CN215069914U - Wafer positioning device of glue spreading developing machine - Google Patents
Wafer positioning device of glue spreading developing machine Download PDFInfo
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- CN215069914U CN215069914U CN202121546279.5U CN202121546279U CN215069914U CN 215069914 U CN215069914 U CN 215069914U CN 202121546279 U CN202121546279 U CN 202121546279U CN 215069914 U CN215069914 U CN 215069914U
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Abstract
The utility model discloses a rubber coating developing machine wafer positioner, including strutting arrangement, strutting arrangement includes that mounting base, mobile jib accomodate post, activity bracing piece, two-sided spiral groove and wafer play out the piece, the location tray is installed to the strutting arrangement upper end, the location tray includes tray main part, wafer constant head tank, plays export, two-sided installation screw thread, short positioning column, limit baffle and protection cushion, location tray upside swing joint installs location structure, location structure includes work holding ring, tray amalgamation breach, locating column groove, connects arm screw thread and work arm, the activity of wafer play piece upper end is accomodate in play out mouth department, two-sided installation screw thread is embedded to be installed in two-sided spiral groove inside. A rubber coating developing machine wafer positioner, adaptable multiple model wafer, the practicality is stronger, provides certain protection to the wafer, can carry out the high accuracy location simultaneously.
Description
Technical Field
The utility model relates to a positioner field, in particular to rubber coating developing machine wafer positioner.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, at present, the domestic wafer production line mainly takes 8 inches and 12 inches, and the wafer needs to be positioned when the wafer is subjected to glue coating and developing processing; the existing glue spreading developing machine has certain defects when in use, when a wafer is transported to a glue spreading developing processing device by a transport arm, the wafer is directly sent to the upper part of a tray, the transportation is excessive, the condition of crossing the tray is avoided, a small part of the glue spreading developing processing device with a positioning device is arranged, the positioning precision is low, and the processing quality is influenced.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a wafer positioning device for a glue coating and developing machine, which can effectively solve the problems of the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a rubber coating developing machine wafer positioner, includes strutting arrangement, strutting arrangement includes that mounting base, mobile jib accomodate post, activity bracing piece, two-sided spiral shell groove and wafer play out the piece, the location tray is installed to the strutting arrangement upper end, the location tray includes tray main part, wafer constant head tank, plays export, two-sided installation screw socket, short positioning column, limit baffle and protection cushion, location tray upside swing joint installs location structure, location structure includes work holding ring, tray amalgamation breach, holding column groove, connects arm screw socket and work arm.
Preferably, the fixed welding of mounting base upside installs the mobile jib and accomodates the post, swing joint installs movable support rod in the post is accomodate to the mobile jib, two-sided screw groove has been seted up to movable support rod upside surface, the inside swing joint of movable support rod upper end installs the wafer and plays the piece.
Preferably, the wafer positioning groove has been seted up to tray main part upper surface, the export has been seted up at wafer positioning groove middle part, tray main part bottom side fixed surface welding installs the two-sided installation screw socket, fixed welding in wafer positioning groove notch edge installs the short positioning column, fixed welding in tray main part upper surface edge installs limit baffle, fixed surface installs the protection cushion in the inboard surface of limit baffle.
Preferably, the tray amalgamation breach has been seted up to work holding ring lower extreme, the locating post groove has been seted up to work holding ring lower extreme surface, the arm screw socket has been seted up to work holding ring inboard surface, the work arm is installed through arm screw socket connection in work holding ring upper end.
Preferably, the upper end of the wafer lifting block is movably accommodated at the lifting port.
Preferably, the double-sided mounting screw is embedded inside the double-sided screw groove.
Compared with the prior art, the utility model discloses following beneficial effect has:
in the utility model, the mounting base is fixedly arranged inside the gluing and developing device, the working positioning ring is fixedly arranged at the working end of the working arm through the screw port of the connecting arm, when the wafer is sent into the gluing and developing device by the transmission arm, the movable supporting rod extends out of the main rod receiving column to lift the positioning tray, the wafer is sent into the upper part of the tray main body by the transmission arm, the limiting baffle plate resists and blocks the wafer, the transmission arm is prevented from excessively conveying, the protective cushion effectively absorbs impact and prevents the wafer from breaking, the wafer is protected, the wafer is loosened by the transmission arm, the wafer falls into the wafer positioning groove and is fixed in position, when the working arm works, the working arm moves to the upper part of the tray main body, the limiting baffle plate is spliced with the notch of the tray splicing, the positioning short column is inserted into the positioning column groove to position the working arm for working, the positioning precision is greatly improved, the working quality is further improved, the wafer is lifted out from the wafer positioning groove after the processing is finished, make things convenient for the transfer arm to take out, when the wafer of processing different models, the location tray that corresponds the model is changed to two-sided spiral shell groove of accessible and two-sided installation screw socket, changes the work holding ring through connecing the arm screw socket, and suitable model is more extensive, and the practicality is stronger.
