CN218888710U - Microphone structure and electronic equipment - Google Patents
Microphone structure and electronic equipment Download PDFInfo
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- CN218888710U CN218888710U CN202221245603.4U CN202221245603U CN218888710U CN 218888710 U CN218888710 U CN 218888710U CN 202221245603 U CN202221245603 U CN 202221245603U CN 218888710 U CN218888710 U CN 218888710U
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Abstract
The utility model relates to a microphone structure and electronic equipment, wherein the microphone structure includes the basement, the circuit module, and the sound wave sensing encapsulation subassembly, the basement has relative first surface and second surface, the circuit module and the sound wave sensing encapsulation subassembly all set up on the first surface of basement; the input end of the circuit module is connected with the power supply voltage end of the sound wave sensing packaging assembly, the output end of the circuit module is connected with the signal output end of the sound wave sensing packaging assembly, a first pad electrically connected with the power supply voltage end is arranged on the second surface of the substrate, and a second pad electrically connected with the grounding end of the sound wave sensing packaging assembly is arranged on the second surface of the substrate, so that the welding electrodes of the microphone structure are changed into two from three, and the application range of the microphone is expanded.
Description
Technical Field
The utility model relates to a microphone technical field especially relates to a microphone structure and electronic equipment.
Background
The MEMS is a Micro-Electro-Mechanical System (Micro Electro Mechanical System) in English, and a Micro Electro Mechanical System (MEMS) in Chinese refers to a high-tech device with the size of several millimeters or less, the internal structure of the device is generally in the micrometer or nanometer level, and the device is an independent intelligent System. MEMS technology has been widely used in the fields of electronics, medicine, industry, automotive, aerospace systems, etc., because of its advantages of miniaturization, intelligence, high integration, and mass production.
In electronic products, a MEMS microphone generally has a VDD pole, an OUT pole and a GND pole, and therefore, the mounting environment and the application environment of the MEMS microphone need to be respectively corresponding to the VDD pole, the OUT pole and the GND pole, which results in higher mounting requirements and application environment requirements of the MEMS microphone, and greatly limits the application range of the MEMS microphone.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a microphone structure and electronic equipment, the input through with circuit module is connected with the supply voltage end of sound wave sensing encapsulation subassembly in this structure, connect circuit module's output and the signal output part of sound wave sensing encapsulation subassembly in parallel to make the supply voltage end of microphone structure can provide the power to sound wave sensing encapsulation subassembly, also can realize the output of signal, thereby make welding electrode become two by the three, thereby enlarged the range of application of microphone, concrete scheme is as follows:
in a first aspect, a microphone structure (100) is provided, the structure comprising a substrate (101), a circuit module, and an acoustic wave sensing package (104), the substrate (101) having opposing first (1011) and second (1012) surfaces, the circuit module and the acoustic wave sensing package (104) each being disposed on the first surface (1011) of the substrate (101);
wherein, the input of circuit module with the supply voltage end connection of sound wave sensing encapsulation subassembly (104), the output of circuit module with the signal output part of sound wave sensing encapsulation subassembly (104) is connected, and base (101) be provided with on second surface (1012) with first pad (105) that the supply voltage end electricity is connected, and with second pad (106) that the earthing terminal electricity of sound wave sensing encapsulation subassembly (104) is connected.
Further, the circuit module comprises a capacitor (102) and a resistor (103) which are connected in parallel, and input ends of the capacitor (102) and the resistor (103) are both connected with the power supply voltage end of the acoustic wave sensing package assembly (104), and output ends of the capacitor (102) and the resistor (103) are both connected with the signal output end of the acoustic wave sensing package assembly (104).
Further, the capacitor (102) is a patch capacitor, and the resistor (103) is a patch resistor;
the first surface (1011) having a first patch region (10111) for resistive connection with the patch, a second patch region (10112) for capacitive connection with the patch, and a third patch region (10113) for connection with the acoustic wave sensing package (104);
wherein the third patch region (10113) is located between the first patch region (10111) and the second patch region (10112).
Further, the structure also comprises a shell (107), wherein the shell (107) is fixedly connected with the substrate (101) to form a cavity;
the acoustic wave sensing package assembly (104), the capacitor (102), and the resistor (103) are all located within the cavity.
Further, a third pad (108) electrically connected with the housing (107) and used for grounding the housing (107) is also arranged on the second surface (1012).
Further, the structure further comprises a support (109) located within the cavity;
one end of the support (109) abuts the first surface (1011) and the other end abuts an inner surface of the housing (107) relative to the base (101).
