WO2021203787A1

WO2021203787A1 - Heat superconducting heat transfer plate and radiator

Info

Publication number: WO2021203787A1
Application number: PCT/CN2021/070657
Authority: WO
Inventors: 仝爱星; 卢忠亮; 唐必洪
Original assignee: 浙江嘉熙科技股份有限公司
Priority date: 2020-04-09
Filing date: 2021-01-07
Publication date: 2021-10-14

Abstract

The present invention provides a heat superconducting heat transfer plate and a radiator. The radiator comprises a radiating substrate and heat superconducting heat transfer plates. Each heat superconducting heat transfer plate comprises a heat conducting plate of a composite plate type structure, a heated area located on the edge of one side of the heat conducting plate, and condensation heat dissipation areas and isolation blocking areas located on the surface of the heat conducting plate; the condensation heat dissipation areas and the isolation blocking areas are sequentially alternately arranged from top to bottom, and the condensation heat dissipation areas are located on the upper portion; heat dissipation pipelines are formed in the condensation heat dissipation areas, the heat dissipation pipelines in the condensation heat dissipation areas are connected to form a through closed pipeline, and the closed pipeline is filled with a heat transfer working medium; the extension direction of the isolation blocking areas is obliquely crossed with the side edges of the heat conducting plate, and the ends thereof close to the heated area are lower than the ends distant from the heated area. By means of the present invention, the high-temperature phenomenon caused by the fact that heat cannot be conducted out due to different heat source positions can be avoided, the heat dissipation problem of a plurality of heating power devices can be solved, the local high-temperature phenomenon is avoided, and the heat dissipation efficiency and the heat dissipation capacity of the whole radiator are improved.

Description

Thermal superconducting heat transfer plate and radiator

Technical field

The present invention relates to the technical field of heat dissipation, in particular to a thermal superconducting heat transfer plate and a radiator.

Background technique

With the rapid development of 5G communication technology, the integration of power components is getting higher and higher, and the power density is getting bigger and bigger. Traditional aluminum radiators can no longer meet the heat dissipation requirements of 5G communication base station equipment.

Thermal superconducting heat transfer technology, including filling working medium in a closed interconnected microchannel system, phase change heat transfer technology that realizes thermal superconducting heat transfer through the evaporation and condensation phase change of the working medium; or through controlled airtightness The microstructure state of the working medium in the system, that is, during the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and on this basis, the consistency of the working medium microstructure is achieved, and the phase of high-efficiency heat transfer is achieved. Variable Inhibition (PCI) heat transfer technology. Due to the rapid thermal conductivity of thermal superconducting technology, its equivalent thermal conductivity can reach more than 4000W/m℃, which can realize the uniform temperature of the entire thermal superconducting heat transfer plate.

Thermal superconducting fin radiator is a radiator composed of a thermal superconducting heat transfer plate as a heat dissipation fin. It is mainly composed of a radiator base plate and a plurality of thermal superconducting heat transfer plates arranged on the radiator base plate. The heat source is set On the other plane of the heat sink substrate. The heat of the heat source is conducted to a plurality of heat dissipation fins through the substrate, and then the heat is dissipated to the surrounding environment through the heat dissipation fins. Because the thermal superconducting heat transfer plate has a thin plate structure, it has fast heat conduction rate, small size, light weight, high fin efficiency, and the fin efficiency does not change with the height of the fin, so it has been widely used in the heat dissipation of 5G base station equipment.

At present, the structure of the thermal superconducting heat transfer plate on the radiator of the 5G base station equipment is shown in Figure 1 and Figure 2. The total volume of the edge honeycomb pipeline 11. Because the radiator is installed vertically, the heat transfer working medium 12 is mainly concentrated in the lower space of the thermal superconducting heat transfer plate under the influence of gravity. When the filling amount is too low (as shown in Figure 1), the thermal superconducting transfer The upper part of the hot plate will have a non-working fluid area, and the heat of the heat source 13 at the upper part of the radiator cannot conduct heat conduction through the heat transfer working fluid inside the thermal superconducting heat transfer plate, resulting in a high temperature of the local heat source. In order to solve the high temperature problem of the upper heat source 13, the filling amount of the heat transfer working medium 12 can be increased (as shown in Fig. 2). Due to the influence of gravity, the heat source 13 of the lower part of the thermal superconducting heat transfer plate has a long startup time and a large thermal resistance at the bottom. The heat source 13 located on the upper part of the radiator has a relatively high temperature, the temperature difference between the upper part and the lower part of the thermal superconducting heat transfer plate is large, the effect of the radiator is deteriorated, and other defects, and it is easy to cause damage to the heating device.

