CN209806262U - sensor, sensor base body, and electronic device - Google Patents
sensor, sensor base body, and electronic device Download PDFInfo
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- CN209806262U CN209806262U CN201921966676.0U CN201921966676U CN209806262U CN 209806262 U CN209806262 U CN 209806262U CN 201921966676 U CN201921966676 U CN 201921966676U CN 209806262 U CN209806262 U CN 209806262U
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Abstract
The utility model discloses a sensor, sensor parent and electronic equipment, wherein, the sensor includes: a housing with one end open; the circuit board is arranged at the opening of the shell; the circuit board is provided with a first electric connection position outside the shell; the sensor chip is arranged in the shell; the connecting piece is arranged on the circuit board and positioned outside the shell; one end of the connecting piece, which is far away from the circuit board, is provided with a second electric connection position, the second electric connection position is electrically connected with the first electric connection position, and the second electric connection position is used for being connected with an external circuit; and the adhesive bonding part enables the connecting piece, the shell and the circuit board to be connected into a whole. Therefore, the connection structure of the sensor and the external circuit can be prevented from influencing the performance of the sensor, and the connection of the sensor and the external circuit can be convenient and simple.
Description
Technical Field
The utility model relates to a packaging technology field of sensor, in particular to sensor, sensor parent and electronic equipment.
background
the package structure of a sensor (e.g., a MEMS microphone, etc.) generally includes a circuit board, a housing having an opening, and a sensor chip, etc., where the housing and the circuit board are packaged to form a cavity structure, and the sensor chip is mounted in the cavity structure.
sensors are generally used in electronic devices (such as mobile phones, etc.), that is, the sensors need to be connected with an external circuit; it is common practice to provide a through hole in the housing and then to connect the sensor to an external circuit via a wire. Thus, the wires can affect the performance of the sensor.
SUMMERY OF THE UTILITY MODEL
the utility model aims at providing a sensor, the wire that aims at solving and be connected with external circuit can influence the technical problem of sensor performance.
to achieve the above object, the present invention provides a sensor, including:
A housing with one end open;
The circuit board is arranged at the opening of the shell; the circuit board is provided with a first electric connection position outside the shell;
the sensor chip is arranged in the shell;
the connecting piece is arranged on the circuit board and positioned outside the shell; a second electric connection position is arranged at one end of the connecting piece, which is far away from the circuit board, and is electrically connected with the first electric connection position and the external circuit; and
And the adhesive connecting part enables the connecting piece, the shell and the circuit board to be connected into a whole.
Optionally, an electrical connection line is disposed in the connecting member to electrically connect the second electrical connection location and the first electrical connection location.
Optionally, the connector extends along the width direction of the circuit board, and a gap is provided between the connector and the circuit board.
Optionally, the connecting member and the housing are spaced apart from each other, and the adhesive joint includes a first adhesive joint filled between the connecting member and the housing.
Optionally, the adhesive joint further comprises a second adhesive joint arranged on a side of the connecting piece away from the housing; and/or the presence of a gas in the gas,
The adhesive joint part further comprises a third adhesive joint part arranged on one side, far away from the connecting piece, of the shell.
optionally, a ratio of a height of the second glue joint to a height of the connector is greater than or equal to 0.1; and/or the presence of a gas in the gas,
The ratio of the height of the third adhesive joint to the height of the connector is greater than or equal to 0.1.
Optionally, the connecting member is a conductive member to electrically connect the second electrical connection site and the first electrical connection site; the connecting piece is columnar, the connecting piece is located in the gluing part.
Optionally, the first electrical connection site is a pad; and/or the presence of a gas in the gas,
The second electrical connection site is a pad; and/or the presence of a gas in the gas,
the sensor is a MEMS microphone.
