CN116053188A - Wafer inclined rotation bearing device and wafer cleaning and drying method - Google Patents
Wafer inclined rotation bearing device and wafer cleaning and drying method Download PDFInfo
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- CN116053188A CN116053188A CN202310040867.9A CN202310040867A CN116053188A CN 116053188 A CN116053188 A CN 116053188A CN 202310040867 A CN202310040867 A CN 202310040867A CN 116053188 A CN116053188 A CN 116053188A
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- 238000001035 drying Methods 0.000 title claims abstract description 32
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- 235000012431 wafers Nutrition 0.000 claims description 119
- 238000009434 installation Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 5
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- 230000009471 action Effects 0.000 claims description 3
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- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 210000005056 cell body Anatomy 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 7
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- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model belongs to the technical field of wafer cleaning or dry production facility, relate to a wafer slope rotatory carrier device, first rotation axis through mutual transmission connection, second rotation axis and third rotation axis transmit the power from the one end on the first mounting panel that supports to the third on supporting the mounting panel, thereby realized the rotation of the wafer in the wafer basket of placing on the third supporting the mounting panel in the wafer holding box, simultaneously, the setting of universal yoke lever, lifter plate and lifter block, make the wafer basket can be the horizontality when accepting the wafer basket of manipulator transport, be the inclination when falling to in the cell body, need not the cooperation of manipulator, work efficiency has been improved. The application also provides a wafer cleaning and drying method based on the wafer inclined rotation bearing device.
Description
Technical Field
The application belongs to the technical field of wafer cleaning or drying production equipment, and particularly relates to a carrying device capable of enabling wafers in a wafer box to obliquely rotate and a wafer cleaning and drying method.
Background
The cleaning and drying of wafers is divided into basket-less processing and basket-with processing, i.e., placing the wafer in a wafer basket (also known as a flower basket), and then the wafer basket is fed into a tank together with the wafer by related components to complete the cleaning or drying process.
Chinese patent document CN108389813B discloses an integrated device for cleaning and drying silicon wafer and a cleaning method thereof, as shown in fig. 3, in which, in order to improve the cleaning effect, wafer baskets are placed in a cleaning tank in an inclined manner, and in order to realize the inclination of the wafer baskets, fixing blocks at the bottom of the wafer baskets are set to different heights. However, in doing so, the related grabbing manipulators of the wafer basket also need to be arranged in a manner of obliquely grabbing the wafer basket, however, the cleaning station does not need to adjust the wafer basket to be inclined, which results in frequent adjustment of the posture of the wafer basket, and further reduces the cleaning efficiency of the wafer.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the defects in the prior art, the bearing device capable of enabling wafers in the wafer box to incline and rotate is provided without adjusting the posture of the wafer basket through a mechanical arm.
The technical scheme adopted for solving the technical problems is as follows:
a wafer tilt rotary carrier comprising:
the support installation assembly comprises a first support installation plate, a third support installation plate and a second support installation plate, wherein the first support installation plate and the third support installation plate are horizontally parallel, the second support installation plate is arranged in the vertical direction and connected with the first support installation plate and the third support installation plate, the first support installation plate and the third support installation plate are arranged in a staggered mode, the second support installation plate is connected with two adjacent ends of the first support installation plate and the third support installation plate, and a hollow is arranged in the middle of the third support installation plate;
the rotary driving assembly comprises a first rotary shaft, a second rotary shaft and a third rotary shaft which are respectively arranged on the first support mounting plate, the second support mounting plate and the third support mounting plate, the first rotary shaft is connected with the second rotary shaft, and the second rotary shaft is connected with the third rotary shaft through a transmission piece, the surface of the third rotary shaft is used for contacting with the bottom of the wafer, and the third rotary shaft drives the wafer to rotate together when rotating;
the third rotating shaft is formed by connecting two telescopic universal coupling rods in series, the connecting parts of the two universal coupling rods are fixed in a lifting block, and the lifting block is positioned above the hollow part in the middle of the third supporting and mounting plate;
the lifting plate is arranged on the third support mounting plate, two ends of the lifting plate are respectively connected with connecting blocks of the third support mounting plate and the lifting block through rotating shafts, the connecting blocks of the lifting block are provided with arc holes, the rotating shafts of the lifting plate are positioned in the arc holes, and the lifting block can be jacked up under the action of the protruding blocks in the groove body and drives the connecting parts of the lifting plate and the universal coupling rod to lift up;
the first rotating shaft is connected with the second rotating shaft through a right-angle gear, the second rotating shaft is connected with the connecting piece through a right-angle gear, and the connecting piece penetrates through the second support mounting plate and is connected with a second straight gear at one end of the third rotating shaft through a first straight gear;
the universal joint shaft rod comprises a telescopic rod body and universal joints positioned at two ends of the rod body, wherein the universal joint close to one end of the connecting piece is fixed with a rotating shaft of a second spur gear penetrating through the first fixing block, the universal joints in the middle of the two universal joint shaft rods are fixed together to form a connecting part, the universal joint far away from one end of the connecting piece is rotationally fixed on the second fixing block, and the first fixing block and the second fixing block are respectively arranged at two ends of the third support mounting plate.