Therefore, how to solve the problems of the high temperature of the local heat source, the large temperature difference between the upper and lower parts of the thermal superconducting heat transfer plate, and the poor effect of the radiator have become one of the problems to be solved by those skilled in the art.

Summary of the invention

In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a thermal superconducting heat transfer plate and a heat sink, which are used to solve the high temperature of the local heat source and the temperature difference between the upper and lower parts of the thermal superconducting heat transfer plate in the prior art. Problems such as large and poor radiator effect.

In order to achieve the above objectives and other related objectives, the present invention provides a thermal superconducting heat transfer plate, the thermal superconducting heat transfer plate at least comprising:

A heat-conducting plate with a composite plate structure, the heat-conducting plate comprising a heated area on one side edge of the heat-conducting plate, at least two condensation and heat dissipation areas on the surface of the heat-conducting plate, and an isolation blocking area corresponding to each condensation and heat dissipation area;

Among them, each condensation heat dissipation area and each isolation blocking area are arranged sequentially from top to bottom at intervals, and each condensation heat dissipation area is located above the corresponding isolation blocking area;

A heat dissipation pipeline is formed in the heat conduction plate of each condensation heat dissipation area, and the heat dissipation pipelines of each condensation heat dissipation area are connected by the heat dissipation pipelines located on both sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with Heat transfer working fluid;

The extending direction of each isolation blocking area obliquely intersects the side of the heat conducting plate, and the end of each isolation blocking area adjacent to the heated area is lower than the end far away from the heated area.

Optionally, the thermal superconducting heat transfer plate further includes a non-pipeline blank area arranged in at least one condensation heat dissipation area.

More optionally, the non-pipeline blank area is far away from the side of the heated area.

Optionally, the shape of the heat dissipation pipeline of each condensation heat dissipation area is a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, a plurality of U-shaped, rhombic, triangular, circular, and criss-crossed nets connected in series. Shape or any combination of any one or more of them.

Optionally, the filling amount of the heat transfer working medium is 20% to 70% of the volume of the closed pipeline.

Optionally, the heat-conducting plate of the heated area has a folded edge structure.

More optionally, the heat conducting plate is a phase change suppression heat dissipation plate or a phase change heat dissipation plate.

More optionally, the position of each condensation heat dissipation area corresponds to the installation position of each heat source; the lower end of each isolation blocking area is not higher than the lower end of the corresponding heat source, and not lower than the upper end of the heat source located below the corresponding heat source.

In order to achieve the above objects and other related objects, the present invention also provides a radiator, the radiator at least comprising:

A heat dissipation substrate and a plurality of the above-mentioned thermal superconducting heat transfer plates;

The first surface of the heat dissipating substrate is provided with grooves arranged at intervals, and the heat receiving area of each thermal superconducting heat transfer plate is inserted in each groove one by one, and each thermal superconducting heat transfer plate is along a vertical direction extend;

A heat source attachment area is provided on the second surface of the heat dissipation substrate.

Optionally, a sintered core heat pipe is embedded in the heat dissipation substrate.

Optionally, the first surface and the second surface are arranged opposite to each other.

As mentioned above, the thermal superconducting heat transfer plate and heat sink of the present invention have the following beneficial effects:

The thermal superconducting heat transfer plate of the present invention is provided with a non-pipeline isolation blocking area with an inclined angle along the fin root to the top of the fin at the height near the heat source, and the steam above the isolation blocking area is condensed and then flows back to Isolate the blocking area, and form a certain amount of liquid accumulation near the heat source; this can solve the high temperature phenomenon caused by the heat failure caused by the different heat source location.

The radiator of the present invention adopts the above-mentioned thermal superconducting heat transfer plate, and is fixed on the heat dissipation substrate by bonding, welding, expansion and cogging, etc., to form a radiator for communication base station equipment or power supply equipment to solve the problem of The heat dissipation problem of a heating power device and avoid local high temperature phenomenon, improve the heat dissipation efficiency and heat dissipation capacity of the entire heat sink.

Description of the drawings

Fig. 1 is a schematic diagram showing the principle of the high temperature of the local heat source of the thermal superconducting heat transfer plate in the prior art.

