CN218648968U - MEMS microphone structure, packaging structure and electronic equipment - Google Patents
MEMS microphone structure, packaging structure and electronic equipment Download PDFInfo
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- CN218648968U CN218648968U CN202223280299.XU CN202223280299U CN218648968U CN 218648968 U CN218648968 U CN 218648968U CN 202223280299 U CN202223280299 U CN 202223280299U CN 218648968 U CN218648968 U CN 218648968U
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Abstract
The utility model provides a structure and electronic equipment are advanced in MEMS microphone structure, encapsulation, wherein MEMS microphone structure includes first base plate, first casing, a plurality of acoustic pressure sensing chip and signal processing chip, first casing with one side fixed connection of first base plate, a plurality of acoustic pressure sensing chip with the signal processing chip all be located by first casing with in the first cavity that first base plate is constituteed, perhaps, including annular substrate structure, acoustic pressure sensing chip and signal processing chip, wherein, acoustic pressure sensing chip and signal processing chip are located the inside second cavity of annular substrate structure, acoustic pressure sensing chip and first internal surface fixed connection, the signal processing chip with second internal surface fixed connection to practice thrift the space that MEMS microphone structure occupy.
Description
Technical Field
The utility model relates to a pressure sensor technical field especially relates to a MEMS microphone structure, packaging structure and electronic equipment.
Background
An MEMS (Micro Electro mechanical System) microphone is an electric transducer manufactured by micromachining technology, and has the characteristics of small volume, good frequency response characteristic, low noise and the like. With the development of miniaturization and thinning of electronic devices, MEMS microphones are increasingly widely used for these devices.
As shown in fig. 1, the MEMS microphone structure generally includes a substrate 1 and a housing 2, the substrate 1 and the housing 2 are fixedly connected to form a cavity 3, a sensing device 4 and a signal processing device 5 are located in the cavity 3 and fixedly connected to the substrate 1, the sensing device 4 generally includes a substrate 41 and a sensing device 42 located on the substrate, the substrate 41 has a cavity 411, and for the package structure of the rear sound in fig. 1, the substrate 1 has a sound inlet 11 corresponding to the cavity 411. With the structure of fig. 1, when a plurality of sensing assemblies 4 of such structures are required for recognizing the magnitude of sound signals input at different positions, a plurality of MEMS microphone structures are often arranged, which results in occupying more space.
SUMMERY OF THE UTILITY MODEL
The utility model provides a structure and electronic equipment are advanced in MEMS microphone structure, encapsulation can practice thrift the space that MEMS microphone structure occupy, and concrete scheme is as follows:
in a first aspect, an MEMS microphone structure is provided, where the MEMS microphone structure includes a first substrate, a first casing, a plurality of sound pressure sensing chips, and a signal processing chip, where the first casing is fixedly connected to one side of the first substrate, and the plurality of sound pressure sensing chips and the signal processing chip are both located in a first cavity formed by the first casing and the first substrate;
the sound pressure sensing chips are respectively electrically connected with the signal processing chip.
Further, a plurality of the sound pressure sensing chips are arranged around the signal processing chip.
Furthermore, a sound inlet hole is formed in the first substrate at a position corresponding to each sound pressure sensing chip.
In a second aspect, a MEMS microphone structure is provided, which includes an annular substrate structure, a sound pressure sensing chip and a signal processing chip, wherein the sound pressure sensing chip and the signal processing chip are located in a second cavity inside the annular substrate structure;
the annular substrate structure is provided with a first inner surface and a second inner surface which correspond to each other, the sound pressure sensing chip is fixedly connected with the first inner surface, and the signal processing chip is fixedly connected with the second inner surface.
Furthermore, a sound inlet hole is formed in the annular substrate structure at a position corresponding to the sound inlet cavity of the sound pressure sensing chip.