The utility model also provides a sensor matrix, include:
the circuit motherboard is provided with a plurality of groups of first electric connection positions which are arranged at intervals;
The device comprises a plurality of shells, a plurality of connecting rods and a plurality of connecting rods, wherein one ends of the shells are arranged in an open manner; the plurality of shells are respectively arranged on the circuit motherboard at intervals, and a group of first electric connection positions is arranged outside each shell;
A plurality of groups of sensor chips, wherein a group of sensor chips is arranged in each shell;
The multiple groups of connecting pieces are arranged on the circuit motherboard; a group of connecting pieces are arranged outside each shell, a second electric connection position is arranged at one end of each connecting piece, which is far away from the circuit mother board, the second electric connection position is electrically connected with the first electric connection position, and the second electric connection position is used for being connected with an external circuit; and
The glue joint portion parent, glue joint portion parent is filled in a plurality of between the casing, glue joint portion parent makes the connecting piece, the casing and circuit motherboard connects as an organic whole.
The utility model also provides an electronic equipment, including mainboard and sensor. The sensor includes:
a housing with one end open;
The circuit board is arranged at the opening of the shell; the circuit board is provided with a first electric connection position outside the shell;
the sensor chip is arranged in the shell;
the connecting piece is arranged on the circuit board and positioned outside the shell; a second electric connection position is arranged at one end of the connecting piece, which is far away from the circuit board, and is electrically connected with the first electric connection position and the external circuit; and
And the adhesive connecting part enables the connecting piece, the shell and the circuit board to be connected into a whole.
And the second electric connection position of the sensor is electrically connected with the mainboard.
The utility model discloses the sensor through set up first electricity connection position outside the casing on the circuit board, sets up the connecting piece that has second electricity connection position on the circuit board to make second electricity connection position and first electricity connection position electricity be connected, can make the sensor need set up outside the casing with the electricity connection position that external circuit electricity is connected, and make its protrusion in the surface of circuit board, then make through adhesive splice portion connecting piece, casing and circuit board are connected as an organic wholely. Therefore, the connection structure of the sensor and the external circuit can be prevented from influencing the performance of the sensor, and the connection of the sensor and the external circuit can be convenient and simple. Meanwhile, the connection stability between the connecting piece and the circuit board can be ensured, so that the reliability of the sensor can be improved.
drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the sensor of the present invention;
FIG. 2 is a top view of the sensor of FIG. 1;
fig. 3 is a schematic structural diagram of another embodiment of the sensor of the present invention;
FIG. 4 is a top view of the sensor of FIG. 3;
Fig. 5 is a schematic structural diagram of an embodiment of the sensor matrix of the present invention;
FIG. 6 is a schematic structural diagram of another embodiment of the sensor precursor of FIG. 5.
The reference numbers illustrate:
| reference numerals | name (R) | Reference numerals | Name (R) |
| 100 | Sensor/sensor unit | 42 | Electrical connection wire |
| 10 | Shell body | 50 | Adhesive joint |
| 20 | Circuit board | 51 | the first adhesive joint part |
| 21 | a first electric connection site | 52 | Second adhesive joint part |
| 22 | Sound hole | 53 | third glue joint |
| 31 | MEMS microphone chip | 1000 | Sensor matrix |
| 32 | ASIC chip | 1 | Circuit mother board |
| 40 | Connecting piece | 2 | Adhesive joint matrix |
| 41 | Second electric connection site |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that if the embodiments of the present invention are described with reference to "first", "second", etc., the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied.
The utility model provides a sensor.
Wherein the sensor may be a (MEMS) microphone, a (MEMS) environmental sensor, a (MEMS) acceleration sensor, a (MEMS) angular velocity sensor, or a (MEMS) pressure sensor, etc. In the examples of the present invention, the MEMS microphone is taken as an example, and the technical contents of the present invention are described in detail.
in an embodiment of the present invention, as shown in fig. 1-4, the sensor 100 includes:
A case 10 having one open end;
A circuit board 20 provided at an opening of the case 10; the circuit board 20 is provided with a first electric connection position 21 located outside the shell 10;
a sensor chip provided in the case 10;
The connecting piece 40 is arranged on the circuit board 20, and the connecting piece 40 is positioned outside the shell 10; a second electrical connection site 41 is arranged at one end of the connecting member 40 away from the circuit board 20, the second electrical connection site 41 is electrically connected with the first electrical connection site 21, and the second electrical connection site 41 is used for being connected with an external circuit; and
And an adhesive bonding part 50, wherein the adhesive bonding part 50 integrally connects the connector 40, the housing 10 and the circuit board 20.