Fig. 2 is a schematic diagram showing the large temperature difference between the upper part and the lower part of the thermal superconducting heat transfer plate and the heat dissipation effect in the prior art.

Fig. 3 shows a schematic diagram of a structure of the thermal superconducting heat transfer plate of the present invention.

Fig. 4 is a schematic diagram of another structure of the thermal superconducting heat transfer plate of the present invention.

FIG. 5 is a schematic diagram showing a partial enlarged structure of a thermal superconducting heat transfer plate according to the second embodiment of the present invention.

Fig. 6 is a schematic diagram showing another structure of the thermal superconducting heat transfer plate of the present invention.

FIG. 7 shows a schematic diagram of the structure of the heat sink of the present invention.

FIG. 8 is a partial enlarged schematic diagram of the connection between the thermal superconducting heat transfer plate and the heat dissipation substrate in the heat sink of the present invention.

Component label description

11 Hexagonal honeycomb pipeline

12 Heat transfer working medium

13 Heat source

2 Thermal superconducting heat transfer plate

21 Heat conduction plate

211 Heated area

212 Condensation and heat dissipation area

213 Isolation and blocking area

213a Main isolation block area

213b Secondary isolation block area

214 Non-piping blank area

22 Heat dissipation pipeline

23 Heat transfer working medium

3 Heat dissipation substrate

4 Heat source

4a Main heat source

4b Secondary heat source

Detailed ways

The following describes the implementation of the present invention through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

Please refer to Figure 3 to Figure 8. It should be noted that the illustrations provided in this embodiment only illustrate the basic idea of the present invention in a schematic manner. The figures only show the components related to the present invention instead of the number, shape, and shape of the components in actual implementation. For the size drawing, the type, quantity, and proportion of each component can be changed at will during actual implementation, and the component layout type may also be more complicated.

Example one

As shown in FIG. 3, this embodiment provides a thermal superconducting heat transfer plate 2, and the thermal superconducting heat transfer plate 2 includes:

The heat-conducting plate 21 includes a heat-receiving area 211 on one side edge of the heat-conducting plate 21, at least two condensation heat-dissipating areas 212 on the surface of the heat-conducting plate 21, and isolation barriers corresponding to each condensation heat-dissipating area 212 Dissipation area 213; among them, each condensation heat dissipation area 212 and each isolation blocking area 213 are arranged sequentially from top to bottom at intervals, and each condensation heat dissipation area 212 is located above the corresponding isolation blocking area 213; the heat conducting plate of each condensation heat dissipation area 212 A heat dissipation pipeline 22 is formed in each condensation heat dissipation area 212, and the heat dissipation pipeline 22 of each condensation heat dissipation area 212 is connected by the heat dissipation pipelines located on both sides of the isolation blocking area 213 to form a through closed pipeline. The closed pipeline is filled with heat transfer technology. Mass 23; the extending direction of each isolation blocking area 213 obliquely intersects the side of the heat conducting plate 21, and the end of each isolation blocking area 213 adjacent to the heated area 211 is lower than the end away from the heated area 211.

As shown in Fig. 3, the heat conducting plate 21 has a composite plate structure. The heat conducting plate 21 includes at least two layers of plates, and the number of plates can be set according to actual needs, which will not be repeated here. As an example, the heat conducting plate 21 realizes heat transfer based on thermal superconducting heat transfer technology; one kind of thermal superconducting technology is a sealed interconnected micro channel system (ie, the heat dissipation pipeline 22 described in this embodiment) The phase change heat transfer technology that is filled with the heat transfer working fluid and realizes thermal superconducting heat transfer through the evaporation or condensation phase change of the heat transfer working fluid; another thermal superconducting technology is through the microchannel system The microstructure state of the heat transfer working fluid, that is, during the heat transfer process, the boiling of the heat transfer working fluid in the liquid state (or the condensation of the heat transfer working fluid in the gaseous state) is suppressed, and the result is achieved on this basis. The phase change suppression (PCI) heat transfer technology that describes the consistency of the microstructure of the heat transfer working fluid and realizes high-efficiency heat transfer.

As shown in FIG. 3, one side edge of the heat conducting plate 21 is a heated area 211. In this embodiment, the heated area 211 is located at the left edge of the heat conducting plate 21. As an example, the heat-receiving area 211 is a hemming structure. In actual use, the structure of the heat-receiving area 211 is not limited as long as heat conduction can be achieved.

