CN219679764U

CN219679764U - Packaging structure of electronic cigarette sensing chip and electronic cigarette

Info

Publication number: CN219679764U
Application number: CN202320616482.8U
Authority: CN
Inventors: 张敏; 梅嘉欣; 李刚
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2023-03-27
Filing date: 2023-03-27
Publication date: 2023-09-15
Anticipated expiration: 2033-03-27

Abstract

The utility model provides a packaging structure of an electronic cigarette sensing chip and an electronic cigarette, wherein the packaging structure comprises: the electronic cigarette comprises a first substrate, a shell and an electronic cigarette sensing chip; the shell is fixedly connected with one side of the first substrate and encloses a cavity, and the electronic cigarette sensing chip is positioned in the cavity and is fixedly connected with the first substrate; the first ventilation structure penetrating the first substrate in the thickness direction is arranged on the first substrate, the first ventilation structure comprises narrow slits and/or micropores, and the electronic cigarette sensing chip is correspondingly arranged with the first ventilation structure, so that the first sensing surface of the electronic cigarette sensing chip is communicated with one end of the first ventilation structure, and failure, false triggering and short circuit of the electronic cigarette sensing chip can be avoided.

Description

Packaging structure of electronic cigarette sensing chip and electronic cigarette

Technical Field

The utility model relates to the technical field of electronic cigarettes, in particular to a packaging structure of an electronic cigarette sensing chip and an electronic cigarette.

Background

The MEMS (Micro Electro Mechanic System, micro-electromechanical system) microphone is an electric energy sound transducer manufactured by micro-machining technology, and has the characteristics of small volume, good frequency response characteristic, low noise and the like. With the development of miniaturization and thinning of electronic devices, MEMS microphones are increasingly used in these devices.

In the electronic cigarette market, micro-differential pressure products formed by MEMS chips are increasingly accepted by the market, the MEMS chips are required to be packaged before application, the packaging structure comprises a substrate and a shell fixedly connected with the substrate, the substrate and the shell form a cavity, the MEMS chips are arranged in the cavity and are fixedly connected with the substrate, the shell plays a role in protecting the MEMS chips, an air inlet hole is formed in the position, corresponding to the MEMS chips, of the substrate, smoke or condensate generated by the electronic cigarette possibly enters the MEMS chips through the air inlet hole, and accordingly false triggering and short circuit of devices are caused.

Disclosure of Invention

The utility model provides a packaging structure of an electronic cigarette sensing chip and the electronic cigarette, which can avoid malfunction, false triggering and short circuit of the electronic cigarette sensing chip, and the specific scheme is as follows:

in a first aspect, a package structure of an electronic cigarette sensing chip is provided, including: the electronic cigarette comprises a first substrate, a shell and an electronic cigarette sensing chip; the shell is fixedly connected with one side of the first substrate and encloses a cavity, and the electronic cigarette sensing chip is positioned in the cavity and is fixedly connected with the first substrate;

the first substrate is provided with a first ventilation structure penetrating through the first substrate in the thickness direction, the first ventilation structure comprises narrow slits and/or micropores, and the electronic cigarette sensing chip is correspondingly arranged with the first ventilation structure, so that the first sensing surface of the electronic cigarette sensing chip is communicated with one end of the first ventilation structure.

Further, the first substrate comprises a base material, a conductive layer and a protective layer, the base material comprises a first surface and a second surface which are opposite in the thickness direction, the shell is fixedly connected with the first surface, the conductive layer at least partially covers the second surface, and the protective layer covers the conductive layer;

the first ventilation structure comprises a first through hole, a first hollow-out area and a second hollow-out area, wherein the first through hole penetrates through the base material, the first hollow-out area penetrates through the conductive layer, the second hollow-out area penetrates through the protective layer, the first through hole is communicated with the second hollow-out area through the first hollow-out area, and the first through hole is narrow-slit and/or micropore.

Further, on the plane perpendicular to the thickness direction of the first substrate, the projection of the first hollow area is identical to the projection of the second hollow area, and the projection range of the first hollow area is larger than the projection range of the first through hole, or the projection range of the first hollow area is smaller than the projection range of the second hollow area, and the projection of the second hollow area is identical to the projection of the first through hole, or the projections of the first hollow area, the second hollow area and the first through hole are identical.