Preferably, in the carrying device for obliquely rotating the wafer, the universal joint rods are two groups, and the two groups of the universal joint rods are parallel to each other when being in a horizontal state.
Preferably, the wafer is tilted to rotate the carrier device of the present invention, and the surface of the universal joint rod is made of PTFE material.
Preferably, in the wafer tilting and rotating carrying device, a positioning block is arranged on the lifting plate at least at one side far away from the lifting block below the wafer basket.
Preferably, in the wafer tilting bearing device, the through hole of the second support mounting plate is provided with a bearing, and the connecting piece passes through the bearing.
The application also provides a wafer cleaning and drying method, which comprises the following steps:
s1: placing a wafer basket loaded with wafers on the carrying device capable of obliquely rotating the wafers in the wafer box in a horizontal mode by using a mechanical arm;
s2: the bearing device is lowered into the tank body, the tank body is a drying tank or a cleaning tank, when the bearing device is lowered to the lowest end, the lifting block is jacked by the convex block at the bottom of the tank body to enable the wafer basket to incline, the wafer is cleaned or dried in the tank body, and in the cleaning or drying process, the motor drives the rotary driving assembly to enable the wafer to rotate;
s3: after the cleaning or drying is finished, the bearing device is lifted, the wafer basket is restored to be horizontal, and then the wafer basket is grabbed away by the manipulator.
Preferably, in the wafer cleaning and drying method of the present invention, in step S2, after the cleaning is completed, the motor drives the rotation driving assembly to rotate the wafer for a period of time.
In the step S2, the carrying device is lowered into the tank body to perform cleaning or drying for a period of time, then lowered to the lowest end, and the lifting block is lifted by the protruding block at the bottom of the tank body to perform cleaning or drying for a period of time.
The beneficial effects of the invention are as follows:
according to the bearing device capable of enabling the wafers in the wafer box to obliquely rotate, the power is transmitted to the third support mounting plate from one end on the first support mounting plate through the first rotating shaft, the second rotating shaft and the third rotating shaft which are in transmission connection with each other, so that rotation of the wafers in the wafer basket placed on the third support mounting plate in the wafer accommodating box is achieved, meanwhile, the universal connecting rod, the lifting plate and the lifting block are arranged, the wafer basket can be in a horizontal state when the wafer basket carried by the mechanical arm is carried, the wafer basket is in an oblique state when the wafer basket is lowered into the tank body, matching of the mechanical arm is not needed, and working efficiency is improved.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
FIG. 1 is a schematic view of a carrying device according to an embodiment of the present disclosure when the carrying device is placed in a slot;
FIG. 2 is a schematic structural view of a carrying device according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of the bearing device according to the embodiment of the present application when being jacked up;
FIG. 4 is a schematic view of the wafer basket and lift block housing of FIG. 3 hidden;
FIG. 5 is a perspective view of the carrier of FIG. 3 in longitudinal section;
the reference numerals in the figures are:
1. supporting the mounting assembly;
2. a rotary drive assembly;
8. a tank body;
9. a wafer accommodating case;
11. a first support mounting plate;
12. a second support mounting plate;
13. a third support mounting plate;
14. a lifting plate;
15. a lifting block;
16. a bump;
17. a connecting block;
21. a first rotation shaft;
22. a second rotation shaft;
23. a third rotation shaft;
31. a connecting piece;
32. a first straight gear;
33. a second spur gear;
34. a first fixed block;
35. a second fixed block;
141. a positioning block;
231. a universal coupling rod;
2311. a rod body;
2312. a universal joint.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application can be understood by those of ordinary skill in the art in a specific context.