As shown in FIG. 3, a condensation heat dissipation area 212 and an isolation blocking area 213 are provided on the surface of the heat conducting plate 21. The condensation heat dissipation area 212 and the isolation blocking area 213 are arranged at intervals from top to bottom. In this embodiment, two condensation and heat dissipation regions 212 and two isolation blocking regions 213 are included.

Specifically, a heat dissipation pipe 22 is formed in the heat conduction plate 21 of the condensation heat dissipation area 212, and the heat dissipation pipe 22 is a pipe formed by a protrusion of a plate located on the outer side of the composite plate structure, and the heat dissipation pipe 22 It can be prepared by a single-sided inflation or double-sided inflation process, which will not be repeated here. The shape of the heat dissipation pipeline 22 in the condensation heat dissipation area 212 includes, but is not limited to, a hexagonal honeycomb shape, a circular honeycomb shape, a quadrangular honeycomb shape, a plurality of U-shapes, rhombuses, triangles, circular rings, criss-crossing. In the present embodiment, a hexagonal honeycomb shape is used. As an example, as shown in FIG. 3, the length of the condensation heat dissipation area 212 in the vertical direction on the side close to the heated area 211 is covered (the position corresponds and the length value is large) or the basic coverage (the position is basically corresponding and the length value is large) ) Corresponding to the length in the vertical direction of the region where the heat source 4 (the heat source is used to illustrate the principle of the thermal superconducting heat transfer plate of this embodiment, and is not included in the thermal superconducting heat transfer plate).

Specifically, the isolation blocking area 213 is provided below the corresponding condensation heat dissipation area 212, and the isolation blocking area 213 is used to block the upper and lower connections between the heat dissipation pipelines 22. It should be noted that the The isolation blocking area 213 does not completely block the connection of the heat dissipation pipeline 22, and the heat dissipation pipelines in different condensation heat dissipation areas 212 can still be connected through the pipelines at both ends of the isolation blocking area 213. As an example, the isolation blocking area 213 extends in the left-right direction and has a strip-like structure, and the isolation blocking area 213 is inclined upward from left to right, so that condensation on the isolation blocking area 213 can be caused. The heat dissipation area 212 obtains an inclined lower end surface according to the potential, so that the heat transfer working medium 23 is returned to the vicinity of the heat source 4; as an example, the isolation blocking area 213 may also include multiple strip-shaped structures, thereby providing multiple return paths. For the path, the inclination direction of each strip structure is the same. As an example, as shown in FIG. 3, the lower end (the lowermost end on the left side) of the isolation blocking area 213 is not higher than the lower end of the corresponding heat source, and not lower than the upper end of the heat source located below the corresponding heat source.

As shown in FIG. 3, the heat transfer working medium 23 is arranged in the heat dissipation pipeline 22. As an example, the filling amount of the heat transfer working medium 23 is 20% to 70% of the volume of the closed pipeline. In this embodiment, the filling amount of the heat transfer working medium 23 is 45% of the volume of the closed pipeline. In actual use, the filling amount of the heat transfer working medium 23 can be set according to actual needs. As an example, the heat transfer working medium 23 is a fluid. Preferably, the heat transfer working medium 23 may be a gas or a liquid or a mixture of gas and liquid. More preferably, in this embodiment, the heat transfer working medium 23 The substance 23 is a mixture of liquid and gas.