Further, a third hollow-out area is further arranged on the protective layer, the third hollow-out area and the second hollow-out area are arranged at intervals, and the third hollow-out area surrounds the second hollow-out area.

Further, a third hollow area is further arranged on the protective layer, the third hollow area is connected with the second hollow area, a fourth hollow area is arranged on the protective layer, projection of the second hollow area is in a range surrounded by projection of the fourth hollow area on a plane perpendicular to the thickness direction of the first substrate, and projection of the fourth hollow area is in a range surrounded by projection of the third hollow area.

Further, a third hollow area is further arranged on the protective layer, the third hollow area and the second hollow area are arranged at intervals, a fourth hollow area is arranged on the protective layer, projection of the second hollow area is in a range surrounded by projection of the fourth hollow area on a plane perpendicular to the thickness direction of the first substrate, and projection of the fourth hollow area is in a range surrounded by projection of the third hollow area.

Further, the welding device further comprises a fifth hollowed-out area, the fifth hollowed-out area penetrates through the protective layer to form a first welding area, and projection of the fifth hollowed-out area does not interfere with projection of the third hollowed-out area.

Further, the first substrate comprises a base material, a conductive layer and a protective layer, wherein the base material comprises a first surface and a second surface which are opposite in the thickness direction, the shell is fixedly connected with the first surface, the conductive layer covers the second surface, and the protective layer covers the conductive layer;

the first ventilation structure comprises a first through hole, a first hollow-out area and a second hollow-out area, wherein the first through hole penetrates through the base material, the first hollow-out area penetrates through the conductive layer, the second hollow-out area penetrates through the protective layer, the first through hole is communicated with the second hollow-out area through the first hollow-out area, and the first hollow-out area is the narrow slit and/or the micropore;

and on a plane perpendicular to the thickness direction of the first substrate, the projection of the first through hole covers the projection of the first hollowed-out area.

Further, a sixth hollow area is arranged on the conductive layer at intervals with the first hollow area, the sixth hollow area surrounds the first hollow area, and on a plane perpendicular to the thickness direction of the first substrate, the projection of the first through hole is in a range surrounded by the projection of the second hollow area, and the outer contour of the projection of the sixth hollow area is identical with the outer contour of the projection of the second hollow area.

Further, on a plane perpendicular to the thickness direction of the first substrate, the projection of the first through hole covers the projection of the first hollowed-out area, the projection of the second hollowed-out area is within a range surrounded by the projection of the first through hole, and the projection of the first hollowed-out area is within a range surrounded by the projection of the second hollowed-out area.

Further, the width of the narrow slit is in the range of 0.02 mm-0.06 mm, and the diameter of the micropore is in the range of 0.02 mm-0.06 mm.

Further, the narrow slit is in any one or more of a cross shape, a three-shaped shape, a ring shape and a spiral shape.

Further, the device also comprises a second ventilation structure, one end of the second ventilation structure is connected with the cavity, and the second ventilation structure is arranged on the shell, or the second ventilation structure is arranged at the joint of the first substrate and the shell.

In a second aspect, an electronic cigarette is provided, including a second substrate and a package structure of an electronic cigarette sensing chip as described above, where a first substrate in the package structure is fixedly connected with the second substrate.

In the utility model, the first substrate is provided with the first ventilation structure penetrating through the first substrate in the thickness direction, the first ventilation structure comprises a narrow slit and/or a micropore, the electronic cigarette sensing chip is correspondingly arranged with the first ventilation structure, so that the first sensing surface of the electronic cigarette sensing chip is communicated with one end of the first ventilation structure, the other end of the first ventilation structure is illustratively communicated with the cigarette cavity, and because the first ventilation structure is the narrow slit and/or the micropore, the width is smaller, smoke or condensate in the cigarette cavity is not easy to enter the electronic cigarette sensing chip through the first ventilation structure, thereby avoiding causing malfunction, false triggering and short circuit of the electronic cigarette sensing chip.

