CN219845040U

CN219845040U - MEMS sensor packaging structure and electronic cigarette using same

Info

Publication number: CN219845040U
Application number: CN202320959189.1U
Authority: CN
Inventors: 魏宝节; 刘端
Original assignee: Anhui Aofei Acoustics Technology Co ltd
Current assignee: Anhui Aofei Acoustics Technology Co ltd
Priority date: 2023-04-25
Filing date: 2023-04-25
Publication date: 2023-10-20
Anticipated expiration: 2033-04-25

Abstract

The utility model provides an MEMS sensor packaging structure and an electronic cigarette using the same. The MEMS sensor packaging structure comprises: a MEMS sensor portion and a PCBA portion; the MEMS sensor portion includes: the sensor circuit board is provided with a sensor air hole; the MEMS chip is arranged on the first surface of the sensor circuit board in alignment with the sensor air hole; the PCBA part includes: the PCBA circuit board is provided with a PCB through hole; the sensor circuit board is welded with the PCBA circuit board, and an inter-plate channel is formed between the sensor circuit board and the PCBA circuit board; the first projection of the sensor air hole on the PCBA circuit board is not overlapped with the PCB through hole. In the utility model, the sensor air holes and the PCB through holes form dislocation, and the air flows to the MEMS chip after flowing through the channels between the boards, so that the invasion of water vapor molecules, tobacco tar molecules and PCB scraps is greatly reduced, and the reliability of the packaging structure is improved.

Description

MEMS sensor packaging structure and electronic cigarette using same

Technical Field

The utility model relates to the technical field of MEMS chips, in particular to an MEMS sensor packaging structure and an electronic cigarette using the same.

Background

Electronic cigarettes (also called as atomized cigarettes and electronic atomized cigarettes; english is called as electronic Cigarette; english is called as EC) are a combination of traditional tobacco and modern technology. At present, electronic cigarettes are mainly divided into two types: atomized (steam type) electronic cigarettes and heated non-combustible electronic cigarettes (HNB for short). According to whether the atomization bin is closed, the atomization type electronic cigarette can be divided into: closed electronic cigarettes and open electronic cigarettes. For closed electronic cigarette, it is further divided into according to whether it can change the atomizing storehouse: bullet-exchanging electronic cigarette and disposable electronic cigarette. The bullet-changing electronic cigarette is a main stream electronic cigarette product in China at present.

Structurally, the cartridge-changing electronic cigarette comprises two parts: tobacco stems and tobacco cartridges. The tobacco stem portion mainly comprises: lithium battery, control chip and air flow sensor, etc. Solutions for air flow sensors are Electret Capacitive (EC) sensors and microelectromechanical systems (MEMS) sensors. In the initial development stage, more electret capacitive sensors are adopted in the cartridge-changing electronic cigarette, however, due to the advantages of low cost, good oil resistance, good consistency and the like, the MEMS sensors are gradually on the rise.

The electronic cigarette MEMS sensor is used for sensing negative pressure in the oral cavity, and the air holes are formed in the shell and the PCB circuit board to form the air pressure difference of the upper cavity and the lower cavity, so that the purpose of detecting the negative pressure is achieved, and smoke oil molecules, water vapor molecules and tiny tin beads and tin slag are extremely easy to invade into the sensor through the bottom air holes due to the existence of the pressure difference to induce the sensor to sense faults. Therefore, how to solve the problem that the MEMS sensor of the electronic cigarette reduces the invasion of foreign matters from the bottom hole and increases the reliability of the sensor becomes a urgent need in the whole industry.

Disclosure of Invention

First, the technical problem to be solved

In view of the above, in order to at least partially solve one of the above technical problems, the present utility model provides a MEMS sensor package structure and an electronic cigarette using the same.

(II) technical scheme

In a first aspect of the present utility model, a MEMS sensor package structure is provided. The MEMS sensor packaging structure comprises: a MEMS sensor portion and a PCBA portion; the MEMS sensor portion includes: the sensor circuit board is provided with a sensor air hole; the MEMS chip is arranged on the first surface of the sensor circuit board in alignment with the sensor air hole; the PCBA part includes: the PCBA circuit board is provided with a PCB through hole; the sensor circuit board is welded with the PCBA circuit board, and an inter-plate channel is formed between the sensor circuit board and the PCBA circuit board; the first projection of the sensor air hole on the PCBA circuit board is not overlapped with the PCB through hole.

