JP2012207931A - Pressure sensor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensor package capable of preventing irradiation of light or mixing-in of a foreign object from a pressure introduction hole and preventing a deterioration of characteristics of a pressure sensor.SOLUTION: A pressure sensor package 1A includes: a box-shaped package body 20 mounted with a pressure sensor 10; and a lid 30 covering the package body 20 with a space 21 secured in the upper part of a diaphragm 11 provided in the upper side of the pressure sensor 10. The package body 20 is formed of resin. The package body 20 is formed with a pressure introduction hole 29 communicated to the space 21 from the outside. At least a part of the pressure introduction hole 29 is provided along a metal wiring pattern that is connected to the pressure sensor 10 and extends to the outside of the package body 20.

Description

  The present invention relates to a pressure sensor package in which a diaphragm type pressure sensor is mounted.

  A pressure sensor is a device that measures the pressure of a gas or liquid with a pressure-sensitive element via a diaphragm, converts the pressure into an electrical signal, and outputs the electrical signal. In principle, a semiconductor strain gauge is formed on the surface of the diaphragm, and changes in electrical resistance due to the piezoresistive effect, which is a pressure-sensitive resistance element generated by deformation of the diaphragm by external force (pressure), are converted into electrical signals. is doing.

  Depending on what pressure is used as the external force (pressure), the above pressure sensor measures absolute pressure based on the absolute vacuum, and any comparison pressure such as atmospheric pressure It is roughly classified into two types: a differential pressure (relative pressure) pressure sensor that measures a pressure expressed with respect to (reference pressure).

  For example, a pressure sensor package disclosed in Patent Document 1 is known as a related art related to a pressure sensor package on which the diaphragm type pressure sensor is mounted.

  As shown in FIG. 7, the pressure sensor package 100 disclosed in Patent Document 1 includes a rectangular box-shaped package 101 to which an absolute pressure sensor 110 is fixed, and a lid 120 that is a lid that covers the upper opening of the package 101. And. The absolute pressure sensor 110 has a vacuum cavity 111 therein, and a plurality of piezoresistors (not shown) in which the deformation of the diaphragm 112 due to the pressure difference between the vacuum cavity 111 and the outside is arranged around the diaphragm 112. Therefore, the size is detected. The detection value of the absolute pressure sensor 110 is output to an external device (not shown) via an external connection terminal 102 formed on the lower side of the rectangular box-shaped package 101.

  In the lid 120, an opening 121, which is a pressure guiding portion, is formed immediately above the absolute pressure sensor 110, that is, at the center position of the lid 120, thereby exposing the inside of the pressure sensor package 100 to the pressure to be measured. It is like that.

  Another conventional pressure sensor package is disclosed in Patent Document 2. In the pressure sensor package 200 disclosed in the above-mentioned Patent Document 2, as shown in FIGS. 8A and 8B, pressure introduction holes 221 and 221 are formed at both diagonal ends of the lid body 220 having a square planar shape. Is formed.

JP 2010-96505 A (published on April 30, 2010) Japanese Patent Laying-Open No. 2010-28169 (released on December 16, 2010)

  However, in the pressure sensor packages disclosed in the above-described conventional patent documents 1 and 2, a pressure introduction hole is formed in the lid.

  As a result, since the pressure introducing hole exists on the pressure sensor, there is a problem that light is irradiated to the pressure sensor and the characteristics of the pressure sensor are deteriorated.

  Further, when the pressure sensor package is manufactured in a sheet shape and separated into individual pieces after assembling, foreign matters such as water and cutting waste may be mixed from the pressure introduction hole, which may deteriorate the characteristics of the pressure sensor.

  The present invention has been made in view of the above-described conventional problems, and the object thereof is to prevent light irradiation or foreign matter from being introduced from the pressure introducing hole, and thus prevent deterioration of the characteristics of the pressure sensor. The object is to provide a pressure sensor package.

  In order to solve the above problems, the pressure sensor package of the present invention includes a box-shaped package body on which the pressure sensor is mounted, and a lid body that covers the package body in a state where a space is secured above the diaphragm of the pressure sensor. The package body is made of resin, and the package body has a pressure introduction hole communicating with the space from the outside, and the pressure introduction hole is a pressure sensor. It is characterized in that at least a part is provided along a metal wiring pattern that is connected to and extends to the outside of the package body.

  According to the above invention, the package body is formed with the pressure introduction hole communicating with the space from the outside. The pressure introducing hole is provided at least partially along the metal wiring pattern connected to the pressure sensor and extending to the outside of the package body. That is, in the pressure sensor package of the present invention, the pressure introducing hole is not provided in the lid body, but is provided in the package body. For this reason, the pressure introduction hole does not exist on the pressure sensor.

  As a result, the pressure sensor is not irradiated with light, and the characteristics of the pressure sensor are not deteriorated.

  In addition, even when the pressure sensor package is manufactured in a sheet shape and separated into pieces after assembling, if there is a pressure introduction hole on the pressure sensor, foreign matters such as water and cutting waste are likely to be mixed from the pressure introduction hole. . However, in the present invention, since the pressure introduction hole is provided in the package body, there is little possibility that foreign matters such as water and cutting waste are mixed from the pressure introduction hole. For this reason, the characteristic in the pressure sensor does not deteriorate due to the foreign matter mixed in the pressure sensor.

  Furthermore, in the present invention, the package body is made of resin. That is, in this type of pressure sensor package, conventionally, a hard ceramic is often used even if the package body is thin. For this reason, the pressure sensor package becomes expensive, and the processing of the package body is not easy, so the yield cannot be improved.

  In this regard, the present invention is inexpensive because the package body is formed of resin. Further, complicated processing can be easily performed by injection molding or the like.

  As a result, an inexpensive and highly productive pressure sensor package can be provided.

  Therefore, it is possible to provide a pressure sensor package that can prevent light irradiation or foreign matter from being introduced from the pressure introduction hole, and thereby prevent deterioration of the characteristics of the pressure sensor.