The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Example 1
The embodiment provides a wafer tilting and rotating carrying device, as shown in fig. 1 and 2, including:
the support mounting assembly 1 comprises a first support mounting plate 11, a third support mounting plate 13 and a second support mounting plate 12, wherein the first support mounting plate 11 and the third support mounting plate 13 are horizontally parallel to each other, the second support mounting plate 12 is arranged in the vertical direction and is connected with the first support mounting plate 11 and the third support mounting plate 13, the first support mounting plate 11 and the third support mounting plate 13 are arranged in a staggered mode, the second support mounting plate 12 is connected with two adjacent ends of the first support mounting plate 11 and the third support mounting plate 13, and a hollow is arranged in the middle of the third support mounting plate 13;
the rotary driving assembly 2 comprises a first rotary shaft 21, a second rotary shaft 22 and a third rotary shaft 23 which are respectively arranged on the first support mounting plate 11, the second support mounting plate 12 and the third support mounting plate 13, wherein the first rotary shaft 21 and the second rotary shaft 22 and the third rotary shaft 23 are connected through a transmission piece, the surface of the third rotary shaft 23 is used for contacting with the bottom of the wafer, and the wafer is driven to rotate together when the third rotary shaft 23 rotates;
the third rotating shaft 23 is formed by connecting two telescopic universal connecting rods 231 in series, the connecting parts of the two universal connecting rods 231 are fixed in the lifting block 15, and the lifting block 15 is positioned above the hollow part in the middle of the third supporting and mounting plate 13;
the third support mounting plate 13 is provided with a lifting plate 14, two ends of the lifting plate 14 are respectively connected with the third support mounting plate 13 and a connecting block 17 of the lifting block 15 through rotating shafts, the connecting block 17 of the lifting block 15 is provided with an arc hole, the rotating shaft of the lifting plate 14 is positioned in the arc hole, the lifting block 15 can be jacked up under the action of the protruding block 16 in the groove body 8 and drives the connecting part of the lifting plate 14 and the universal connecting rod 231 to lift, meanwhile, the wafer basket is inclined, when lifted, the two lifting plates 14 arch towards the middle to form a shape of a letter "a", as shown in fig. 3 and 4, the lifting block 15 is provided with a top cover and a bottom cover, the side face of the lifting block is provided with a vertical strip hole for the rod 2311 of the universal connecting rod 231 to pass through, and the height of the strip hole is limited by the movement when the universal connecting rod 231 is lifted. The bump 16 may be a rod body disposed at the bottom of the groove body 8, when the carrying device with the whole wafer rotating obliquely descends into the groove body 8, in the descending process, the lifting block 15 gradually approaches to the bump 16, so that the bump 16 abuts against the bottom of the lifting block 15 to jack up the lifting block 15, and the height of the bump 16 is adapted to the lifting height of the lifting block 15, as shown in fig. 3, the bump 16 may also be a stepped structure with a gradually reduced diameter from bottom to top.
