CN211858609U

CN211858609U - POLY-Si horizontal back sealing vertical quartz boat device for furnace

Info

Publication number: CN211858609U
Application number: CN202020948851.XU
Authority: CN
Inventors: 寇文辉; 苗利刚; 胡晓亮
Original assignee: Mesk Electronic Materials Co Ltd
Current assignee: Mesk Electronic Materials Co Ltd; MCL Electronic Materials Ltd
Priority date: 2020-05-29
Filing date: 2020-05-29
Publication date: 2020-11-03
Anticipated expiration: 2030-05-29

Abstract

The utility model provides a vertical quartz boat device for POLY-Si horizontal back sealing furnace, includes overhead gage, silicon chip support groove stick, silicon chip constant head tank stick and under bracing baffle, the overhead gage with under bracing baffle corresponds the setting from top to bottom, is equipped with between overhead gage and the under bracing baffle silicon chip support groove stick with silicon chip constant head tank stick, silicon chip support groove stick and silicon chip constant head tank stick's top all connect the overhead gage through the welding mode, and silicon chip support groove stick and silicon chip constant head tank stick's bottom all connect the under bracing baffle through the welding mode. The utility model discloses a lower supporting baffle realizes that the quartz boat is stable to be placed on the oar, and the level of realizing the silicon chip through four root groove stick is placed, realizes the location of silicon chip in the quartz boat through the constant head tank stick to keep the interval when vertical unanimous, realize automatic loading, through quartz boat device, can use the general of former horizontal quartz boat inverter, effectively solved the not enough that former horizontal quartz boat processing exists.

Description

POLY-Si horizontal back sealing vertical quartz boat device for furnace

Technical Field

The utility model relates to a 7 carrier quartz boats of semiconductor trade POLY-Si back seal technology silicon chip mainly relates to a POLY-Si horizontal back seal vertical quartz boat device for stove.

Background

The quartz boat is a carrier in the silicon wafer back sealing process, the structure of the quartz boat directly influences the arrangement of the silicon wafer, influences the contact area of the silicon wafer and the quartz boat, influences the stress of the contact point, and finally directly influences the edge breakage rate of the contact point after the silicon wafer back sealing.

The conventional horizontal back sealing furnace is designed by adopting a horizontal quartz boat, a silicon wafer is vertically placed, a plurality of stress concentration points exist between the silicon wafer and the quartz boat, the contact area between the silicon wafer and the quartz boat is large, the silicon wafer is seriously bonded with the quartz boat after POLY-Si deposition, and the edge of a higher proportion is broken. The reasonable design of the quartz boat can effectively change the contact position and the contact area of the quartz boat and the silicon wafer.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a POLY-Si horizontal back of body seals vertical quartz boat device for stove to solve the defect of this kind of design, and possible easy operation, safe high-efficient.

The utility model discloses a following technical scheme realizes: the utility model provides a vertical quartz boat device for POLY-Si horizontal back sealing furnace, includes overhead gage, silicon chip support groove stick, silicon chip constant head tank stick and under bracing baffle, the overhead gage with under bracing baffle corresponds the setting from top to bottom, is equipped with between overhead gage and the under bracing baffle silicon chip support groove stick with silicon chip constant head tank stick, the top of silicon chip support groove stick and silicon chip constant head tank stick is passed through the welding mode and is connected the overhead gage, and the bottom of silicon chip support groove stick and silicon chip constant head tank stick is all connected the under bracing baffle through the welding mode.

Further preferably, the upper baffle is a quadrilateral plate, and the shape and the size of the upper baffle and the size of the lower support baffle are the same.

Further optimizing, the number of the silicon wafer supporting groove rods is four, two of the silicon wafer supporting groove rods are arranged at one corner of the upper baffle, the other two silicon wafer supporting groove rods are arranged at the other corner corresponding to the corner, and a plurality of grooves are formed in the silicon wafer supporting groove rods along the length direction.

Further optimize, silicon chip constant head tank stick is established at another turning of last baffle, and silicon chip support groove stick and silicon chip constant head tank stick form a triangle-shaped form, and one side of silicon chip constant head tank stick is equipped with a plurality of V type grooves corresponding with the recess, the opening of recess with the opening in V type groove is corresponding to realize that the silicon chip level is placed and is fixed a position in the quartz boat.

Further optimizing, the silicon wafer supporting groove rod and the silicon wafer positioning groove rod are the same in length and are arranged in parallel.

The beneficial effects of the utility model reside in that:

the utility model discloses a lower supporting baffle realizes that the quartz boat is stable to be placed on the oar, and the level of realizing the silicon chip through four root groove stick is placed, realizes the location of silicon chip in the quartz boat through the constant head tank stick to keep the interval when vertical unanimous, realize automatic loading, through quartz boat device, can use the general of former horizontal quartz boat inverter, effectively solved the not enough that former horizontal quartz boat processing exists.

Drawings

FIG. 1 is a schematic structural view of a quartz boat when the boat is vertically placed;

FIG. 2 is a schematic view of a quartz boat in a horizontal position;

FIG. 3 is a schematic top view of the quartz boat;

FIG. 4 is a schematic structural view of a silicon wafer support slot bar;

FIG. 5 is a schematic structural view of a silicon wafer positioning slot bar;

reference numerals: 1. the silicon wafer positioning device comprises an upper baffle, 2 a silicon wafer supporting groove rod, 3 a silicon wafer positioning groove rod, 4 a lower supporting baffle, 5 a groove, 6 a V-shaped groove, 7 a silicon wafer.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.