  In the pressure sensor package of the present invention, the pressure introducing hole is formed in the bottom surface of the package body, and is provided in parallel to the through electrode wiring that is the metal wiring pattern formed in the bottom surface of the package body. It can be.

  That is, in the present invention, the pressure introducing hole is a through hole that is formed in the bottom surface of the package body and communicates with the space above the diaphragm.

  Therefore, it is possible to provide a pressure sensor package that can surely prevent light irradiation or foreign matter from being introduced from the pressure introduction hole, and further prevent deterioration of the characteristics of the pressure sensor.

  In this type of pressure sensor package, the lead-out wiring from the pressure sensor is normally performed by a through wiring formed on the bottom surface of the package body. Therefore, in the step of forming the through hole for the through wiring, the through hole for the pressure introducing hole may be formed, so that the trouble of separately providing the step of forming the through hole for the pressure introducing hole is not necessary. Does not occur. As a result, the pressure introducing hole is formed on the bottom surface of the package body, and is provided in parallel to the through electrode wiring which is the metal wiring pattern formed on the bottom surface of the package body.

  In the pressure sensor package of the present invention, the opening position of the pressure introduction hole to the space is higher than the pressure sensor mounting floor of the package body on which the pressure sensor is mounted, and the contact surface between the lid and the package body Preferably it is lower than the position.

  That is, on the pressure sensor mounting floor of the package body on which the pressure sensor is mounted, the pressure sensor is usually bonded to the pressure sensor mounting floor with an adhesive. At this time, when the opening position of the pressure introducing hole to the space is the same or lower than the pressure sensor mounting floor, the adhesive flows into the opening position of the pressure introducing hole to the space, and the pressure introducing hole is There is a risk of blockage.

  In this respect, in the present invention, the position of the pressure introduction hole to the space is higher than the pressure sensor mounting floor of the package body on which the pressure sensor is mounted, and therefore the pressure introduction hole is not blocked by the adhesive.

  Moreover, since the opening position of the pressure introducing hole into the space is lower than the position of the contact surface between the lid and the package body, the pressure introducing hole is not blocked by the lid.

  In the pressure sensor package of the present invention, the package body is provided with a metal wiring pattern connected to the pressure sensor so as to extend from the inside of the package body to the outer bottom surface via the outer wall surface, It can be said that it is parallel to the metal wiring pattern extending on the outer wall surface.

  Thereby, wirings, such as a signal line from a pressure sensor, can be taken out, without providing a penetration wiring. Therefore, it is not necessary to provide a through hole for through wiring in the package body, and the number of man-hours can be reduced.

  In the pressure sensor package of the present invention, the pressure introduction hole is formed on a side surface of the package body, and a metal wiring pattern connected to the pressure sensor is provided in the package body from the inside of the package body. And extending to the outer bottom surface through the outer wall surface.

  Thereby, since the pressure introduction hole is formed in the side surface of the package body, the pressure introduction hole does not exist on the pressure sensor. As a result, the pressure sensor is not irradiated with light, and the characteristics of the pressure sensor are not deteriorated.

  In addition, even when the pressure sensor package is manufactured in a sheet shape and separated into pieces after assembling, if there is a pressure introduction hole on the pressure sensor, foreign matters such as water and cutting waste are likely to be mixed from the pressure introduction hole. . However, in the present invention, since the pressure introduction hole is provided on the side surface of the package body, there is little possibility that foreign matters such as water and cutting waste are mixed from the pressure introduction hole. For this reason, the characteristic in the pressure sensor does not deteriorate due to the foreign matter mixed in the pressure sensor.

  In the present invention, the package body is provided with a metal wiring pattern connected to the pressure sensor so as to extend from the inside of the package body to the outer bottom surface through the outer wall surface through the pressure introduction hole. For this reason, wiring such as a signal line from the pressure sensor can be taken out without providing a through wiring. Moreover, in the conventional pressure sensor package, since the through-hole is provided in the lid body, an additional process for forming the hole is required. On the other hand, in the present invention, since it is not necessary to form a through hole in the lid, the number of manufacturing steps can be reduced in that respect. In the present invention, the pressure introducing hole can be formed on the side surface of the package body by injection molding.

  In the pressure sensor package of the present invention, the pressure introduction hole is formed in a side surface of the package body, and the pressure introduction hole formed in the side surface of the package body has an inclined surface that descends from the inside toward the outside. It can be said that it is formed.

  As a result, an inclined surface is formed in the pressure introduction hole formed in the side surface of the package body, and the inclined surface is higher than the outside toward the inside. Is difficult to mix.

  For this reason, it can prevent that foreign materials, such as water and cutting waste, mix from a pressure introduction hole, and can prevent the fall of the characteristic of a pressure sensor by extension.

  In the pressure sensor package of the present invention, the pressure introduction hole is formed on a side surface of the package body, and the pressure introduction hole formed on the side surface of the package body is subjected to water repellent treatment or surface roughness adjustment. Can be.

  Thereby, when the pressure introduction hole is subjected to water repellent treatment, it is possible to prevent water from entering. In addition, when the pressure introduction hole has a surface roughness adjusted, it is possible to prevent foreign matters such as cutting dust from entering.

  In the pressure sensor package of the present invention, the pressure introducing hole may be filled with a ventilation resin that allows air to pass but does not pass water.

  As a result, the pressure introduction hole is closed with the ventilation resin. However, since the ventilation resin filled in the pressure introduction hole allows air to pass therethrough, the communication between the outside air and the space above the diaphragm provided above the cavity in the pressure sensor package is ensured in the pressure introduction hole. .

  On the other hand, the breathable resin filled in the pressure introduction hole does not pass water. Therefore, mixing of foreign matters such as water or cutting waste can be reliably prevented.

  In the pressure sensor package of the present invention, it is preferable that an insulating film is provided on the back surface of the lid.

  Thereby, it can prevent that the cover body which consists of metals short-circuits with a pressure sensor, a wire, or a metal wiring pattern.

