CN217770753U - Modular partition phase change radiator - Google Patents

Modular partition phase change radiator Download PDF

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Publication number
CN217770753U
CN217770753U CN202221753233.5U CN202221753233U CN217770753U CN 217770753 U CN217770753 U CN 217770753U CN 202221753233 U CN202221753233 U CN 202221753233U CN 217770753 U CN217770753 U CN 217770753U
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heat
groove
heat source
base plate
substrate
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CN202221753233.5U
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卢忠亮
仝爱星
韦开满
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Zhejiang Jiaxi Technology Co ltd
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Zhejiang Jiaxi Technology Co ltd
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Abstract

The utility model provides a modular subregion phase change radiator, at least, including the base plate, the heat source combination board, condensation fin group and heat transfer working medium, be provided with the base plate recess that is the matrix and distributes on the base plate, the base plate recess, the heat source combination board, a plurality of condensation fins and heat transfer working medium form the heat dissipation subregion, with the line heat dissipation subregion autonomous working nevertheless communicates each other, with the line heat dissipation subregion autonomous working and each other not communicate, can dispel the heat alone many heat source products, accurate heat dissipation has realized small, and is low in cost, be convenient for utilize on a large scale. The second surface of the base plate is provided with the mounting plate, so that the replacement and the maintenance of the condensing fin group are facilitated; the radiating fins are arranged to increase the radiating area; the side plates are arranged to protect the condensing fin group and the radiating fins from being damaged or damaged due to the influence of external force; the condensing fins comprise at least two regions which are distributed at intervals, and transverse gaps between the regions are gas flow channels, so that the internal pressure of the modular partition phase-change radiator is reduced, and the heat dissipation efficiency is improved.

Description

Modular partition phase change radiator
Technical Field
The utility model relates to a radiator field especially relates to a module formula subregion phase change radiator.
Background
Most radiators in the market provide heat dissipation for one heat source, however, various products of the current products have uneven heat sources, the most suitable temperature of each heat source is different, and separate heat dissipation for each heat source is also a great demand in the market.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings in the prior art, an object of the present invention is to provide a modular partitioned phase change heat sink for solving the heat dissipation problem of multiple heat sources in the prior art.
In order to achieve the above objects and other related objects, the present invention provides a modular partitioned phase change heat sink, the modular partitioned phase change heat sink at least includes:
the substrate comprises a first surface and a second surface which are opposite, the substrate is provided with a plurality of substrate grooves which penetrate through the substrate, the adjacent substrate grooves are separated by a substrate wall, step structures are arranged in the substrate grooves, and the number of the substrate grooves is at least 2;
the heat source combination plate is laid with a capillary structure, the heat source combination plate is arranged corresponding to the substrate groove, the heat source combination plate is fixed in the substrate groove on the first surface by combining the step structure, a reserved gap is formed between the heat source combination plate and the substrate, and the reserved gap is used as a storage cavity;
the condensation fin groups are fixed on the second surface of the base plate and are arranged corresponding to the base plate grooves, each condensation fin group comprises a plurality of condensation fins separated by transverse walls, and the plurality of correspondingly arranged condensation fins are combined with the base plate grooves and the heat source combination plate to form heat dissipation partitions;
and the heat transfer working medium is filled in the storage cavity formed by the heat source combination plate and the base plate.
Preferably, the base plate recess is the matrix and distributes, and with all on the same line the base plate recess the heat source combination board with the condensation fin forms be linked together between the subregion of dispelling the heat and constitute the liquid heat absorption evaporation and the cyclic seal chamber of the heat transfer of the heat dissipation condensation of steam heat absorption, with all on the same row the base plate recess the heat source combination board with the formation of condensation fin each other do not communicate with each other between the subregion of dispelling the heat.
Preferably, the heat source bonding plate is further provided with a groove, and the capillary structure extends and fills the groove.
Preferably, the grooves include a first groove and a second groove which are communicated with each other, the first groove is adjacent to the storage cavity, a plurality of protrusions distributed at intervals in the same direction are arranged in the first groove, the second groove is a plurality of grooves distributed in the same direction, and the extending directions of the protrusions and the grooves are vertically parallel.