Specifically, as shown in fig. 1 and 3, the circuit board 20 is disposed at an opening of the housing 10, and may form a package structure having an inner cavity.
As shown in fig. 1 and 3, the sensor chip includes a MEMS microphone chip 31, the MEMS microphone chip 31 is usually disposed on the circuit board 20, and the MEMS microphone chip 31 is electrically connected to the circuit on the circuit board 20.
Optionally, as shown in fig. 1 and 3, the sensor chip further includes an ASIC (application Specific Integrated circuit) chip, and the ASIC chip 32 is generally disposed on the circuit board 20 and electrically connected to the circuit on the circuit board 20.
Optionally, a sound hole 22 communicating with an inner cavity thereof is generally provided on the package structure formed by the housing 10 and the circuit board 20. For example, a sound hole 22 may be provided on the circuit board 20 at a position corresponding to the MEMS microphone chip 31 for sound to enter; the MEMS microphone chip 31 is a transducer component for converting a sound signal into an electrical signal, and the MEMS microphone chip 31 is manufactured based on MEMS (micro electro mechanical system) technology. The MEMS microphone chip 31 and the ASIC chip 32 are connected together, so that the electrical signal output by the MEMS microphone chip 31 can be transmitted to the ASIC chip 32, processed and output by the ASIC chip 32.
the MEMS microphone chip 31 and the ASIC chip 32 may be electrically connected through a metal wire, or may be electrically connected through a circuit pattern in the circuit board 20, which is common knowledge of those skilled in the art and will not be described in detail herein.
Wherein the first electrical connection site 21 is electrically connected to the sensor chip, optionally, the first electrical connection site 21 may be electrically connected to the ASIC chip 32 through a circuit layout in the circuit board 20. In this way, the electrical connection position of the sensor 100, which needs to be electrically connected to the external circuit, can be disposed outside the housing 10, so as to prevent the electrical connection structure of the sensor 100 and the external circuit from affecting the performance of the sensor 100.
as shown in fig. 2 and 4, by providing the connecting member 40 with the second electrical connection site 41 on the circuit board 20 and electrically connecting the second electrical connection site 41 with the first electrical connection site 21, the electrical connection site of the sensor 100, which needs to be electrically connected with an external circuit, can be protruded from the surface of the circuit board 20, so as to seal the housing 10 by glue.
as shown in fig. 2 and 4, the adhesive bonding part 50 is provided to integrally connect the connector 40, the housing 10, and the circuit board 20, thereby improving the connection stability of the connector 40 and the reliability of the sensor 100.
It is to be understood that the working principle of the sensor 100 of the present invention is roughly: the sound wave enters the housing 10 through the sound hole 22 and acts on the diaphragm of the MEMS chip, the diaphragm vibrates along with the strength of the sound wave, the MEMS chip converts the vibration of the diaphragm with different amplitudes into a changed electrical signal, and the electrical signal is amplified by the ASIC chip 32 and then transmitted to an external circuit (such as a terminal electronic device) through the circuit board 20, the first electrical connection site 21 and the second electrical connection site 41, thereby completing the conversion of sound and electricity.
It should be noted that, when the sensor 100 of the present invention is another type of sensor, the type of the sensor chip and the operation principle of the sensor are also changed accordingly. For example, when the sensor 100 is a MEMS environmental sensor, the sensor chip includes a MEMS environmental sensor chip (and an ASIC chip), etc.; when the sensor 100 is a MEMS acceleration sensor, the sensor chip includes a MEMS acceleration sensor chip (and an ASIC chip), and the like; when the sensor 100 is a MEMS angular velocity sensor, the sensor chip includes a MEMS angular velocity sensor chip (and an ASIC chip), and the like; when the sensor 100 is a MEMS pressure sensor, the sensor chip includes a MEMS pressure sensor chip (and an ASIC chip), and the like; a detailed description thereof is not necessary. However, the structure of the sensor 100 electrically connected to the external circuit may remain substantially unchanged.