  In the pressure sensor package of the present invention, it is preferable that a through wiring for grounding the lid body is formed in a part of a contact portion with the lid body in the package body. Note that the lid may be a metal or a non-conductor. The grounding is performed, for example, via an external device connected to the pressure sensor package.

  Thereby, the electric charge accumulated in the lid can be grounded through the through wiring.

  As described above, in the pressure sensor package of the present invention, the package body is made of resin, and the package body has a pressure introduction hole communicating with the space from the outside, and the pressure introduction hole. Is provided at least partially along a metal wiring pattern connected to the pressure sensor and extending to the outside of the package body.

  Therefore, there is an effect that it is possible to provide a pressure sensor package that can prevent light irradiation or foreign matter from being introduced from the pressure introduction hole, and thereby prevent deterioration of the characteristics of the pressure sensor.

(A) shows one Embodiment of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the AA 'line cross section of Fig.1 (a). FIG. 2C is a cross-sectional view taken along the line BB ′ of FIG. 1A, and FIG. 4D is a cross-sectional view taken along the line CC ′ of FIG. (A) shows the modification of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is AA 'line sectional drawing of Fig.2 (a). FIG. 2C is a sectional view taken along line BB ′ in FIG. 2A, and FIG. 2D is a sectional view taken along line CC ′ in FIG. (A) shows the other modification of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the AA 'line cross section of Fig.3 (a). FIG. 3C is a cross-sectional view taken along the line BB ′ of FIG. 3A, FIG. 3D is a cross-sectional view taken along the line CC ′ of FIG. 3A, and FIG. It is DD 'sectional view taken on the line of (a). (A) shows other embodiment of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the AA 'line | wire of Fig.4 (a). 4C is a cross-sectional view taken along the line BB ′ of FIG. 4A, FIG. 4D is a cross-sectional view taken along the line CC ′ of FIG. 4A, and FIG. It is DD 'sectional view taken on the line of 4 (a). (A) shows the other modification of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the AA 'line cross section of Fig.5 (a). FIG. 5C is a cross-sectional view taken along the line BB ′ in FIG. 5A, and FIG. 5D is a cross-sectional view taken along the line CC ′ in FIG. (A) shows the other modification of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the AA 'line | wire of Fig.6 (a). It is sectional drawing, (c) is BB 'sectional view taken on the line of Fig.6 (a), (d) is CC' sectional view taken on the line of Fig.6 (a). It is sectional drawing which shows the structure of the conventional pressure sensor package. It is sectional drawing which shows the structure of the other conventional pressure sensor package.

[Embodiment 1]
An embodiment of the present invention will be described below with reference to FIGS.

  The pressure sensor package of the present embodiment is a package in which a pressure sensor such as an absolute pressure sensor is mounted, for example. In the following description, it is assumed that the pressure sensor is an absolute pressure sensor. However, the pressure sensor is not necessarily limited to this, and may be a differential pressure (relative pressure) pressure sensor that measures a pressure expressed with respect to an arbitrary pressure to be compared (reference pressure) such as atmospheric pressure.

  The configuration of the pressure sensor package 1A according to the present embodiment will be described with reference to FIGS. FIG. 1A is a plan view showing the configuration of the pressure sensor package 1A of the present embodiment, FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG. 1A, and FIG. ) Is a cross-sectional view taken along line BB ′ of FIG. 1A, and FIG. 1D is a cross-sectional view taken along line CC ′ of FIG.

  In the present embodiment, a pressure sensor package in which a pressure introduction hole is formed on the bottom surface of the package body will be described.

  As shown in FIGS. 1A to 1D, the pressure sensor package 1 </ b> A according to the present embodiment has a space above the cavity 12, which will be described later, for example, a rectangular box-shaped package body 20 on which the pressure sensor 10 is mounted. 21 is provided with a lid 30 as a lid that covers the opening of the package main body 20 in a state in which 21 is secured.

  The pressure sensor 10 is an absolute pressure sensor, and forms a piezoresistor (not shown) as a plurality of pressure-sensitive resistor elements on the periphery of the diaphragm 11, and has, for example, a cylindrical shape on a surface opposite to the surface where the piezoresistor is formed. And a semiconductor sensor substrate 13 having a cavity 12 formed of a space portion in a vacuum state.

  In the pressure sensor 10 including the absolute pressure sensor having the above-described configuration, when the diaphragm 11 is distorted according to the pressure of the space 21 added to the outer surface, the resistance values of a plurality of piezoresistors change according to the degree of distortion. The midpoint potential of the bridge circuit constituted by a plurality of piezoresistors is output as a sensor output to an external device (not shown). As a result, the absolute pressure can be measured.

  The box-shaped package body 20 is formed of resin by injection molding, and has a two-step recess. That is, the package body 20 includes a shallow wide concave portion 22 and a narrow deep concave portion 23 formed inside the shallow wide concave portion 22, and the horizontal cross section of each of the shallow wide concave portion 22 and the narrow deep concave portion 23 is square. It has become.

  The pressure sensor 10 described above is mounted by being bonded to a narrow depth recess bottom 23a as a pressure sensor mounting floor in the narrow depth recess 23 of the package body 20 with a die bonding resin 24 as an adhesive. In the present embodiment, the position of the upper surface of the diaphragm 11 in the pressure sensor 10 is higher than the shallow wide recess bottom 22 a of the shallow wide recess 22. A plurality of pads 14 are formed around the diaphragm 11 of the pressure sensor 10, and wires 15 made of, for example, gold (Au) are connected to the pads 14.

  The other end of the wire 15 is connected to a wire bonding pad 25 formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20. The wire bonding pad 25 is formed on the through via wiring 26 as the through electrode wiring formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20 and the outer bottom surface 20 a that is the back surface of the package body 20. The external connection terminal 27 is connected. The wire bonding pad 25, the through via wiring 26, and the external connection terminal 27 constitute the metal wiring pattern of the present invention.

  As a result, the electrical signal from the piezoresistor of the pressure sensor 10 is electrically connected to an external device (not shown) via the wire 15, the wire bonding pad 25, the through via wiring 26 and the external connection terminal 27. Yes.

