CN214096464U

CN214096464U - Electronic device

Info

Publication number: CN214096464U
Application number: CN202022361169.3U
Authority: CN
Inventors: 李刚; 程腾艳; 梅嘉欣; 张永强
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-08-31
Anticipated expiration: 2030-10-21

Abstract

The utility model provides an electronic equipment, it includes: a main body having an airflow hole; the differential pressure sensor packaging structure is provided with a first through hole which is communicated with the airflow hole to form an airflow channel; and the air leakage hole is communicated with the air flow channel and communicates the air flow channel with the outside so as to reduce the pressure of the air flow channel. The utility model has the advantages of, utilize the disappointing hole with the air current channel intercommunication, reduce air current channel's pressure only reaches when a higher value when air current pressure among the air current channel, through first through-hole acts on pressure differential sensor packaging structure's air current pressure just can make the pressure differential that pressure differential sensor packaging structure detected just reach electronic equipment's start threshold value, electronic equipment just can start this moment to avoid electronic equipment to receive the influence of external disturbance air current and the mistake starts.

Description

Electronic device

Technical Field

The utility model relates to a sensor encapsulation field especially relates to an electronic equipment.

Background

Currently, in electronic devices that need to detect air pressure difference, two methods are generally used to detect air pressure difference.

One method is that two air pressure sensors are placed on a PCB of the electronic equipment, and the pressure difference of the two air pressure sensors is processed to judge whether the pressure difference reaches a threshold value, so that the detection of the air pressure difference is realized. However, the use of two air pressure sensors leads to an increase in the cost of the electronic device; the two air pressure sensors occupy larger space to influence the shortening design of the product; moreover, the two air pressure sensors have strong mutual dependency, and the damage of any one of the two air pressure sensors can cause the failure of the whole product, so that the failure risk of the electronic equipment is large.

The other method is to directly measure the pressure difference by using a pressure difference sensor and judge whether the pressure difference reaches a threshold value so as to realize the detection of the pressure difference and start the electronic equipment. However, when the start threshold of the electronic device is small, the external airflow makes the signal generated by the differential pressure sensor easy to be used as an effective signal, so that the electronic device is started by mistake.

Therefore, how to avoid the false start of the electronic device is a problem that needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that an electronic equipment is provided, it can avoid electronic equipment mistake to start.

In order to solve the above problem, the present invention provides an electronic device, which includes:

a main body having an airflow hole;

the differential pressure sensor packaging structure is provided with a first through hole, and the differential pressure sensor packaging structure is communicated with the airflow hole through the first through hole to form an airflow channel;

and the air leakage hole is communicated with the air flow channel and communicates the air flow channel with the outside so as to reduce the pressure of the air flow channel.

Further, an annular bonding pad is arranged between the differential pressure sensor packaging structure and the main body, a through hole is formed in the center of the annular bonding pad, and the through hole is connected with the first through hole and the airflow hole.

Further, the air leakage hole is formed in the side wall of the first through hole, the through hole or the airflow hole.

Further, the annular pad has at least one notch, and the notch forms the air release hole.

Further, when the annular pad is provided with a plurality of gaps, the gaps are symmetrically arranged by taking the central axis of the via hole as a symmetry axis.

Further, in the axial direction of the via hole, the annular pad is partially or completely removed at the notch corresponding region to form the notch.

Further, the area is corresponded to in the breach, the annular pad is got rid of completely, in order to form under the condition of breach, pressure differential sensor packaging structure bottom have with the recess that the breach corresponds, the recess with the breach is as the hole loses heart.

Further, pressure differential sensor packaging structure bottom has the solder mask the breach corresponds the region, first annular pad is got rid of completely, in order to form under the condition of breach, at least the breach corresponds the region, the solder mask windowing, with the breach is regarded as jointly the hole of leaking gas.

Furthermore, a stop block protruding out of the annular bonding pad is arranged on the edge of the notch on the annular bonding pad.

Further, in the area corresponding to the notch, the annular pad is completely removed to form the notch, the main body has a groove corresponding to the notch, and the groove and the notch serve as the air release hole.

Further, the main part surface has the solder mask the breach corresponds the region, the annular pad is got rid of completely, in order to form under the condition of breach, at least the breach corresponds the region, the solder mask windowing, with the breach is regarded as jointly the hole of leaking.