The utility model provides a POLY-Si horizontal back of body seals vertical quartz boat device for stove, includes overhead gage 1, silicon chip support groove stick 2, silicon chip constant head tank stick 3 and under bracing baffle 4, overhead gage 1 is the quadrilateral plate, and the shape, the size homogeneous phase of overhead gage 1 and under bracing baffle 4 correspond and parallel arrangement from top to bottom, and silicon chip support groove stick 2 and silicon chip constant head tank stick 3 set up between overhead gage 1 and under bracing baffle 4 and set up perpendicularly with overhead gage 1, and silicon chip support groove stick 2 and silicon chip constant head tank stick 3's top all connects overhead gage 1 through the welding mode, and silicon chip support groove stick 2 and silicon chip constant head tank stick 3's bottom all connects under bracing baffle 4 through the welding mode, and silicon chip support groove stick 2 and silicon chip constant head tank stick 3 length homogeneous phase and parallel arrangement.

The number of the silicon wafer supporting groove rods 2 is four, two of the silicon wafer supporting groove rods are arranged at one corner of the upper baffle plate 1, the other two silicon wafer supporting groove rods are arranged at the other corner opposite to the corner, and a plurality of grooves 5 are formed in the silicon wafer supporting groove rods 2 along the length direction; silicon chip constant head tank stick 3 establishes at one of them corner of 1 surplus at the overhead gage, and silicon chip support groove stick 2 and silicon chip constant head tank stick 3 form a triangle-shaped, are equipped with a plurality of V type grooves 6 on the silicon chip constant head tank 3, the opening of recess 5 with the opening in V type groove 6 is corresponding to realize that 7 levels of silicon chip are placed in the quartz boat, and the sandblast is carried out on recess 5 surface, promotes its roughness, reduces silicon chip 7 and recess 5's area of contact and silicon chip 7 and recess 5's caking property.

When a silicon wafer is placed, the quartz boat is in an upright state, as shown in fig. 1, the silicon wafer supporting groove rod 2 and the silicon wafer positioning groove rod 3 are arranged in an open mode, an original horizontal quartz boat sheet inverter is adopted to convey a silicon wafer 7 into the quartz boat through a gap between the silicon wafer supporting groove rod 2 and the silicon wafer positioning groove rod 3, the edge of the silicon wafer 7 is in point contact with the silicon wafer supporting groove rod 2 to achieve that the silicon wafer is horizontally placed in the quartz boat, the surface of the silicon wafer supporting groove rod 2 is subjected to sand blasting treatment, so that the contact area between the silicon wafer 7 and the silicon wafer supporting groove rod 2 is reduced, and the adhesion degree between the silicon wafer 7 and the quartz boat after POLY-Si deposition is improved; when the silicon wafers are unloaded, the quartz boat is in a horizontal flat state, as shown in fig. 2, the edge of the silicon wafer 7 is clamped in the V-shaped groove 6 due to the action of gravity, and the silicon wafer 7 is vertically arranged at the same interval through the silicon wafer positioning groove rods 3.

Having shown and described the basic principles, essential features and advantages of the invention, it will be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, which are merely illustrative of the principles of the invention, but rather is susceptible to various changes and modifications without departing from the spirit and scope of the invention, as claimed herein.

Claims

1. The utility model provides a vertical quartz boat device for horizontal back of body seal furnace of POLY-Si, its characterized in that, includes overhead gage (1), silicon chip support groove stick (2), silicon chip constant head tank stick (3) and under bracing baffle (4), overhead gage (1) with under bracing baffle (4) correspond the setting from top to bottom, are equipped with between overhead gage (1) and under bracing baffle (4) silicon chip support groove stick (2) with silicon chip constant head tank stick (3), silicon chip support groove stick (2) and the top of silicon chip constant head tank stick (3) all connect overhead gage (1) through the welding mode, and silicon chip support groove stick (2) and the bottom of silicon chip constant head tank stick (3) all connect under bracing baffle (4) through the welding mode.

2. The vertical quartz boat device for the POLY-Si horizontal back-sealing furnace as claimed in claim 1, wherein the upper baffle (1) is a quadrilateral plate, and the shape and size of the upper baffle (1) and the lower support baffle (4) are the same.

3. The vertical quartz boat device for the POLY-Si horizontal back-sealing furnace as claimed in claim 1, wherein the number of the silicon wafer support groove rods (2) is four, two of the silicon wafer support groove rods are arranged at one corner of the upper baffle plate (1), the other two silicon wafer support groove rods are arranged at the other corner corresponding to the corner, and the silicon wafer support groove rods (2) are provided with a plurality of grooves (5) along the length direction.

4. The vertical quartz boat device for the POLY-Si horizontal back-sealing furnace as claimed in claim 3, wherein the silicon wafer positioning groove rod (3) is arranged at the other corner of the upper baffle (1), the silicon wafer supporting groove rod (2) and the silicon wafer positioning groove rod (3) form a triangle, one side of the silicon wafer positioning groove rod (3) is provided with a plurality of V-shaped grooves (6) corresponding to the grooves (5), and the openings of the grooves (5) correspond to the openings of the V-shaped grooves (6) so as to realize the horizontal placement and positioning of the silicon wafers in the quartz boat.

5. The vertical quartz boat device for the POLY-Si horizontal back-sealing furnace as claimed in claim 1, wherein the silicon wafer support groove bar (2) and the silicon wafer positioning groove bar (3) have the same length and are arranged in parallel.