Preferably, the second surface of the base plate is provided with an installation plate, the installation plate is correspondingly provided with a plurality of through installation grooves, and the condensation fin group is installed in the installation grooves and is in contact with the base plate.
Preferably, the condensing fin group is further provided with heat radiating fins, and the heat radiating fins are fixed on one side or two sides of the condensing fin group.
Preferably, the heat dissipation fins between adjacent condensing fin groups are arranged in a staggered and overlapping manner.
Preferably, a side plate is further disposed on the base plate, and the side plate is located outside the condensing fin group.
Preferably, a fixing groove is formed between the heat source combining plate and the first surface, and the heat source is installed in the fixing groove.
Preferably, the condensing channels in the condensing fins are vertically parallel to each other and comprise at least two regions which are distributed at intervals, and the transverse gap between the regions is used as a gas flow passage.
As above, the utility model discloses a module formula subregion phase change radiator has following beneficial effect: the modular partitioned phase-change radiator at least comprises a base plate, a heat source combination plate, a plurality of condensing fin groups and a heat transfer working medium, wherein base plate grooves distributed in a matrix form are formed in the base plate, the base plate grooves, the heat source combination plate, the condensing fins in the plurality of condensing fin groups and the heat transfer working medium form radiating partitions, the radiating partitions in the same row work independently but are communicated with one another, the radiating partitions in the same row work independently and are not communicated with one another, so that independent radiating can be realized for a multi-heat-source product, independent radiating between upper and lower heat sources in the same row is not influenced, accurate radiating is realized, and the radiating efficiency of the modular partitioned phase-change radiator is improved; the heat sources in the same row independently dissipate heat, the heat sources are not affected by positions and uniformly dissipate heat, and the heat source combination plates are arranged to disperse the pressure of gaseous heat transfer working medium on the heat source combination plates, so that the safety and reliability of the modular partitioned phase change radiator are improved; the modular partitioned phase-change radiator integrates a plurality of radiating partitions into the same radiator, so that the modular partitioned phase-change radiator is small in size, low in cost and convenient to apply on a large scale.
The second surface of the base plate is provided with an installation plate, so that the condensation fin group is convenient to replace and overhaul; the condensing fin group is also provided with radiating fins, so that the radiating area is increased, and the radiating efficiency of the modular partitioned phase-change radiator is improved; the base plate is also provided with a side plate, and the side plate protects the condensation fin group and the radiating fins from being damaged or damaged due to the influence of external force, so that the service life of the modular type partitioned phase change radiator is prolonged; a fixed groove is formed between the heat source combination plate and the first surface, a heat source is arranged in the fixed groove, and the contact area of the heat source and the substrate is increased, so that the heat transfer performance of the modular partitioned phase-change radiator is improved; the condensing channels in the condensing fins are vertically parallel to each other and comprise at least two regions which are distributed at intervals, and the transverse gap between the regions is a gas flow channel, so that gaseous heat transfer working media can be condensed, liquefied and released heat more quickly, the internal pressure of the modular partitioned phase-change radiator is reduced, and the heat dissipation efficiency of the modular partitioned phase-change radiator is improved.
Drawings
Fig. 1 is a schematic view illustrating a heat dissipation principle of a modular partitioned phase change heat sink according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a modular partitioned phase change heat sink according to an embodiment of the present invention.
Fig. 3 is an enlarged schematic view of the area a in fig. 2.
Fig. 4 is a schematic structural view of a substrate and a heat source bonding board according to an embodiment of the present invention.
Description of the element reference numerals
100. Substrate
110. Substrate groove
120. Step structure
130. Substrate wall
200. Heat source combined board
211. Capillary structure
212. Groove
220. Storage cavity
300. Condensing fin group
310. Condensing fin
311. Gas flow channel
312. Condensation channel
313. Liquid flow passage
320. Transverse wall
400. Radiating fin
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 1-4. It should be noted that the drawings provided in the present embodiment are only for schematically illustrating the basic concept of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, amount and proportion of each component may be changed arbitrarily and the layout of the components may be more complicated.
For convenience of description, the directions herein are defined as follows: the X direction is a horizontal direction and is also a row of the substrate groove matrix; the Y direction is vertical and is also the row of the substrate groove matrix; the Z direction is transverse.