Further, the differential pressure sensor package structure includes:

a housing;

the edge of the shell is fixed on the front surface of the substrate, a first cavity is formed between the edge of the shell and the substrate, and the first through hole penetrates through the substrate;

the pressure sensing element is fixed on the front surface of the substrate and located in the first cavity, the pressure sensing element is provided with a second cavity and a pressure sensing layer, the pressure sensing layer is located between the first cavity and the second cavity, and the second cavity is communicated with the airflow hole through the first through hole to form the airflow channel.

Further, the pressure sensing element is connected with the substrate through a sealing layer, the sealing layer is provided with a through hole, and the through hole is communicated with the first through hole and the second cavity.

Further, the air leakage hole is formed in the side wall of the second cavity or the through hole.

Further, the electronic equipment is an electronic cigarette.

The utility model has the advantages of, utilize the disappointing hole with the air current channel intercommunication, reduce air current channel's pressure only reaches when a higher value when air current pressure among the air current channel, through first through-hole acts on pressure differential sensor packaging structure's air current pressure just can make the pressure differential that pressure differential sensor packaging structure detected just reach electronic equipment's start threshold value, electronic equipment just can start this moment to avoid electronic equipment to receive the influence of external disturbance air current and the mistake starts.

Drawings

Fig. 1 to 28 are schematic structural views of the electronic device of the present invention.

Detailed Description

The following describes in detail a specific embodiment of an electronic device according to the present invention with reference to the accompanying drawings.

First embodiment

Fig. 1 is a schematic diagram of a partial cross-sectional structure of a first embodiment of an electronic device according to the present invention, referring to fig. 1, the electronic device includes a main body and a differential pressure sensor package structure 2, and the differential pressure sensor package structure 2 is disposed on the main body. Specifically, in the present embodiment, the main body has a circuit board 1, and the pressure sensor package 2 is disposed on the circuit board 1 and electrically connected to the circuit board 1.

The main body has an airflow hole 10. The airflow hole 10 allows airflow within the main body to flow toward the pressure sensor package 2 through the airflow hole 10. In the present embodiment, the airflow hole 10 is composed of a section penetrating the circuit board 1 and a section located outside the circuit board 1.

The pressure sensor package 2 has a first through hole 20, and the first through hole 20 is communicated with the airflow hole 10 to form an airflow channel.

The pressure sensor package 2 includes a substrate 21, a housing 22, and a pressure sensing element 23. The edge of the housing 22 is fixed to the front surface of the substrate 21, and a first cavity 24 is formed between the housing and the substrate 21. The first through hole 20 penetrates the substrate 21. The pressure sensing element 23 is located in the first cavity 24 and covers the first through hole 20. A fifth through hole 25 is further disposed on the housing 22, and the fifth through hole 25 is communicated with the first cavity 24.

Since the pressure sensing element 2 covers the first through hole 20, that is, the pressure sensing element 23 is located between the first cavity 24 and the first through hole 20, the gas pressure in the first cavity 24 and the first through hole 20 simultaneously acts on the pressure sensing element 23, so that the pressure finally received by the pressure sensing element 23 is the pressure difference between the first cavity 24 and the first through hole 20, and thus the detection signal output by the pressure sensing element 23 corresponds to the pressure difference between the first cavity 24 and the first through hole 20, and then the detection signal output by the pressure sensing element 23 is calculated by the asic chip to obtain the corresponding pressure difference value, thereby realizing the function of detecting the pressure difference by the package structure of the pressure difference sensor.

As described in the background art, when the start threshold of the electronic device is small, the external airflow makes the signal generated by the differential pressure sensor package structure be easily used as an effective signal, so that the electronic device is started by mistake. Therefore, the electronic device of the present invention further includes at least one air release hole 3. The air release hole 3 is communicated with the airflow channel and communicates the airflow channel with the outside so as to reduce the pressure of the airflow channel. Specifically, as shown by the arrow in fig. 1, when an airflow flows to the pressure sensing element 23 through the airflow channel, a part of the airflow flows out to the outside through the air release hole 3, so that the airflow pressure actually acting on the pressure sensing element 23 through the first through hole 20 is reduced, and only when the airflow pressure in the airflow channel reaches a higher value, the airflow pressure acting on the pressure sensing element 23 through the first through hole 20 is sufficiently large, so that the pressure difference between the first cavity 24 and the first through hole 20 reaches the start threshold of the electronic device, and the electronic device is started, thereby preventing the electronic device from being influenced by the external interference airflow and being started by mistake.

