CN210491197U - MEMS microphone encapsulation - Google Patents
MEMS microphone encapsulation Download PDFInfo
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- CN210491197U CN210491197U CN201921470778.3U CN201921470778U CN210491197U CN 210491197 U CN210491197 U CN 210491197U CN 201921470778 U CN201921470778 U CN 201921470778U CN 210491197 U CN210491197 U CN 210491197U
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Abstract
The utility model relates to an acoustoelectric conversion field especially relates to a MEMS microphone encapsulation, including MEMS encapsulation shell and PCB board, MEMS encapsulation shell bottom is fixed with the phonate hole, MEMS encapsulation shell both sides are fixed with the pad, the pad up end evenly is fixed with a plurality of welding grooves, the PCB board is equipped with the fixed orifices that MEMS encapsulation shell passed, be fixed with a plurality of spread grooves that use with the cooperation of welding groove on the PCB board with aforementioned pad equipment face on. The solder paste is added into the welding groove and the connecting groove, the MEMS microphone is positioned with the PCB after being packaged and passed through the fixing hole, the device is subjected to soldering tin through a hot air welding machine, the sound hole is connected with the inside of the MEMS packaging shell from the bottom of the bonding pad, the welding groove, the connecting groove and the sound hole are separated by the MEMS packaging shell and the bonding pad, the solder paste cannot splash into the sound hole, and the MEMS packaging shell is fixed after being passed through the PCB, so that the height of the MEMS microphone is thinner.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the field of sound-electricity conversion, in particular to an MEMS microphone package.
[ background of the invention ]
MEMS is a Micro-Electro mechanical System (Micro-Electro mechanical System), which refers to a sensor device with a size of several millimeters or less, and the internal structure of the sensor device is generally in the micrometer or nanometer level, and the sensor device is an independent intelligent System. Briefly, the MEMS is a silicon-based sensor formed by miniaturizing mechanical components of a conventional sensor, fixing a device on a silicon wafer (wafer) by a three-dimensional stacking technique, for example, a three-dimensional through-silicon via (TSV) technique, and finally cutting and assembling the device in a specially-customized packaging form according to different application occasions. The MEMS has the advantages of miniaturization and high integration degree which cannot be achieved by the common sensor; compared with the common forward sound MEMS microphone, the forward sound laminated structure MEMS microphone has optimized performance, higher signal-to-noise ratio and more outstanding performance advantages in the fields of voice recognition, man-machine interaction and the like;
after a semiconductor wafer is divided, one or more integrated circuit chips are packaged by using proper packaging, and bonding pads and outer pins of the chips are connected by using a lead bonding mode to realize a certain function, which belongs to chip-level packaging of microelectronic packaging.
Therefore, the MEMS microphone capable of realizing the slimmer circuit board after being mounted has higher practical value for controlling the thickness of a terminal product.
[ summary of the invention ]
The invention aims to overcome the defects of the prior art, and provides an MEMS microphone package which can effectively solve the problem that the overall height of a circuit board after the MEMS microphone package and a PCB are welded in the prior art cannot be reduced, and can effectively avoid the risk that solder paste splashes to sound holes.
The invention can be realized by the following technical scheme:
the invention discloses an MEMS microphone package, which comprises an MEMS package shell and a PCB, wherein a sound hole is fixed at the bottom of the MEMS package shell, bonding pads are fixed at two sides of the MEMS package shell, a plurality of welding grooves are uniformly fixed on the upper end surface of each bonding pad, the PCB is provided with a fixed hole through which the MEMS package shell passes, and a plurality of connecting grooves matched with the welding grooves are fixed on the assembling surface of the PCB and the bonding pad. The solder paste is added into the welding groove and the connecting groove, the MEMS microphone is positioned with the PCB after being packaged and passed through the fixing hole, the device is subjected to soldering tin through a hot air welding machine, the sound hole is connected with the inside of the MEMS packaging shell from the bottom of the bonding pad, the welding groove, the connecting groove and the sound hole are separated by the MEMS packaging shell and the bonding pad, the solder paste cannot splash into the sound hole, and the MEMS packaging shell is fixed after being passed through the PCB, so that the height of the MEMS microphone is thinner.