As shown in fig. 1-2, the utility model provides a modular subregion phase change heat sink, modular subregion phase change heat sink includes at least:
the substrate 100 comprises a first surface and a second surface which are opposite to each other, the substrate 100 is provided with a plurality of substrate grooves 110 which penetrate through the substrate 100, adjacent substrate grooves 110 are separated by a substrate wall 130, a step structure 120 is arranged in each substrate groove 110, and the number of the substrate grooves 110 is at least 2;
a capillary structure 211 is laid on the heat source combination plate 200, the heat source combination plate 200 is arranged corresponding to the substrate groove 110, the heat source combination plate 200 is fixed in the substrate groove 110 of the first surface in combination with the step structure 120, a reserved gap is formed between the heat source combination plate 200 and the substrate 100, and the reserved gap is used as a storage cavity 220;
condensation fin groups 300, the condensation fin groups 300 being fixed to the second surface of the substrate 100, the condensation fin groups 300 being disposed corresponding to the substrate grooves 110, each condensation fin group 300 including a plurality of condensation fins 310 separated by transverse walls 320, the plurality of condensation fins 310 disposed corresponding to each other forming heat dissipation partitions by combining the substrate grooves 110 and the heat source combining plates 200;
and the heat transfer working medium is filled in the storage cavity 220 formed by the heat source combination plate 200 and the substrate 100.
Specifically, in this embodiment, the substrate 100 includes the first surface and the second surface that are oppositely disposed, and the substrate 100 is provided with a plurality of substrate grooves 110 that penetrate through the substrate 100 and are separated by the substrate wall 130. In this embodiment, the vertical spacing distance between the adjacent substrate grooves 110 is greater than the horizontal spacing distance between the adjacent substrate grooves 110, but the present invention is not limited to this, and the vertical spacing distance may be set according to actual requirements, for example, the vertical spacing distance is equal to or less than the horizontal spacing distance. The step structure 120 is disposed in the substrate groove 110, and the heat source bonding board 200 is fixed in the substrate groove 110 by combining the step structure 120. In order to be able to dissipate heat separately from a plurality of heat sources, the number of the substrate recesses 110 should be not less than 2.
The surface of the heat source combination plate 200 facing the first surface is in contact with a heat source to form a heat source contact surface, the capillary structure 211 is laid on the other surface of the heat source combination plate 200 opposite to the heat source contact surface, and the capillary structure 211 provides capillary force to disperse heat transfer working media to the whole surface of the heat source combination plate 200. The heat source combination plate 200 is fixed in the substrate groove 110 of the first surface in combination with the step structure 120, and a reserved gap is formed between the heat source combination plate 200 and the substrate 100, and the reserved gap can store a heat transfer working medium, so the heat transfer working medium is also called as a storage cavity 220.
The condensing fin groups 300 are fixed on the second surface of the base plate 100, the condensing fin groups 300 are arranged corresponding to the base plate grooves 110, each condensing fin group 300 spans all the base plate grooves 110 in the same vertical direction and is fixed on the second surface, and each condensing fin group comprises a plurality of condensing fins 310 separated by the transverse walls 320; the condensation fin 310 is provided with a condensation channel 312 and an opening, the condensation channel 312 and the transverse gap at the top of the condensation fin 310 are gas flow channels 311, the condensation channel 312 and the transverse gap at the bottom of the condensation fin 310 are liquid flow channels 313, the opening faces the substrate groove 110 and is fixed on the two sides of the substrate groove 110, and the condensation fin 310 is correspondingly arranged to be combined with the substrate groove 110 and the heat source combining plate 200 to form a heat dissipation partition. The combination of the plurality of condensing fins 310 may be formed by welding all the condensing fin groups 300 into a whole by connecting plates, or may be formed in other manners, which is selected according to the actual situation, and is not particularly limited herein.
The heat transfer working medium is filled in the storage cavity 220 formed by the heat source combination plate 200 and the substrate 100, and the heat source is radiated by utilizing the property that the heat transfer working medium absorbs heat through phase change and the temperature of the heat transfer working medium is kept unchanged.