Further, the acoustic wave sensing package assembly (104) comprises a substrate (110), a housing (111), a MEMS acoustic-electric conversion component (112), and a signal processing component (113), wherein the substrate (110) is connected with the first surface (1011), the housing (111) is fixedly connected with the substrate (110) to form a cavity, the MEMS acoustic-electric conversion component (112) and the signal processing component (113) are located in the cavity, the MEMS acoustic-electric conversion component (112) is electrically connected with the signal processing component (113) through a first conductive path, and the signal processing component (113) is electrically connected with the substrate (110) through a second conductive path;
wherein the shell (111) is provided with a sound hole (114) penetrating through the shell (111) so as to enable the cavity to be communicated with the cavity, and the projection of the sound wave sensing area of the MEMS sound-electricity conversion component (112) and the projection of the sound hole (114) do not overlap on a plane perpendicular to the axis of the sound hole (114).
Furthermore, a through hole (117) staggered with the sound hole (114) is further formed in the shell (107), and the through hole (117) penetrates through the shell (107) to enable the cavity to be communicated with the external environment.
Further, the substrate (101) is a circular substrate (101), and the support (109) is a ring-shaped structure, and the acoustic wave sensing package assembly (104), the capacitor (102), and the resistor (103) are located in a circular area surrounded by the ring-shaped structure.
Further, the housing (107) is cylindrical, and the housing (107) has a bent structure (1071) connected to the third land (108), and the third land (108) is annular.
Furthermore, the shell (107) and the shell (111) are both made of metal.
Further, the power supply voltage end is connected with an external resistor, and the resistance value of the resistor is at least 3 times of that of the external resistor.
In a second aspect, an electronic device is provided, comprising a microphone structure as described above.
The utility model provides an among the microphone structure, through being connected the input of circuit module with the supply voltage end of sound wave sensing encapsulation subassembly in this structure, output and the sound wave sensing encapsulation subassembly of circuit module and signal output part are parallelly connected, thereby make when the microphone structure with external circuit connection after, sound wave sensing encapsulation subassembly and circuit module constitute parallel circuit, after current signal flowed in the microphone structure from first pad, carry to the supply voltage end from sound wave sensing encapsulation subassembly and the input of circuit module, therefore, through sound wave sensing encapsulation subassembly, circuit module's current signal all can transmit to the earthing terminal of sound wave sensing encapsulation subassembly, when signal output, transmit to first pad through current signal through the signal output part of sound wave sensing encapsulation subassembly and circuit module's output, from this to the welding electrode of sound wave sensing encapsulation subassembly by original supply voltage pad in the microphone structure, output pad and ground pad have become the first pad of being connected with supply voltage end, the second pad of being connected with the earthing terminal, welding electrode's quantity has been reduced, thereby microphone structure's installation scope and range of application have been enlarged.
Drawings
The technical solution and other advantages of the present invention will be apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a perspective view of a microphone structure in an embodiment of the invention;
FIG. 2 is a schematic view of a bonding line of a substrate according to an embodiment of the present invention;
fig. 3 is a circuit diagram of a microphone structure according to an embodiment of the present invention;
fig. 4 is a schematic view of a base patch surface in an embodiment of the invention;
fig. 5 is a cross-sectional view of the microphone structure in the embodiment of the present invention taken along plane B-B.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts all belong to the protection scope of the present invention.
The utility model provides a microphone structure and electronic equipment, the structure includes a substrate, a chip capacitor, a chip resistor and a sound wave sensing packaging assembly, the substrate has a first surface and a second surface which are opposite, the chip capacitor, the chip resistor and the sound wave sensing packaging assembly are all arranged on the first surface of the substrate, wherein, the chip capacitor and the chip resistor are connected in parallel with a supply voltage end and an output end of the sound wave sensing packaging assembly, and a first bonding pad connected with the supply voltage end and a second bonding pad connected with a grounding end of the sound wave sensing packaging assembly are arranged on the second surface of the substrate, in the microphone structure of the utility model, by connecting an input end of a circuit module with the supply voltage end sensed by the sound wave packaging assembly in the structure, an output end of the circuit module is connected in parallel with the signal output end and the sound wave sensing packaging assembly, so that when the microphone structure is connected with an external circuit, the sound wave sensing packaging assembly and the circuit module form a parallel circuit, current signals flow into the microphone structure from the first bonding pad and are transmitted to the power supply voltage end of the sound wave sensing packaging assembly and the input end of the circuit module, therefore, the current signals of the circuit module are transmitted to the grounding end of the sound wave sensing packaging assembly through the sound wave sensing packaging assembly, and when the signals are output, the current signals are transmitted to the first bonding pad through the signal output end of the sound wave sensing packaging assembly and the output end of the circuit module, therefore, the welding electrodes of the sound wave sensing packaging assembly in the microphone structure are changed into a first bonding pad connected with the power supply voltage end, a second bonding pad connected with the grounding end from the original power supply voltage bonding pad, an output end bonding pad and a grounding bonding pad, the number of welding electrodes is reduced, and thus the installation range and the application range of the microphone structure are expanded.