Further, the sound pressure sensing chip comprises an acoustic wave sensing element and a substrate;
one side of the substrate is fixedly connected with the sound wave sensing element, the other side of the substrate is fixedly connected with the first inner surface of the annular base plate structure, and the sound wave sensing element and the substrate form the sound inlet cavity;
and on a plane perpendicular to the thickness direction of the substrate, the projection of the sound inlet cavity covers the projection of the sound inlet hole.
Furthermore, the sound pressure sensing chip is electrically connected with the internal circuit of the annular substrate structure through a first conductive wire, and the signal processing chip is electrically connected with the internal circuit of the annular substrate structure through a second conductive wire.
Furthermore, the annular substrate structure comprises a first circuit substrate, a second circuit substrate and a third circuit substrate, wherein the first circuit substrate and the second circuit substrate are arranged correspondingly, one end of the third circuit substrate is connected with the first circuit substrate, and the other end of the third circuit substrate is connected with the second circuit substrate;
the sound pressure sensing chip is fixedly connected with the first circuit substrate, and the signal processing chip is fixedly connected with the second circuit substrate.
Further, the MEMS microphone structure includes a plurality of the sound pressure sensing chips, each of the sound pressure sensing chips being fixedly connected to the first inner surface of the annular substrate structure.
Further, the outer surface of the annular substrate structure is provided with a first pad.
Furthermore, the sound pressure sensing chip is an MEMS chip, and the signal processing chip is an ASIC chip.
In a third aspect, a package structure is provided, the package structure comprising a second substrate, a second housing, and the MEMS microphone structure as described above;
the MEMS microphone structure is fixedly connected with one side of the second substrate, the second shell is positioned on the other side of the second substrate, a hollow area communicated with a sound inlet hole of the MEMS microphone structure is formed in the second shell, and the sound inlet hole and the hollow area form a sound inlet channel;
the packaging structure further comprises a sealing element, wherein one end of the sealing element is connected with the second substrate, and the other end of the sealing element is connected with the second shell so as to seal the sound inlet channel.
In a fourth aspect, a package structure is provided, which includes a third substrate, a third housing fixed to one side of the third substrate, and the MEMS microphone structure as described above;
the MEMS microphone structure is positioned in a third cavity formed by the third substrate and the third shell and is fixedly connected with the third substrate.
Further, a second bonding pad used for being welded with the first bonding pad of the MEMS microphone structure is arranged on the third substrate;
the third shell is provided with a hollow-out area communicated with the sound inlet hole of the MEMS microphone structure;
the package structure further includes a sealing member having one end connected to the MEMS microphone structure and another end connected to the third housing to seal the third housing.
In a fifth aspect, an electronic device is provided, which includes the MEMS microphone structure described above.
In this application, in some embodiments, set up a plurality of sound pressure sensing chips, each sound pressure sensing chip all with signal processing chip electric connection to can handle the signal of telecommunication that a plurality of sound pressure sensing chips produced, thereby can perceive the sound signal size of different position input, compare in setting up a plurality of MEMS microphone structures, sound pressure sensing chip is less usually in this embodiment, therefore MEMS microphone structure can occupy less space. In some embodiments, the first substrate and the first housing are improved to be an annular substrate structure, the sound pressure sensing chip and the signal processing chip are located in a second cavity inside the annular substrate structure, the annular substrate structure has a first inner surface and a second inner surface which correspond to each other, the sound pressure sensing chip is fixedly connected with the first inner surface, and the signal processing chip is fixedly connected with the second inner surface, so that the sound pressure sensing chip and the signal processing chip are arranged on the corresponding inner surfaces, the space of the second cavity is fully utilized, the space occupied by the sound pressure sensing chip and the signal processing chip is further reduced, and the volume of the MEMS microphone structure is reduced.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a MEMS microphone structure in the prior art;
fig. 2A is a schematic diagram of a MEMS microphone structure having two sound pressure sensing chips according to a first embodiment of the present invention;
fig. 2B is a schematic view of a MEMS microphone structure according to an embodiment of the present invention with a first housing removed;
fig. 2C is a bottom view of a MEMS microphone structure according to an embodiment of the present invention;
fig. 2D is a schematic diagram of a MEMS microphone structure having four sound pressure sensing chips according to a first embodiment of the present invention;
fig. 3 is a schematic view of a package structure according to a second embodiment of the present invention;
fig. 4A is a schematic diagram of a MEMS microphone structure having a sound pressure sensing chip according to a third embodiment of the present invention;
fig. 4B is a schematic diagram of a MEMS microphone structure having two sound pressure sensing chips according to a third embodiment of the present invention;
fig. 4C is a bottom view of a MEMS microphone structure according to a third embodiment of the present invention;
fig. 5 is a schematic diagram of a package structure in the fourth embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts all belong to the protection scope of the present invention.