Compared with the prior art, the invention has the following advantages:
1. the MEMS packaging shell is fixed after penetrating through the PCB, the MEMS microphone is thinner in height and wider in application, and the requirements of chip-level packaging of microelectronic packaging can be met.
2. The sound hole is connected with the inside of the MEMS packaging shell from the bottom of the bonding pad, the MEMS packaging shell and the bonding pad are separated between the welding groove and the connecting groove and the sound hole, solder paste cannot splash into the sound hole, and the performance of the MEMS microphone can be effectively guaranteed.
[ description of the drawings ]
The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:
FIG. 1 is a schematic diagram of a prior art structure;
FIG. 2 is a prior art assembly diagram of a MEMS package housing and a PCB;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is a top view of the present invention;
FIG. 5 is a diagram of the assembly structure of the MEMS package housing and the PCB board of the present invention;
in the figure: 1. a MEMS package housing; 2. a pad; 3. welding a groove; 4. a sound hole; 5. a PCB board; 6. a fixing hole; 7. connecting grooves;
[ detailed description ] embodiments
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings:
as shown in fig. 1 to 5, the invention discloses an MEMS microphone package, which includes an MEMS package housing 1 and a PCB 5, wherein a sound hole 4 is fixed at the bottom of the MEMS package housing 1, pads 2 are fixed on two sides of the MEMS package housing 1, a plurality of soldering grooves 3 are uniformly fixed on the upper end surface of the pads 2, the PCB 5 is provided with a fixing hole 6 through which the MEMS package housing 1 passes, and a plurality of connecting grooves 7 matched with the soldering grooves 3 are fixed on the assembly surface of the PCB 5 and the pads 2. Solder paste is added into the soldering bath 3 and the connecting groove 7, the MEMS microphone is packaged and positioned with the PCB 5 after penetrating through the fixing hole 6, soldering tin is carried out on the device through a hot air welding machine, the sound hole 4 is connected with the inside of the MEMS packaging shell 1 from the bottom of the bonding pad 2, the soldering bath 3, the connecting groove 7 and the sound hole 4 are separated by the MEMS packaging shell 1 and the bonding pad 2, the solder paste cannot splash into the sound hole 4, and the MEMS packaging shell 1 penetrates through the PCB 5 and then is fixed, so that the height of the MEMS microphone is thinner.
The above description is only a preferred embodiment of the present invention, and it should be noted that a person skilled in the art can make various changes, modifications, substitutions and alterations to the embodiments without departing from the technical principles of the present invention, and such changes, modifications, substitutions and alterations should also be regarded as the protection scope of the present invention.
Claims (1)
1. The utility model provides a MEMS microphone encapsulation, includes MEMS encapsulation shell and PCB board, its characterized in that: the MEMS packaging shell is fixed with the sound hole in bottom, MEMS packaging shell both sides are fixed with the pad, the pad up end is evenly fixed with a plurality of welding grooves, the PCB board is equipped with the fixed orifices that MEMS packaging shell passed, be fixed with a plurality of spread grooves with welding groove cooperation use on the PCB board with aforementioned pad equipment face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921470778.3U CN210491197U (en) | 2019-09-05 | 2019-09-05 | MEMS microphone encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921470778.3U CN210491197U (en) | 2019-09-05 | 2019-09-05 | MEMS microphone encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210491197U true CN210491197U (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921470778.3U Active CN210491197U (en) | 2019-09-05 | 2019-09-05 | MEMS microphone encapsulation |
Country Status (1)
| Country | Link |
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| CN (1) | CN210491197U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446148A (en) * | 2019-09-05 | 2019-11-12 | 朝阳聚声泰（信丰）科技有限公司 | A kind of MEMS microphone package and its welding manner |
-
2019
- 2019-09-05 CN CN201921470778.3U patent/CN210491197U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446148A (en) * | 2019-09-05 | 2019-11-12 | 朝阳聚声泰（信丰）科技有限公司 | A kind of MEMS microphone package and its welding manner |
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