The gimbaled shaft lever 231 includes a rod body 2311 which is capable of telescoping (telescoping is to compensate for a length change caused by the elevation of the gimbaled shaft lever 231) and gimbaled joints 2312 at both ends of the rod body 2311, wherein the gimbaled joint 2312 near one end of the link 31 is fixed to the rotation shaft of the second spur gear 33 (the gimbaled joint 2312 at the left side in fig. 4) passing through the first fixing block 34, that is, the rotation shaft passing through the second spur gear 33 is provided on the first fixing block 34, the first fixing block 34 does not affect the rotation of the gimbaled joint 2312, but can restrict the gimbaled joint 2312 to keep the gimbaled joint 2312 always horizontal, and the gimbaled joint 2312 at the middle of the gimbaled shaft levers 231 of each group is directly fixed together, and the gimbaled joint 2312 at the end far from the link 31 (the gimbaled joint 2312 at the right side in fig. 4) is rotatably fixed to the second fixing block 35, so that the gimbaled joint 2312 is only rotatable but kept horizontal. The first and second fixing blocks 34 and 35 are provided at both ends of the third support mounting plate 13, and the first and second fixing blocks 34 and 35 do not rise and fall with the rising and falling plate 14. It should be noted that the first spur gear 32 may directly mesh with the two second spur gears 33.
According to the carrying device capable of enabling wafers in the wafer box to obliquely rotate, power is transmitted to the third support mounting plate 13 from one end on the first support mounting plate 11 through the first rotating shaft 21, the second rotating shaft 22 and the third rotating shaft 23 which are in transmission connection with each other, so that rotation of the wafers in the wafer basket placed on the third support mounting plate 13 in the wafer accommodating box 9 is achieved, meanwhile, the universal connecting rod 231, the lifting plate 14 and the lifting block 15 are arranged, the wafer basket can be in a horizontal state when the wafer basket carried by the manipulator is carried, the wafer basket is in an oblique state when the wafer basket is lowered into the groove body 8, matching of the manipulator is not needed, and working efficiency is improved.
The wafer in the wafer accommodating box 9 can rotate during cleaning or drying, so that the position of the wafer in the wafer accommodating box 9 is changed, the wafer surface is rotated relative to the wafer accommodating box 9 through the rotation of the wafer surface, for example, the part blocked by the bottom of the wafer accommodating box 9 is rotated above after the wafer rotates so as to be free from obstruction, and therefore the cleaning or drying effect is improved.
Further, the universal coupling shafts 231 are arranged in two groups, and the two groups of the universal coupling shafts 231 are parallel to each other in a horizontal state. Two parallel universal coupling shafts 231 are capable of two-point contact rotation of the wafer.
Further, the surface of the universal joint lever 231 is made of a PTFE material. All components of the support mounting assembly 1 and the rotary drive assembly 2 are made of plastic materials so as to prevent corrosion of certain cleaning solutions with corrosive effects on metals. The PTFE material is corrosion-proof, has certain flexibility compared with metal, and plays a role in protecting the wafer.
The first rotation shaft 21 is connected to a motor, which is omitted in the drawing and may be arranged in a usual manner. It should be noted that the rotation speed of the wafer is not required to be very fast, and thus the rotation speed of the motor cannot be too fast.
Further, a positioning block 141 is disposed at least on a side of the lifting plate 14 below the wafer basket away from the lifting block 15, so as to abut against the wafer basket and prevent the wafer basket from sliding. Of course, the positioning blocks 141 may be disposed at four corners of the wafer basket.
Further, the first rotating shaft 21 is connected with the second rotating shaft 22 through a right angle gear, the second rotating shaft 22 is connected with the connecting piece 31 through a right angle gear, the connecting piece 31 passes through the second supporting mounting plate 12 and is connected with the second straight gear 33 at one end of the third rotating shaft 23 through the first straight gear 32, in order to reduce friction, a bearing is arranged on a through hole of the second supporting mounting plate 12, and the connecting piece 31 passes through the bearing, as shown in fig. 5, that is, the connecting piece 31 comprises a rod body, one end of the rod body is the right angle gear (the left side of the second supporting mounting plate 12 in fig. 2), the other end is the first straight gear 32 (the right side of the second supporting mounting plate 12 in fig. 2), wherein the rod body passes through the through hole of the second supporting mounting plate 12, and the bearing is arranged in the through hole to reduce friction.