Wherein the air leakage hole 3 is arranged on the side wall of the airflow hole 10. Specifically, in the present embodiment, the air release hole 3 is provided on the side wall of the section of the airflow hole 10 located outside the circuit board 1. The air leakage hole 3 can be communicated with the outside of the electronic equipment through a connecting pipe and other structures to achieve the effect of reducing the pressure of the airflow channel. In this embodiment, the electronic device only sets up one disappointing hole 3, and in other embodiments of the present invention, the electronic device may set up a plurality of disappointing holes 3 on the airflow channel to mutually assist, reduce better the pressure of airflow channel, thereby avoid the electronic device to receive the influence of external disturbance air current and the mistake starts.

Optionally, an annular pad is disposed between the differential pressure sensor package 2 and the main body, and a via hole is formed in the center of the annular pad and connects the first through hole and the airflow hole. The annular pad may be disposed at the bottom of the differential pressure sensor package structure 2, or disposed on the circuit board 1 of the main body, or disposed at the bottom of the differential pressure sensor package structure 2 and on the circuit board of the main body.

In this embodiment, the bottom of the differential pressure sensor package 2 and the circuit board of the main body are both provided with annular pads. Specifically, please refer to fig. 2, which is an enlarged view of a region a in fig. 1. The bottom of the differential pressure sensor packaging structure 2 is provided with a first annular bonding pad 26, and the first annular bonding pad 26 is in a closed annular configuration and is provided with a second through hole 27 in the center. The first annular pad 26 protrudes from the substrate 21 of the differential pressure sensor package 2, and in other embodiments, the first annular pad 26 does not protrude from the substrate 21 of the differential pressure sensor package 2. The main body is provided with a second annular bonding pad 12, specifically, the second annular bonding pad 12 is arranged on the circuit board 1, the second annular bonding pad 12 is in a closed annular configuration, the center of the second annular bonding pad is provided with a third through hole 13, and the second through hole 27 and the third through hole 13 form the through hole. The second annular pad 12 protrudes from the circuit board 1, and in other embodiments, the second annular pad 12 does not protrude from the circuit board 1.

The first annular pad 26 and the second annular pad 12 may be soldered by solder 4 to secure the differential pressure sensor package 2 to the body. The first through hole 20, the second through hole 27, the third through hole 13 and the airflow hole 11 are communicated to form the airflow channel. This embodiment has the advantage that the control of the air flow can be accurately achieved by the size and shape of the bleed holes 3.

Second embodiment

Fig. 3 is a schematic partial cross-sectional view of a second embodiment of the electronic device of the present invention, please refer to fig. 3, the second embodiment is different from the first embodiment in that the position of the air release hole 3 is different. Specifically, in the present embodiment, the air release hole 3 is provided on the side wall of the section where the airflow hole 10 penetrates the circuit board 1. The air release hole 3 may obliquely pass through the circuit board 1 and be communicated with the outside, for example, after the air release hole 3 obliquely passes through the circuit board 1, the air release hole may be communicated with the outside through a connecting pipe or other structures, thereby achieving the purpose of reducing the pressure of the airflow channel. The advantage of this embodiment is that the air release hole 3 is formed by operating the circuit board 1, so that the implementation mode is one-step molding and the operation is convenient.

Third embodiment

Fig. 4 is a schematic partial cross-sectional view of a third embodiment of the electronic device of the present invention, please refer to fig. 4, the third embodiment is different from the first embodiment in that the position of the air release hole 3 is different. Specifically, in the present embodiment, the air release hole 3 is provided in a sidewall of the first through hole 20. The air release hole 3 penetrates through the circuit board 1 along an axial direction perpendicular to the first through hole 20 and is communicated with the outside, so that the purpose of reducing the pressure of an airflow channel is achieved. In other embodiments of the present invention, the air release hole 3 may also pass through the circuit board 1 obliquely downward along a direction forming an acute angle with the axial direction of the first through hole 20, and communicate with the outside, thereby achieving the purpose of reducing the pressure of the airflow channel. The advantage of this embodiment is that the operation of the air-escape hole 3 can be completed before the differential pressure sensor package structure leaves the factory, and there is no need to subsequently cooperate in use and a matching scheme.