The thermal superconducting heat transfer plate of this embodiment is provided with an inclined non-pipeline isolation blocking area 213 near the lower end of the height position of the heat source 4, and separates the heat dissipation pipeline 23 on the thermal superconducting heat transfer plate into several areas. The heat dissipation pipes 23 in each area communicate with each other through two pipes on the outside. During operation, even if the filling amount of the heat transfer working medium 23 is relatively small, the heat source 4 starts to input heat, and the lower heat source 4 conducts the heat to the heat transfer working medium 23 attached to the heat source. After being heated, it undergoes a phase change and vaporizes, turning into steam upwards. And enter the upper heat dissipation pipeline 23 area through the pipelines on both sides, and condense into liquid after heat exchange with the outside. The upper condensed liquid first passes through the upper isolation blocking area 213, and flows along the inner inclined pipeline near the upper heat source 4. Because the upper heat source 4 has a higher temperature, the condensed liquid near the heat source evaporates and becomes a gas flowing upwards. The condensing and heat dissipation area 212 performs heat dissipation and condensation, and this cycle continuously conducts heat to the thermal superconducting heat transfer plate to dissipate it. The condensed liquid participates in the phase change heat conduction cycle in the upper condensation heat dissipation area 212; excess liquid will pass through the upper part The pipes on both sides of the isolation blocking area 213 flow to the lower part. The lower heat source 4 heats the evaporated gas, condenses in the lower condensation heat dissipation area 212 and flows back to the heat dissipation pipe 23 near the lower heat source 4 to participate in the heat conduction cycle of continuing evaporation and condensation. When the lower heat is large, the heat generated There is more steam, and the pressure of the corresponding gas phase is higher. The excess steam enters the upper condensation heat dissipation area 212 along the pipes on both sides of the upper isolation blocking area 213 to maintain the balance and uniform temperature of the temperature and heat dissipation on the entire board.

Example two

As shown in FIGS. 4 and 5, this embodiment provides a thermal superconducting heat transfer plate 2. The difference from the first embodiment is that the thermal superconducting heat transfer plate further includes at least one condensation heat transfer area Non-pipeline blank area 214 in 212.

Specifically, as shown in FIG. 4, in this embodiment, the non-pipeline blank area 214 is provided in each condensation heat dissipation area 212. In actual use, the non-pipeline blank area 214 can be selected for condensation and heat dissipation. The setting of the area 212 is not limited to this embodiment.

As a result, the arrangement of the heat dissipation pipeline 23 can be reduced, the filling amount of the heat transfer working medium inside the thermal superconducting heat transfer plate 2 can be further reduced, the cost can be reduced, and the startup rate of the thermal superconducting plate can be accelerated at the same time.

As an example, the non-pipeline blank area 214 has a block structure, and the length in the vertical direction is greater than the length in the horizontal direction. The non-pipeline blank area 214 may also have a strip structure, and the length in the vertical direction is smaller than the length in the horizontal direction, which will not be repeated here.

As an example, the non-pipeline blank area 214 is far away from the side of the heated area 21, thereby ensuring that the heat transfer working medium 23 is accumulated on the side close to the heat source 4, thereby improving the heat dissipation efficiency.

As shown in Fig. 5, the heat transfer working medium 23 undergoes a phase change and vaporizes after being heated, and then flows upward through the heat dissipation pipe 23 on the left side of the condensation heat dissipation area 212 (close to the heat source side), and then passes through the condensation heat dissipation area 212 after condensation. The radiating pipe 23 on the right side (the side away from the heat source) flows back downwards and flows along the inner inclined pipe toward the vicinity of the heat source. The other principles are the same as in the first embodiment, and will not be repeated here.

Example three

As shown in FIG. 6, this embodiment provides a thermal superconducting heat transfer plate 2. The difference from the first embodiment is that the thermal superconducting heat transfer plate is used for multiple heat sources.

Specifically, as shown in FIG. 6, in this embodiment, there are 4 heat sources along the height direction, among which the middle two heat sources 4 are the main heat sources 4a with larger power, and the upper and lower heat sources are relatively smaller in power. The secondary heat source 4b. An inclined main isolation blocking area 213a and a sub isolation blocking area 213b are respectively provided at the lower ends of the main heat source 4a and the auxiliary heat source 4b corresponding to the height positions. Among them, the area of the main isolation blocking area 213a is larger than the secondary isolation blocking area 213b, which can realize that there are liquid heat transfer working fluids near the heating power devices at different heights, and fast heat conduction depends on the evaporation and condensation of the heat transfer working fluid. , The heat of the heat source is exported and dissipated.

Specifically, as shown in FIG. 6, in this embodiment, a non-piping blank area 214 is provided in the condensation heat dissipation area 212 corresponding to the three heat sources located on the lower side, and the area of the non-piping blank area 214 is smaller than that of the implementation. The area of the non-pipeline blank area 214 in Example 2.

It should be noted that the positions of the condensation heat dissipation area 212, the isolation blocking area 213, and the non-piping blank area 214 in the thermal superconducting heat transfer plate of the present invention can be set according to the different numbers and positions of the heat sources. Those skilled in the art Adaptable adjustments can be made based on the content recorded in the present invention according to actual needs, and will not be repeated here.