In some embodiments of the utility model, n PCB through holes are arranged on the PCBA circuit board, wherein n is more than or equal to 2; wherein, n PCB through-holes set up in the periphery of first projection.

In some embodiments of the utility model, 1 sensor air hole is formed on the sensor circuit board; the n PCB through holes are uniformly arranged on the circumference of the outer side of the first projection.

In some embodiments of the utility model, n=4, and both the sensor air hole and the PCB through hole are circular holes.

In some embodiments of the utility model, a first sealing pad is formed on the second face of the sensor circuit board facing the PCBA circuit board, outside the sensor air hole; wherein the diameter d of the sensor air hole is more than or equal to 0.1mm and less than or equal to 0.3mm, and the first distance h between the sensor air hole and the outer side first sealing pad is more than or equal to 0.1mm ₁ ≤1mm。

In some embodiments of the utility model, a second sealing pad corresponding to the first sealing pad is formed on the outer side of the PCBA circuit board facing the first surface of the sensor circuit board; the first and second sealing pads are soldered by a reflow process through solder paste.

In some embodiments of the utility model, m first signal pads are formed on the outer side of the first sealing pad on the sensor circuit board, and m is larger than or equal to 1; on the PCBA circuit board, m second signal pads corresponding to the m first signal pads are formed on the outer side of the second sealing pad.

In some embodiments of the utility model, the height of the inter-board vias in a direction perpendicular to the PCBA wiring board is 0 < L _h ≤0.5mm。

In some embodiments of the utility model, the MEMS sensor portion further comprises: the ASIC chip is fixed on the first surface of the sensor circuit board far away from the PCBA circuit board and is connected with the MEMS chip through signals; the shell is welded and fixed on the first surface of the sensor circuit board far away from the PCBA circuit board, a sensing space is formed by the shell and the circuit board, the MEMS chip and the ASIC chip are buckled in the sensing space, and a shell through hole is formed in the shell; the second projection of the through hole of the shell on the sensor circuit board is not overlapped with the sensor air hole.

In a third aspect of the present utility model, an electronic cigarette is provided. The electronic cigarette comprises: an electronic cigarette body; the MEMS sensor packaging structure provides an electrical signal reflecting the pumping action of a user for the electronic cigarette body.

(III) beneficial effects

As can be seen from the technical scheme, compared with the prior art, the utility model has at least one of the following beneficial effects:

(1) The sensor circuit board is provided with the sensor air hole, the PCBA circuit board is provided with the PCB through hole, the first projection of the sensor air hole on the PCBA circuit board is not overlapped with the PCB through hole, so that dislocation is formed between the sensor air hole and the PCB through hole, air flows to the MEMS chip after flowing through the inter-board channel, water vapor molecules, tobacco tar molecules and invasion of PCB scraps are greatly reduced, and reliability of the packaging structure is improved.

(2) The PCBA circuit board is provided with n PCB through holes, n is more than or equal to 2, a plurality of airflow channels can be formed on the PCBA circuit board, the risk of foreign matter blocking holes can be greatly reduced, and the reliability of the PCBA is improved.

(3) The sensor gas pocket and the PCB through-hole are the round hole, have seted up 1 sensor gas pocket on the sensor circuit board, and a plurality of sensor gas pockets evenly set up on the circumference in the first projection outside, are favorable to forming the sensor gas pocket through the even flow direction intermediate position of the stranded air current of a plurality of PCB through-holes, lighten the harm of too big air current to MEMS chip on the one hand, on the other hand can also reduce the possibility that external air current false triggering electron cigarette.

(4) In the reflow soldering process of fixing the sensor circuit board on the PCBA circuit board, the content of soldering flux in the solder paste is excessive, so that the conditions that solder balls are sputtered into the sensor air holes and damage the MEMS sensor and the like are easy to occur.

In the utility model, the distance between the outer side of the sensor air hole and the sealing bonding pad is more than or equal to 0.1mm and less than or equal to h ₁ The pore diameter is reduced to be less than or equal to 1mm and less than or equal to 0.1mm and less than or equal to 0.3mm, so that the risk of tin bead invasion formed in the reflow soldering process can be reduced, and the process reliability is improved.

Drawings

FIG. 1 is a schematic cross-sectional view of a MEMS sensor package structure according to an embodiment of the utility model.

Fig. 2A, 2B, and 2C are top, bottom, and side cross-sectional views, respectively, of a MEMS sensor portion of the MEMS sensor package structure of fig. 1.

FIG. 3 is a schematic cross-sectional view of a prior art MEMS sensor package structure.