Drawings

The technical solution and other advantageous effects of the present utility model will be made apparent by the following detailed description of the specific embodiments of the present utility model with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of a package structure of an electronic cigarette sensing chip according to an embodiment of the utility model;

FIGS. 2A-2D are schematic views of various types of slots according to a first embodiment of the present utility model;

FIG. 2E is a schematic view of a different type of microwell according to the first embodiment of the utility model;

FIG. 2F is a schematic view of a slit and micropore combination according to an embodiment of the present utility model;

FIG. 3A is a first slot and/or via arrangement according to a first embodiment of the present utility model;

FIG. 3B illustrates a second embodiment of the present utility model of slot and/or via arrangement;

FIG. 3C illustrates a third slot and/or via arrangement in accordance with an embodiment of the present utility model;

FIG. 4A is a schematic view of a bonding surface of a first substrate according to a first embodiment of the utility model;

FIG. 4B is a schematic view of a bonding surface of a first substrate according to a second embodiment of the utility model;

FIG. 4C is a schematic view of a bonding surface of a first substrate according to a second embodiment of the utility model;

FIG. 5A is a schematic view of a second ventilation structure disposed on a housing according to a first embodiment of the present utility model;

FIG. 5B is a schematic diagram illustrating a second ventilation structure disposed at a connection portion between the housing and the first substrate according to the first embodiment of the present utility model;

FIG. 5C is a schematic diagram illustrating a connection surface between the first substrate and the housing in the second ventilation structure of FIG. 5B according to an embodiment of the present utility model;

FIG. 6 illustrates a slot and/or via arrangement in accordance with a second embodiment of the present utility model;

fig. 7 illustrates a slot and/or via arrangement in accordance with a third embodiment of the present utility model.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The following describes the package structure of the electronic cigarette sensing chip in the present utility model in detail with reference to the accompanying drawings and detailed description.

Example 1

As shown in fig. 1, this embodiment provides a package structure of an electronic cigarette sensing chip, including: a first substrate 10, a housing 20, and an electronic cigarette sensing chip 30; the shell 20 is fixedly connected with one side of the first substrate 10 and encloses a cavity, and the electronic cigarette sensing chip 30 is positioned in the cavity and is fixedly connected with the first substrate 10;

the first substrate 10 is provided with a first ventilation structure 40 penetrating through the first substrate 10 in the thickness direction, the first ventilation structure 40 comprises narrow slits and/or micropores, and the electronic cigarette sensing chip 30 and the first ventilation structure 40 are correspondingly arranged, so that the first sensing surface of the electronic cigarette sensing chip 30 is communicated with one end of the first ventilation structure 40.

The electronic cigarette sensing chip 30 in this embodiment is a MEMS chip, in the prior art, the first ventilation structure 40 of the MEMS chip in the electronic cigarette is typically a ventilation hole, and the diameter of the ventilation hole is typically greater than 0.15mm, which in this embodiment, the first ventilation structure 40 includes narrow slits and/or micropores, and illustratively, the width of the narrow slits is as follows: the diameter of the micropores is 0.02 mm-0.06 mm and the diameter of the micropores is 0.02 mm-0.06 mm. In this embodiment, the first ventilation structure 40 may include only slits, or only micropores, or may include both slits and micropores, and as shown in fig. 2A, for example, the first ventilation structure 40 includes only slits in a form of three shapes, that is, three slits, where the widths of the three slits may be the same or different, and the lengths of the three slits may be the same or different; as shown in fig. 2B, the first ventilation structure 40 includes only slits in the form of cross shapes, wherein the width of the cross shapes may be the same or different; as shown in fig. 2C, the first ventilation structure 40 includes only a narrow slit, the form of the narrow slit is a ring shape formed by two arcs, and the widths of the two arcs may be the same or different; as shown in fig. 2D, the first ventilation structure 40 includes only a slit in the form of a spiral, and the widths of the spiral slit at different positions may be the same or different; as shown in fig. 2E, the first ventilation structure 40 includes only a plurality of micro holes, and the diameters of the different micro holes may be the same or different, the pitches between the different micro holes may be the same or different, and the plurality of micro holes form an annular area, and of course, the plurality of micro holes may also form a square area or a triangular area, which is not limited in this embodiment; as shown in fig. 2F, the first ventilation structure 40 includes slots and micro-holes, the slots are in the form of a cross, and the plurality of micro-holes are distributed around the slots, and of course, the first ventilation structure 40 may also include three-shaped slots and micro-holes, and the combination of the slots and the micro-holes is not specifically limited in this embodiment.