The utility model discloses sensor 100 through set up first electricity connection position 21 outside casing 10 on circuit board 20, sets up the connecting piece 40 that has second electricity connection position 41 on circuit board 20 to make second electricity connection position 41 be connected with first electricity connection position 21 electricity, can make sensor 100 need to be connected with the electricity of external circuit electricity and connect the position and set up outside casing 10, and make its protrusion in circuit board 20's surface, then make through adhesive bonding portion 50 connecting piece 40, casing 10 and circuit board 20 connect as an organic wholely. Thus, the performance of the sensor 100 can be prevented from being affected by the electrical connection structure between the sensor 100 and the external circuit, and the connection between the sensor 100 and the external circuit can be facilitated and simplified. At the same time, the connection stability between the connector 40 and the circuit board 20 can be ensured, so that the reliability of the sensor 100 can be improved.
further, as shown in fig. 1 and 3, an electrical connection wire 42 is disposed in the connecting member 40 to electrically connect the second electrical connection site 41 and the first electrical connection site 21. By providing the electrical connection wire 42 in the connector 40 in this manner, the wiring pattern of the electrical connection wire 42 can be simplified.
optionally, the lower end of the connecting member 40 is disposed at the first electrical connection site 21. The lower end of the connector 40 refers to an end of the electrical connector 40 close to the circuit board 20, and the upper end of the connector 40 refers to an end of the electrical connector 40 far from the circuit board 20.
it should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
Alternatively, the electrical connection wire 42 is provided as a hard metal wire.
Optionally, the first electrical connection site 21 is a pad; and/or the second electrical connection site 41 is a pad.
Optionally, the Circuit board 20 is a pcb (printed Circuit board).
further, as shown in fig. 2 and 4, a plurality of first electrical connection sites 21 are disposed in the width direction of the circuit board 20, a plurality of second electrical connection sites 41 are correspondingly disposed, and each second electrical connection site 41 is correspondingly electrically connected to one first electrical connection site 21.
Specifically, as shown in fig. 2 and 4, the connector 40 extends along the width direction of the circuit board 20, and a plurality of second electrical connection sites 41 are provided on the connector 40.
Further, an adhesive gap is formed between the connecting member 40 and the circuit board 20. In this manner, when the adhesive bonding portion 50 is formed, adhesive water can be allowed to enter between the connector 40 and the circuit board 20 from one side of the connector 40 toward the housing 10 and flow to the other side of the connector 40, so that the connection strength between the connector 40 and the circuit board 20 can be enhanced, and the connection stability of the connector 40 and the circuit board 20 can be enhanced.
Specifically, as shown in fig. 1 and 3, the lower end of the electrical connection wire 42 protrudes from the lower end of the connector 40 to be electrically connected to the first electrical connection, and an adhesive gap may be formed between the connector 40 and the circuit board 20.
specifically, as shown in fig. 2 and 4, the connecting member 40 is spaced apart from the housing 10, and the adhesive joint 50 includes a first adhesive joint 51 filled between the connecting member 40 and the housing 10. In this way, the first adhesive bonding portion 51 may connect the connector 40 and the housing 10 to enhance the mounting stability of the connector 40.
specifically, as shown in fig. 2 and 4, the adhesive joint 50 further includes a second adhesive joint 52 disposed on a side of the connecting member 40 away from the housing 10. For convenience of description, a side of the connecting member 40 facing the housing 10 is an inner side of the connecting member 40, and a side of the connecting member 40 away from the housing 10 is an outer side of the connecting member 40.
As shown in fig. 2 and 4, the circuit board 20 protrudes from the connector 40 at the outer side of the connector 40, and the second adhesive bonding portion 52 connects the outer side of the connector 40 and the circuit board 20. In this way, the connection strength between the outside of the connector 40 and the circuit board 20 can be secured to improve the mounting stability of the connector 40.
Specifically, the ratio of the height of the second adhesive joint 52 to the height of the connecting member 40 is greater than or equal to 0.1. The height of the second adhesive bonding portion 52 refers to the height of the second adhesive bonding portion 52 in the direction away from the surface of the circuit board 20, and the height of the connector 40 refers to the height of the connector 40 in the direction away from the surface of the circuit board 20.
