CN217952968U - Wafer drying equipment swing mechanism - Google Patents
Wafer drying equipment swing mechanism Download PDFInfo
- Publication number
- CN217952968U CN217952968U CN202221579394.7U CN202221579394U CN217952968U CN 217952968 U CN217952968 U CN 217952968U CN 202221579394 U CN202221579394 U CN 202221579394U CN 217952968 U CN217952968 U CN 217952968U
- Authority
- CN
- China
- Prior art keywords
- sliding
- arm
- block
- wafer drying
- swing mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001035 drying Methods 0.000 title claims abstract description 38
- 230000007246 mechanism Effects 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 description 11
- 210000005056 cell body Anatomy 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a wafer drying equipment swing mechanism, interior locating piece has played two side spacing piece distances in location, provides the mounted position for the kicking block, and interior locating piece and kicking block suspend on holding seat middle hollow part, and hollow side spacing piece, interior locating piece, kicking block form a whole set of mounting structure, have installation locate function, and simple installation, the higher advantage of structural strength still does not obstruct dry gas's flow simultaneously, has improved drying effect.
Description
Technical Field
The application belongs to the technical field of wafer cleaning, and particularly relates to a swing mechanism of wafer drying equipment.
Background
For semiconductor wafer cleaning, the wafer needs alkaline cleaning solution cleaning, pure water cleaning, hydrofluoric acid cleaning, ozone water cleaning, drying and other processes, and wafer drying is generally the final step of wafer cleaning, and can remove the cleaning solution remaining on the surface of the wafer, prevent wafer oxidation, and control surface moisture and surface cleanliness. Chinese patent document CN114496847a discloses a swing mechanism disposed inside a cleaning tank, wherein the swing mechanism is provided with two wafer cassette carrying areas for placing wafer cassettes.
The shell of the wafer cleaning tank is made of metal materials. The swing mechanism comprises a driving motor, a sliding track, a sliding block, a shaft joint track and a swing arm, the sliding track and the shaft joint track are arranged in parallel, the sliding track is located above the shaft joint track, the sliding block is installed on the sliding track in a sliding mode, and the driving motor is used for controlling the sliding block to reciprocate on the sliding track.
Then, the cassette receiving seats (cassette receiving areas) in the swing mechanism are not flexible enough, and are inconvenient to install, especially the middle multi-heel beam is difficult to align.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: in order to solve the defects in the prior art, the wafer drying equipment swing mechanism is convenient to install.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model discloses a wafer drying equipment swing mechanism, include, have the top mounting panel of horizontal slide rail, set up the driving piece on the mounting panel of top, slide the slidable mounting piece that can move along the horizontal slide rail under the driving of driving piece that sets up on the horizontal slide rail, install the arch sliding arm on the slidable mounting piece, install and hold the seat on the arch sliding arm, the driving piece during operation can drive the arch sliding arm and swing together with holding the seat;
the accommodating seat is used for accommodating the wafer box and comprises a base, side limiting blocks and a top block, wherein the base is connected with the arched sliding arm and is hollow in the middle, the side limiting blocks are arranged on the base and are used for limiting two sides of the wafer box respectively, the top block is positioned between the side limiting blocks, the middle of each side limiting block is hollow, protrusions which are oppositely arranged are arranged on the inner walls of the hollow parts of the two side limiting blocks, and the accommodating seat further comprises an inner positioning block;
the two ends of the inner positioning block are respectively connected with the bulges of the side limiting blocks, the connecting points are distributed on the two sides of the width direction of the inner positioning block, and the jacking blocks are arranged on the two sides of the length direction of the inner positioning block.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, two still be provided with the width stopper between the side stopper.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, side spacing piece bottom and base joggle.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, the top surface of side spacing piece is the inclined plane.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, the top surface of kicking block is the inclined plane.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, the kicking block is provided with rectangular hole along the direction of height.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, have in the middle of the interior locating piece and have the material through-hole that subtracts who reduces weight and gas passing effect concurrently.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, arch slide arm cross the top of cell body and extend to the cell body and form the first support arm that is located the cell body outside and be located the inside second support arm of cell body, install the bottom of second support arm hold the seat.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, first arm rotate connect on rotating the mount pad, have the sliding tray in the middle of the first arm, be provided with the pulley that is located the sliding tray on the slidable mounting piece.