Fig. 4A is a schematic diagram of a PCBA circuit board in a prior art MEMS sensor package structure.

FIG. 4B is a schematic diagram of a PCBA circuit board in the MEMS sensor package structure of FIG. 1.

Fig. 5 is a mounting effect diagram of the MEMS sensor package structure shown in fig. 1.

Fig. 6A is an enlarged view of a first seal land portion on the back side of a sensor circuit board in a prior art MEMS sensor package structure.

Fig. 6B is an enlarged view of a first seal land portion on the back side of the sensor circuit board in the MEMS sensor package structure shown in fig. 1.

Fig. 7A and 7B are schematic diagrams of the MEMS sensor package structure according to the prior art and the present embodiment, respectively, when encountering a foreign object.

Detailed Description

The utility model provides a brand-new MEMS sensor packaging structure and an electronic cigarette applying the same, so as to reduce or even stop invasion of foreign matters, and bring safer and more superior use experience to the electronic cigarette.

The present utility model will be further described in detail below with reference to the accompanying drawings in order to make the objects, technical solutions and advantages of the present utility model more apparent.

The present utility model first provides a MEMS sensor package structure, and although the embodiments are described by taking the application to the field of electronic cigarettes as an example, it should be understood by those skilled in the art that the MEMS sensor package structure can be applied to other fields besides electronic cigarettes, for example: microphones, speakers, acceleration sensors, etc.

In one exemplary embodiment of the present utility model, a MEMS sensor package structure is provided. FIG. 1 is a schematic cross-sectional view of a MEMS sensor package structure according to an embodiment of the utility model. The direction of the arrow in the figure is the direction of inhalation (reverse inhalation may be set as required). As shown in fig. 1, the MEMS sensor package structure of the present embodiment includes: a MEMS sensor portion and a PCBA portion; wherein:

the MEMS sensor portion 10 includes: a sensor circuit board 11 on which a sensor air hole 12 is formed; the MEMS chip 13 is arranged on the first surface of the sensor circuit board in alignment with the sensor air hole;

the PCBA portion 20 includes: a PCBA circuit board 21 on which a PCB through hole 22 is formed;

wherein, sensor circuit board and PCBA circuit board pass through welding material 31 welded connection, form the interplate passageway between the two to, the first projection 14 of sensor gas pocket on PCBA circuit board does not coincide with the PCB through-hole. In the present embodiment, the solder material 31 is an inter-plate solder paste.

First, the MEMS sensor portion in this embodiment will be described in detail.

Referring to fig. 2A and 2c, the mems sensor portion includes:

a sensor circuit board 11 on which a sensor air hole 12 is formed;

the MEMS chip 13 is fixed on the first surface of the sensor circuit board through peripheral silica gel 13';

the ASIC chip 15 is fixed on the first surface of the sensor circuit board far away from the PCBA circuit board through peripheral resin adhesive 15', and is connected with the MEMS chip through gold wire signals;

the shell 16 is welded and fixed on the first surface, far away from the PCBA circuit board, of the sensor circuit board through solder paste 16', a sensing space is formed by the shell and the circuit board, the MEMS chip and the ASIC chip are buckled in the sensing space, a shell through hole 17 is formed in the shell, and the second projection of the shell through hole 17 on the sensor circuit board is not overlapped with the sensor air hole 12, namely, the shell through hole 17 and the sensor air hole 12 are staggered.

Referring to fig. 2B, a first sealing pad 18 is formed on the first surface of the sensor circuit board facing the PCBA circuit board, and 3 first signal pads 19 are formed on the outer side of the first sealing pad.

Next, features of the MEMS sensor for electronic cigarette of the present embodiment, which are compared with the prior art, will be described in detail, wherein the PCBA portion of the present embodiment will also be described in detail.

(1) Positional relationship between sensor air holes and PCB through holes

FIG. 3 is a schematic cross-sectional view of a prior art MEMS sensor package structure. The direction of the arrow in the figure is the direction of inhalation (reverse inhalation may be set as required). As shown in fig. 3, in the prior art, there are only 1 PCB through holes 22' and are disposed opposite to the upper sensor air holes 12.

As shown in fig. 1, in the MEMS sensor package structure of this embodiment, there are a plurality of PCB through holes 22 on the PCBA circuit board, and the PCB through holes are offset from the sensor air holes 12 above, that is, the first projections 14 of the sensor air holes on the PCBA circuit board do not coincide with the PCB through holes.