  The lid 30 is made of, for example, a metal plate and covers the opening of the package body 20. In the present embodiment, the lid 30 is bonded in a state where it is placed on a pedestal 28 that rises from the shallow wide recess bottom 22 a at the four corners of the rectangular shallow wide recess 22 in the package body 20. The lid 30 is not necessarily limited to a metal plate, and may be made of a non-conductor. Further, the adhesion locations are not necessarily limited to the four corners.

  Here, in the lid 30 made of the metal plate, charges may accumulate. As described above, when the lid 30 has a charge, the charge of the lid 30 may adversely affect the pressure sensor 10. For example, a failure such as a large voltage fluctuation of the pressure sensor 10 occurs.

  Therefore, in the present embodiment, in order to prevent the lid 30 from having an electric charge, as shown in FIGS. 2A to 2D, a ground line 40 as a through wiring is provided in the lid 30. The pressure sensor package 1B can be obtained. That is, when the lid 30 is grounded, for example, the ground through hole 41 is formed in the base 28 with which the lid 30 is in contact, and the ground wire 40 is provided in the ground through hole 41. An external connection terminal 42 connected to the ground line 40 is provided on the outer bottom surface 20 a of the package body 20. As a result, the electric charge accumulated in the lid 30 is grounded to the ground of an external device (not shown) via the ground line 40 and the external connection terminal 42.

  Next, in the pressure sensor packages 1 </ b> A and 1 </ b> B configured as described above, a pressure introduction hole that communicates the space 21 above the diaphragm 11 provided above the cavity 12 and the outside air is essential. Conventionally, the pressure introduction hole is provided in the lid for ease of processing or the like. However, when the pressure introduction hole is provided in the lid, the pressure sensor is irradiated with light, and the characteristics of the pressure sensor are deteriorated. Has the problem. Further, when the pressure sensor package is manufactured in a sheet shape and separated into individual pieces after assembly, there is a possibility that foreign matters such as water and cutting waste may be mixed from the pressure introduction hole and deteriorate the characteristics of the pressure sensor.

  Therefore, in order to solve this problem, in the pressure sensor packages 1A and 1B of the present embodiment, as shown in FIGS. 1 (a) and 1 (d), the pressure introducing hole 29 is provided outside the package body 20. One is formed on the bottom surface 20a. In the present embodiment, only one pressure introduction hole 29 is provided. However, the present invention is not limited to this, and a plurality of pressure introduction holes 29 may be provided.

  That is, in the pressure sensor packages 1A and 1B of the present embodiment, the through-hole is formed from the outer bottom surface 20a of the package body 20 toward the shallow wide recess bottom 22a of the shallow wide recess 22 in the package body 20, thereby An introduction hole 29 is formed. As a result, the opening position of the pressure introduction hole 29 at the shallow wide concave bottom 22a is higher than the position of the narrow deep concave bottom 23a in the narrow deep concave 23 of the package body 20, and is higher than the pedestal 28 where the lid 30 is bonded. It is in a low position.

  The cross-sectional shape of the pressure introducing hole 29 is circular in the present embodiment, and the diameter of the circle is, for example, about 0.1 mm. However, the shape is not limited to a circle, and may be a square, a polygon, an ellipse, or the like. Also, the dimensions are not limited to this.

  As a result, since the pressure introducing hole 29 is provided in the package body 20, there is no problem that the pressure sensor 10 is irradiated with light and the characteristics of the pressure sensor 10 are deteriorated. In addition, when the pressure sensor packages 1A and 1B are manufactured in a sheet form and separated into pieces after assembly, there is a problem that foreign matters such as water and cutting waste are mixed from the pressure introduction hole 29 and the characteristics of the pressure sensor 10 are deteriorated. It does not occur.

  As described above, the pressure sensor packages 1A and 1B according to the present embodiment include the package main body 20 in which the pressure sensor 10 is mounted, and the package main body 20 in a state where the space 21 is secured above the diaphragm 11 of the pressure sensor 10. And a lid 30 for covering. The package body 20 is formed with a pressure introduction hole 29 that communicates with the space 21 from the outside. The pressure introducing hole 29 is provided at least partially along a metal wiring pattern which is connected to the pressure sensor 10 and extends to the outside of the package body 20 and which includes the wire bonding pad 25, the through via wiring 26 and the external connection terminal 27. ing.

  According to the configuration described above, in the pressure sensor packages 1 </ b> A and 1 </ b> B of the present embodiment, the pressure introducing hole 29 is provided not in the lid 30 but in the package body 20. For this reason, the pressure introduction hole 29 does not exist on the pressure sensor 10.

  As a result, the pressure sensor 10 is not irradiated with light, and the characteristics of the pressure sensor 10 do not deteriorate.

  Further, even when the pressure sensor packages 1A and 1B are manufactured in a sheet shape and separated into pieces after assembly, when the pressure introduction hole 29 exists on the pressure sensor 10, water, cutting waste, etc. It is easy for foreign matter to enter. However, in the present embodiment, since the pressure introduction hole 29 is provided in the package main body 20, there is little possibility that foreign matters such as water and cutting waste are mixed from the pressure introduction hole 29. For this reason, the characteristic in the pressure sensor 10 does not deteriorate due to the foreign matter mixed in the pressure sensor 10.

  Furthermore, in the present embodiment, the package body 20 is made of resin. That is, in this type of pressure sensor package, conventionally, a hard ceramic is often used even if the package body is thin. For this reason, the pressure sensor package becomes expensive, and the processing of the package body 20 becomes complicated and difficult to process.

  In this respect, in the present embodiment, the package body 20 is formed of resin, so that it is inexpensive. Further, complicated processing can be easily performed by injection molding or the like.

  As a result, inexpensive and highly productive pressure sensor packages 1A, 1B, and 1C can be provided.