In detail, after the welding and assembling of the modular partitioned phase change heat radiator are completed, the modular partitioned phase change heat radiator is subjected to vacuum pumping treatment and then is fused and sealed to avoid air entering. Taking one of the heat dissipation partitions as an example, the working principle of the modular partitioned phase change heat sink is analyzed. When the heat source combination plate 200 is heated, the heat transfer working medium on the surface of the heat source combination plate 200 absorbs latent heat to evaporate, the gaseous heat transfer working medium enters the condensation fins 310 from the opening, is condensed and liquefied in the condensation fins 310 to release heat, and exchanges heat with the cooling air flowing through the outer surface of the condensation fins 310 to dissipate the heat to the surrounding environment; under the action of gravity, the condensed and liquefied liquid heat transfer working medium is collected at the bottom of the condensing fins 310 along the condensing channel 312 and flows back to the storage cavity 220 along the liquid flow channel 313 at the bottom, and the heat transfer working medium in the storage cavity 220 flows back and spreads to the surface of the whole heat source combination plate 200 under the action of the capillary structure 211 and absorbs heat for evaporation again, so that the circulation of evaporation heat absorption and condensation heat release is continuously carried out, and dynamic balance is achieved.
As an example, the substrate grooves 110 are distributed in a matrix form, all the substrate grooves 110, the heat source combination plate 200 and the heat dissipation subareas formed by the condensation fins 310 in the same row are communicated with each other and form a sealed cavity of a liquid heat absorption evaporation and steam heat release condensation heat transfer cycle, and all the substrate grooves 110, the heat source combination plate 200 and the heat dissipation subareas formed by the condensation fins 310 in the same row are not communicated with each other.
Specifically, as shown in fig. 1 and 4, in this embodiment, the substrate groove 110 is distributed in a matrix form, and the same vertical direction is that a plurality of condensation fins 310 correspondingly arranged on the same row are combined with the substrate groove 110 and the heat source combination board 200 to form a plurality of independent heat dissipation partitions, and the adjacent heat dissipation partitions are not communicated with each other, so that the vertical direction can independently and simultaneously dissipate heat from a plurality of heat sources, and the heat dissipation partitions do not affect each other, thereby achieving precise and efficient heat dissipation. When the traditional radiator provides heat dissipation for different vertical heat sources, the temperature of a heat transfer working medium can be continuously increased when the heat transfer working medium flows to an upper heat source from a lower heat source under the action of capillary action, so that the heat dissipation efficiency of the upper heat source is poor, and the phenomenon of uneven vertical heat dissipation is caused. In the embodiment, the vertical upper heat source and the vertical lower heat source are correspondingly provided with independent heat dissipation subareas, so that the phenomenon of uneven vertical heat dissipation is avoided, and the overall heat dissipation efficiency of the modular type subarea phase change heat radiator is improved.
The plurality of condensation fins 310 correspondingly arranged in the same horizontal direction, that is, in the same row, are combined with the substrate groove 110 and the heat source combination plate 200 to form heat dissipation partitions to work independently, but the heat dissipation partitions in the same horizontal direction are communicated with each other to form a sealed cavity for liquid heat absorption evaporation and steam heat release condensation heat transfer circulation, so that the problem of low heat dissipation efficiency caused by the influence of heat transfer of the heat dissipation partitions at two sides in the middle of the heat dissipation partition is avoided, and a plurality of heat sources are uniformly dissipated without the influence of heat dissipation positions. In addition, the heat source combination plates 200 are arranged upwards in the same horizontal direction, so that the pressure of gaseous heat transfer working medium in the heat dissipation cavity on the heat source combination plates 200 can be dispersed, and the safety and reliability of the modular partitioned phase change heat radiator are improved.
The modular partitioned phase-change radiator integrates a plurality of radiating partitions into the same radiator, so that the modular partitioned phase-change radiator is small in size, low in cost and convenient to apply on a large scale.
As an example, the heat source bonding board 200 is further provided with a groove 212, and the capillary structure 211 extends and fills the groove 212.