Through the arrangement, the sensor air holes and the PCB through holes form dislocation, and air flows to the MEMS chip after transversely flowing through the inter-plate channels, so that the invasion of water vapor molecules, tobacco tar molecules and PCB scraps is greatly reduced, and the reliability of the packaging structure is improved.

(2) Number and symmetrical arrangement of PCB vias

Fig. 4A is a schematic diagram of a PCBA circuit board in a prior art MEMS sensor package structure. FIG. 4B is a schematic diagram of a PCBA circuit board in the MEMS sensor package structure of FIG. 1. Fig. 5 is a mounting effect diagram of the MEMS sensor package structure shown in fig. 1.

Referring to fig. 3 and 4A, in the prior art, there are only 1 PCB through holes 22' on the PCB, and they are disposed opposite to the sensor air holes 12 above.

Referring to fig. 1, 4B and 5, in the present embodiment, the PCBA circuit board has 4 PCB through holes 22. On the premise that the 4 PCB through holes 22 are staggered with the sensor air holes above, the sensor air holes are uniformly distributed on the outer circumference of the first projection 14 on the PCBA circuit board. Through such setting, can form many air current passageway to greatly reduced the risk that the foreign matter plugged the hole, increased PCBA's reliability.

In addition, a second sealing pad 23 corresponding to the first sealing pad is formed on the first surface of the PCBA circuit board facing the sensor circuit board outside the PCB through hole. And, the first and second sealing pads 19 and 23 are soldered by a solder paste by a reflow process, thereby forming a laterally extending inter-board channel between the sensor circuit board and the PCBA circuit board. Meanwhile, the outer sides of the second sealing pads are formed with 3 second signal pads 24 corresponding to the 3 first signal pads.

(3) Distance between sensor air hole and first sealing pad

Fig. 6A is an enlarged view of a first seal land portion on the back side of a sensor circuit board in a prior art MEMS sensor package structure. Fig. 6B is an enlarged view of a first seal land portion on the back side of the sensor circuit board in the MEMS sensor package structure shown in fig. 1.

In the prior art, referring to fig. 6A, in the MEMS sensor portion, the sensor air hole has a larger diameter, and the distance between the sensor air hole and the outer first sealing pad is very narrow, which is generally smaller than 0.05mm. In this case, during the reflow soldering process for fixing the sensor circuit board to the PCBA circuit board, the solder flux content in the solder paste is excessive, and the situation that solder balls are sputtered into the sensor air holes and damage the MEMS sensor is likely to occur.

In the present utility model, referring to FIG. 6B, in the MEMS sensor portion, the diameter d of the sensor air hole is reduced by 0.1mm or less and 0.3mm or less, and the distance h between the outside of the sensor air hole and the sealing pad is set to be 0.1mm or less ₁ Less than or equal to 1mm by increasing h ₁ The risk of solder ball invasion in the reflow soldering process can be reduced, and the process reliability is improved. In this example, d=0.25 mm, h ₁ ＝0.77mm。

(4) Variations of the utility model

The utility model includes but is not limited to the following 5 aspects which may be modified or substituted with equivalents:

(1) shape of sensor air hole and PCB through hole

Although the sensor air holes and the PCB through holes are circular holes in the present embodiment, in other embodiments of the present utility model, the sensor air holes and the PCB through holes may be square holes, elliptical holes, elongated holes, and the like.

(2) Number of PCB vias

Although the number of the PCB through holes is 4 in the present embodiment, the present utility model does not limit the number of the PCB through holes, and the number of the PCB through holes may be 2, 3, 5, 6, 7 or more, or even 1, so long as the number of the PCB through holes and the sensor air holes are staggered from each other, it is within the protection scope of the present utility model.

(3) Number of sensor air holes

Although the number of the sensor air holes is 1 in the embodiment, the utility model does not limit the number of the sensor air holes, and the number of the sensor air holes can be 1, 2 or 3, so long as the sensor air holes and the PCB through holes are staggered, the sensor air holes and the PCB through holes are all within the protection scope of the utility model.

(4) Even arrangement of n PCB through holes on periphery of sensor air hole projection

In this embodiment, 4 PCB through holes are uniformly disposed on the circumference of the outside of the first projection, thereby achieving the effects of uniform airflow and improved reliability. However, in other embodiments of the present utility model, a plurality of PCB through holes may be disposed at the periphery of the sensor air hole projection, which may also implement the present utility model.