Preferably, the utility model discloses a wafer drying equipment swing mechanism, the slidable mounting piece extends downwards and forms the extension, the pulley setting is on the extension.
The utility model has the advantages that:
the utility model discloses a wafer drying equipment swing mechanism, interior locating piece have played two side spacing piece distances in location, for the kicking block provides mounted position, interior locating piece and kicking block suspend in and hold in the middle of the seat on the fretwork part, hollow side spacing piece, interior locating piece, kicking block form a whole set of mounting structure, have installation location function, simple installation, the higher advantage of structural strength still does not obstruct dry gas's flow simultaneously, has improved drying effect. In addition, the extension part is formed by extending the sliding mounting block downwards, and the pulley is arranged on the extension part, so that the pulley can be far away from the moving center line of the sliding mounting block (namely the center line of the sliding rail) as far as possible, the matching point of the whole pulley and the sliding groove is lower, and the swinging amplitude is improved.
Drawings
The technical solution of the present application is further explained below with reference to the drawings and the embodiments.
Fig. 1 is a schematic structural diagram of a swing type wafer drying apparatus according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural view of the swing type wafer drying apparatus of FIG. 1 with the cover removed;
FIG. 3 is a schematic structural view of a rocking mechanism in embodiment 1 of the present application;
fig. 4 and 5 are schematic views of two states of the rocking mechanism swinging respectively;
FIG. 6 is a schematic structural view of a receiving seat in embodiment 1 of the present application;
the reference numbers in the figures are:
1. a trough body;
2. a cover body;
3. a rocking mechanism;
9. a wafer box;
21. a gas line;
31. a top mounting plate;
32. an arcuate slider arm;
33. a drive member;
34. a sliding mounting block;
35. rotating the mounting seat;
36. an accommodating seat;
321. a sliding groove;
341. a pulley;
342. an extension portion;
360. a base;
361. a side limiting block;
362. an inner positioning block;
363. a top block;
364. a width limiting block.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.
In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific cases.
The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example 1
The present embodiment provides a swing mechanism of a wafer drying apparatus, as shown in fig. 1 and 2 and 3,
the device comprises a top mounting plate 31 with a horizontal sliding rail, a driving part 33 arranged on the top mounting plate, a sliding mounting block 34 which is arranged on the horizontal sliding rail in a sliding mode and can move along the horizontal sliding rail under the driving of the driving part 33, an arched sliding arm 32 arranged on the sliding mounting block 34, an accommodating seat 36 arranged on the arched sliding arm 32, and the driving part 33 can drive the arched sliding arm 32 and the accommodating seat 36 to swing when working;
the accommodating seat 36 is used for accommodating a wafer cassette 9, and comprises a base 360 connected with the arched sliding arm 32, side limiting blocks 361 installed on the base 360 and used for limiting two sides of the wafer cassette respectively, and a top block 363 located between the side limiting blocks 361, wherein the middle of each side limiting block 361 is hollow, the inner walls of the hollow parts of the two side limiting blocks 361 are provided with oppositely arranged bulges, and the accommodating seat 36 further comprises an inner positioning block 362;
two ends of the inner positioning block 362 are respectively connected with the protrusions of the side limiting blocks 361, connecting points are distributed on two sides of the width direction of the inner positioning block 362, and the top blocks 363 are installed on two sides of the length direction of the inner positioning block 362. After the wafer box 9 is placed in the accommodating seat 36, the top block 363 can lift the wafer in the wafer box 9 to a certain height (slightly lift up) to improve the drying effect. The middle of the accommodating seat 36 is hollowed out, so that the drying airflow is smoother.
The wafer drying equipment swing mechanism of this embodiment, interior locating piece 362 has played two side spacing piece 361 distances of location, provides the mounted position for kicking block 363, and interior locating piece 362 and kicking block 363 suspend on holding seat 36 middle fretwork part, and hollow side spacing piece, interior locating piece 362, kicking block 363 form a whole set of mounting structure, have the installation locate function, and simple installation, the higher advantage of structural strength does not hinder dry gas's flow simultaneously, has improved drying effect.