Specifically, as shown in fig. 1, in this embodiment, a groove 212 is further disposed on the heat source bonding board 200, and the bottom of the capillary structure 211 extends and fills a gap in the groove 212. The groove 212 not only can effectively increase the cross-sectional area of the heat transfer working medium circulation channel, but also can provide capillary force for the heat transfer working medium circulation, and the capillary structure which provides main power for the heat transfer working medium is combined, so that the circulation resistance of the heat transfer working medium is reduced in a limited way, and the heat transfer capacity of the modular partitioned phase change radiator is improved.
By way of example, the grooves 212 include a first groove (not shown) and a second groove (not shown) that are communicated with each other, the first groove is adjacent to the storage cavity 220, a plurality of protrusions (not shown) are arranged in the first groove and distributed at intervals in the same direction, the second groove is a plurality of grooves (not shown) distributed in the same direction, and the extending directions of the protrusions and the grooves are vertically parallel.
Specifically, in this embodiment, the groove 212 includes a first groove and a second groove that are communicated with each other, where the first groove is adjacent to the storage cavity 220, and a plurality of protrusions are disposed in the first groove and distributed at intervals in the same direction, and the protrusions may be polygonal protrusions such as triangle, square, etc., or curved protrusions such as circle, etc., and are specifically disposed as needed, and there is no particular limitation here. The protrusions can be smaller in structure, and gaps between adjacent protrusions are smaller, so that the sectional area of a heat transfer working medium circulation channel can be effectively increased, the evaporation area of a heat transfer working medium is increased, boiling heat transfer is enhanced, the thermal resistance of evaporation and heat absorption and the heat transfer temperature difference are reduced, the capillary force of a backflow liquid heat transfer working medium is increased, the backflow quantity of the liquid heat transfer working medium is increased, the dry burning phenomenon is avoided, the heat transfer capacity is improved, and the stability of the heat dissipation efficiency of the module type partition phase change radiator is guaranteed. The second grooves are a plurality of grooves distributed in the same direction, the extending directions of the protrusions and the grooves are parallel in the vertical direction, so that the sectional area of a heat transfer working medium circulation channel is increased moderately, the capillary force of the heat transfer working medium is increased, and meanwhile, the evaporation speed of the heat transfer working medium far away from the storage cavity 220 is effectively controlled, the evaporation speed is not greater than the reflux speed of the heat transfer working medium, the dry burning phenomenon is avoided, and the service life of the modular partitioned phase change radiator is prolonged.
As an example, the second surface of the base plate is provided with a mounting plate (not shown) correspondingly provided with a plurality of mounting grooves (not shown) therethrough, and the condensing fin group 300 is mounted in the mounting grooves and in contact with the base plate 100.
Specifically, in this embodiment, the second surface of the substrate 100 is provided with a mounting plate, the mounting plate corresponds to the substrate groove is provided with a plurality of through mounting grooves, and the condensing fin group 300 is fixed in the mounting groove and in contact with the substrate, so that the condensing fin group is convenient to replace and overhaul.
As an example, the condensation fin set 300 is further provided with heat dissipation fins 400, and the heat dissipation fins 400 are fixed on one side or both sides of the condensation fin set 300.
Specifically, as shown in fig. 2, in the present embodiment, in order to increase the heat dissipation area and the heat dissipation capability, the condensing fin set 300 is further provided with heat dissipation fins 400, and the heat dissipation fins, due to the corrugated shape, greatly increase the heat dissipation area when the condensing fin set 300 exchanges heat with cooling air, so as to improve the heat dissipation efficiency and the heat dissipation capability of the modular partitioned phase change heat sink. The heat dissipation fins 400 may be fixed to a single side of the condensation fin group 300, may also be fixed to two sides of the condensation fin group 300, and may also be partially fixed to a single side of the condensation fin group 300 and partially fixed to two sides of the condensation fin group 300, which is specifically set according to actual requirements, and is not particularly limited herein.
As an example, the heat dissipating fins 400 between the adjacent condensing fin groups 300 are arranged in a staggered and overlapping manner.
Specifically, as shown in fig. 3, in the embodiment, the heat dissipation fins 400 are located on two sides of the condensation fin groups 300, but in order to increase the number of the condensation fin groups 300, the heat dissipation fins 400 between adjacent condensation fin groups 300 are arranged in a staggered and overlapping manner, so that a large amount of space is saved for installing more condensation fin groups 300, and thus, the space for condensing and liquefying the gaseous heat transfer working medium to release heat is relatively increased, and the heat dissipation efficiency and the heat transfer capacity of the modular partitioned phase change heat sink are improved.