(5) Solder and adhesive

Referring to fig. 1, the sensor circuit board and the PCBA circuit board are connected by solder paste between the boards. Referring to fig. 2C, in the present embodiment, the MEMS chip is fixed to the first surface of the sensor circuit board through a peripheral silica gel 13'; the ASIC chip is fixed on the first surface of the sensor circuit board far away from the PCBA circuit board through peripheral resin adhesive 15'; the housing is secured to a first side of the sensor circuit board remote from the PCBA circuit board by solder paste 16'.

It will be appreciated by those skilled in the art that the above-described solder and adhesive are examples, and may be replaced with solder and adhesive well known in the art, and will not be described in detail herein.

In summary, the MEMS sensor package structure of the present embodiment may have better performance in case of being invaded by foreign matters. Fig. 7A and 7B are schematic diagrams of the MEMS sensor package structure according to the prior art and the present embodiment, respectively, when encountering a foreign object.

As shown in fig. 7A, when the MEMS sensor package structure of the prior electronic cigarette is actually mounted on the PCBA, the sealing pad is close to the air hole (with a diameter of 0.3 mm) of the circuit board, which often causes a problem that the tin beads block the air hole.

(1) When the tin ball volume is great, the tin ball can block up the gas pocket completely, directly leads to the sensor unable to detect the negative pressure, and then makes whole PCBA take place the functional failure, directly scrap.

(2) When the tin ball volume is less, the tin ball can directly enter the bottom of the MEMS chip through the air hole, and after the user sucks for several times, the sensor can be directly damaged, so that the function of the whole PCBA is disturbed, even false triggering is caused, and the harm is extremely large.

(3) Because the sensor circuit board gas pocket is right against the through-hole of PCB circuit board, after the user used repeatedly the suction, outside tobacco tar molecule, steam molecule very easily adhere to on the sensor diaphragm through the gas pocket, causes the response malfunction, and board bits and outside dust on the PCB through-hole wall also very easily flow into the MEMS inner chamber along with the gas pocket moreover, increases the risk that the sensor damaged.

As shown in fig. 7B, when the electronic cigarette MEMS sensor packaging structure of the present embodiment is actually mounted to a PCBA, the following technical means is adopted to alleviate or even avoid the problem that the tin beads block the air holes:

(1) dislocation arrangement of sensor air holes and PCB through holes

The sensor air holes on the sensor circuit board and the PCB through holes on the PCBA circuit board form dislocation, so that the sensor air holes are prevented from being opposite to the PCB through holes, and the air flow transversely passes through the inter-board channels (solder paste welding positions have a certain floating height of 0)<L _h And less than or equal to 0.5 mm) and then flows into the sensor, the method can greatly reduce the invasion probability of water vapor molecules, tobacco tar molecules and PCB scraps, and increase the reliability of PCBA.

(2) Number and symmetrical arrangement of PCB vias

The PCB adopts the design of many through-holes during the design to form many air current passageway, can greatly reduce the risk that foreign matter plugged the hole, can further increase PCBA's reliability.

(3) Reducing the diameter of the sensor air hole and increasing the distance between the sensor air hole and the first sealing pad

In the reflow soldering process, the content of soldering flux in the solder paste is excessive, so that tin balls are easy to sputter into pores of the MEMS bottom plate, and a sensor is damaged.

In the utility model, the diameter of the sensor air hole is reduced by at most 0.3mm; and meanwhile, the distance between the sensor air hole on the sensor circuit board and the first sealing bonding pad at the outer side is increased, and the distance of 0.1mm at least is ensured, so that the invasion of tin balls in the reflow soldering process is reduced. Experiments prove that the effect set up above is good.

Based on the MEMS sensor packaging structure, the utility model further provides the electronic cigarette. The electronic cigarette provided by the embodiment of the utility model comprises the following components: an electronic cigarette body; the MEMS sensor packaging structure provides an electrical signal reflecting the pumping action of a user for the electronic cigarette body. For specific features of the MEMS sensor package structure, reference may be made to the description of the above embodiments, which will not be repeated here.

Thus, various embodiments of the present utility model have been described. The present utility model should be clearly recognized by those skilled in the art in light of the above description.

It will be understood by those skilled in the art that unless explicitly indicated to the contrary, numerical parameters in the description and claims of the utility model may be approximations that can vary depending upon the context in which the utility model is practiced. In particular, all numbers expressing quantities of ingredients, reaction conditions, and so forth, used in the specification and claims are to be understood as being modified in all instances by the term "about", and the term "about" is intended to mean that the term "about" is intended to include variations of about 10% by a specified amount in some embodiments.