Fourth embodiment

Fig. 5 is a bottom schematic view of a differential pressure sensor package structure according to a fourth embodiment of the present invention in an area a shown in fig. 1, fig. 6 is a schematic cross-sectional view taken along a direction B-B in fig. 5, please refer to fig. 5 and fig. 6, the fourth embodiment is different from the first embodiment in that the position of the air release hole 3 is different. Specifically, the air release hole 3 is located on the sidewall of the second through hole 27. The first annular pad 26 has a first gap 261, and the first gap 261 is the air release hole 3. In the present embodiment, in the first notch corresponding region in the axial direction O of the second through hole 27, the first annular land 26 is completely removed to form the first notch 261. That is, in this embodiment, the first annular land 26 is not a closed pattern, but is a non-closed pattern interrupted by the first notch 261, and the first notch 261 serves as the air release hole 3, so as to achieve the purpose of reducing the pressure of the air flow passage. The advantage of this embodiment is that the operation of the first notch 261 can be completed before the differential pressure sensor package structure leaves the factory, the operation is simple, and the cost of the differential pressure sensor package structure does not need to be additionally increased.

Fifth embodiment

Fig. 7 is a bottom view of a differential pressure sensor package structure of a fifth embodiment of an electronic device according to the present invention in a region a shown in fig. 1, and fig. 8 is a cross-sectional view along a direction B-B in fig. 7, please refer to fig. 7 and fig. 8, the fifth embodiment is different from the fourth embodiment in that a portion of the first annular pad 26 is removed in a region corresponding to the first notch to form the first notch 261. That is, in this embodiment, in the first notch corresponding region in the axial direction O of the second through hole 27, the first annular land 26 is not completely removed, but only partially removed, and a part is left. For example, in this embodiment, in the area corresponding to the first notch 261, the bottom of the first annular pad 26 is removed, the top is retained, and the first notch 261 is formed, and the first notch 261 serves as the air release hole 3, so as to achieve the purpose of reducing the pressure of the air flow passage. This embodiment has an advantage in that the operation of the first notch 261 can be completed before the shipment of the differential pressure sensor package structure, and the air escape hole 3 can be controlled to a relatively small range as compared with the fourth embodiment.

Sixth embodiment

Fig. 9 is a schematic bottom view of a differential pressure sensor package structure according to a sixth embodiment of the present invention in an area a shown in fig. 1, fig. 10 is a schematic cross-sectional view along a direction B-B in fig. 9, please refer to fig. 9 and fig. 10, the sixth embodiment is different from the fourth embodiment in that, in an area corresponding to the first gap 261, the first annular pad 26 is completely removed to form the first gap 261, and a bottom of the differential pressure sensor package structure 2 has a groove corresponding to the first gap 261, and the groove and the first gap 261 serve as the air release hole 3. Specifically, the bottom of the base plate 21 is provided with a groove 211 corresponding to the first notch 261, the groove 211 is recessed toward the inside of the base plate 21, and the groove 211 and the first notch 261 together form the air release hole 3, so as to increase the volume of the air release hole 3. This embodiment has an advantage in that the operation of the first notch 261 can be completed before the differential pressure sensor package is shipped from the factory, and the air release hole 3 is enlarged as compared with the fourth and fifth embodiments, thereby further reducing the pressure of the air flow passage.