The MEMS microphone structure, the package structure and the electronic device according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Example one
As shown in fig. 2A to fig. 2D, the present embodiment provides an MEMS microphone structure, which includes a first substrate 101, a first casing 201, a plurality of sound pressure sensing chips 300, and a signal processing chip 400, where the first casing 201 is fixedly connected to one side of the first substrate 101, and the plurality of sound pressure sensing chips 300 and the signal processing chip 400 are both located in a first cavity formed by the first casing 201 and the first substrate 101;
the sound pressure sensing chips 300 are electrically connected to the signal processing element, respectively.
In this embodiment, a plurality of sound pressure sensing chips 300 are provided, and each sound pressure sensing chip 300 is electrically connected to the signal processing chip 400, so as to process the electrical signals generated by the plurality of sound pressure sensing chips 300, and thus sense the sound signals input at different positions.
In the present embodiment, the sound pressure sensing chip 300 is electrically connected to the first substrate 101 through a first conductive line 801, and the signal processing chip 400 is electrically connected to the first substrate 101 through a second conductive line 802.
Further, a plurality of sound pressure sensing chips 300 are arranged around the signal processing chip 400.
As shown in fig. 2D, there are four sound pressure sensing chips 300, and the four sound pressure sensing chips 300 are arranged around the signal processing chip 400, so that the structure is more compact.
Further, a sound inlet hole 600 is formed on the first substrate 101 at a position corresponding to each of the sound pressure sensing chips 300.
In the present embodiment, in order to enable each sound pressure sensing chip 300 to sense a sound, a sound inlet hole 600 is provided on the first substrate 101 at a position corresponding to each sound pressure sensing chip 300.
Further, the outer surface of the first substrate 101 is provided with first pads 901.
In the present embodiment, the first bonding pad 901 includes two types, one is used for soldering the MEMS microphone structure 100 to other products, and the other is disposed around the sound inlet hole 600 for preventing air leakage from the sound inlet hole 600.
Example two
As shown in fig. 3, the present embodiment provides a package structure, which includes a second substrate 102, a second housing 202, and the MEMS microphone structure 100 according to the first embodiment;
the MEMS microphone structure 100 is fixedly connected to one side of the second substrate 102, the second housing 202 is located at the other side of the second substrate 102, the second housing 202 has a hollow area 800 communicated with the sound inlet 600 of the MEMS microphone structure 100, and the sound inlet 600 and the hollow area 800 form a sound inlet channel;
the package structure further includes a sealing member 700, one end of the sealing member 700 is connected to the second substrate 102, and the other end is connected to the second housing 202 so as to seal the sound inlet channel.
The MEMS microphone structure 100 in the first embodiment includes a plurality of sound inlet holes 600, and for each sound inlet hole 600, a hollow area 800 is disposed, and the number of the hollow areas 800 in the first embodiment is the same as the number of the sound inlet holes 600. The sealing member 700 may be a silicone sleeve, and is disposed around the hollow area 800, the number of the sealing members 700 is the same as that of the hollow area, and a second pad 902 corresponding to the first pad 901 of the MEMS microphone structure 100 is disposed on one side of the second substrate 102.