The microphone structure of the present invention will be described in detail with reference to the following embodiments and accompanying drawings.
As shown in fig. 1 and fig. 2, a microphone structure 100 includes a substrate 101, a circuit module, and an acoustic wave sensing package 104, the substrate 101 has a first surface 1011 and a second surface 1012 opposite to each other, and the circuit module and the acoustic wave sensing package 104 are disposed on the first surface 1011 of the substrate 101;
the input terminal of the circuit module is connected to the power supply voltage terminal of the acoustic wave sensing package 104, the output terminal of the circuit module is connected to the signal output terminal of the acoustic wave sensing package 104, and the second surface 1012 of the substrate 101 is provided with a first pad 105 electrically connected to the power supply voltage terminal and a second pad 106 electrically connected to the ground terminal of the acoustic wave sensing package 104.
Further, the circuit module includes a capacitor 102 and a resistor 103 connected in parallel, and input terminals of the capacitor 102 and the resistor 103 are connected to the supply voltage terminal of the acoustic wave sensing package 104, and output terminals of the capacitor 102 and the resistor 103 are connected to the signal output terminal of the acoustic wave sensing package 104.
In fig. 3, the resistor R is an external resistor, the resistance of the external resistor is usually 2.2K Ω, and the capacitor 102 and the resistor 103 are connected in parallel with the acoustic wave sensing package 104, so that when the microphone structure 100 is connected to an external circuit, the acoustic wave sensing package 104, the capacitor 102 and the resistor 103 form a parallel circuit, and a current signal flows into the microphone structure from the first pad 105 and then is transmitted to the supply voltage terminal VDD of the acoustic wave sensing package 104 and the input of the circuit module, so that the current signal of the circuit module is transmitted to the ground terminal of the acoustic wave sensing package 104 through the acoustic wave sensing package 104, and when the signal is output, the current signal is transmitted to the first pad 105 through the signal output terminal OUT of the acoustic wave sensing package 104 and the output terminal of the circuit module, thereby the number of the welding electrodes for the acoustic wave sensing package 104 in the microphone structure is changed from the original supply voltage pad, the output terminal pad and the ground pad to the first pad 105 connected to the supply voltage terminal, and the second pad 106 connected to the ground terminal, and the number of the welding electrodes is reduced, thereby expanding the installation range and the application range of the microphone structure.
Further, the capacitor 102 is a chip capacitor, and the resistor 103 is a chip resistor;
the first surface 1011 has a first patch area 10111 for connection with a patch resistor, a second patch area 10112 for connection with a patch capacitor, and a third patch area 10113 for connection with the acoustic wave sensing package 104;
wherein the third tile region 10113 is located between the first tile region 10111 and the second tile region 10112.
As shown in fig. 4, the first chip region 10111, the second chip region 10112 and the third chip region 10113 are discontinuous regions, the first chip region 10111 and the second chip region 10112 have two corresponding chip sub-regions respectively for attaching two ends of the chip resistor and the chip capacitor, and the third chip region 10113 has four chip sub-regions respectively for attaching four corners of the acoustic wave sensing package 104.
Further, the microphone structure 100 further includes a housing 107, wherein the housing 107 is fixedly connected to the substrate 101 to form a cavity;
the acoustic wave sensing package assembly 104, the capacitor 102, and the resistor 103 are all located within the cavity.
As shown in fig. 5, the acoustic wave sensing package 104, the capacitor 102, and the resistor 103 are protected by the housing 107 from external force and dust.
Further, a third pad 108 electrically connected to the housing 107 and used for grounding the housing 107 is also provided on the second surface 1012.
Further, the microphone structure 100 further comprises a support 109 located within the cavity;
one end of the support 109 abuts the first surface 1011 and the other end abuts the inner surface of the housing 107 relative to the base 101.
In the present embodiment, the support 109 keeps the housing 107 away from the acoustic wave sensing package 104, the capacitor 102, and the resistor 103 inside the cavity, so as to prevent the housing 107 from contacting the acoustic wave sensing package 104, the capacitor 102, and the resistor 103.