Seventh embodiment

Fig. 11 is a schematic bottom view of a differential pressure sensor package structure according to a seventh embodiment of the present invention in an area a shown in fig. 1, fig. 12 is a schematic cross-sectional view along a direction B-B in fig. 11, please refer to fig. 11 and fig. 12, the seventh embodiment is different from the fourth embodiment in that a solder mask 27 is disposed at the bottom of the differential pressure sensor package structure 2, in an area corresponding to the first notch 261, the first annular pad 26 is completely removed to form the first notch 261, and at least in the area corresponding to the first notch 261, the solder mask 27 is windowed to serve as the air release hole 3 together with the first notch 261. Specifically, in the present embodiment, the solder resist layer 27 is provided on the bottom of the substrate 21. In the area corresponding to the first gap 261 and the area (shown by hatching in fig. 11) away from the first annular pad 26, the solder resist layer 27 is windowed to serve as the air release hole 3 together with the first gap 261. In other embodiments of the present invention, the solder resist layer 27 may be windowed only in the area corresponding to the first notch 261. This embodiment has an advantage in that the operation of the first notch 261 can be completed before the differential pressure sensor package is shipped from the factory, and the air release hole 3 is enlarged as compared with the fourth and fifth embodiments, thereby further reducing the pressure of the air flow passage.

Eighth embodiment

Fig. 13 is a bottom view of a differential pressure sensor package structure according to a sixth embodiment of the electronic device of the present invention in an area a shown in fig. 1, fig. 14 is a cross-sectional view along a direction C-C in fig. 13, please refer to fig. 13 and fig. 14, the eighth embodiment is different from the seventh embodiment in that a first blocking block 262 protruding from the first annular pad 26 is disposed on an edge of the first gap 261 on the first annular pad 26. The first stopper 262 can limit the height of the solder 4 connecting the first annular pad 26 and the second annular pad 12, and further can limit the size of the air release hole 3 to prevent the air release hole from being too large and affecting the normal operation of the electronic device. Meanwhile, the first blocking block 262 can also prevent the solder 4 from flowing to the windowing region of the solder mask layer 27, so as to avoid the occurrence of short circuit and the like.

Ninth embodiment

In the first to eighth embodiments, the air release hole 3 is provided on the side wall of the first through hole 20, the second through hole 27, or the airflow hole 11, and in the ninth embodiment, the air release hole 3 is provided on the side wall of the third through hole 13. Fig. 15 is a schematic top view of a circuit board of a ninth embodiment of the electronic device of the present invention in an area a shown in fig. 1, fig. 16 is a schematic cross-sectional view taken along a direction B-B in fig. 15, please refer to fig. 15 and fig. 16, the ninth embodiment is different from the first embodiment in that the air release hole 3 is disposed on a side wall of the third through hole 13. Specifically, the second ring pad 12 has a second notch 121, and the second notch 121 is the air release hole 3. In this embodiment, in the axial direction O of the third through hole 13, the second ring pad 12 is completely removed in the area corresponding to the second notch 121 to form the second notch 121. That is, in this embodiment, the second ring pad 12 is not a closed pattern, but a non-closed pattern interrupted by the second notch 121, and the second notch 121 serves as the air release hole 3, so as to reduce the pressure of the air flow channel. This embodiment has the advantage that the second notch 121 can be formed before the differential pressure sensor package is combined with the body, which is simpler to operate than a differential pressure sensor package, and does not require additional operations on the differential pressure sensor package, thus saving costs.

The structure of the first annular bonding pad 26 at the bottom of the differential pressure sensor package structure 2 may be the same as the structure of the first annular bonding pad 26 in the first to eighth embodiments, and is not described again. Further, the first notch 261 of the first ring pad 26 may be directly opposite to the second notch 121 of the second ring pad 12 to collectively serve as the relief hole 3.

Tenth embodiment

Fig. 17 is a schematic top view of a circuit board of a tenth embodiment of the electronic device of the present invention in an area a shown in fig. 1, and fig. 18 is a schematic cross-sectional structure along a direction B-B in fig. 17, please refer to fig. 17 and fig. 18, the tenth embodiment is different from the ninth embodiment in that a portion of the second ring pad 12 is removed in an area corresponding to the second gap to form the second gap 121. That is, in this embodiment, in the direction along the axial direction O of the third through hole 13, in the area corresponding to the second notch 121, the second ring pad 12 is not completely removed, but only partially removed, and a part is remained. For example, in this embodiment, in the area corresponding to the second notch 121, the top of the second ring pad 12 is removed, the bottom is reserved, and the second notch 121 is formed, and the second notch 121 serves as the air release hole 3, so as to achieve the purpose of reducing the pressure of the air flow channel. This embodiment has the advantage that the second notch 121 can be formed before the differential pressure sensor package is coupled to the body, which is simpler with respect to handling on the differential pressure sensor package and enables the bleed hole 3 to be controlled to a relatively small extent compared to the ninth embodiment.