As an example, a side plate (not shown) is further provided on the base plate, and the side plate is positioned outside the condensing fin group 300.
Specifically, in this embodiment, the substrate 100 is further provided with a side plate, the side plate is located in parallel at the outer side of the condensing fin group 300, when the cooling fins 400 are arranged on the condensing fin group 300, the side plate is located in parallel at the outer side of the cooling fins 400, and the vertical projections of the condensing fin group 300 and the cooling fins 400 relative to the side plate are located in the side plate, so that the side plate can effectively isolate the influence of external force on the condensing fin group 300 and the cooling fins 400, prevent the condensing fin group 300 and the cooling fins 400 from being deformed due to the external force, and protect the modular partitioned phase change radiator.
As an example, a fixing groove (not shown) is formed between the heat source bonding plate 200 and the first surface, and a heat source is installed in the fixing groove.
Specifically, in this embodiment, the heat source bonding board 200 is sunk into the first surface of the substrate 100, so that a groove exists between the heat source bonding board 200 and the first surface, and the groove can be used as a fixing groove for installing and fixing a heat source, and meanwhile, the contact area between the heat source and the substrate 100 is increased, so as to improve the heat transfer performance of the modular partitioned phase change heat sink.
As an example, the condensation channels 312 in the condensation fins 310 are vertically parallel to each other and comprise at least two spaced apart regions, with a transverse gap between the regions serving as a gas flow passage 311.
Specifically, as shown in fig. 1, in this embodiment, the condensing channels 312 in the condensing fins 310 are vertically parallel to each other, so that the liquefied heat transfer medium can be collected at the bottoms of the condensing fins 310 quickly, and the reflux speed of the heat transfer medium is increased. The condensation channel 312 comprises at least two regions which are distributed at intervals, and the transverse gap between the regions is a gas flow channel 311, so that the flow of gas heat transfer working media in the condensation fin is increased, the gas heat transfer working media can be condensed, liquefied and released heat more quickly, the internal pressure of the modular partitioned phase-change radiator is reduced, and the heat dissipation efficiency of the modular partitioned phase-change radiator is also improved. In order to make the lower area of the condensation channel 312 provide enough condensation and liquefaction space for the gaseous heat transfer medium, the area of the condensation channel 312 located above may be smaller than the area of the condensation channel 312 located below.
To sum up, the utility model discloses a module formula subregion phase change radiator has following beneficial effect: the modular partitioned phase-change radiator at least comprises a base plate, a heat source combination plate, a plurality of condensing fin groups and a heat transfer working medium, wherein base plate grooves distributed in a matrix form are formed in the base plate, the base plate grooves, the heat source combination plate, the condensing fins in the plurality of condensing fin groups and the heat transfer working medium form radiating partitions, the radiating partitions in the same row work independently but are communicated with one another, the radiating partitions in the same row work independently and are not communicated with one another, so that independent radiating can be realized for a multi-heat-source product, independent radiating between upper and lower heat sources in the same row is not influenced, accurate radiating is realized, and the radiating efficiency of the modular partitioned phase-change radiator is improved; the heat sources in the same row independently dissipate heat, the heat sources are not affected by positions and uniformly dissipate heat, and the heat source combination plates are arranged to disperse the pressure of gaseous heat transfer working medium on the heat source combination plates, so that the safety and reliability of the modular partitioned phase change radiator are improved; the modular partitioned phase-change radiator integrates a plurality of radiating partitions into the same radiator, so that the modular partitioned phase-change radiator is small in size, low in cost and convenient to apply on a large scale.