As shown in fig. 4 and 5, the driving member 33 drives the sliding mounting block 34 to move on the sliding rail, and then acts on the sliding groove 321 through the pulley 341, so as to swing the accommodating seat 36, wherein fig. 4 is located at the middle position, which is capable of loading and unloading the wafer cassette 9, and fig. 5 shows the maximum amplitude of the right swing.
Further, a width limiting block 364 is further arranged between the two side limiting blocks 361, and two ends of the width limiting block 364 abut against the side limiting blocks 361, so that the structural stability is improved.
Further, the bottom of the side limiting block 361 is joggled with the base 360. That is, the side stopper 361 is installed by sliding in the side surface and then fastened by a bolt, thereby improving the installation convenience.
The sliding mounting block extends downwards to form an extending part, and the pulley is arranged on the extending part, so that the pulley can be far away from a moving central line (namely the central line of the sliding rail) of the sliding mounting block as far as possible, the matching point of the whole pulley and the sliding groove is lower, and the swinging amplitude is improved.
The top surfaces of the side limiting block 361 and the top block 363 are both provided with inclined surfaces, namely sharp tops. The inclined planes of the side limiting blocks 361 face each other, so that the wafer cassette 9 can slide in from the inclined planes conveniently, and a positioning effect is achieved. The inclined surface of the top block 363 can reduce the contact area with the wafer, and improve the drying effect.
The top block 363 is provided with a long hole along the height direction so as to adjust the installation height of the top block 363.
The arched sliding arm 32 is specifically configured to extend from the outside of the tank body 1 to the inside of the tank body 1, as shown in fig. 6, so that the arched sliding arm 32 crosses the top of the tank body 1 and extends into the tank body 1 to form a first arm outside the tank body 1 and a second arm inside the tank body 1, and the receiving seat 36 is installed at the bottom of the second arm. The first arm is rotatably connected to the rotating mounting base 35, a sliding groove 321 is formed in the middle of the first arm, and a pulley 341 located in the sliding groove 321 is arranged on the sliding mounting block 34. The slide mounting block 34 extends downward to form an extension portion 342, and the pulley 341 is provided on the extension portion 342. The sliding mounting block extends downwards to form an extending part, and the pulley is arranged on the extending part, so that the pulley can be far away from a moving central line (namely the central line of the sliding rail) of the sliding mounting block as far as possible, the matching point of the whole pulley and the sliding groove is lower, and the swinging amplitude is improved.
In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A wafer drying equipment swing mechanism, characterized by includes:
the device comprises a top mounting plate (31) with a horizontal sliding rail, a driving part (33) arranged on the top mounting plate, a sliding mounting block (34) which is arranged on the horizontal sliding rail in a sliding mode and can move along the horizontal sliding rail under the driving of the driving part (33), and an arched sliding arm (32) arranged on the sliding mounting block (34), wherein an accommodating seat (36) is arranged on the arched sliding arm (32), and the driving part (33) can drive the arched sliding arm (32) to swing together with the accommodating seat (36) when working;
the accommodating seat (36) is used for accommodating a wafer box (9), and comprises a base (360) which is connected with an arched sliding arm (32) and is hollow in the middle, side limiting blocks (361) which are arranged on the base (360) and used for limiting two sides of the wafer box respectively, and a top block (363) which is positioned between the side limiting blocks (361), wherein the middle of each side limiting block (361) is hollow, the inner walls of the hollow parts of the two side limiting blocks (361) are provided with protrusions which are arranged oppositely, and the accommodating seat (36) further comprises an inner positioning block (362);
two ends of the inner positioning block (362) are respectively connected with the protrusions of the side limiting blocks (361), connecting points are distributed on two sides of the inner positioning block (362) in the width direction, and the top blocks (363) are installed on two sides of the inner positioning block (362) in the length direction.
2. The oscillating mechanism of wafer drying equipment according to claim 1, wherein a width stopper (364) is further disposed between the two side stoppers (361).
3. The wafer drying apparatus oscillating mechanism of claim 2, wherein the bottom of the side stopper (361) is joggled with the base (360).
4. The wafer drying apparatus swing mechanism according to claim 1, wherein the top surface of the side stopper (361) is a slope.
5. The wafer drying apparatus swing mechanism according to claim 1, wherein the top surface of the top block (363) is a sloped surface.
6. The swing mechanism of wafer drying equipment as claimed in claim 1, wherein the top block (363) is provided with a long hole along the height direction.