As used in the specification and claims, ordinal numbers such as "first," "second," and Arabic numerals, letters, etc. are used to modify a corresponding element, and are intended to merely make a clear distinction between an element having a certain name and another element having the same name, and do not imply that the element has any ordinal number nor does it represent the order of another element. It should be noted that, in the embodiments, directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc., refer to the directions of the drawings only, and are not intended to limit the scope of the present utility model. Moreover, the shapes and dimensions of the various elements in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of embodiments of the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms may be understood by those of ordinary skill in the art according to the specific circumstances.

For some implementations, if not critical to the utility model and well known to those of ordinary skill in the art, the detailed description is not provided in the drawings or text of the specification, as will be understood with reference to the related art. Moreover, the foregoing embodiments are provided merely for the purpose of illustrating the utility model and are not to be construed as limiting the embodiments set forth herein.

Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the utility model, various features of the utility model are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure. However, the method of the utility model should not be interpreted as reflecting the intention: the claimed utility model requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. In addition, the embodiments can be mixed and matched with each other or other embodiments based on design and reliability, i.e. the technical features of different embodiments can be freely combined to form more embodiments. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this utility model.

The above embodiments are provided to illustrate the objects, technical means and advantageous effects of the present utility model in detail, and it should be understood that the detailed description is intended to more clearly understand the present utility model and is not intended to limit the present utility model, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims

1. A MEMS sensor package structure, comprising: a MEMS sensor portion and a PCBA portion;

the MEMS sensor portion includes: the sensor circuit board is provided with a sensor air hole; the MEMS chip is arranged on the first surface of the sensor circuit board in an aligned mode;

the PCBA part comprises: the PCBA circuit board is provided with a PCB through hole;

the sensor circuit board is welded with the PCBA circuit board, and an inter-board channel is formed between the sensor circuit board and the PCBA circuit board; the first projection of the sensor air hole on the PCBA circuit board is not overlapped with the PCB through hole.

2. The MEMS sensor package of claim 1 wherein,

n PCB through holes are formed in the PCBA circuit board, and n is more than or equal to 2;

the n PCB through holes are arranged at the periphery of the first projection.

3. The MEMS sensor package of claim 2 wherein,

the sensor circuit board is provided with 1 sensor air hole;

the n PCB through holes are uniformly formed in the circumference of the outer side of the first projection.

4. The MEMS sensor package structure of claim 2, wherein n = 4, the sensor air hole and PCB through hole are circular holes.

5. The MEMS sensor package of claim 1 wherein,

a first sealing bonding pad is formed on the outer side of the sensor air hole on the second surface of the sensor circuit board facing the PCBA circuit board;

wherein the diameter d of the sensor air hole is more than or equal to 0.1mm and less than or equal to 0.3mm, and the first distance h between the sensor air hole and the outer side first sealing pad is more than or equal to 0.1mm and less than or equal to 0.3mm ₁ ≤1mm。

6. The MEMS sensor package structure of claim 5, wherein,

a second sealing bonding pad corresponding to the first sealing bonding pad is formed on the outer side of the PCB through hole on the first surface of the PCBA circuit board facing the sensor circuit board;

the first and second sealing pads are soldered by a reflow process via solder paste.

7. The MEMS sensor package of claim 6 wherein,

m first signal pads are formed on the outer side of the first sealing pad on the sensor circuit board, and m is more than or equal to 1;

and m second signal pads corresponding to the m first signal pads are formed on the outer side of the second sealing pad on the PCBA circuit board.

8. The MEMS sensor package of claim 1, wherein the inter-board vias have a height 0 < L in a direction perpendicular to the PCBA wiring board _h ≤0.5mm。

9. The MEMS sensor package of claim 1, wherein the MEMS sensor portion further comprises:

the ASIC chip is fixed on the first surface of the sensor circuit board far away from the PCBA circuit board and is connected with the MEMS chip through signals;

the shell is welded and fixed on the first surface, far away from the PCBA circuit board, of the sensor circuit board, a sensing space is formed by the shell and the circuit board, the MEMS chip and the ASIC chip are buckled in the sensing space, and a shell through hole is formed in the shell;

and the second projection of the shell through hole on the sensor circuit board is not overlapped with the sensor air hole.

10. An electronic cigarette, comprising:

an electronic cigarette body;

the MEMS sensor package structure of any one of claims 1 to 9, providing the e-cigarette body with an electrical signal reflecting a user's pumping action.