  Therefore, it is possible to provide the pressure sensor packages 1A and 1B that can prevent light irradiation or foreign matter from being introduced from the pressure introduction hole 29, and further prevent deterioration of the characteristics of the pressure sensor 10.

  Further, in the pressure sensor packages 1A and 1B of the present embodiment, the pressure introducing hole 29 is formed on the outer bottom surface 20a of the package body 20, and is a metal wiring pattern formed on the outer bottom surface 20a of the package body 20. The through via wiring 26 is provided in parallel. In other words, in the present embodiment, the pressure introducing hole 29 is a through hole that is formed in the outer bottom surface 20 a of the package body 20 and communicates with the space 21 above the diaphragm 11.

  Therefore, it is possible to provide the pressure sensor packages 1A and 1B that can surely prevent light irradiation or foreign matter from being introduced from the pressure introduction hole 29, and thereby prevent deterioration of the characteristics of the pressure sensor 10.

  In this type of pressure sensor package 1 </ b> A / 1 </ b> B, the lead-out wiring from the pressure sensor 10 is normally performed by through via wiring 26 formed on the outer bottom surface 20 a of the package body 20. Therefore, in the step of forming the through hole for the through via wiring 26, the through hole for the pressure introducing hole 29 may be formed. Therefore, the step of forming the through hole for the pressure introducing hole 29 is separately performed. There is no need for installation. As a result, the pressure introducing hole 29 is formed in the outer bottom surface 20a of the package body 20, and is provided in parallel to the through via wiring 26 which is a metal wiring pattern formed in the outer bottom surface 20a of the package body 20. become.

  Further, in the pressure sensor packages 1A and 1B in which the pressure introduction holes 29 are formed on the outer bottom surface 20a of the package body 20, when the pressure sensor packages 1A and 1B are manufactured in a sheet shape and separated into individual pieces after assembly, Next, a stretched tape is attached to the outer bottom surface 20a of the package body 20 to separate them. Therefore, since the pressure introducing hole 29 is blocked by the stretched tape, it is possible to reliably prevent foreign matters such as water and cutting waste from being mixed.

  Further, in the pressure sensor packages 1A and 1B of the present embodiment, the opening position of the pressure introducing hole 29 into the space 21 is higher than the narrow and deep recess bottom 23a of the package body 20 on which the pressure sensor 10 is mounted, and the lid 30 And lower than the position of the contact surface with the package body 20.

  That is, the pressure sensor 10 is usually bonded to the narrow recess bottom 23a with an adhesive such as a die bonding resin 24 at the narrow recess bottom 23a of the package body 20 on which the pressure sensor 10 is mounted. At this time, when the opening position of the pressure introducing hole 29 into the space 21 is the same as or lower than the narrow deep recess bottom 23a, the die bonding resin 24 flows into the opening position of the pressure introducing hole 29 into the space 21. There is a possibility that the pressure introducing hole 29 is blocked.

  In this regard, in the present embodiment, the opening position of the pressure introducing hole 29 into the space 21 is higher than the narrow and deep recessed bottom 23a of the package body 20 on which the pressure sensor 10 is mounted. 24 is not occluded.

  Further, since the opening position of the pressure introducing hole 29 into the space 21 is lower than the position of the contact surface between the lid 30 and the package body 20, the pressure introducing hole 29 is not blocked by the lid 30.

  In addition, this invention is not limited to said embodiment, A various change is possible within the scope of the present invention. For example, in the above embodiment, the electrical signal is extracted from the pressure sensor 10 through the through via wiring 26. However, the present invention is not necessarily limited thereto. For example, the pressure sensor package 1 </ b> C having a metal wiring pattern extending to the outer bottom surface 20 a via the outer wall surface of the package body 20 can be used.

  The configuration of such a pressure sensor package 1C will be described based on FIGS. 3 (a) to 3 (e). 3A is a plan view showing the configuration of the pressure sensor package 1C of the present embodiment, FIG. 3B is a cross-sectional view taken along the line AA ′ of FIG. 3A, and FIG. ) Is a cross-sectional view taken along the line BB ′ of FIG. 3A, FIG. 3D is a cross-sectional view taken along the line CC ′ of FIG. 3A, and FIG. It is a DD 'line sectional view of).

  As shown in FIGS. 3A to 3E, the pressure sensor package 1 </ b> C includes a wall-exposed metal wiring pattern as a metal wiring pattern connected to the wire 15 connected to the pressure sensor 10 in the package body 20. 50 extends from the inside of the package body 20 to the outer bottom surface 20a via the outer wall surface 20b. That is, the wall-exposed metal wiring pattern 50 includes a wire bonding pad portion 51 provided on the shallow wide recess bottom 22 a of the shallow wide recess 22, an inclined rising portion 52 that rises along the inclined rising surface 22 b of the shallow wide recess 22, and an outer wall surface. It consists of an outer wall surface portion 53 along 20b and an outer bottom surface portion 54 along the outer bottom surface 20a. The reason why the inclined rising portion 52 is provided in the wall surface exposed metal wiring pattern 50 is to avoid contact with the lid 30. In order to avoid contact between the lid 30 and the wall-exposed metal wiring pattern 50, a gap 20c is formed on the upper surface of the package body 20 as shown in FIG.

  Here, in the present embodiment, the insulating film 31 is preferably provided on the back surface of the lid 30. Thereby, the short circuit with the lid 30 and the wall surface exposed metal wiring pattern 50 etc. can be prevented.

  As described above, in the pressure sensor package 1C of the present embodiment, the package body 20 has the wall surface exposed metal wiring pattern 50 connected to the pressure sensor 10 from the inside of the package body 20 through the outer wall surface 20b. The pressure introduction hole 29 can be assumed to be parallel to the wall surface exposed metal wiring pattern 50 extending to the outer wall surface.

  Thereby, wiring such as a signal line from the pressure sensor 10 can be taken out without providing the through via wiring 26. Moreover, in the conventional pressure sensor package, since the through-hole is provided in the lid body, an additional process for forming the hole is required. On the other hand, in the present embodiment, since it is not necessary to form a through hole in the lid 30, the number of manufacturing steps can be reduced in that respect. In the present embodiment, the pressure introducing hole 29 can be formed on the side surface of the package body 20 by injection molding.