Eleventh embodiment

Fig. 19 is a schematic top view of a circuit board of an eleventh embodiment of the electronic device of the present invention at a region a shown in fig. 1, fig. 20 is a schematic cross-sectional view along a direction B-B in fig. 19, please refer to fig. 19 and fig. 20, the difference between the eleventh embodiment and the ninth embodiment is that in a region corresponding to the second notch 121, the second ring pad 12 is completely removed to form the second notch 121, and a bottom of a top of the circuit board 1 has a groove corresponding to the second notch 121, and the groove and the second notch 121 serve as the air release hole 3. Specifically, the top of the circuit board 1 is provided with a groove 100 corresponding to the second notch 121, the groove 100 is recessed towards the inside of the circuit board 1, and the groove 100 and the second notch 121 together form the air release hole 3, so as to increase the volume of the air release hole 3. This embodiment has the advantage that the second notch 121 can be formed before the differential pressure sensor package is combined with the body, which is simpler than performing operations on the differential pressure sensor package, and the air release hole 3 is enlarged compared to the ninth and tenth embodiments, further reducing the pressure of the air flow passage.

The structure of the first annular bonding pad 26 at the bottom of the differential pressure sensor package structure 2 may be the same as the structure of the first annular bonding pad 26 in the first to eighth embodiments, and is not described again. Further, the first notch 261 of the first annular pad 26 may be opposite to the second notch 121 of the second annular pad 12, and the groove 100 at the top of the circuit board 1 is opposite to the groove 211 at the bottom of the differential pressure sensor package structure 2, so as to jointly serve as the air release hole 3.

Twelfth embodiment

Fig. 21 is a schematic top view of a circuit board of a twelfth embodiment of the electronic device of the present invention at a region a shown in fig. 1, fig. 22 is a schematic cross-sectional structure along a direction B-B in fig. 21, please refer to fig. 21 and fig. 22, the twelfth embodiment is different from the ninth embodiment in that the circuit board 1 has a solder resist layer 14 on the top, in a region corresponding to the second notch 121, the second annular pad 12 is completely removed to form the second notch 121, and at least in the region corresponding to the second notch 121, the solder resist layer 14 is windowed to be used as the air release hole 3 together with the second notch 121. Specifically, in the present embodiment, the solder resist layer 14 is provided on top of the circuit board 1. In the area corresponding to the second gap 121 and the area deviating from the second ring pad 12, the solder mask layer 14 is windowed to be used as the air release hole 3 together with the second gap 121. In other embodiments of the present invention, the solder resist layer 14 may be windowed only in the area corresponding to the second notch 121. This embodiment has the advantage that the second notch 121 can be formed before the differential pressure sensor package is combined with the body, which is simpler than performing operations on the differential pressure sensor package, and the air release hole 3 is enlarged compared to the ninth and tenth embodiments, further reducing the pressure of the air flow passage.

The structure of the first annular bonding pad 26 at the bottom of the differential pressure sensor package structure 2 may be the same as the structure of the first annular bonding pad 26 in the first to eighth embodiments, and is not described again. Further, the first notch 261 of the first annular pad 26 may be aligned with the second notch 121 of the second annular pad 12, and the window of the solder resist layer 14 on the top of the circuit board 1 is aligned with the window of the solder resist 27 at the bottom of the differential pressure sensor package structure 2 to serve as the air release hole 3.

Thirteenth embodiment

Fig. 23 is a schematic top view of a circuit board of a thirteenth embodiment of the electronic device of the present invention in an area a shown in fig. 1, fig. 24 is a schematic cross-sectional structure along a direction C-C in fig. 23, please refer to fig. 23 and fig. 24, the thirteenth embodiment is different from the twelfth embodiment in that a second stopper 122 protruding from the second ring pad 12 is disposed on an edge of the second gap 121 on the second ring pad 12. The second barrier 122 can limit the height of the solder 4 connecting the second annular pad 12 and the first annular pad 26, and further can limit the size of the formed air release hole 3, so as to prevent the air release hole from being too large and affecting the normal operation of the electronic device. Meanwhile, the second blocking bump 122 can also prevent the solder 4 from flowing to the windowed area of the solder mask layer 14, so as to avoid short circuit and the like.

The structure of the first annular bonding pad 26 at the bottom of the differential pressure sensor package structure 2 may be the same as the structure of the first annular bonding pad 26 in the first to eighth embodiments, and is not described again. Further, the first notch 261 of the first annular pad 26 may be aligned with the second notch 121 of the second annular pad 12, and the window of the solder resist layer 14 on the top of the circuit board 1 is aligned with the window of the solder resist 27 at the bottom of the differential pressure sensor package structure 2 to serve as the air release hole 3. The second block 122 abuts against the first block 262 to prevent solder from flowing to the windowed area of the solder mask.

Fourteenth embodiment

Fig. 25 is a schematic cross-sectional view of a pressure difference sensor package structure according to a fourteenth embodiment of the electronic device of the present invention, please refer to fig. 25, wherein the pressure sensor package structure 2 includes a substrate 21, a housing 22 and a pressure sensing element 23. The edge of the housing 22 is fixed to the front surface of the substrate 21, and a first cavity 24 is formed between the housing and the substrate 21. The first through hole 20 penetrates the substrate 21. The pressure sensing element 23 is fixed on the front surface of the substrate 21 and located in the first cavity 24. The pressure sensing element 23 has a second cavity 231 and a pressure sensing layer 232, the pressure sensing layer 232 is located between the first cavity 24 and the second cavity 231, and the second cavity 231 is communicated with the airflow hole through the first through hole 20 to form the airflow channel. A fifth through hole 25 is further disposed on the housing 22, and the fifth through hole 25 is communicated with the first cavity 24.

In this embodiment, the air leakage hole 3 is disposed on the sidewall of the second cavity 231. Specifically, the pressure sensing element 23 further includes a supporting structure 233 for supporting an edge of the pressure sensing layer 232, the supporting structure 233 serves as a side wall of the second cavity 231, and the air release hole 3 penetrates through the supporting structure 233 to communicate with the second cavity 231, and further communicate with the airflow channel, so as to reduce the pressure of the airflow channel. The advantage of this embodiment is that can accomplish the operation to disappointing hole 3 before pressure differential sensor packaging structure leaves the factory, easy operation does not need extra cost that increases pressure differential sensor packaging structure. In other embodiments of the present invention, the air release hole 3 may not be disposed on the sidewall of the second cavity 231, but may be disposed as shown in the first to the thirteenth embodiments.

Further, the pressure sensing element 23 is connected to the substrate 21 through a sealing layer 28. Specifically, the supporting structure 233 is connected to the substrate 21 through a sealing layer 28, so that the first cavity 24 is not communicated with the second cavity 231.

Fifteenth embodiment

Fig. 26 is a schematic cross-sectional view of a pressure difference sensor package structure according to a fifteenth embodiment of the electronic device of the present invention, please refer to fig. 26, and in this embodiment, a position of the air release hole 3 is changed relative to the fourteenth embodiment. Specifically, in the present embodiment, the air leakage hole 3 is not disposed on the sidewall of the second cavity 231, but is disposed on the sealing layer 28. The sealing layer 28 has a through hole 29, and the through hole 29 communicates the first through hole 20 and the second cavity 231. The air release hole 3 is arranged on the side wall of the through hole 29, namely, the air release hole 3 penetrates through the sealing layer 28 and is communicated with the outside, so that the purpose of reducing the pressure of the air flow channel is achieved. The advantage of this embodiment is that the operation of the air release hole 3 can be completed before the differential pressure sensor package is shipped, the operation is simple, the additional cost of the differential pressure sensor package is not required to be added, and compared with the fourteenth embodiment, the operation of the pressure sensing element 23 is not required, but the sealing layer is operated, and the pressure sensing element 23 can be prevented from being damaged.

In this embodiment, the air release hole 3 penetrates through the sealing layer, and it is understood that, in other embodiments of the present invention, when the pressure sensing element 23 is fixed on the substrate 21, no sealing material may be provided in the area corresponding to the air release hole 3, so as to form the air release hole 3 in the sealing layer.

In the above embodiments, only the case where one air release hole is provided is illustrated, but in other embodiments of the present invention, the number of air release holes may be plural.