Example four

As shown in FIG. 7 and FIG. 8, the present invention provides a heat sink, which includes:

The heat-dissipating substrate 3 and a plurality of the above-mentioned thermal superconducting heat transfer plates 2. The first surface of the heat-dissipating substrate 3 is provided with grooves arranged at intervals, and the heat-receiving areas of each thermal superconducting heat transfer plate 2 are inserted in one-to-one correspondence In each groove, and each thermal superconducting heat transfer plate extends in a vertical direction; the second surface of the heat dissipation substrate 3 is provided with a heat source attachment area.

Specifically, in this embodiment, the heat dissipation substrate 3 has a flat structure, and the first surface of the heat dissipation substrate 3 is provided with grooves for inserting the thermal superconducting heat transfer plates 2 (not shown in the figure). , The second surface is provided with a heat source attaching area for installing the heating device. As an example, the first surface and the second surface are arranged opposite to each other. The heating device includes, but is not limited to, a power device. The grooves extend along the first direction on the surface of the heat dissipation substrate 3 and are arranged at intervals along the second direction. The first direction is perpendicular to the second direction; in this embodiment, the grooves are connected to the The surface of the heat dissipation substrate 3 is vertical. In actual use, each groove can also be inclined at a certain angle compared to the surface of the heat dissipation substrate 3. The vertical is only used to indicate the direction trend, and does not mean that it is in a strict sense. The horizontal plane is at an angle of 90°, which is not limited to this embodiment.

As an example, a sintered core heat pipe (not shown) is embedded in the heat dissipation substrate 3. The sintered core heat pipe is a sintered powder tube integrated with the tube wall formed by sintering a certain mesh of metal powder on the inner wall of a metal tube, and the metal powder sintered on the inside of the metal tube forms a wick capillary The structure enables the sintered core heat pipe to have a higher capillary suction force, so that the heat conduction direction of the sintered core heat pipe is not affected by gravity, and the sintered wick capillary structure strengthens evaporation heat absorption and condensation heat release. The thermal conductivity and transmission power of the heat pipe are greatly improved, so that the sintered core heat pipe has a larger axial equivalent thermal conductivity (a few hundred to a thousand times that of copper). The sintered core heat pipe is embedded in the heat dissipation substrate 3, so that the heat generated by the heating devices provided on the surface of the heat dissipation substrate 3 can quickly diffuse to other positions of the heat dissipation substrate 3, so that the heat on the heat dissipation substrate 3 The distribution is relatively uniform, which effectively improves the heat dissipation efficiency and heat dissipation capacity of the radiator.

Specifically, the heated area 211 of each thermal superconducting heat transfer plate 2 is vertically inserted into the groove (it can also have a certain inclination angle, not limited to this embodiment), and each thermal superconducting heat transfer plate 2 passes through the mechanical The extrusion process, the thermal adhesive bonding process or the brazing process are fixedly connected to the heat sink substrate 3, and the bonding strength is increased as much as possible, the bonding thermal resistance is reduced, and the heat dissipation capacity and efficiency of the heat sink are improved.

The working principle of the heat sink described in this embodiment is: the heat generated by the heat source located on the surface of the heat sink substrate 3 is quickly transferred to the entire heat sink substrate 3 through the sintered core heat pipe, and the heat dissipation The device substrate 3 quickly conducts heat to each thermal superconducting heat transfer plate 2, and the heat transfer working medium in the heat dissipation pipe 22 in each thermal superconducting heat transfer plate 2 quickly transfers the heat to the entire thermal superconducting heat transfer plate 2. The surface of the heat transfer plate 2 is then taken away by the air flow flowing through the gap of the thermal superconducting heat transfer plate 2. The working principle of each thermal superconducting heat transfer plate 2 will not be repeated here.