  Further, in the pressure sensor package 1 </ b> C of the present embodiment, an insulating film 31 is provided on the back surface of the lid 30. Thereby, it is possible to prevent the lid 30 made of metal from being short-circuited with the pressure sensor 10, the wire 15, or the wall surface exposed metal wiring pattern 50.

  Further, in the pressure sensor packages 1A, 1B, and 1C of the present embodiment, the package body 20 is formed with a ground line 40 for grounding the lid 30 at a part of the contact portion with the lid 30. It is preferable. Thereby, the electric charge accumulated in the lid 30 can be grounded via the ground line 40.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIGS. The configurations other than those described in the present embodiment are the same as those in the first embodiment. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and explanation thereof is omitted.

  In the pressure sensor packages 1A, 1B, and 1C of the first embodiment, the pressure introducing hole 29 is formed on the bottom surface of the package body 20.

  In contrast, the pressure sensor packages 2A, 2B, and 2C of the present embodiment differ in that the pressure introduction holes 29 are formed on the side surfaces of the package body 20.

  The configuration of the pressure sensor package 2A according to the present embodiment will be described with reference to FIGS. 4A is a plan view showing the configuration of the pressure sensor package 2A of the present embodiment, FIG. 4B is a cross-sectional view taken along the line AA ′ of FIG. 4A, and FIG. ) Is a cross-sectional view taken along line BB ′ of FIG. 4A, FIG. 4D is a cross-sectional view taken along line CC ′ of FIG. 4A, and FIG. 4E is FIG. It is a DD 'line sectional view of).

  The configuration of the pressure sensor package 2A of the present embodiment is the same as the configuration of the pressure sensor package 1A except that the pressure introduction hole 29 is formed on the side surface of the package body 20.

  That is, in the pressure sensor package 2A, as shown in FIGS. 4A to 4E, for example, a rectangular box-shaped package body 20 in which the pressure sensor 10 is mounted, and a space 21 is secured above the cavity 12. And a lid 30 as a lid for covering the opening of the package body 20.

  The pressure sensor 10 is an absolute pressure sensor, and forms a piezoresistor (not shown) as a plurality of pressure-sensitive resistor elements on the periphery of the diaphragm 11. And a semiconductor sensor substrate 13 having a cavity 12 formed of a space portion in a vacuum state.

  The box-shaped package body 20 is formed of resin by injection molding, and has a two-step recess. That is, the package body 20 includes a shallow wide concave portion 22 and a narrow deep concave portion 23 formed inside the shallow wide concave portion 22, and the horizontal cross section of each of the shallow wide concave portion 22 and the narrow deep concave portion 23 is square. It has become.

  The pressure sensor 10 described above is mounted by being bonded to a narrow recess bottom 23 a of the narrow recess 23 of the package body 20 with a die bonding resin 24. In the present embodiment, the position of the upper surface of the diaphragm 11 in the pressure sensor 10 is higher than the shallow wide recess bottom 22 a of the shallow wide recess 22. A plurality of pads 14 are formed around the diaphragm 11 of the pressure sensor 10, and wires 15 made of, for example, gold (Au) are connected to the pads 14.

  The other end of the wire 15 is connected to a wire bonding pad 25 formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20. The wire bonding pad 25 includes a through-via wiring 26 formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20 and an external connection terminal 27 formed on the outer bottom surface 20 a that is the back surface of the package body 20. It is connected to the.

  As a result, the electrical signal from the piezoresistor of the pressure sensor 10 is electrically connected to an external device (not shown) via the wire 15, the wire bonding pad 25, the through via wiring 26 and the external connection terminal 27. Yes.

  The lid 30 is made of, for example, a metal plate and covers the opening of the package body 20. In the present embodiment, the lid 30 is bonded in a state where it is placed on a pedestal 28 that rises from the shallow wide recess bottom 22 a at the four corners of the rectangular shallow wide recess 22 in the package body 20.

  Also in the pressure sensor package 2A of the present embodiment, in the pressure sensor package 1B of the first embodiment, as shown in FIG. 2A to FIG. 40 can be provided as a pressure sensor package. That is, when the lid 30 is grounded, for example, the ground through hole 41 is formed in the base 28 with which the lid 30 is in contact, and the ground wire 40 is provided in the ground through hole 41. Then, an external connection terminal 42 connected to the ground line 40 may be provided on the outer bottom surface 20 a of the package body 20. Thereby, the voltage fluctuation of the pressure sensor 10 can be prevented from becoming large.

  Next, in the pressure sensor package 2A of the present embodiment, the pressure introducing hole 60 is formed on the side surface of the package body 20 as shown in FIGS. 4 (a), 4 (d) and 4 (e). The pressure introducing hole 60 is formed with an inclined surface 20d that hangs from the inside toward the outside. Thereby, the incidence of light from above can be blocked and foreign matters such as water and cutting waste can be prevented from being mixed. The inclined surface 20d is preferably subjected to water repellent treatment or surface roughness adjustment. In the pressure sensor package 2A, the pressure introduction hole 60 formed on the side surface of the package body 20 is a straight hole, but is not limited to this, and is, for example, a maze-like curved hole. It may be. Thereby, mixing of foreign materials, such as water and cutting waste, can further be prevented.

  Thus, in the pressure sensor package 2A of the present embodiment, the pressure introduction hole 60 is formed on the side surface of the package body 20, so that the pressure introduction hole does not exist on the pressure sensor 10. As a result, the pressure sensor 10 is not irradiated with light, and the characteristics of the pressure sensor 10 do not deteriorate.

  Further, even when the pressure sensor package 2A is manufactured in a sheet shape and separated into pieces after assembly, if there is a pressure introduction hole on the pressure sensor 10, foreign matters such as water and cutting waste are mixed from the pressure introduction hole. Easy to do. However, in the present embodiment, since the pressure introducing hole 60 is provided on the side surface of the package body 20, there is little possibility that foreign matters such as water and cutting waste are mixed from the pressure introducing hole 60. For this reason, the characteristic in the pressure sensor 10 does not deteriorate due to the foreign matter mixed in the pressure sensor 10.