Drawings
Fig. 1 is a schematic view of the overall structure of a wafer positioning device of a glue spreading developing machine according to the present invention;
fig. 2 is a schematic view of a supporting device of a wafer positioning device of a glue spreading developing machine according to the present invention;
fig. 3 is a schematic view of a positioning tray of the wafer positioning device of the glue spreading developing machine of the present invention;
fig. 4 is a schematic view of a positioning structure of the wafer positioning device of the glue spreading developing machine of the present invention.
In the figure: 1. a support device; 101. mounting a base; 102. a main rod receiving column; 103. a movable support rod; 104. double-sided screw grooves; 105. a wafer is taken out; 2. positioning the tray; 201. a tray main body; 202. a wafer positioning groove; 203. an outlet; 204. screw ports are arranged on two sides; 205. a positioning short column; 206. a limit baffle; 207. protecting the soft cushion; 3. a positioning structure; 301. a working positioning ring; 302. a tray splicing gap; 303. a positioning post slot; 304. a connecting arm screw socket; 305. a working arm.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-4, a wafer positioning device of a glue spreading developing machine comprises a supporting device 1, the supporting device 1 comprises a mounting base 101, a main rod receiving column 102, a movable supporting rod 103, a double-sided screw groove 104 and a wafer lifting block 105, a positioning tray 2 is mounted at the upper end of the supporting device 1, the positioning tray 2 comprises a tray main body 201, a wafer positioning groove 202, a lifting outlet 203, a double-sided mounting screw port 204, a positioning short column 205, a limit baffle 206 and a protective cushion 207, a positioning structure 3 is movably connected and mounted at the upper side of the positioning tray 2, and the positioning structure 3 comprises a working positioning ring 301, a tray splicing notch 302, a positioning column groove 303, an arm screw port 304 and a working arm 305;
a main rod receiving column 102 is fixedly welded on the upper side of the mounting base 101, a movable supporting rod 103 is movably connected and mounted in the main rod receiving column 102, a double-sided screw groove 104 is formed in the upper side surface of the movable supporting rod 103, and a wafer raising block 105 is movably connected and mounted in the upper end of the movable supporting rod 103; 2, a wafer positioning groove 202 is formed in the upper surface of a tray main body 201, an outlet 203 is formed in the middle of the wafer positioning groove 202, a double-sided mounting screw port 204 is fixedly welded and mounted on the bottom side surface of the tray main body 201, a positioning short column 205 is fixedly welded and mounted at the edge of the notch of the wafer positioning groove 202, a limit baffle 206 is fixedly welded and mounted at the edge of the upper surface of the tray main body 201, and a protective cushion 207 is fixedly mounted on the inner side surface of the limit baffle 206; the lower end of the working positioning ring 301 is provided with a tray splicing notch 302, the lower end surface of the working positioning ring 301 is provided with a positioning column groove 303, the inner side surface of the working positioning ring 301 is provided with an arm connecting screw 304, and the upper end of the working positioning ring 301 is connected with and provided with a working arm 305 through the arm connecting screw 304; the upper end of the wafer lift-out block 105 is movably accommodated at the lift-out opening 203; the double-sided mounting screw 204 is embedded inside the double-sided screw groove 104.