It can be understood that by making the ratio of the height of the second adhesive bonding portion 52 to the height of the connecting member 40 greater than or equal to 0.1, the amount of glue used on the outer side of the connecting member 40 can be ensured, so that the bonding strength between the outer side of the connecting member 40 and the circuit board 20 can be ensured/improved, and undesirable phenomena such as cracking, failure and the like can be prevented; meanwhile, the problems that the outside of the connecting piece 40 is difficult to detect when climbing glue and is easy to leak are avoided.
generally, the height of the second adhesive joint 52 should not be higher than the height of the connecting element 40, i.e. the ratio of the height of the second adhesive joint 52 to the height of the connecting element 40 is less than or equal to 1. Of course, the height of the second adhesive joint portion 52 may be slightly higher than the height of the connecting member 40 so that the second adhesive joint portion 52 extends inward of the connecting member 40.
optionally, the ratio of the height of the second adhesive joint 52 to the height of the connecting member 40 is greater than or equal to 0.2 and less than or equal to 0.8; to save glue on the outside of the connecting element 40.
Optionally, the ratio of the height of the second adhesive joint 52 to the height of the connecting member 40 is greater than or equal to 0.3 and less than or equal to 0.6; to save glue on the outside of the connecting element 40.
Further, as shown in fig. 2 and 4, the adhesive joint 50 further includes a third adhesive joint 53 disposed on a side of the housing 10 away from the connecting member 40.
The circuit board 20 protrudes laterally from the housing 10 in a direction of the housing 10 away from the connector 40, and the third adhesive bonding portion 53 connects the sidewall of the housing 10 away from the connector 40 and the circuit board 20. In this way, the connection strength between the side wall of the housing 10 remote from the connector 40 and the circuit board 20 can be ensured.
Specifically, the ratio of the height of the third adhesive joint 53 to the height of the housing 10 is greater than or equal to 0.1. The height of the third adhesive bonding portion 53 refers to the height of the third adhesive bonding portion 53 in the direction away from the surface of the circuit board 20, and the height of the housing 10 refers to the height of the housing 10 in the direction away from the surface of the circuit board 20.
It can be understood that, by making the ratio of the height of the third adhesive connecting portion 53 to the height of the housing 10 greater than or equal to 0.1, the glue amount on the side of the housing 10 away from the connecting element 40 can be ensured, so that the bonding strength between the side wall of the housing 10 away from the connecting element 40 and the circuit board 20 can be ensured/improved, and undesirable phenomena such as cracking and failure can be prevented.
Generally, the height of the third adhesive joint 53 should be no higher than the height of the housing 10, that is, the ratio of the height of the third adhesive joint 53 to the height of the housing 10 is less than or equal to 1. Of course, the third adhesive joint 53 may be formed to have a height slightly higher than that of the housing 10 so that the third adhesive joint 53 extends toward the top of the housing 10.
Optionally, a ratio of the height of the third glue joint 53 to the height of the housing 10 is greater than or equal to 0.2 and less than or equal to 0.8; so as to save the glue consumption.
Optionally, a ratio of the height of the third glue joint 53 to the height of the housing 10 is greater than or equal to 0.3 and less than or equal to 0.6; so as to save the glue consumption.
Alternatively, the height of the connecting member 40 is equivalent to the height of the housing 10, that is, the height of the connecting member 40 is equal to the height of the housing 10, or the height of the connecting member 40 is slightly lower/higher than the height of the housing 10.
Optionally, the height of the second glue joint 52 is comparable to the height of the third glue joint 53, that is, the height of the second glue joint 52 is equal to the height of the third glue joint 53, or the height of the second glue joint 52 is slightly lower/higher than the height of the third glue joint 53.
In the present embodiment, as shown in fig. 1, the height of the second adhesive joint portion 52 is equal to the height of the connecting member 40, and the height of the third adhesive joint portion 53 is equal to the height of the housing 10.
in another embodiment of the present invention, as shown in fig. 3, the ratio of the height of the second adhesive joint portion 52 to the height of the connecting member 40 is about or 0.5, and the ratio of the height of the third adhesive joint portion 53 to the height of the housing 10 is about or 0.5.
it should be noted that the connecting member 40 may be configured in other structural forms, for example, in other embodiments of the present invention, the connecting member 40 is a conductive member to electrically connect the second electrical connection site 41 and the first electrical connection site 21; the connecting piece 40 is columnar, and the connecting piece 40 is arranged in the adhesive bonding part 50; when there are a plurality of second electrical connection sites 41, there are a plurality of corresponding connection members 40, and each connection member 40 has a second electrical connection site 41.