Further, a connection block 17 is connected to the bottom of the lifting block 15 as a connection to the lifting plate 14. The third support mounting plate 13 is formed with a groove to accommodate the lifter plate 14, the depth of the groove being the same as the thickness of the lifter plate 14.
Example 2
The embodiment provides a wafer cleaning and drying method, which comprises the following steps:
s1: placing a wafer basket loaded with wafers in a horizontal manner on a carrying device capable of tilting and rotating wafers in a wafer cassette according to embodiment 1 using a robot;
s2: the bearing device descends into the tank body 8, the tank body 8 is a drying tank or a cleaning tank, when the bearing device descends to the lowest end, the lifting block 15 is jacked by the convex block 16 at the bottom of the tank body 8 to enable the wafer basket to incline, the wafer is cleaned or dried in the tank body 8, and in the cleaning or drying process, the motor drives the rotary driving assembly 2 to enable the wafer to rotate;
s3: after the cleaning or drying is finished, the bearing device is lifted, the wafer basket is restored to be horizontal, and then the wafer basket is grabbed away by the manipulator.
Further, in step S2, after the cleaning is completed, the motor drives the rotation driving assembly 2 to rotate the wafer for a period of time.
Further, in step S2, the carrying device descends into the tank body 8 to perform cleaning or drying for a period of time, descends to the lowest end, and performs cleaning or drying for a period of time after the lifting block 15 is lifted up by the bump 16 at the bottom of the tank body 8. That is, the height of the tank body 8 is higher, so that the carrying device can be cleaned or dried in two states, when the carrying device is at a higher position, the wafer basket is in a horizontal state, and when the wafer basket descends to the lowest end, the wafer basket is in an inclined state, and the adaptability of the device is expanded through switching of different states, that is, a customer can freely select a required cleaning or drying state according to actual conditions.
With the above-described preferred embodiments according to the present application as a teaching, the related workers can make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (8)
1. A wafer tilt rotary carrier, comprising:
the support installation assembly (1) comprises a first support installation plate (11) and a third support installation plate (13) which are horizontally parallel, and a second support installation plate (12) which is vertically arranged and connected with the first support installation plate (11) and the third support installation plate (13), wherein the first support installation plate (11) and the third support installation plate (13) are arranged in a staggered manner, the second support installation plate (12) is connected with two adjacent ends of the first support installation plate (11) and the third support installation plate (13), and a hollow part is arranged in the middle of the third support installation plate (13);
the rotary driving assembly (2) comprises a first rotary shaft (21), a second rotary shaft (22) and a third rotary shaft (23) which are respectively arranged on the first support mounting plate (11), the second support mounting plate (12) and the third support mounting plate (13), the first rotary shaft (21) and the second rotary shaft (22) are connected through a transmission piece, the surface of the third rotary shaft (23) is used for being in contact with the bottom of the wafer, and the wafer is driven to rotate together when the third rotary shaft (23) rotates;
the third rotating shaft (23) is formed by connecting two telescopic universal connecting rods (231) in series, the connecting parts of the two universal connecting rods (231) are fixed in the lifting block (15), and the lifting block (15) is positioned above the hollow part in the middle of the third supporting and mounting plate (13);
the lifting plate (14) is arranged on the third support mounting plate (13), two ends of the lifting plate (14) are respectively connected with the connecting blocks (17) of the third support mounting plate (13) and the lifting block (15) through rotating shafts, the connecting blocks (17) of the lifting block (15) are provided with arc holes, the rotating shafts of the lifting plate (14) are positioned in the arc holes, and the lifting block (15) can be jacked up under the action of the protruding blocks (16) in the groove body (8) and drives the connecting parts of the lifting plate (14) and the universal connecting rods (231) to lift;
the first rotating shaft (21) is connected with the second rotating shaft (22) through a right-angle gear, the second rotating shaft (22) is connected with the connecting piece (31) through a right-angle gear, and the connecting piece (31) penetrates through the second support mounting plate (12) and is connected with a second straight gear (33) at one end of the third rotating shaft (23) through a first straight gear (32);
the universal joint shaft rod (231) comprises a telescopic rod body (2311) and universal joints (2312) positioned at two ends of the rod body (2311), wherein the universal joints (2312) close to one end of the connecting piece (31) are fixed with a rotating shaft of the second spur gear (33) penetrating through the first fixing block (34), the universal joints (2312) in the middle of the two universal joint shaft rods (231) are fixed together to form a connecting part, the universal joints (2312) far away from one end of the connecting piece (31) are rotationally fixed on the second fixing block (35), and the first fixing block (34) and the second fixing block (35) are respectively arranged at two ends of the third supporting and mounting plate (13).