EXAMPLE III
As shown in fig. 4A to 4C, the present embodiment provides a MEMS microphone structure, which includes an annular substrate structure 103, a sound pressure sensing chip 300 and a signal processing chip 400, wherein the sound pressure sensing chip 300 and the signal processing chip 400 are located in a first cavity inside the annular substrate structure 103;
the annular substrate structure 103 has a first inner surface and a second inner surface corresponding to each other, the sound pressure sensing chip 300 is fixedly connected to the first inner surface, and the signal processing chip 400 is fixedly connected to the second inner surface.
In this embodiment, the first substrate 101 and the first housing 201 in the first embodiment are modified into the annular substrate structure 103, the sound pressure sensing chip 300 and the signal processing chip 400 are located in a second cavity inside the annular substrate structure 103, the annular substrate structure 103 has a corresponding first inner surface and a second inner surface, the sound pressure sensing chip 300 is fixedly connected to the first inner surface, and the signal processing chip 400 is fixedly connected to the second inner surface, so that the sound pressure sensing chip 300 and the signal processing chip 400 are disposed on the corresponding inner surfaces, and the space of the second cavity is fully utilized, thereby further reducing the space occupied by the sound pressure sensing chip 300 and the signal processing chip 400, and reducing the volume of the MEMS microphone structure.
Further, a sound inlet hole 600 is disposed on the annular substrate structure 103 at a position corresponding to the sound inlet cavity of the sound pressure sensing chip 300.
Further, the sound pressure sensing chip 300 includes an acoustic wave sensing element 301 and a substrate 302;
one side of the substrate 302 is fixedly connected with the acoustic wave sensing assembly, the other side of the substrate is fixedly connected with the first inner surface of the annular base plate structure 103, and the acoustic wave sensing element 301 and the substrate 302 form a sound inlet cavity;
the projection of the sound inlet chamber covers the projection of the sound inlet hole 600 on a plane perpendicular to the thickness direction of the substrate 302.
The MEMS microphone structure in this embodiment is suitable for a rear sound structure, and the projection of the sound inlet cavity covers the projection of the sound inlet hole 600, so that the sound pressure sensing chip 300 can sense sound pressure sufficiently while avoiding air leakage.
Further, the sound pressure sensing chip 300 is electrically connected to the internal circuit of the annular substrate structure 103 through a first conductive line 801, and the signal processing chip 400 is electrically connected to the internal circuit of the annular substrate structure 103 through a second conductive line 802.
In the present embodiment, the sound pressure sensing chip 300 is electrically connected to the signal processing chip 400 through the first conductive line, the internal circuit of the annular substrate structure 103, and the second conductive line 802, so as to transmit the electrical signal detected by the sound pressure sensing chip 300 to the signal processing chip 400.
Further, the ring-shaped substrate structure 103 includes a first circuit substrate 1031, a second circuit substrate 1032 and a third circuit substrate 1033, the first circuit substrate 1031 and the second circuit substrate 1032 are disposed correspondingly, one end of the third circuit substrate 1033 is connected to the first circuit substrate 1031, and the other end is connected to the second circuit substrate 1032;
the sound pressure sensing chip 300 is fixedly connected to the first circuit substrate 1031, and the signal processing chip 400 is fixedly connected to the second circuit substrate 1032.
In this embodiment, the first circuit substrate 1031, the third circuit substrate 1033, the second circuit substrate 1032 and the third circuit substrate 1033 are connected end to end, the sound pressure sensing chip 300 is fixed to the first circuit substrate 1031, and the signal processing chip 400 is fixed to the second circuit substrate 1032.
Further, the MEMS microphone structure includes a plurality of sound pressure sensing chips 300, and each of the plurality of sound pressure sensing chips 300 is fixedly connected to the first inner surface of the annular substrate structure 103.
In the present embodiment, in order to fully utilize the internal space of the annular substrate structure 103, the plurality of sound pressure sensing chips 300 are disposed on the first inner surface of the annular substrate structure 103, so as to prevent the MEMS microphone structure 100 from occupying more space.