It should be noted that, the utility model relates to a wafer positioning device of a glue spreading developing machine, when in use, the mounting base 101 is fixedly arranged inside the glue spreading developing device, the working positioning ring 301 is fixedly arranged at the working end of the working arm 305 through the connecting arm screw 304, when the conveying arm sends the wafer into the glue spreading developing device, the movable support rod 103 extends out of the main rod receiving column 102 to lift the positioning tray 2, the conveying arm sends the wafer into the upper part of the tray main body 201, the limit baffle 206 resists and blocks the wafer, the conveying arm is prevented from over-conveying, meanwhile, the protection cushion 207 effectively absorbs impact to prevent the wafer from breaking, the wafer is protected, the conveying arm loosens the wafer, the wafer falls into the wafer positioning groove 202, the position is fixed, when the working arm 305 works, the wafer moves to the upper part of the tray main body 201, the limit baffle 206 is spliced with the tray splicing notch 302, the positioning short column 205 is inserted into the positioning column groove 303, work arm 305 location, carry out work, improve positioning accuracy greatly, and then improve operating mass, the back wafer play piece 105 that finishes of processing lifts out the wafer from wafer positioning groove 202, makes things convenient for the conveying arm to take out, and when the wafer of different models of processing, the two-sided spiral shell groove 104 of accessible and two-sided installation screw socket 204 change the location tray 2 of corresponding model, through connecing arm screw socket 304 to change work holding ring 301, and suitable model is more extensive, and the practicality is stronger.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a rubber coating developing machine wafer positioner which characterized in that: including strutting arrangement (1), strutting arrangement (1) is including installation base (101), mobile jib accomodate post (102), activity bracing piece (103), two-sided spiral groove (104) and wafer play out piece (105), locating tray (2) are installed to strutting arrangement (1) upper end, locating tray (2) are including tray main part (201), wafer positioning groove (202), play out mouth (203), two-sided installation spiral groove (204), short positioning column (205), limit baffle (206) and protection cushion (207), locating structure (3) are installed to locating tray (2) upside swing joint, locating structure (3) are including work holding ring (301), tray amalgamation breach (302), locating post groove (303), connect arm spiral groove (304) and work arm (305).
2. The wafer positioning device for the gumming developing machine as claimed in claim 1, wherein: mounting base (101) upside fixed welding installs mobile jib and accomodates post (102), swing joint installs movable support rod (103) in mobile jib accomodate post (102), two-sided spiral shell groove (104) have been seted up to movable support rod (103) side surface, the inside swing joint in movable support rod (103) upper end installs the wafer and plays piece (105).
3. The wafer positioning device for the gumming developing machine as claimed in claim 2, wherein: wafer positioning groove (202) have been seted up to tray main part (201) upper surface, export (203) have been seted up at wafer positioning groove (202) middle part, tray main part (201) bottom side fixed surface welding installs two-sided installation screw socket (204), fixed welding in wafer positioning groove (202) notch edge installs spacer column (205), fixed welding in tray main part (201) upper surface edge installs limit baffle (206), limit baffle (206) inboard fixed surface installs protection cushion (207).
4. A glue developer wafer positioning device as claimed in claim 3, wherein: tray amalgamation breach (302) have been seted up to work holding ring (301) lower extreme, locating column groove (303) have been seted up to work holding ring (301) lower extreme surface, work holding ring (301) inboard surface has been seted up and has been connect arm screw socket (304), work holding ring (301) upper end is connected through connecing arm screw socket (304) and is installed work arm (305).
5. The wafer positioning device for the gumming developing machine as claimed in claim 4, wherein: the upper end of the wafer lift-out block (105) is movably accommodated at the lift-out opening (203).
6. The wafer positioning device for glue spreading and developing machine according to claim 5, wherein: the double-sided mounting screw (204) is embedded inside the double-sided screw groove (104).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121546279.5U CN215069914U (en) | 2021-07-08 | 2021-07-08 | Wafer positioning device of glue spreading developing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121546279.5U CN215069914U (en) | 2021-07-08 | 2021-07-08 | Wafer positioning device of glue spreading developing machine |
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| Publication Number | Publication Date |
|---|---|
| CN215069914U true CN215069914U (en) | 2021-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121546279.5U Active CN215069914U (en) | 2021-07-08 | 2021-07-08 | Wafer positioning device of glue spreading developing machine |
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| CN (1) | CN215069914U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117612988A (en) * | 2024-01-19 | 2024-02-27 | 宇弘研科技(苏州)有限公司 | Wafer buffering type positioning bracket for glue spreading developing machine |
-
2021
- 2021-07-08 CN CN202121546279.5U patent/CN215069914U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117612988A (en) * | 2024-01-19 | 2024-02-27 | 宇弘研科技(苏州)有限公司 | Wafer buffering type positioning bracket for glue spreading developing machine |
| CN117612988B (en) * | 2024-01-19 | 2024-04-05 | 宇弘研科技(苏州)有限公司 | Wafer buffering type positioning bracket for glue spreading developing machine |
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