Further, the acoustic wave sensing package assembly 104 includes a substrate 110, a housing 111, a MEMS acoustic-electric conversion component 112, and a signal processing component 113, the substrate 110 is connected to the first surface 1011, the housing 111 is fixedly connected to the substrate 110 to form a cavity, the MEMS acoustic-electric conversion component 112 and the signal processing component 113 are located in the cavity, the MEMS acoustic-electric conversion component 112 is electrically connected to the signal processing component 113 through a first conductive path, and the signal processing component 113 is electrically connected to the substrate 110 through a second conductive path;
wherein, the housing 111 is provided with an acoustic hole 114 penetrating through the housing 111 to communicate the cavity with the cavity, and on a plane perpendicular to an axis of the acoustic hole 114, a projection of an acoustic wave sensing area of the MEMS acoustic-electric conversion member 112 does not overlap with a projection of the acoustic hole 114.
In the present embodiment, as shown in fig. 5, the first conductive path includes a first conductive line 115 that electrically connects the MEMS acoustic-electric conversion part 112 and the signal processing part 113, the second conductive path includes a second conductive line 116 that electrically connects the signal processing part 113 and the substrate 110, and the first conductive line 115 and the second conductive line 116 may be all gold wires. The housing 111 is provided with an acoustic hole 114 penetrating through the housing 111 to communicate the cavity with the cavity, so that the air pressure of the cavity and the air pressure of the cavity are kept consistent, and the MEMS acoustic-electric conversion component 112 is prevented from being damaged due to pressure difference in the measurement process. On a plane perpendicular to the axis of the acoustic hole 114, the projection of the acoustic wave sensing area of the MEMS acousto-electric conversion member 112 does not overlap with the projection of the acoustic hole 114, thereby achieving the effect of dust prevention.
Furthermore, the housing 107 is further provided with a through hole 117 which is staggered with the position of the sound hole 114, and the through hole 117 penetrates through the housing 107 to enable the cavity to be communicated with the external environment.
In the embodiment, as shown in fig. 5, the sound hole 114 is staggered from the through hole 117, so that the anti-blowing performance is improved, and the reliability of the microphone structure is improved, and the cavity, the cavity and the external atmospheric pressure are kept consistent through the sound hole 114 and the through hole 117, so that the structural damage caused by the pressure difference is avoided.
Further, the substrate 101 is a circular substrate, and the support 109 is a ring-shaped structure, and the acoustic wave sensing package assembly 104, the capacitor 102, and the resistor 103 are located in a circular area enclosed by the ring-shaped structure.
Further, the housing 107 has a cylindrical shape, and the housing 107 has a bent structure 1071 connected to the third land 108, and the third land 108 has a circular ring shape.
In the present embodiment, as shown in fig. 1, the housing 107 is cylindrical, and the substrate 101 is a circular substrate, so that the mechanical reliability is further improved, and in order to weld the housing to the substrate 101, the housing 107 has a bending structure 1071 bent toward the central axis of the substrate 101.
Furthermore, the housing 107 and the casing 111 are made of metal materials, so that the frequency interference resistance of the MEMS microphone is improved.
In this embodiment, the acoustic wave sensing package assembly may be a MEMS microphone, so that the bonding electrode of the MEMS microphone is changed from the original supply voltage pad, the output terminal pad and the ground pad to the first pad connected to the supply voltage terminal and the second pad connected to the ground terminal, thereby reducing the number of electrode pads, and expanding the installation range and application range of the MEMS microphone. The acoustic-electric conversion part may be a mesh chip, the signal processing part may be an ASIC (Application Specific Integrated Circuit) chip, and the substrate and the base may be a PCB board.
Further, as shown in fig. 3, the supply voltage terminal VDD is connected to the external resistor R, wherein the resistance of the resistor 103 is at least 3 times of the resistance of the external resistor R, so that when the external power supplies power to the microphone structure, the normal operation of the microphone structure is not affected even when the power supply voltage fluctuates, and the electronic device has a certain adaptability to withstand voltage fluctuation.
The invention also provides an electronic device comprising a microphone arrangement 100 as described above.
It is to be understood that the various numerical references mentioned in the embodiments of the present invention are merely for convenience of description and are not intended to limit the scope of the embodiments of the present invention. The sequence numbers of the above processes do not mean the execution sequence, and the execution sequence of the processes should be determined by the functions and the inherent logic.
The pressure sensor module provided by the embodiment of the present invention is described in detail above, and the principle and the implementation of the present invention are explained herein by applying a specific example, and the description of the above embodiment is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (13)
1. A microphone structure (100) comprising a substrate (101), a circuit module, and an acoustic wave sensing package (104), the substrate (101) having opposing first (1011) and second (1012) surfaces, the circuit module and the acoustic wave sensing package (104) both being disposed on the first surface (1011) of the substrate (101);
wherein, the input of circuit module with the supply voltage end connection of sound wave sensing encapsulation subassembly (104), the output of circuit module with the signal output part of sound wave sensing encapsulation subassembly (104) is connected, and base (101) be provided with on second surface (1012) with first pad (105) that the supply voltage end electricity is connected, and with second pad (106) that the earthing terminal electricity of sound wave sensing encapsulation subassembly (104) is connected.
2. The microphone structure of claim 1, wherein the circuit module comprises a capacitor (102) and a resistor (103) connected in parallel, and wherein an input of the capacitor (102) and an input of the resistor (103) are both connected to the supply voltage terminal of the acoustic wave sensing package (104), and an output of the capacitor (102) and the resistor (103) are both connected to the signal output terminal of the acoustic wave sensing package (104).
3. Microphone structure according to claim 2, characterized in that the capacitor (102) is a patch capacitor and the resistor (103) is a patch resistor;
the first surface (1011) having a first patch region (10111) for resistive connection with the patch, a second patch region (10112) for capacitive connection with the patch, and a third patch region (10113) for connection with the acoustic wave sensing package (104);
wherein the third patch region (10113) is located between the first patch region (10111) and the second patch region (10112).
4. A microphone structure according to claim 2, characterized in that the structure further comprises a housing (107), the housing (107) being fixedly connected to the substrate (101) to form a cavity;
the acoustic wave sensing package assembly (104), the capacitor (102), and the resistor (103) are all located within the cavity.
5. Microphone structure according to claim 4, characterized in that the second surface (1012) is further provided with a third pad (108) electrically connected to the housing (107) and for grounding the housing (107).
6. The microphone structure of claim 4, wherein the structure further comprises a support (109) located within the cavity;
the support (109) has one end abutting the first surface (1011) and the other end abutting an inner surface of the housing (107) relative to the base (101).
7. The microphone structure according to any of claims 4-6, wherein the acoustic wave sensing package assembly (104) comprises a substrate (110), a housing (111), a MEMS acousto-electric conversion component (112), and a signal processing component (113), the substrate (110) is connected with the first surface (1011), the housing (111) is fixedly connected with the substrate (110) to form a cavity, the MEMS acousto-electric conversion component (112), and the signal processing component (113) are located in the cavity, and the MEMS acousto-electric conversion component (112) is electrically connected with the signal processing component (113) through a first conductive path, and the signal processing component (113) is electrically connected with the substrate (110) through a second conductive path;
wherein the shell (111) is provided with a sound hole (114) penetrating through the shell (111) so as to enable the cavity to be communicated with the cavity, and the projection of the sound wave sensing area of the MEMS sound-electricity conversion component (112) and the projection of the sound hole (114) do not overlap on a plane perpendicular to the axis of the sound hole (114).
8. Microphone structure according to claim 7, characterized in that the housing (107) is further provided with a through hole (117) offset from the position of the sound hole (114), the through hole (117) penetrating the housing (107) to connect the cavity to the external environment.
9. The microphone structure according to claim 6, characterized in that the substrate (101) is a circular substrate (101) and the support (109) is a ring-shaped structure, the acoustic wave sensing package (104), the capacitance (102) and the resistance (103) being located within a circular area enclosed by the ring-shaped structure.
10. Microphone structure according to claim 5, characterized in that the housing (107) is cylindrical and that the housing (107) has a meander structure (1071) connected to the third pad (108) and that the third pad (108) is ring-shaped.
11. Microphone structure according to claim 7, characterized by the fact that the shell (107) and the housing (111) are both made of metal.
12. A microphone structure according to claim 2, characterized in that the supply voltage terminal is connected to an external resistor, the resistance of which is at least 3 times the resistance of the external resistor.
13. An electronic device, characterized in that it comprises a microphone arrangement according to any of claims 1-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221245603.4U CN218888710U (en) | 2022-05-23 | 2022-05-23 | Microphone structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221245603.4U CN218888710U (en) | 2022-05-23 | 2022-05-23 | Microphone structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218888710U true CN218888710U (en) | 2023-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221245603.4U Active CN218888710U (en) | 2022-05-23 | 2022-05-23 | Microphone structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218888710U (en) |
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- 2022-05-23 CN CN202221245603.4U patent/CN218888710U/en active Active
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