In this embodiment, the first substrate 10 is provided with the first ventilation structure 40 penetrating the first substrate 10 in the thickness direction, the first ventilation structure 40 includes a narrow slit and/or a micro-hole, and the electronic cigarette sensing chip 30 is disposed corresponding to the first ventilation structure 40, so that the first sensing surface of the electronic cigarette sensing chip 30 is communicated with one end of the first ventilation structure 40, and, for example, the other end of the first ventilation structure 40 is communicated with the cigarette cavity, and because the first ventilation structure 40 is the narrow slit and/or the micro-hole, the width is smaller, smoke or condensate in the cigarette cavity is not easy to enter the electronic cigarette sensing chip 30 through the first ventilation structure 40, thereby avoiding causing malfunction, false triggering and short circuit of the electronic cigarette sensing chip 30, and for example, when the other end of the first ventilation structure 40 is communicated with the external environment, as the first ventilation structure 40 is the narrow slit and/or the micro-hole, the width is smaller, if there is oil leakage in the cigarette cavity, the tobacco oil is not easy to enter the electronic cigarette sensing chip 30 through the first ventilation structure 40, thereby avoiding malfunction, false triggering and short circuit of the electronic cigarette sensing chip 30.

Further, the first substrate 10 includes a substrate 101, a conductive layer 102, and a protective layer 103, where the substrate 101 includes a first surface and a second surface opposite to each other in a thickness direction, the housing 20 is fixedly connected to the first surface, the conductive layer 102 at least partially covers the second surface, and the protective layer 103 covers the conductive layer 102;

the first ventilation structure 40 includes a first through hole 401, a first hollow area 402 and a second hollow area 403, the first through hole 401 penetrates through the substrate 101, the first hollow area 402 penetrates through the conductive layer 102, the second hollow area 403 penetrates through the protective layer 103, the first through hole 401 is communicated with the second hollow area 403 through the first hollow area 402, and the first through hole 401 is a narrow slit and/or a micro hole.

In the present embodiment, the first substrate 10 is a PCB board, the substrate 101 in the first substrate 10 is an insulating substrate 101 in the PCB board, and the first substrate 10 is not limited to 2-6 layers. The conductive layer 102 is a metal layer, and illustratively, the metal layer may be a copper foil layer, the protective layer 103 is for protecting the copper foil layer, and illustratively, the protective layer 103 may be an ink layer.

In this embodiment, the first through hole 401 is a slot and/or a micropore, that is, the slot and/or the micropore is disposed on the substrate 101, so that the structural strength of the slot and/or the micropore is relatively high, the first hollowed-out area 402 on the conductive layer 102 and the second hollowed-out area 403 on the protective layer 103 play a role of avoiding, and the first through hole 401 is completely exposed, thereby avoiding the failure of the electronic cigarette sensing chip 30 caused by blocking the first through hole 401.

Further, on a plane perpendicular to the thickness direction of the first substrate 10, the projection of the first hollowed-out area 402 is identical to the projection of the second hollowed-out area 403, and the projection range of the first hollowed-out area 402 is larger than the projection range of the first through hole 401, or the projection range of the first hollowed-out area 402 is smaller than the projection range of the second hollowed-out area 403, and the projection of the second hollowed-out area 403 is identical to the projection of the first through hole 401, or the projections of the first hollowed-out area 402, the second hollowed-out area 403 and the first through hole 401 are identical.

In this embodiment, the first hollow area 402, the second hollow area 403 and the first through hole 401 are all coaxially arranged, as shown in fig. 3A, the projection of the first hollow area 402 is identical to the projection of the second hollow area 403, and the projection range of the first hollow area 402 is larger than the projection range of the first through hole 401, so that the substrate 101 can be exposed, and the subsequent forming of the narrow slit and/or micro hole is facilitated, as shown in fig. 3B, the projection range of the second form of narrow slit and/or through hole is smaller than the projection range of the second hollow area 403, and the projection of the second hollow area 403 is identical to the projection of the first through hole 401, so that the conductive layer 102 can be exposed, and the lipophilicity of the conductive layer 102 is smaller than the substrate 101, so that the mobility of tobacco tar or condensate is reduced, as shown in fig. 3C, the third form of narrow slit and/or through hole arrangement, and the projection of the first hollow area 402, the second hollow area 403 and the first through hole 401 are identical to the projection of the conductive layer 102, and the conductive layer 102 are all of the same, and the substrate has high strength and the packaging structure is completely protected.