For example, in the fourth embodiment, the first annular pad 26 has a first notch 261, and in other embodiments, as shown in fig. 27, which is a bottom schematic view of a differential pressure sensor package structure of a sixteenth embodiment of the electronic device of the present invention at the area a shown in fig. 1, in this embodiment, the first annular pad 26 has four first notches 261, and the four first notches 261 can form four air release holes. Further, the four first notches 261 are symmetrically disposed with respect to the central axis of the second through hole 27 as a symmetry axis. As shown in fig. 28, which is a bottom schematic view of a differential pressure sensor package structure at the area a shown in fig. 1 according to a seventeenth embodiment of the electronic device of the present invention, in this embodiment, the first annular pad 26 has two first notches 261, and the two first notches 261 can form two air release holes. Further, the two first notches 261 are symmetrically disposed with the central axis of the second through hole 27 as a symmetry axis, so as to simplify the process. It is understood that, in other embodiments of the present invention, the first gap 261 can be in other numbers, which is not limited by the present invention.

For another example, in the ninth embodiment, the second ring pad 12 has one second notch 121, and in other embodiments, the second ring pad 12 has a plurality of second notches 121. The arrangement may refer to the arrangement of the first notch 261.

For another example, in the fifteenth embodiment, the sidewall of the through hole 29 has one relief hole 3, while in other embodiments of the present invention, the sidewall of the through hole 29 has a plurality of relief holes, and the plurality of relief holes can be symmetrically distributed with the central axis of the through hole 29 as the symmetry axis.

The utility model discloses electronic equipment can be the electron cigarette, wherein, the air current hole can with the atomizing passageway intercommunication in the electron cigarette, so that pressure differential sensor packaging structure can sensing atomizing passageway and external pressure differential to realize the start-up of electron cigarette.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. An electronic device, comprising:

a main body having an airflow hole;

2. The electronic device of claim 1, wherein an annular pad is disposed between the differential pressure sensor package and the body, the annular pad having a via in a center thereof, the via connecting the first via and the airflow aperture.

3. The electronic device of claim 2, wherein the air escape hole is disposed at a sidewall of the first through hole, the via hole, or the airflow hole.

4. The electronic device of claim 2, wherein the annular pad has at least one indentation that forms the relief hole.

5. The electronic device according to claim 4, wherein when the annular pad has a plurality of notches, the plurality of notches are arranged symmetrically with respect to a central axis of the via.

6. The electronic device of claim 4, wherein the annular pad is partially or completely removed at the notch corresponding region in the via axial direction to form the notch.

7. The electronic device of claim 6, wherein in the area corresponding to the gap, the annular pad is completely removed to form the gap, and the bottom of the differential pressure sensor package structure has a groove corresponding to the gap, and the groove and the gap are used as the air release hole.

8. The electronic device of claim 6, wherein the bottom of the differential pressure sensor package structure has a solder mask, and in the area corresponding to the gap, the annular pad is completely removed to form the gap, and in at least the area corresponding to the gap, the solder mask is windowed to serve as the air release hole together with the gap.

9. The electronic device according to claim 8, wherein a stopper protruding from the annular pad is provided on the annular pad at an edge of the notch.

10. The electronic device according to claim 6, wherein in a case where the annular land is completely removed in the area corresponding to the notch to form the notch, the main body has a groove corresponding to the notch, the groove and the notch serving as the relief hole.

11. The electronic device according to claim 6, wherein the main body surface has a solder resist layer, and in the case where the annular land is completely removed at the area corresponding to the notch to form the notch, the solder resist layer is windowed at least at the area corresponding to the notch to function as the relief hole in cooperation with the notch.

12. The electronic device of claim 1, wherein the differential pressure sensor package structure comprises:

a housing;

13. The electronic device according to claim 12, wherein the pressure sensing element is connected to the substrate through a sealing layer, the sealing layer having a through hole, the through hole communicating the first through hole and the second cavity.

14. The electronic device according to claim 12 or 13, wherein the air release hole is provided in a sidewall of the second cavity, or in a sidewall of the through hole when the pressure sensing element is connected to the substrate through a sealing layer having a through hole.

15. The electronic device of claim 1, wherein the electronic device is an electronic cigarette.