7. The swing mechanism of wafer drying equipment as claimed in claim 1, wherein the inner positioning block (362) has a material reducing through hole in the middle for reducing weight and passing gas.
8. The swing mechanism of the wafer drying equipment as claimed in claim 1, wherein the arched sliding arm (32) crosses the top of the tank body (1) and extends into the tank body (1) to form a first arm outside the tank body (1) and a second arm inside the tank body (1), and the accommodating seat (36) is installed at the bottom of the second arm.
9. The swing mechanism of wafer drying equipment as claimed in claim 8, wherein the first arm is rotatably connected to the rotary mounting seat (35), the first arm has a sliding groove (321) in the middle, and the sliding mounting block (34) is provided with a pulley (341) located in the sliding groove (321).
10. The wafer drying apparatus swinging mechanism according to claim 9, wherein the sliding mounting block (34) extends downward to form an extension portion (342), and the pulley (341) is disposed on the extension portion (342).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221579394.7U CN217952968U (en) | 2022-06-22 | 2022-06-22 | Wafer drying equipment swing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221579394.7U CN217952968U (en) | 2022-06-22 | 2022-06-22 | Wafer drying equipment swing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217952968U true CN217952968U (en) | 2022-12-02 |
Family
ID=84218980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221579394.7U Active CN217952968U (en) | 2022-06-22 | 2022-06-22 | Wafer drying equipment swing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217952968U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116053188A (en) * | 2023-01-13 | 2023-05-02 | 江苏亚电科技有限公司 | Wafer inclined rotation bearing device and wafer cleaning and drying method |
| WO2023246353A1 (en) * | 2022-06-22 | 2023-12-28 | 江苏亚电科技有限公司 | Swing mechanism for wafer drying apparatus |
-
2022
- 2022-06-22 CN CN202221579394.7U patent/CN217952968U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023246353A1 (en) * | 2022-06-22 | 2023-12-28 | 江苏亚电科技有限公司 | Swing mechanism for wafer drying apparatus |
| CN116053188A (en) * | 2023-01-13 | 2023-05-02 | 江苏亚电科技有限公司 | Wafer inclined rotation bearing device and wafer cleaning and drying method |
| CN116053188B (en) * | 2023-01-13 | 2023-06-02 | 江苏亚电科技有限公司 | Wafer inclined rotation bearing device and wafer cleaning and drying method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217952968U (en) | Wafer drying equipment swing mechanism | |
| CN115218627A (en) | Wafer drying equipment swing mechanism | |
| JP6948860B2 (en) | Board holding device | |
| CN115274492B (en) | Swing type wafer drying equipment and wafer drying method | |
| CN112235927B (en) | Wafer static electricity removing and cleaning device | |
| JP2000286312A5 (en) | Rotational drive mechanism, mounting mechanism of the object to be inspected, and inspection device | |
| CN115702479A (en) | Substrate liquid processing apparatus and substrate liquid processing method | |
| CN215785546U (en) | Conversion transition device and wafer cleaning equipment | |
| KR20030010540A (en) | Method and apparatus for centrifugally dehydrating workpiece | |
| CN212696256U (en) | Wafer static electricity removing and cleaning device | |
| JPH0697137A (en) | Substrate cleaning equipment | |
| CN112235926B (en) | Wafer static electricity removing and cleaning method | |
| JP2600456B2 (en) | Automatic cleaning device | |
| CN214935683U (en) | EMUs coupling dismouting device | |
| JPH0214237Y2 (en) | ||
| JPH10275846A (en) | Substrate-holding member and substrate-treating device using the same | |
| CN219183587U (en) | Base station device and cleaning robot | |
| CN220439576U (en) | Wafer transmission device | |
| JP2955910B2 (en) | Horizontal axis type substrate drying device | |
| CN211858609U (en) | POLY-Si horizontal back sealing vertical quartz boat device for furnace | |
| CN219565600U (en) | Egg product loading and supporting machine | |
| CN216103525U (en) | A storage box for chemical reagent transportation is deposited | |
| CN218778189U (en) | Lower contact arm feeding device | |
| CN219815855U (en) | Catalyst loading and unloading integrated device | |
| JP2003045935A (en) | Vertical type cassette for flat panel such as liquid crystal grass substrate, shifter, and robot |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |