CN217641330U

CN217641330U - Anti-interference packaging structure

Info

Publication number: CN217641330U
Application number: CN202221804397.6U
Authority: CN
Inventors: 江琛琛
Original assignee: Jiangsu Ming Microelectronics Co ltd
Current assignee: Jiangsu Ming Microelectronics Co ltd
Priority date: 2022-07-12
Filing date: 2022-07-12
Publication date: 2022-10-21
Anticipated expiration: 2032-07-12

Abstract

The application discloses anti-interference packaging structure includes: the upper surface of the substrate is provided with a first side and a second side which are opposite, and the second side is provided with an annular groove; a first chip for emitting light, bonded to the first side; the second chip is used for receiving light and bonded to the second side and arranged on the inner side of the annular groove; the transparent packaging layer is laid on the upper surface, an annular through groove communicated with the annular groove is formed in the packaging layer, a spherical crown-shaped bump is formed on the upper portion of the packaging layer, and the bump is arranged right above the second chip; the light-insulating sleeve is vertically arranged and provided with an upper opening end and a lower opening end which are opposite, the middle of the light-insulating sleeve is arranged in the annular through groove in a penetrating mode, the lower opening end is inserted in the annular groove, and the upper opening end extends to the upper portion of the lug. The utility model provides a photoelectric switch of SMD encapsulation have the problem of internal disturbance influence performance.

Description

Anti-interference packaging structure

Technical Field

The utility model relates to a chip package technical field, concretely relates to anti-interference packaging structure.

Background

The photoelectric switch detects whether an object exists or not by blocking or reflecting the light beam by the object to be detected and switching on a circuit by a synchronous circuit. The photoelectric switch converts the input current into an optical signal on the transmitter to be emitted, and the receiver detects the target object according to the intensity or the existence of the received light. The traditional photoelectric switch adopts a packaging form which is mostly SMD (surface mounted device) packaging. The external resin of the package structure for separating the transmitter and the receiver cannot completely prevent light from penetrating therethrough, and thus, there is a problem in that the performance of the product is affected by internal interference.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects in the prior art, an anti-interference packaging structure is provided so as to solve the problem that the performance of an SMD packaged photoelectric switch is influenced by internal interference.

In order to achieve the above object, an anti-interference package structure is provided, which includes:

the upper surface of the substrate is provided with a first side and a second side which are opposite, and the second side is provided with an annular groove;

a first chip for emitting light, bonded to the first side;

the second chip is used for receiving light and bonded to the second side and arranged on the inner side of the annular groove;

the transparent packaging layer is laid on the upper surface, an annular through groove communicated with the annular groove is formed in the packaging layer, a spherical crown-shaped convex block is formed on the upper portion of the packaging layer, and the convex block is arranged right above the second chip; and

the light-shielding sleeve is vertically arranged and provided with an upper opening end and a lower opening end which are opposite, the middle part of the light-shielding sleeve penetrates through the annular through groove, the lower opening end is inserted into the annular groove, and the upper opening end extends to the upper part of the lug.

Further, the light-blocking sleeve is a metal sleeve.

Further, the size of the outer diameter of the bump is larger than that of the outer diameter of the second chip.

Further, the outer wall of the light-proof sleeve is coated with a light-reflecting film layer.

The beneficial effects of the utility model reside in that, the utility model discloses an anti-interference packaging structure utilizes and separates the sleeve and carry out light complete isolation to the second chip and see through the encapsulated layer with the light of avoiding first chip transmission and be received by second chip directness, and then has improved the accuracy nature of packaging structure's performance. On the other hand, the plano-convex lens is formed on the packaging layer to improve the light acceptance rate of the second chip, so that the sensitivity of the packaging structure is improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is a cross-sectional view of an anti-interference package structure according to an embodiment of the present invention.

Fig. 2 is a top view of an anti-interference package structure according to an embodiment of the present invention.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1 and 2, the utility model provides an anti-interference packaging structure, include: the chip comprises a substrate 1, a first chip 2, a second chip 3, a packaging layer 4 and a light-isolating sleeve 5.

In the present embodiment, the substrate 1 has an upper surface and a lower surface opposite to each other. Further, the upper surface of the substrate 1 has a first side and a second side opposite to each other. A second side of the upper surface of the substrate 1 is formed with an annular groove;

the first chip 2 is bonded to a first side of the upper surface of the substrate 1. The first chip 2 is used for emitting light. The first chip 2 is an emissive chip.

The second chip 3 is bonded to a second side of the upper surface of the substrate 1. The second chip 3 is disposed inside the annular groove (i.e., the area defined by the enclosure of the annular groove). The second chip 3 is used for receiving light. The second chip 3 is a receiver chip.

The first chip 2 and the second chip 3 are respectively bonded to the substrate to be electrically connected to the substrate.

The encapsulation layer 4 is a transparent encapsulation layer, such as an epoxy resin encapsulation layer. The encapsulation layer 4 is laid on the upper surface. The packaging layer 4 is formed with an annular through groove communicated with the annular groove. The upper part of the encapsulation layer 4 is formed with a spherical-crown-shaped bump 41. The bump 41 is disposed directly above the second chip 3. The spherical-crown-shaped bumps form plano-convex lenses to improve light transmission.

The light-insulating sleeve 5 is vertically arranged. Wherein the light-insulating sleeve 5 has opposite upper and lower open ends. The middle part of the light-shielding sleeve 5 is arranged in the annular through groove in a penetrating mode, the lower opening end of the light-shielding sleeve 5 is inserted into the annular groove, and the upper opening end of the light-shielding sleeve 5 extends to the upper portion of the protruding block 41.

During packaging, chip packaging is performed firstly, namely, the first chip and the second chip are respectively bonded on the upper surface of the substrate, then the packaging layer is packaged on the upper surface of the substrate, and a bump is formed above the second chip by using a mold. And continuously cutting an annular through groove in the packaging layer and cutting the upper surface of the substrate to form an annular groove by cutting. And finally, inserting the lower opening end of the light-shielding sleeve into the annular groove by using an adhesive, so that the middle part of the light-shielding sleeve 5 is inserted into the annular through groove, and the upper opening end of the light-shielding sleeve 5 extends to the upper part of the lug 41.

The utility model discloses an anti-interference packaging structure utilizes to separate the sleeve and carries out light isolation completely to the second chip and see through the encapsulated layer in order to avoid the light of first chip transmission and be received by the second chip is direct, and then has improved the accuracy nature of packaging structure's performance. On the other hand, the plano-convex lens is formed on the packaging layer to improve the light acceptance rate of the second chip, so that the sensitivity of the packaging structure is improved.

In the present embodiment, the light-blocking sleeve 5 is a metal sleeve.

In a preferred embodiment, the outer wall of the light-shielding sleeve 5 is coated with a light-reflecting film layer 51. The side surface of the light-isolating sleeve facing the first chip is coated with a reflective film layer, and the reflective film layer is a metal reflective film.

In the present embodiment, the bump is circular, and the size of the outer diameter of the bump 41 is larger than that of the second chip 3.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features disclosed herein, and that other combinations of features disclosed herein or their equivalents, in any combination, are also encompassed by the invention without departing from the spirit of the invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. An anti-tamper packaging structure, comprising:

a first chip for emitting light, bonded to the first side;

the second chip is used for receiving light rays, is bonded to the second side and is arranged on the inner side of the annular groove;

the transparent packaging layer is laid on the upper surface, an annular through groove communicated with the annular groove is formed in the packaging layer, a spherical crown-shaped bump is formed on the upper portion of the packaging layer, and the bump is arranged right above the second chip; and

the light-blocking sleeve is vertically arranged and provided with an upper opening end and a lower opening end which are opposite, the middle of the light-blocking sleeve is arranged in the annular through groove in a penetrating mode, the lower opening end is inserted in the annular groove, and the upper opening end extends to the upper portion of the lug.

2. The tamper resistant packaging structure of claim 1, wherein the optically opaque sleeve is a metal sleeve.

3. The tamper-resistant package structure of claim 1, wherein an outer diameter of the bumps is greater in size than an outer diameter of the second chip.

4. The tamper resistant packaging structure of claim 1, wherein an outer wall of the light blocking sleeve is coated with a light reflecting film layer.