In this embodiment, the narrow slits and micro holes are formed by laser firing and etching.

Further, in this embodiment, a third hollow area 404 is further disposed on the protection layer 103, the third hollow area 404 and the second hollow area 403 are disposed at intervals, and the third hollow area 404 surrounds the second hollow area 403.

As shown in fig. 4A, the narrow slit and the micro-hole are in the arrangement shown in fig. 3B, which is a schematic diagram of the welding surface of the first substrate 10 in the first form, the protective layer 103 is provided with a third hollow area 404, the first hollow area 402, the second hollow area 403 and the first through hole 401 are disposed within a range surrounded by the third hollow area 404, the third hollow area 404 and the second hollow area 403 are coaxially disposed, as shown in fig. 4A, the third hollow area 404 and the second hollow area 403 are all circular, the center positions of the second hollow area 403 and the third hollow area 404 are the same, and the radius of the third hollow area 404 is larger than the radius of the second hollow area 403, the second hollow area 403 and the third hollow area 404 are separated by the protective layer 103, so that the exposed conductive layer 102 of the third hollow area 404 can be used as the second welding area or as a grounding pad to be welded with the terminal circuit board, and the effect of sealing the first ventilation structure 40 can be achieved.

Further, in this embodiment, the protection layer 103 is further provided with a third hollow area 404, the third hollow area 404 is connected with the second hollow area 403, the protection layer 103 is provided with a fourth hollow area 405, and on a plane perpendicular to the thickness direction of the first substrate 10, the projection of the second hollow area 403 is within a range surrounded by the projection of the fourth hollow area 405, and the projection of the fourth hollow area 405 is within a range surrounded by the projection of the third hollow area 404.

As shown in fig. 4B, the narrow slits and the micro holes are schematic diagrams of the soldering surface of the first substrate 10 in the second form in the manner shown in fig. 3B, the protective layer 103 is provided with a third hollow area 404, the third hollow area 404 is connected with the second hollow area 403, so that the protective layer 103 is removed in a range surrounded by the outermost contour of the third hollow area 404, and the conductive layer 102 exposed by the third hollow area 404 is used as a second soldering area or as a grounding pad to be soldered with the terminal circuit board, and can also play a role in sealing the first ventilation structure 40; and, be provided with fourth fretwork area 405 on the protective layer 103 thereby expose substrate 101, be favorable to the solderability of product, avoid scaling powder class material to flow to micropore or narrow slit. The third hollow area 404 and the fourth hollow area 405 are coaxially arranged with the second hollow area 403, as shown in fig. 4B, the second hollow area 403, the third hollow area 404 and the fourth hollow area 405 are all circular, the radius corresponding to the third hollow area 404 is larger than the radius corresponding to the fourth hollow area 405, and the radius corresponding to the fourth hollow area 405 is larger than the radius corresponding to the second hollow area 403.

Further, in this embodiment, the protection layer 103 is further provided with a third hollow area 404, the third hollow area 404 and the second hollow area 403 are disposed at intervals, the protection layer 103 is provided with a fourth hollow area 405, and on a plane perpendicular to the thickness direction of the first substrate 10, the projection of the second hollow area 403 is within a range surrounded by the projection of the fourth hollow area 405, and the projection of the fourth hollow area 405 is within a range surrounded by the projection of the third hollow area 404.

As shown in fig. 4C, the narrow slits and the micro holes are shown in fig. 3B, which is a schematic diagram of the soldering surface of the first substrate 10 in the third form, the protective layer 103 is provided with a fourth hollowed-out area 405, and the conductive layer 102 exposed by the third hollowed-out area 404 is used as a second soldering area or as a grounding pad to be soldered with the terminal circuit board, and can also play a role in sealing the first ventilation structure 40; unlike fig. 4B, the third hollow area 404 is spaced from the second hollow area 403 and is separated by the protective layer 103, and the protective layer 103 is further spaced apart from the fourth hollow area 405 between the second welding area and the micro-hole or slit, so as to further prevent the flux material from flowing into the micro-hole or slit.