In order to facilitate understanding of the present invention, the present invention further provides a method for manufacturing the sensor 100 and a sensor body 1000.
The method of making the sensor 100 is generally:
1) a circuit motherboard 1 (i.e., a circuit board 20 precursor) is prepared, and the circuit motherboard 1 has a plurality of groups of first electrical connection sites 21 arranged at intervals. Wherein, each group of first electrical connection sites 21 is correspondingly provided with a group of sensor chips.
2) A plurality of housings 10 are prepared, the housings 10 being open at one end.
3) A plurality of sets of connecting members 40 are prepared, and one end of the connecting members 40 is provided with a second electrical connection site 41.
4) A plurality of shells 10 are respectively arranged on the circuit motherboard 1 at intervals, a group of sensor chips are arranged in each shell 10, and a group of first electric connection positions 21 are arranged outside each shell 10; wherein the open end of the housing 10 is connected to the circuit motherboard 1.
5) A plurality of sets of connecting members 40 are respectively disposed on the circuit motherboard 1, and a set of connecting members 40 is disposed outside each housing 10, and the second electrical connection sites 41 are electrically connected to the first electrical connection sites 21.
Each housing 10, the corresponding set of first electrical connecting sites 21, the set of connecting members 40, and the set of sensor chips form a sensor unit 100.
6) Glue is filled between the plurality of sensor units 100 so that the glue is filled between the plurality of housings 10 to form the adhesive bonding mother body 2 filling between the plurality of housings 10, and the connector 40, the housing 10, and the circuit mother board 1 are integrally connected by the adhesive bonding mother body 2.
It is understood that, in the example shown in fig. 5, for two adjacent sensor units 100, the height of the glue between the connecting member 40 of one sensor unit 100 and the housing 10 of the other sensor unit 100 may be equal to the height of the connecting member 40 and/or the housing 10, so that "the ratio of the height of the second glue joint 52 to the height of the connecting member 40 is equal to 1", and/or "the ratio of the height of the third glue joint 53 to the height of the housing 10 is equal to 1".
in the example shown in fig. 6, for two adjacent sensor units 100, the height of the glue between the connecting member 40 of one sensor unit 100 and the housing 10 of the other sensor unit 100 may be lower than the height of the connecting member 40 and the height of the housing 10, so that "the ratio of the height of the second glue joint 52 to the height of the connecting member 40 is greater than or equal to 0.2 and less than or equal to 01", and "the ratio of the height of the third glue joint 53 to the height of the housing 10 is greater than or equal to 0.2 and less than or equal to 01".
In this manner, a sensor precursor 1000 can be obtained, as shown in fig. 5 and 6, i.e., the sensor precursor 1000 includes:
The circuit motherboard 1 is provided with a plurality of groups of first electric connection bits 21 which are arranged at intervals;
A plurality of housings 10, wherein one end of each housing 10 is open; the plurality of shells 10 are respectively arranged on the circuit motherboard 1 at intervals, and a group of first electric connection positions 21 is arranged outside each shell 10;
A plurality of groups of sensor chips, wherein a group of sensor chips is arranged in each shell 10;
A plurality of groups of connecting pieces 40 arranged on the circuit mother board 1; a group of connecting pieces 40 are arranged outside each shell 10, a second electric connection position 41 is arranged at one end of each connecting piece 40, which is far away from the circuit motherboard 1, the second electric connection position 41 is electrically connected with the first electric connection position 21, and the second electric connection position 41 is used for being connected with an external circuit; and
and an adhesive bonding section 50, wherein the adhesive bonding section 50 is filled between the plurality of cases 10, and the adhesive bonding section 50 integrally connects the connector 40, the case 10, and the circuit mother board 1.
7) The sensor precursor 1000 is divided, and the sensor precursor 1000 is divided into a plurality of sensors 100 (by die cutting or the like).