2. The wafer tilting and rotating carrier according to claim 1, wherein the universal joint shafts (231) are arranged in two groups and the two groups of universal joint shafts (231) are parallel to each other in a horizontal state.
3. A wafer tilting and rotating carrier according to claim 1, characterized in that the surface of the universal joint rod (231) is made of PTFE material.
4. The wafer tilting and rotating carrying device according to claim 1, wherein a positioning block (141) is arranged at least on one side of the lifting plate (14) below the wafer basket, which side is far away from the lifting block (15).
5. A wafer tilting and rotating carrying device according to claim 1, characterized in that the through hole of the second support mounting plate (12) is provided with a bearing through which the connection piece (31) is arranged.
6. The wafer cleaning and drying method is characterized by comprising the following steps of:
s1: placing a wafer basket loaded with wafers in a horizontal manner on the carrying device capable of tilting and rotating the wafers in the wafer cassette according to any one of claims 1 to 5 using a robot arm;
s2: the bearing device is lowered into the tank body (8), the tank body (8) is a drying tank or a cleaning tank, when the bearing device is lowered to the lowest end, the lifting block (15) is jacked by the convex block (16) at the bottom of the tank body (8) to enable the wafer basket to incline, the wafer is cleaned or dried in the tank body (8), and in the cleaning or drying process, the motor drives the rotary driving assembly (2) to enable the wafer to rotate;
s3: after the cleaning or drying is finished, the bearing device is lifted, the wafer basket is restored to be horizontal, and then the wafer basket is grabbed away by the manipulator.
7. The wafer cleaning and drying method according to claim 6, wherein in step S2, the motor also drives the rotary driving assembly (2) to rotate the wafer for a period of time after the cleaning is completed.
8. The wafer cleaning and drying method according to claim 6, wherein in step S2, the carrier device is lowered into the tank body (8) to perform cleaning or drying for a period of time, then lowered to the lowest end, and the lifting block (15) is lifted up by the bump (16) at the bottom of the tank body (8) to perform cleaning or drying for a period of time.
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| CN202310040867.9A CN116053188B (en) | 2023-01-13 | 2023-01-13 | Wafer inclined rotation bearing device and wafer cleaning and drying method |
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| CN202310040867.9A CN116053188B (en) | 2023-01-13 | 2023-01-13 | Wafer inclined rotation bearing device and wafer cleaning and drying method |
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| CN116053188B CN116053188B (en) | 2023-06-02 |
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| CN116936432A (en) * | 2023-09-14 | 2023-10-24 | 常州银河世纪微电子股份有限公司 | Wafer storage box, taking and placing device using same and taking and placing method |
| CN116968047A (en) * | 2023-08-11 | 2023-10-31 | 无锡亚电智能装备有限公司 | Photovoltaic cleaning tank type mechanical arm |
| CN117012684A (en) * | 2023-09-18 | 2023-11-07 | 上海普达特半导体设备有限公司 | Adjustable wafer handling mechanism |
| CN116968047B (en) * | 2023-08-11 | 2024-04-30 | 无锡亚电智能装备有限公司 | Photovoltaic cleaning tank type mechanical arm |
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| CN117012684A (en) * | 2023-09-18 | 2023-11-07 | 上海普达特半导体设备有限公司 | Adjustable wafer handling mechanism |
| CN117012684B (en) * | 2023-09-18 | 2023-12-08 | 上海普达特半导体设备有限公司 | Adjustable wafer handling mechanism |
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|---|---|
| CN116053188B (en) | 2023-06-02 |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |