from the air outlet 312 needs to flow out of the material cavity after entering the material cavity, so as to maintain the balance of air pressure inside and outside the material cavity. In this application, please refer to FIG. 9 , there is a preset gap Q between the movable plate 310 and the cover plate 220 along the direction from the movable plate 310 to the base 200 (from top to bottom). The setting of the above preset gap Q is to form an air outlet channel, so that the airflow in the material cavity can flow out of the material cavity through the above air outlet channel. In the present application, the air outlet channel is formed between the adjacent movable plate 310 and the cover plate 220 , no additional air outlet structure is required, the number of parts is effectively reduced, and the structure is simple and compact.

The diameter of the solder ball is small, usually about 0.5 mm. In this application, the value range of the preset gap Q is 0.1-0.5 mm. From the above, it can be seen that the size of the preset gap Q is equal to or smaller than the diameter of the solder ball , thus, the solder balls are not easy to pass through the preset gap Q.

Exemplarily, the preset gap Q may be a distance of 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc., or may be an increase of a value between 0.1 mm and 0.5 mm with an interval of 0.05 mm. Optionally, the size of the preset gap Q is 0.2 mm.

Considering that the weight of the solder ball is relatively light, the solder ball is easy to fly around and difficult to fall under the action of the jet airflow. In this application, please continue to refer to FIG. 4 and FIG. 9 , the side of the cover plate 220 facing the groove 210 is provided with a guide surface 222 , and the guide surface 222 is circularly distributed around the central axis of the through hole 221 . The guide surface 222 is configured so that the solder balls in the cavity fall back into the cavity along the guide surface 222 under the action of the jet airflow of the air injection assembly 300 , which can effectively prevent the solder balls from flying out of the cavity with the airflow.

Considering that the gas transported from the external air source to the movable plate 310 may contain water vapor and dust, if the gas containing water vapor and dust is transported to the material cavity, it will easily affect the quality of the solder balls, thereby affecting the soldering quality. In view of this, a vacuum filter 330 is provided at the air inlet 311, and the vacuum filter 330 is set to filter impurities such as moisture and dust in the external air source, thereby effectively ensuring the quality of the solder balls in the material cavity.

In order to realize the lifting of the first picking member 100 relative to the material cavity, the picking device further includes a lifting assembly 400 . Please refer to FIG. 3 , the lifting assembly 400 includes a second driving member 410 connected to the first picking member 100 , and the second driving member 410 is configured to drive the first picking member 100 to move up and down. In the present application, the first driving member 320 and the second driving member 410 are driving members with linear reciprocating motion function, and may be driving members such as air cylinders, hydraulic cylinders, lead screw units, and linear modules. In one embodiment, both the first driving member 320 and the second driving member 410 are air cylinders.

The lifting assembly 400 further includes a connection plate 420 connected to the second driving member 410 , and the first pick-up component 100 is fixed above the connection plate 420 . A mounting part 130 is formed on the end of the first material picking part 100 near the connecting plate 420 side, the first material picking part 100 is arranged on the connecting plate 420 through the mounting part 130, and the mounting part 130 is fastened on the connecting plate 420 by bolts . Taking the second driving member 410 as an example of an air cylinder, the connecting plate 420 is arranged on the free end of the piston rod of the air cylinder, and the movement of the piston rod drives the first pick-up member 100 up and down.

In the present application, the number of material cavities may be one, or two or more. Figure 3 shows the case where multiple material cavities are provided, and the multiple material cavities are independent of each other and distributed at equal intervals, each of which is provided with the above-mentioned first material picking member 100 . The independence of the material cavities above means that each material cavity can pick up solder balls independently, thereby effectively improving the material retrieving efficiency.

Only one cover plate 220 and one movable plate 310 are provided in the accompanying drawing 1, the above-mentioned one cover plate 220 acts on a plurality of grooves 210, and the above-mentioned one movable plate 310 acts on a plurality of through holes 221, which effectively reduces the number of parts and has The advantage of simple structure.

It can be understood that when multiple material cavities are provided, only one lifting assembly 400 can be provided, or can be provided in a one-to-one correspondence with the first material picking member 100 . In this application, only one lifting assembly 400 is provided, and a plurality of first pick-up parts 100 are driven by one lifting assembly 400, which effectively simplifies the structure.

The structure of the reclaiming device has been fully described above, and those skilled in the art will understand the following working process:

In the initial state, the movable plate 310 is far away from the cover plate 220, and the first working end surface 110 is close to the bottom of the material cavity. At this time, there is no shelter above the through hole 221, and the through hole 221 is in an open state. Add solder balls in the cavity;

The material picking process of the first material picking member 100 is as follows: the first working end face 110 is driven to move toward the through hole 221 side by the second driving member 410, when the first working end face 110 is higher than the material surface in the material cavity and reaches the preset picking When the height of the material is high, the second driving member 410 drives the first working end surface 110 to stop moving, and at this time, a number of solder balls are attached to the first working end surface 110;

The process of removing redundant solder balls is as follows: the movable plate 310 is driven to move directly above the cover plate 220 by the first driving member 320, the air outlet 312 is located directly above the through hole 221 and infinitely close to the through hole 221, at this time, the air outlet 312 The airflow is sprayed toward the first working end surface 110 , at this time, the solder balls located on the area outside the plurality of first picking holes 120 are blown off, thereby completing the picking of the solder balls.

Claims

A retrieving device configured to pick up materials, comprising:

The abutment (200) is provided with a material cavity for containing the material;

The first pick-up part (100) is arranged on the base platform (200), the first pick-up part (100) has a first working end face (110), and the first working end face (110) is provided with There are a plurality of first material extraction holes (120), and the first material extraction member (100) is configured to absorb the material in the material cavity through the plurality of first material extraction holes (120); and

An air injection assembly (300), the air injection assembly (300) is configured to inject airflow toward the first working end surface (110) so that the first working end surface (110) is located at the plurality of first material extraction holes ( 120) The material on the area outside is blown off;

Wherein, the first pick-up member (100) can be raised and lowered relative to the material cavity, so that the first working end surface (110) has a first state located above the material surface of the material cavity and located on the material surface of the material cavity. a second state below the material level of the cavity;

The air injection assembly (300) injects airflow toward the first working end surface (110) in response to the change of the first working end surface (110) from the second state to the first state.
The retrieving device as claimed in claim 1, wherein,

A groove (210) is formed in a depression on the base (200), and a cover plate (220) is provided on the top of the groove (210), and the groove (210) and the cover plate (220) Enclosing and forming the material cavity;

Wherein, the cover plate (220) is provided with a through hole (221), and the airflow sprayed by the air injection component (300) enters the material cavity through the through hole (221).
The retrieving device as claimed in claim 2, wherein,

The notch size of the groove (210) is larger than the groove bottom size of the groove (210), and on the direction along the groove bottom to the groove bottom, the cross section of the groove (210) is gradually decreasing trend.
The retrieving device as claimed in claim 2, wherein,

The side of the cover plate (220) facing the groove (210) is provided with a guide surface (222), and the guide surface (222) is distributed circularly around the central axis of the through hole (221);

The guide surface (222) is configured so that the material in the material cavity falls back into the material cavity along the guide surface (222) under the action of the jet airflow of the air injection assembly (300).
The retrieving device as claimed in claim 2, wherein,

The air injection assembly (300) includes a movable plate (310) movably arranged on the base (200), and the movable plate (310) is located on the cover plate (220) away from the base (200). ), the movable plate (310) is provided with an air outlet (312) communicated with an external air source;

Wherein, the air outlet (312) is close to the through hole (221) or away from the through hole (221) in response to the movement of the movable plate (310).
The reclaiming device as claimed in claim 5, wherein,

There is a preset gap between the movable plate (310) and the cover plate (220) along the direction from the movable plate (310) to the base (200);

Wherein, the preset gap is configured to form an air outlet channel for the airflow in the material cavity to flow out of the material cavity.
The reclaiming device as claimed in claim 6, wherein,

The value range of the preset gap is 0.1-0.5mm.
The material retrieving device according to claim 7, wherein the size of the preset gap is 0.2 mm.
The reclaiming device as claimed in claim 5, wherein,

The air injection assembly (300) also includes a first driving member (320), and the first driving member (320) is connected to the movable plate (310);

Wherein, the first driving member (320) is configured to drive the movable plate (310) to perform linear reciprocating motion.
The reclaiming device as claimed in claim 5, wherein,

The movable plate (310) is also provided with an air inlet (311) for connecting the external air source and the air outlet (312), and the air inlet (311) is provided with a vacuum filter (330 ).
The retrieving device as claimed in claim 1, wherein,

The first picking member (100) is arranged through the cavity bottom of the material cavity, and the cavity bottom of the material cavity is formed with a through hole for the first material picking component (100) to pass through;

In the first state, the first working end surface (110) is located in the material cavity;

In the second state, the first working end surface (110) is located in the material cavity; or, the first working end surface (110) is located at the bottom of the material cavity; or, the first The working end surface (110) is located in the through hole.
The retrieving device as claimed in claim 1, wherein,

A flared portion (121) is provided at the port where the first material extraction hole (120) is in contact with the material, and the flared portion (121) is configured to enlarge the first material extraction hole (120) The contact area with the material.
The reclaiming device according to claim 12, wherein,

In a moving direction along the first working end surface (110) from the first state to the second state, the inner diameter of the flared portion (121) is gradually decreasing.
The reclaiming device according to claim 13, wherein,

The hole wall of the flaring part (121) is a conical surface; or,

The hole wall of the flaring part (121) is a spherical surface; or,

The hole wall of the flaring part (121) is a broken line surface.
The material retrieving device according to claim 1, further comprising a lifting assembly (400), said lifting assembly (400) comprising a second drive member (410) connected to said first material retrieving member (100), said The second driving member (410) is configured to drive the first material picking member (100) to perform lifting motion.