In this manner, not only the formation of the second and third adhesive joints 52 and 53 can be facilitated, but also mass production of the sensor 100 can be realized.
The utility model also provides an electronic equipment, this electronic equipment include mainboard and sensor, the second electricity of sensor is connected the position and is connected with the mainboard electricity. The concrete structure of this sensor refers to above-mentioned embodiment, because the utility model discloses electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The electronic equipment can be a mobile phone or a tablet computer.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. a sensor, comprising:
A housing with one end open;
The circuit board is arranged at the opening of the shell; the circuit board is provided with a first electric connection position outside the shell;
The sensor chip is arranged in the shell;
The connecting piece is arranged on the circuit board and positioned outside the shell; a second electric connection position is arranged at one end of the connecting piece, which is far away from the circuit board, and is electrically connected with the first electric connection position and the external circuit; and
and the adhesive connecting part enables the connecting piece, the shell and the circuit board to be connected into a whole.
2. The sensor of claim 1, wherein an electrical connection line is provided in the connector to electrically connect the second electrical connection site with the first electrical connection site.
3. The sensor of claim 2, wherein the connector extends along a width of the circuit board, and an adhesive gap is provided between the connector and the circuit board.
4. A sensor according to any one of claims 1 to 3, wherein the connector is spaced from the housing, and the adhesive joint comprises a first adhesive joint interposed between the connector and the housing.
5. the sensor of claim 4, wherein the adhesive bond further comprises a second adhesive bond disposed on a side of the connector remote from the housing; and/or the presence of a gas in the gas,
The adhesive joint part further comprises a third adhesive joint part arranged on one side, far away from the connecting piece, of the shell.
6. The sensor of claim 5, wherein a ratio of a height of the second adhesive bond to a height of the connector is greater than or equal to 0.1; and/or the presence of a gas in the gas,
the ratio of the height of the third adhesive joint to the height of the connector is greater than or equal to 0.1.
7. The sensor of claim 1, wherein the connecting member is a conductive member for electrically connecting the second electrical connection site and the first electrical connection site; the connecting piece is columnar, the connecting piece is located in the gluing part.
8. The sensor of claim 1, wherein the first electrical connection site is a pad; and/or the presence of a gas in the gas,
The second electrical connection site is a pad; and/or the presence of a gas in the gas,
The sensor is a MEMS microphone.
9. a sensor precursor, comprising:
The circuit motherboard is provided with a plurality of groups of first electric connection positions which are arranged at intervals;
The device comprises a plurality of shells, a plurality of connecting rods and a plurality of connecting rods, wherein one ends of the shells are arranged in an open manner; the plurality of shells are respectively arranged on the circuit motherboard at intervals, and a group of first electric connection positions is arranged outside each shell;
a plurality of groups of sensor chips, wherein a group of sensor chips is arranged in each shell;
the multiple groups of connecting pieces are arranged on the circuit motherboard; a group of connecting pieces are arranged outside each shell, a second electric connection position is arranged at one end of each connecting piece, which is far away from the circuit mother board, the second electric connection position is electrically connected with the first electric connection position, and the second electric connection position is used for being connected with an external circuit; and
the glue joint portion parent, glue joint portion parent is filled in a plurality of between the casing, glue joint portion parent makes the connecting piece, the casing and circuit motherboard connects as an organic whole.
10. an electronic device comprising a main board and the sensor according to any one of claims 1 to 8; and the second electric connection position of the sensor is electrically connected with the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921966676.0U CN209806262U (en) | 2019-11-14 | 2019-11-14 | sensor, sensor base body, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921966676.0U CN209806262U (en) | 2019-11-14 | 2019-11-14 | sensor, sensor base body, and electronic device |
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| Publication Number | Publication Date |
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| CN209806262U true CN209806262U (en) | 2019-12-17 |
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| CN201921966676.0U Active CN209806262U (en) | 2019-11-14 | 2019-11-14 | sensor, sensor base body, and electronic device |
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| Country | Link |
|---|---|
| CN (1) | CN209806262U (en) |
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2019
- 2019-11-14 CN CN201921966676.0U patent/CN209806262U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20200803 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Patentee after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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| TR01 | Transfer of patent right |