  Further, in the pressure sensor package 2A of the present embodiment, the pressure introduction hole 60 formed in the side surface of the package body 20 is formed with an inclined surface 20d that hangs down from the inside toward the outside. Thereby, it has the structure where foreign materials, such as water and a cutting waste, do not mix easily from the pressure introduction hole 60. FIG.

  For this reason, it can prevent that foreign materials, such as water and cutting waste, mix from the pressure introduction hole 60, and can prevent the fall of the characteristic of the pressure sensor 10 by extension.

  Further, in the pressure sensor package 2A of the present embodiment, it is preferable that the pressure introduction hole 60 formed in the side surface of the package body 20 is subjected to water repellent treatment or surface roughness adjustment.

  Thereby, when the pressure introduction hole 60 is subjected to water repellent treatment, it is possible to prevent water from entering. Further, when the pressure introduction hole 60 is adjusted in surface roughness, it is possible to prevent foreign matters such as cutting dust from being mixed.

  In the pressure sensor package 2 </ b> A of the present embodiment, it is preferable that the package body 20 is formed with a through via wiring 26 for grounding the lid 30 at a part of the contact portion with the lid 30. . Thereby, the electric charge accumulated in the lid 30 can be grounded through the through via wiring 26.

  In addition, this invention is not limited to said embodiment, A various change is possible within the scope of the present invention.

  For example, as shown in FIGS. 5A, 5 </ b> B, 5 </ b> C, and 5 </ b> D, the pressure introduction hole 60 is filled with a ventilation resin 61 that allows air to pass but does not pass water. The sensor package 2B can be obtained.

  As a result, the pressure introduction hole 60 is blocked by the ventilation resin 61. However, since the air-permeable resin 61 filled in the pressure introducing hole 60 allows air to pass therethrough, the air above the pressure introducing hole 60 and the space above the diaphragm 11 provided above the cavity 12 inside the pressure sensor package 2B. Communication with 21 is ensured.

  On the other hand, the breathable resin 61 filled in the pressure introducing hole 60 does not pass water. Therefore, mixing of foreign matters such as water or cutting waste can be reliably prevented.

  In addition, as such a ventilation resin 61, a silicone resin is preferable, for example.

  Here, in the pressure sensor packages 2 </ b> A and 2 </ b> B, an electrical signal is taken out from the pressure sensor 10 through the through via wiring 26. However, the present invention is not necessarily limited to this, and in the present embodiment as well, as in the pressure sensor package 1C of the first embodiment, a pressure sensor having a metal wiring pattern that extends to the outer bottom surface 20a via the outer wall surface of the package body 20. The package 2C can be used.

  The configuration of such a pressure sensor package 2C will be described based on FIGS. 6 (a) to 6 (d). 6A is a plan view showing the configuration of the pressure sensor package 2C of the present embodiment, FIG. 6B is a cross-sectional view taken along line AA ′ of FIG. 6A, and FIG. ) Is a cross-sectional view taken along line BB ′ of FIG. 6A, and FIG. 6D is a cross-sectional view taken along line CC ′ of FIG. 6A.

  As shown in FIGS. 6A to 6D, the pressure sensor package 2 </ b> C includes a wall-exposed metal wiring pattern as a metal wiring pattern connected to the wire 15 connected to the pressure sensor 10 on the package body 20. 50 extends from the inside of the package body 20 to the outer bottom surface 20a via the outer wall surface 20b. That is, the wall exposed metal wiring pattern 50 includes a wire bonding pad portion 51 provided on the shallow wide recess bottom 22a of the shallow wide recess 22, an inclined rising portion 52 rising along the inclined rising surface 22b of the shallow wide recess 22, and an outer wall surface. It consists of an outer wall surface portion 53 along 20b and an outer bottom surface portion 54 along the outer bottom surface 20a. The reason why the inclined rising portion 52 is provided in the wall surface exposed metal wiring pattern 50 is to avoid contact with the lid 30.

  Also in the present embodiment, it is preferable to provide the insulating film 31 on the back surface of the lid 30 as in the case of the pressure sensor package 1C. Thereby, the short circuit with the lid 30 and the wall surface exposed metal wiring pattern 50 etc. can be prevented.

  Thus, in the pressure sensor package 2C of the present embodiment, the pressure introduction hole 60 is formed in the side surface of the package body 20, and the wall surface exposed metal wiring connected to the pressure sensor 10 is provided in the package body 20. A pattern 50 is provided so as to extend from the inside of the package body 20 through the pressure introduction hole 60 to the outer bottom surface 20a via the outer wall surface 20b.

  Thereby, since the pressure introduction hole 60 is formed in the side surface of the package body 20, the pressure introduction hole does not exist on the pressure sensor 10. As a result, the pressure sensor 10 is not irradiated with light, and the characteristics of the pressure sensor 10 do not deteriorate.

  Even when the pressure sensor package 2C is manufactured in a sheet shape and separated into individual pieces after assembly, if there is a pressure introduction hole on the pressure sensor 10, foreign matters such as water and cutting waste are mixed from the pressure introduction hole. Easy to do. However, in the present embodiment, since the pressure introducing hole 60 is provided on the side surface of the package body 20, there is little possibility that foreign matters such as water and cutting waste are mixed from the pressure introducing hole 60. For this reason, the characteristic in the pressure sensor 10 does not deteriorate due to the foreign matter mixed in the pressure sensor 10.