Further, in this embodiment, the fifth hollowed-out area 406 is further included, and the fifth hollowed-out area 406 penetrates through the protection layer 103 to form the first welding area, and the projection of the fifth hollowed-out area 406 does not interfere with the projection of the third hollowed-out area 404.

Specifically, the shape of the fifth hollowed-out area 406 may be circular, or may be square, triangle, or other shapes, and the number of the fifth hollowed-out areas 406 may be one or more, which is not limited in this embodiment, except that the fifth hollowed-out area 406 is not within the range enclosed by the peripheral outline of the third hollowed-out area 404.

Further, the device further comprises a second ventilation structure 50, wherein one end of the second ventilation structure 50 is connected with the cavity, and the second ventilation structure 50 is arranged on the housing 20, or the second ventilation structure 50 is arranged on the first substrate 10 at the connection part with the housing 20.

Specifically, as shown in fig. 5A, the second ventilation structure 50 is disposed on the housing; as shown in fig. 5B and fig. 5C, the second ventilation structure 50 is disposed at the connection between the first substrate 10 and the housing 20, and after the first substrate 10 and the housing 20 are welded, a certain level difference exists at the connection due to the solder paste, so that a certain gap may be formed by not disposing a solder paste at a part of the connection between the first substrate 10 and the housing 20, and thus the second ventilation structure 50 may be formed, or the copper foil layer and the ink layer near the surface of the housing 20 on the first substrate 101 may be etched, or only the ink layer may be etched, and the etched level and the level due to the solder paste may together form the second ventilation structure 50.

Specifically, one end of the second ventilation structure 50 is connected with the cavity, the other end of the second ventilation structure can be communicated with the external environment, and also can be communicated with the smoke cavity, so that condensate can be prevented from entering the cavity of the packaging structure as much as possible when the second ventilation structure is connected with the smoke cavity, and tobacco tar can be prevented from entering the cavity of the packaging structure as much as possible when the second ventilation structure is communicated with the external environment.

Example two

Unlike the first embodiment, as shown in fig. 6, in the present embodiment, the first substrate 10 includes a substrate 101, a conductive layer 102, and a protective layer 103, the substrate 101 includes a first surface and a second surface opposite to each other in a thickness direction, the housing 20 is fixedly connected to the first surface, the conductive layer 102 covers the second surface, and the protective layer 103 covers the conductive layer 102;

the first ventilation structure 40 includes a first through hole 401, a first hollow area 402 and a second hollow area 403, the first through hole 401 penetrates through the substrate 101, the first hollow area 402 penetrates through the conductive layer 102, the second hollow area 403 penetrates through the protective layer 103, the first through hole 401 is communicated with the second hollow area 403 through the first hollow area 402, and the first hollow area 402 is a narrow slit and/or a micro-hole;

on a plane perpendicular to the thickness direction of the first substrate 10, the projection of the first through hole 401 covers the projection of the first hollowed-out area 402.

In the first embodiment, the slits and/or micro-holes are the first through holes 401, and in the present embodiment, the first hollowed-out area 402 is the slits and/or micro-holes, that is, the slits and/or micro-holes are disposed on the conductive layer 102, so that the slits and/or micro-holes are convenient to manufacture.

Further, a sixth hollowed-out area 407 is disposed on the conductive layer 102 and spaced from the first hollowed-out area 402, the sixth hollowed-out area 407 surrounds the first hollowed-out area 402, and on a plane perpendicular to the thickness direction of the first substrate 10, the projection of the first through hole 401 is within a range surrounded by the projection of the second hollowed-out area 403, and the outer contour of the projection of the sixth hollowed-out area 407 is the same as the outer contour of the projection of the second hollowed-out area 403.

In this embodiment, the second hollow area 403 on the protective layer 103 forms a narrow slit and/or micropore avoiding area, the second hollow area 403 and the sixth hollow area 407 expose the substrate 101, and the conductive layer 102 exposed by the third hollow area 404 is used as a second welding area or a grounding pad to be welded with the terminal circuit board, and meanwhile, the effect of sealing the first ventilation structure 40 can be achieved; the sixth hollow area 407 is used as a second welding area, which is favorable for welding the product, and prevents the flux material from flowing into the micropores or the narrow slits, and further the first hollow area 402, the sixth hollow area 407 and the second hollow area 403 are coaxially arranged.