In summary, the present invention provides a thermal superconducting heat transfer plate and a heat sink, including a heat dissipation substrate and a plurality of thermal superconducting heat transfer plates. The thermal superconducting heat transfer plate includes a heat conduction plate with a composite plate structure. The heat conduction plate includes a heated area located on one side edge of the heat conduction plate, at least two condensation heat dissipation areas on the surface of the heat conduction plate, and each condensation heat dissipation area. Corresponding isolation and blocking area; among them, each condensation heat dissipation area and each isolation blocking area are arranged sequentially from top to bottom at intervals, and each condensation heat dissipation area is located above the corresponding isolation blocking area; in the heat conducting plate of each condensation heat dissipation area A heat dissipation pipeline is formed, and the heat dissipation pipelines of each condensation heat dissipation area are connected by the heat dissipation pipelines located on both sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat transfer working medium; each isolation resistance The extending direction of the broken area obliquely intersects the side of the heat conducting plate, and the end of each isolation blocking area adjacent to the heated area is lower than the end far away from the heated area. The thermal superconducting heat transfer plate of the present invention is provided with a non-pipeline isolation blocking area with an inclined angle along the fin root to the top of the fin at the height near the heat source, and the steam above the isolation blocking area is condensed and then flows back to Isolate the blocking area, and form a certain amount of liquid accumulation near the heat source; this can solve the high temperature phenomenon caused by the heat failure caused by the different heat source location. The radiator of the present invention adopts the above-mentioned thermal superconducting heat transfer plate, and is fixed on the heat dissipation substrate by bonding, welding, expansion and cogging, etc., to form a radiator for communication base station equipment or power supply equipment to solve the problem of The heat dissipation problem of a heating power device and avoid local high temperature phenomenon, improve the heat dissipation efficiency and heat dissipation capacity of the entire heat sink. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial value.

The above-mentioned embodiments only exemplarily illustrate the principles and effects of the present invention, but are not used to limit the present invention. Anyone familiar with this technology can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present invention should still be covered by the claims of the present invention.

Claims

A thermal superconducting heat transfer plate is characterized in that the thermal superconducting heat transfer plate at least comprises:

A heat-conducting plate with a composite plate structure, the heat-conducting plate comprising a heated area on one side edge of the heat-conducting plate, at least two condensation and heat dissipation areas on the surface of the heat-conducting plate, and an isolation blocking area corresponding to each condensation and heat dissipation area;

Among them, each condensation heat dissipation area and each isolation blocking area are arranged sequentially from top to bottom at intervals, and each condensation heat dissipation area is located above the corresponding isolation blocking area;

A heat dissipation pipeline is formed in the heat conduction plate of each condensation heat dissipation area, and the heat dissipation pipelines of each condensation heat dissipation area are connected by the heat dissipation pipelines located on both sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with Heat transfer working fluid;

The extending direction of each isolation blocking area obliquely intersects the side of the heat conducting plate, and the end of each isolation blocking area adjacent to the heated area is lower than the end far away from the heated area.
The thermal superconducting heat transfer plate of claim 1, wherein the thermal superconducting heat transfer plate further comprises a non-piping blank area arranged in at least one condensation heat dissipation area.
The thermal superconducting heat transfer plate according to claim 2, wherein the non-pipeline blank area is far away from the side of the heated area.
The thermal superconducting heat transfer plate according to claim 1, wherein the shape of the heat dissipation pipeline of each condensation heat dissipation area is a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, and a plurality of U connected in series end to end. Shapes, rhombuses, triangles, circular rings, crisscross nets, or any combination of more than one of them.
The thermal superconducting heat transfer plate according to claim 1, wherein the filling amount of the heat transfer working medium is 20% to 70% of the volume of the closed pipeline.
The thermal superconducting heat transfer plate according to claim 1, wherein the heat conducting plate in the heated area has a folded edge structure.
The thermal superconducting heat transfer plate according to any one of claims 1 to 6, wherein the heat conducting plate is a phase change suppression heat dissipation plate or a phase change heat dissipation plate.
The thermal superconducting heat transfer plate according to claim 7, wherein the position of each condensation heat dissipation area corresponds to the installation position of each heat source; the lower end of each isolation blocking area is not higher than the lower end of the corresponding heat source, and no It is lower than the upper end of the heat source located below the corresponding heat source.
A radiator, characterized in that the radiator at least includes:

A heat dissipation substrate and a plurality of thermal superconducting heat transfer plates according to any one of claims 1 to 8;

The first surface of the heat dissipating substrate is provided with grooves arranged at intervals, and the heat receiving area of each thermal superconducting heat transfer plate is inserted in each groove one by one, and each thermal superconducting heat transfer plate is along a vertical direction extend;

A heat source attachment area is provided on the second surface of the heat dissipation substrate.
The heat sink according to claim 9, wherein the heat dissipation substrate is embedded with a sintered core heat pipe.
9. The heat sink according to claim 9, wherein the first surface and the second surface are arranged opposite to each other.