The second surface of the base plate is provided with an installation plate, so that the condensation fin group is convenient to replace and overhaul; the condensing fin group is also provided with radiating fins, so that the radiating area is increased, and the radiating efficiency of the modular partitioned phase-change radiator is improved; the base plate is also provided with a side plate, and the side plate protects the condensation fin group and the radiating fins from being damaged or damaged due to the influence of external force, so that the service life of the modular type partitioned phase change radiator is prolonged; a fixed groove is arranged between the heat source combination plate and the first surface, a heat source is arranged in the fixed groove, and the contact area of the heat source and the substrate is increased, so that the heat transfer performance of the modular type partitioned phase change radiator is improved; the condensing channels in the condensing fins are vertically parallel to each other and comprise at least two regions which are distributed at intervals, and the transverse gap between the regions is a gas flow channel, so that gaseous heat transfer working media can be condensed, liquefied and released heat more quickly, the internal pressure of the modular partitioned phase-change radiator is reduced, and the heat dissipation efficiency of the modular partitioned phase-change radiator is improved. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. A modular zoned phase change heat sink, comprising at least:
the substrate comprises a first surface and a second surface which are opposite, the substrate is provided with a plurality of substrate grooves which penetrate through the substrate, the adjacent substrate grooves are separated by a substrate wall, step structures are arranged in the substrate grooves, and the number of the substrate grooves is at least 2;
the heat source combination plate is laid with a capillary structure, the heat source combination plate is arranged corresponding to the substrate groove, the heat source combination plate is fixed in the substrate groove on the first surface by combining the step structure, a reserved gap is formed between the heat source combination plate and the substrate, and the reserved gap is used as a storage cavity;
the condensation fin groups are fixed on the second surface of the base plate and are arranged corresponding to the base plate grooves, each condensation fin group comprises a plurality of condensation fins separated by transverse walls, and the plurality of correspondingly arranged condensation fins are combined with the base plate grooves and the heat source combination plate to form heat dissipation partitions;
and the heat transfer working medium is filled in the storage cavity formed by the heat source combination plate and the base plate.
2. The modular zoned phase change heat sink of claim 1, wherein: the base plate recess is the matrix and distributes, and is all with the line the base plate recess the heat source combination board with the condensation fin forms be linked together and constitute the liquid heat absorption evaporation and the cyclic seal chamber of the heat transfer of the heat dissipation condensation of steam heat release between the subregion, with arranging all the base plate recess the heat source combination board with the condensation fin forms each other not communicate with each other between the subregion of dispelling the heat.
3. The modular zoned phase change heat sink of claim 1, wherein: the heat source combination plate is also provided with a groove, and the capillary structure extends and fills the groove.
4. The modular zoned phase change heat sink of claim 3, wherein: the groove comprises a first groove and a second groove which are communicated, the first groove is close to the storage cavity, a plurality of protrusions distributed at intervals in the same direction are arranged in the first groove, the second groove is a plurality of grooves distributed in the same direction, and the protrusions and the extending directions of the grooves are vertically parallel.
5. The modular zoned phase change heat sink of claim 1, wherein: the second surface of base plate is provided with the mounting panel, the mounting panel corresponds and is provided with a plurality of mounting grooves that link up, the condensation fin group install in the mounting groove and with the base plate contact.
6. The modular zoned phase change heat sink of claim 1, wherein: and the condensing fin group is also provided with radiating fins which are fixed on one side or two sides of the condensing fin group.
7. The modular zoned phase change heat sink of claim 6, wherein: the radiating fins between the adjacent condensing fin groups are arranged in a staggered and overlapped mode.
8. The modular zoned phase change heat sink of claim 1, wherein: and the base plate is also provided with a side plate, and the side plate is positioned on the outer side of the condensation fin group.
9. The modular zoned phase change heat sink of claim 1, wherein: a fixing groove is formed between the heat source combination plate and the first surface, and a heat source is installed in the fixing groove.
10. The modular zoned phase change heat sink of claim 1, wherein: the condensing channels in the condensing fins are vertically parallel to each other and comprise at least two areas which are distributed at intervals, and transverse gaps between the areas are used as gas flow channels.
CN202221753233.5U 2022-07-07 2022-07-07 Modular partition phase change radiator Active CN217770753U (en)

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Application Number Priority Date Filing Date Title
CN202221753233.5U CN217770753U (en) 2022-07-07 2022-07-07 Modular partition phase change radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221753233.5U CN217770753U (en) 2022-07-07 2022-07-07 Modular partition phase change radiator

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Publication Number Publication Date
CN217770753U true CN217770753U (en) 2022-11-08

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