Further, the outer surface of the annular substrate structure 103 is provided with a first pad 901.
In this embodiment, in order to facilitate soldering of the annular substrate structure 103 to other products, the outer surface of the annular substrate structure 103 is provided with first pads 901, and further, the first pads 901 are located on the outer surface of the second circuit substrate 1032.
Further, the sound pressure sensing chip 300 is a MEMS chip, and the signal processing chip 400 is an ASIC chip.
In the present embodiment, the sound pressure sensing chip 300 is a MEMS chip, and the signal processing chip 400 is an ASIC (Application Specific Integrated Circuit) chip.
Example four
As shown in fig. 5, a package structure includes a third substrate 104, a third housing 203 fixed to one side of the third substrate 104, and a MEMS microphone structure 100 according to the third embodiment;
the MEMS microphone structure 100 is located in a third cavity formed by the third substrate 104 and the third housing 203 and is fixedly connected to the third substrate 104.
In this embodiment, the MEMS microphone structure 100 is located in a third cavity formed by the third substrate 104 and the third housing 203 and is fixedly connected to the third substrate 104, so as to implement the package of the MEMS microphone structure 100 in the third embodiment.
Further, a second pad 902 for welding with the first pad 901 of the MEMS microphone structure 100 is disposed on the second substrate 102;
the second shell 202 has a hollow area 800 communicating with the sound inlet 600 of the MEMS microphone structure 100;
the package structure further comprises a seal 700, one end of the seal 700 being connected to the MEMS microphone structure 100 and the other end being connected to the second housing 202 to seal the third cavity.
In the present embodiment, if the MEMS microphone structure 100 includes a plurality of sound input holes 600, a hollow area 800 may be disposed for all the sound input holes 600. The sealing member 700 can be the silica gel cover, sets up around the fretwork area 800, and the quantity of sealing member 700 is the same with the quantity in fretwork area.
EXAMPLE five
The embodiment provides an electronic device, which includes the MEMS microphone structure described in the first embodiment or the second embodiment.
The MEMS microphone structure and the electronic device provided by the embodiments of the present invention are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present invention, and the description of the above embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (15)
1. The MEMS microphone structure is characterized by comprising a first substrate (101), a first shell (201), a plurality of sound pressure sensing chips (300) and a signal processing chip (400), wherein the first shell (201) is fixedly connected with one side of the first substrate (101), and the plurality of sound pressure sensing chips (300) and the signal processing chip (400) are both positioned in a first cavity formed by the first shell (201) and the first substrate (101);
the sound pressure sensing chips (300) are respectively electrically connected with the signal processing chip (400).
2. The MEMS microphone structure of claim 1, wherein a plurality of the acoustic pressure sensing chips (300) are arranged around the signal processing chip (400).
3. The MEMS microphone structure of claim 1 or 2, wherein a sound inlet hole (600) is disposed on the first substrate (101) at a position corresponding to each of the sound pressure sensing chips (300).
4. A MEMS microphone structure, comprising an annular substrate structure (103), a sound pressure sensing chip (300) and a signal processing chip (400), wherein the sound pressure sensing chip (300) and the signal processing chip (400) are located within a second cavity inside the annular substrate structure (103);
the annular substrate structure (103) is provided with a first inner surface and a second inner surface which correspond to each other, the sound pressure sensing chip (300) is fixedly connected with the first inner surface, and the signal processing chip (400) is fixedly connected with the second inner surface.
5. The MEMS microphone structure of claim 4, wherein a sound inlet hole (600) is disposed on the annular substrate structure (103) at a position corresponding to a sound inlet cavity of the sound pressure sensing chip (300).
6. The MEMS microphone structure of claim 5, wherein the acoustic pressure sensing chip (300) comprises an acoustic wave sensing element (301) and a substrate (302);
one side of the substrate (302) is fixedly connected with the acoustic wave sensing element (301), the other side of the substrate is fixedly connected with the first inner surface of the annular base plate structure (103), and the acoustic wave sensing element (301) and the substrate (302) form the sound inlet cavity;
the projection of the sound inlet cavity covers the projection of the sound inlet hole (600) on a plane perpendicular to the thickness direction of the substrate (302).
7. The MEMS microphone structure of claim 4, wherein the acoustic pressure sensing chip (300) is electrically connected to the inner circuitry of the annular substrate structure (103) by a first conductive line (801), and the signal processing chip (400) is electrically connected to the inner circuitry of the annular substrate structure (103) by a second conductive line (802).
8. The MEMS microphone structure of any one of claims 4 to 7, wherein the ring-shaped substrate structure (103) comprises a first wiring substrate (1031), a second wiring substrate (1032), and a third wiring substrate (1033), the first wiring substrate (1031) being disposed in correspondence with the second wiring substrate (1032), one end of the third wiring substrate (1033) being connected to the first wiring substrate (1031), the other end being connected to the second wiring substrate (1032);
the sound pressure sensing chip (300) is fixedly connected with the first circuit substrate (1031), and the signal processing chip (400) is fixedly connected with the second circuit substrate (1032).
9. The MEMS microphone structure of claim 4, wherein the MEMS microphone structure comprises a plurality of the acoustic pressure sensing chips (300), each of the acoustic pressure sensing chips (300) being fixedly connected with the first inner surface of the annular substrate structure (103).
10. The MEMS microphone structure of claim 4 wherein an outer surface of the annular substrate structure (103) is provided with a first pad (901).
11. The MEMS microphone structure of claim 4, wherein the sound pressure sensing chip is a MEMS chip and the signal processing chip is an ASIC chip.
12. A package structure, characterized in that the package structure comprises a second substrate (102), a second housing (202), and a MEMS microphone structure according to any of claims 1 to 3;
the MEMS microphone structure (100) is fixedly connected with one side of the second substrate (102), the second shell (202) is located on the other side of the second substrate (102), a hollow area (800) communicated with a sound inlet hole (600) of the MEMS microphone structure (100) is arranged on the second shell (202), and the sound inlet hole (600) and the hollow area (800) form a sound inlet channel;
the packaging structure further comprises a sealing member (700), wherein one end of the sealing member (700) is connected with the second substrate (102), and the other end of the sealing member (700) is connected with the second shell (202) so as to seal the sound inlet channel.
13. A package structure, characterized in that the package structure comprises a third substrate (104), a third housing (203) fixed to one side of the third substrate (104), and a MEMS microphone structure according to any of claims 4 to 8;
the MEMS microphone structure (100) is located in a third cavity formed by the third substrate (104) and the third shell (203) and is fixedly connected with the third substrate (104).
14. The package structure according to claim 13, wherein the third substrate (104) is provided with second pads (902) for soldering with the first pads (901) of the MEMS microphone structure (100);
the third shell (203) is provided with a hollow-out area (800) communicated with the sound inlet hole (600) of the MEMS microphone structure;
the packaging structure further comprises a sealing member (700), one end of the sealing member (700) is connected with the MEMS microphone structure, and the other end of the sealing member (700) is connected with the third shell (203) so as to seal the third cavity.
15. An electronic device, comprising a MEMS microphone structure according to any of claims 1-11 above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223280299.XU CN218648968U (en) | 2022-12-07 | 2022-12-07 | MEMS microphone structure, packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223280299.XU CN218648968U (en) | 2022-12-07 | 2022-12-07 | MEMS microphone structure, packaging structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
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| CN218648968U true CN218648968U (en) | 2023-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223280299.XU Active CN218648968U (en) | 2022-12-07 | 2022-12-07 | MEMS microphone structure, packaging structure and electronic equipment |
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| CN (1) | CN218648968U (en) |
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- 2022-12-07 CN CN202223280299.XU patent/CN218648968U/en active Active
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