Example III

As shown in fig. 6, unlike the second embodiment, in the present embodiment, the first substrate 10 includes a base material 101, a conductive layer 102, and a protective layer 103, the base material 101 includes a first surface and a second surface opposite to each other in the thickness direction, the housing 20 is fixedly connected to the first surface, the conductive layer 102 covers the second surface, and the protective layer 103 covers the conductive layer 102;

on a plane perpendicular to the thickness direction of the first substrate 10, the projection of the first through hole 401 covers the projection of the first hollowed-out area 402, the projection of the second hollowed-out area 403 is within a range surrounded by the projection of the first through hole 401, and the projection of the first hollowed-out area 402 is within a range surrounded by the projection of the second hollowed-out area 403.

In this embodiment, the second hollowed-out area 403 on the protective layer 103 forms a narrow slit and/or micropore avoiding area, and the projection of the first through hole 401 covers the projection of the first hollowed-out area 402, the projection of the second hollowed-out area 403 is within the range surrounded by the projection of the first through hole 401, and the projection of the first hollowed-out area 402 is within the range surrounded by the projection of the second hollowed-out area 403, so that the stability of the narrow slit and/or micropore structure on the conductive layer 102 is improved. The conductive layer 102 exposed by the third hollowed-out area 404 is used as a second welding area or used as a grounding pad to be welded with the terminal circuit board, and meanwhile, the effect of sealing the first ventilation structure 40 can be achieved.

Example IV

The present embodiment provides an electronic cigarette, including a second substrate and a package structure of an electronic cigarette sensing chip of any one of the first embodiment, the second embodiment and the third embodiment, where a first substrate 10 in the package structure is fixedly connected with the second substrate.

It will be appreciated that the various numerical numbers referred to in the embodiments of the present utility model are merely for ease of description and are not intended to limit the scope of the embodiments of the present utility model. The sequence number of each process does not mean the sequence of the execution sequence, and the execution sequence of each process should be determined according to the function and the internal logic.

The foregoing has outlined some of the more detailed description of the embodiments of the present utility model, wherein specific examples are provided herein to illustrate the principles and embodiments of the present utility model, and the above examples are provided to assist in the understanding of the method and core ideas of the present utility model; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present utility model, the present description should not be construed as limiting the present utility model in view of the above.

Claims

1. Packaging structure of electron cigarette sensing chip, its characterized in that includes: a first substrate (10), a housing (20), and an electronic smoke sensing chip (30); the shell (20) is fixedly connected with one side of the first substrate (10) and encloses a cavity, and the electronic cigarette sensing chip (30) is positioned in the cavity and is fixedly connected with the first substrate (10);

a first ventilation structure (40) penetrating through the first substrate (10) in the thickness direction is formed on the first substrate (10), the first ventilation structure (40) comprises narrow slits and/or micropores, and the electronic cigarette sensing chip (30) is correspondingly arranged with the first ventilation structure (40) so that the first sensing surface of the electronic cigarette sensing chip (30) is communicated with one end of the first ventilation structure (40);

wherein the width of the narrow slit is in the range of 0.02 mm-0.06 mm, and the diameter of the micropore is in the range of 0.02 mm-0.06 mm.

2. The package structure according to claim 1, wherein the first substrate (10) includes a base material (101), a conductive layer (102) and a protective layer (103), the base material (101) includes a first surface and a second surface opposite to each other in a thickness direction, the housing (20) is fixedly connected to the first surface, the conductive layer (102) at least partially covers the second surface, and the protective layer (103) covers the conductive layer (102);

the first ventilation structure (40) comprises a first through hole (401), a first hollow-out area (402) and a second hollow-out area (403), the first through hole (401) penetrates through the base material (101), the first hollow-out area (402) penetrates through the conductive layer (102), the second hollow-out area (403) penetrates through the protective layer (103), the first through hole (401) is communicated with the second hollow-out area (403) through the first hollow-out area (402), and the first through hole (401) is narrow slits and/or micropores.