  In the present embodiment, the package body 20 has a wall exposed metal wiring pattern 50 connected to the pressure sensor 10 from the inside of the package body 20 through the pressure introduction hole 60 and the outer bottom surface via the outer wall surface 20b. It extends to 20a. For this reason, wiring such as a signal line from the pressure sensor 10 can be taken out without providing the through via wiring 26. For this reason, wiring such as a signal line from the pressure sensor 10 can be taken out without providing the through via wiring 26. Moreover, in the conventional pressure sensor package, since the through-hole is provided in the lid body, an additional process for forming the hole is required. On the other hand, in the present embodiment, since it is not necessary to form a through hole in the lid 30, the number of manufacturing steps can be reduced in that respect. In the present embodiment, the pressure introducing hole 60 can be formed on the side surface of the package body 20 by injection molding.

  Furthermore, in the present embodiment, the pressure introduction hole 60 provided on the side surface of the package body 20 is used to extend from the inside of the package body 20 through the pressure introduction hole 60 to the outer bottom surface 20a via the outer wall surface 20b. In order to let the provided wall surface exposed metal wiring pattern 50 pass, a pressure introducing hole 60 provided on the side surface of the package body 20 is used. Therefore, there is no need to provide the pressure introduction hole 60 separately.

  In the pressure sensor packages 2A, 2B, and 2C of the present embodiment, it is preferable that the insulating film 31 is provided on the back surface of the lid 30. Thereby, the short circuit with the lid 30 and the wall surface exposed metal wiring pattern 50 etc. can be prevented.

  In the pressure sensor packages 2A, 2B, and 2C of the present embodiment, the package body 20 is formed with a ground line 40 for grounding the lid 30 at a part of the contact portion with the lid 30. It is preferable. Thereby, the electric charge accumulated in the lid 30 can be grounded via the ground line 40.

  In the pressure sensor packages 2A, 2B, and 2C of the present embodiment, the package body 20 is made of resin.

  That is, in this type of pressure sensor package 2A, 2B, 2C, conventionally, a hard ceramic is often used even if the package body is thin. For this reason, the pressure sensor package is expensive, and the processing of the package body is complicated, which makes it difficult to process.

  In this respect, in the present embodiment, the package body 20 is formed of resin, so that it is inexpensive. Further, complicated processing can be easily performed by injection molding or the like. Therefore, it is possible to provide pressure sensor packages 2A, 2B, and 2C that are inexpensive and highly productive.

  For example, as described above, the pressure introduction hole 60 formed on the side surface of the package body 20 can be a curved hole such as a labyrinth, but such processing is complicated with conventional ceramics. Although difficult, such processing is easy with a resin.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

  The pressure sensor package of the present invention is a pressure sensor package in which a diaphragm type pressure sensor is mounted, and can be applied to both an absolute pressure sensor and a differential pressure (relative pressure) pressure sensor. Further, as a field of application of the pressure sensor package of the present invention, a pressure gauge such as a barometer and a water pressure gauge, an altimeter using the pressure gauge, and the like can be considered.

1A, 1B, 1C Pressure sensor package 2A, 2B, 2C Pressure sensor package 10 Pressure sensor 11 Diaphragm 12 Cavity 14 Pad 15 Wire 20 Package body 20a Outer bottom surface (bottom surface)
20b Outer wall surface 20c Gap 20d Inclined surface 21 Space 22 Shallow wide recess 22a Shallow wide recess bottom 23 Narrow deep recess 23a Narrow deep recess bottom (pressure sensor mounting floor)
24 Die bonding resin (adhesive)
25 Wire bonding pad (metal wiring pattern)
26 Through-via wiring (through-electrode wiring, metal wiring pattern)
27 External connection terminal (metal wiring pattern)
28 Pedestal 29 Pressure introducing hole 30 Lid (lid)
40 Grounding wire (through wiring)
41 Ground through hole 42 External connection terminal 50 Wall surface exposed metal wiring pattern (metal wiring pattern)
51 Wire bonding pad portion 52 Inclined rising portion 53 Outer wall surface portion 54 Outer bottom surface portion 60 Pressure introducing hole 61 Breathable resin

Claims (10)

In a pressure sensor package comprising a box-shaped package body mounted with a pressure sensor, and a lid that covers the package body with a space secured above the diaphragm of the pressure sensor,
The package body is made of resin,
The package body has a pressure introduction hole communicating with the space from the outside, and
The pressure sensor package, wherein the pressure introducing hole is provided at least partially along a metal wiring pattern connected to the pressure sensor and extending to the outside of the package body.   2. The pressure introducing hole is formed on a bottom surface of the package body, and is provided in parallel to a through electrode wiring which is the metal wiring pattern formed on the bottom surface of the package body. The described pressure sensor package.   The opening position of the pressure introduction hole to the space is higher than the pressure sensor mounting floor of the package body on which the pressure sensor is mounted, and lower than the position of the contact surface between the lid and the package body. The pressure sensor package according to claim 2. In the package body, a metal wiring pattern connected to the pressure sensor is provided to extend from the inside of the package body to the outer bottom surface through the outer wall surface,
2. The pressure sensor package according to claim 1, wherein the pressure introducing hole is parallel to a metal wiring pattern extending on the outer wall surface. The pressure introducing hole is formed on a side surface of the package body,
2. The package main body is provided with a metal wiring pattern connected to a pressure sensor extending from the inside of the package main body through the pressure introducing hole to an outer bottom surface through an outer wall surface. The described pressure sensor package. The pressure introducing hole is formed on a side surface of the package body,
2. The pressure sensor package according to claim 1, wherein the pressure introduction hole formed in the side surface of the package body is formed with an inclined surface that descends from the inside toward the outside. The pressure introducing hole is formed on a side surface of the package body,
2. The pressure sensor package according to claim 1, wherein the pressure introduction hole formed in the side surface of the package body is subjected to water repellent treatment or surface roughness adjustment.   The pressure sensor package according to any one of claims 1 to 7, wherein the pressure introduction hole is filled with a ventilation resin that allows air to pass therethrough and does not pass water.   The pressure sensor package according to claim 1, wherein an insulating film is provided on a back surface of the lid.   The through-wiring for grounding this cover body is formed in a part of contact part with the said cover body in the said package main body, The any one of Claims 1-7 characterized by the above-mentioned. Pressure sensor package.

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