3. The package structure according to claim 2, wherein, on a plane perpendicular to the thickness direction of the first substrate (10), the projection of the first hollowed-out area (402) is identical to the projection of the second hollowed-out area (403), and the projection range of the first hollowed-out area (402) is larger than the projection range of the first through hole (401), or the projection range of the first hollowed-out area (402) is smaller than the projection range of the second hollowed-out area (403), and the projection of the second hollowed-out area (403) is identical to the projection of the first through hole (401), or the projections of the first hollowed-out area (402), the second hollowed-out area (403) and the first through hole (401) are identical.

4. A package structure according to claim 3, wherein a third hollow area (404) is further disposed on the protective layer (103), the third hollow area (404) and the second hollow area (403) are disposed at intervals, and the third hollow area (404) surrounds the second hollow area (403).

5. A package structure according to claim 3, wherein a third hollow area (404) is further provided on the protective layer (103), the third hollow area (404) is connected with the second hollow area (403), a fourth hollow area (405) is provided on the protective layer (103), on a plane perpendicular to the thickness direction of the first substrate (10), the projection of the second hollow area (403) is within a range surrounded by the projection of the fourth hollow area (405), and the projection of the fourth hollow area (405) is within a range surrounded by the projection of the third hollow area (404).

6. A packaging structure as claimed in claim 3, characterized in that a third hollow area (404) is further provided on the protective layer (103), the third hollow area (404) and the second hollow area (403) are arranged at intervals, a fourth hollow area (405) is provided on the protective layer (103), on a plane perpendicular to the thickness direction of the first substrate (10), the projection of the second hollow area (403) is within a range surrounded by the projection of the fourth hollow area (405), and the projection of the fourth hollow area (405) is within a range surrounded by the projection of the third hollow area (404).

7. The package structure according to any one of claims 4 to 5, further comprising a fifth hollowed-out area (406), wherein the fifth hollowed-out area (406) penetrates through the protective layer (103) to form a first welding area, and a projection of the fifth hollowed-out area (406) does not interfere with a projection of the third hollowed-out area (404).

8. The package structure according to claim 1, wherein the first substrate (10) includes a base material (101), a conductive layer (102), and a protective layer (103), the base material (101) includes a first surface and a second surface opposite to each other in a thickness direction, the housing (20) is fixedly connected to the first surface, the conductive layer (102) covers the second surface, and the protective layer (103) covers the conductive layer (102);

the first ventilation structure (40) comprises a first through hole (401), a first hollow-out area (402) and a second hollow-out area (403), the first through hole (401) penetrates through the base material (101), the first hollow-out area (402) penetrates through the conductive layer (102), the second hollow-out area (403) penetrates through the protective layer (103), the first through hole (401) is communicated with the second hollow-out area (403) through the first hollow-out area (402), and the first hollow-out area (402) is the narrow slit and/or the micropore;

on a plane perpendicular to the thickness direction of the first substrate (10), the projection of the first through hole (401) covers the projection of the first hollowed-out area (402).

9. The package structure according to claim 8, wherein a sixth hollowed-out area (407) is disposed on the conductive layer (102) and spaced from the first hollowed-out area (402), the sixth hollowed-out area (407) surrounds the first hollowed-out area (402), and on a plane perpendicular to the thickness direction of the first substrate (10), the projection of the first through hole (401) is within a range surrounded by the projection of the second hollowed-out area (403), and the outer contour of the projection of the sixth hollowed-out area (407) is the same as the outer contour of the projection of the second hollowed-out area (403).

10. The package structure according to claim 8, wherein the projection of the first through hole (401) covers the projection of the first hollowed-out area (402) on a plane perpendicular to the thickness direction of the first substrate (10), the projection of the second hollowed-out area (403) is within a range surrounded by the projection of the first through hole (401), and the projection of the first hollowed-out area (402) is within a range surrounded by the projection of the second hollowed-out area (403).

11. The package structure of claim 1, wherein the slot has any one or more of a cross shape, a tri-shape, a ring shape, and a spiral shape.

12. The packaging structure according to claim 1, further comprising a second venting structure (50), wherein one end of the second venting structure (50) is connected to the cavity, and the second venting structure (50) is disposed on the housing (20) or the second venting structure (50) is disposed on the first substrate (10) at a connection with the housing (20).

13. An electronic cigarette, characterized by comprising a second substrate and a packaging structure of the electronic cigarette sensing chip according to any one of claims 1 to 12, wherein a first substrate (10) in the packaging structure is fixedly connected with the second substrate.