CN218827060U - Optical sensor packaging structure - Google Patents
Optical sensor packaging structure Download PDFInfo
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- CN218827060U CN218827060U CN202222689948.5U CN202222689948U CN218827060U CN 218827060 U CN218827060 U CN 218827060U CN 202222689948 U CN202222689948 U CN 202222689948U CN 218827060 U CN218827060 U CN 218827060U
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Abstract
The utility model relates to the technical field of sensors, and discloses an optical sensor packaging structure, which comprises a substrate, wherein a light emitting component, an optical sensing component and a transparent cladding body for cladding the light emitting component and the optical sensing component are arranged on the substrate; the transparent cladding body and the metal sputtering layer are used for replacing an opaque shell and a transparent cover plate in the prior art, so that the structure is simpler; moreover, because the optical sensor packaging structure is not provided with the transparent cover plate, the problem that the transparent cover plate falls off can not occur during reliability test or actual use, so that the stability of the optical sensor packaging structure is better.
Description
Technical Field
The utility model relates to a sensor technical field especially relates to an optical sensor packaging structure.
Background
The optical sensor at least comprises a light emitting component and a light receiving component, wherein the light emitting component can emit light outwards, if the emitted light impacts a detected object, the light can be reflected, and the light receiving component can receive the reflected light and enable the optical sensor to output a detection signal.
In the prior art, one type of optical sensor is shown in an optical sensor package structure disclosed in the utility model patent with publication number CN206134714U and publication number 2017.04.26, which includes a first optical chip disposed in a first cavity and a second optical chip disposed in a second cavity; the shell is provided with a first optical window corresponding to the first containing cavity and a second optical window corresponding to the second containing cavity; a light-transmitting cover plate covering the first optical window and the second optical window is further attached to the shell; a first convex lens structure and a second convex lens structure are respectively formed on the light-transmitting cover plate at the positions of the first optical window and the second optical window;
in the above scheme, the light-tight shell is matched with the light-tight cover plate to form the packaging structure, the structure of the light sensor packaging structure is complex, the problem that the light-tight cover plate falls off easily occurs after the reliability test, and the stability of the packaging structure is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at: the light sensor packaging structure is simple in structure and good in stability.
In order to realize the above object, the utility model provides a light sensor packaging structure, which comprises a substrate, be equipped with light emission subassembly, light sensing subassembly on the substrate and be used for the cladding light emission subassembly, light sensing subassembly's transparent cladding body, the surface of transparent cladding body is equipped with the metal and sputters the layer, be equipped with first light trap, second light trap on the metal sputtering layer, first light trap corresponds light emission subassembly arranges, the second light trap corresponds light sensing subassembly arranges.
In a specific embodiment of the present invention, the light-shielding structure further comprises a light-shielding structure disposed between the light-emitting module and the light-sensing module.
In a particular embodiment, the transparent cladding body comprises a first transparent cladding sub-body for cladding the light emitting assembly, a second transparent cladding sub-body for cladding the light sensing assembly, an installation space is formed between the first transparent cladding sub-body and the second transparent cladding sub-body, and the light blocking structure is arranged at the installation space.
The utility model discloses a specific embodiment, metal sputtering layer is including being used for the cladding first metal sputtering portion of first transparent cladding daughter and being used for the cladding the second metal sputtering portion of the transparent cladding daughter of second is located the cooperation of first metal sputtering portion, the second sputtering portion of installation space department forms the structure of being in the light.
In a particular embodiment of the invention, the installation space is a trapezoidal, trough-like structure, the smaller end of which is connected to the substrate.
In a specific embodiment of the present invention, the transparent coating body is further provided with a light entrance groove, and the light entrance groove corresponds to the second light transmission opening.
In a specific embodiment of the present invention, the light-entering groove has a trapezoidal structure, and the larger end of the light-entering groove is connected to the second light-transmitting opening.
In a particular embodiment of the present invention, the transparent coating is an epoxy material.
The embodiment of the utility model provides a light sensor packaging structure, compared with the prior art, its beneficial effect lies in:
in the present invention, the optical sensor package structure mainly comprises a substrate, a light emitting module, a light sensing module, a transparent cladding body and a metal sputtering layer, and the transparent cladding body and the metal sputtering layer replace a transparent cover plate and an opaque housing in the prior art, so that the structure is simpler; moreover, because the optical sensor packaging structure is not provided with the transparent cover plate, the problem that the transparent cover plate falls off can not occur during reliability test or actual use, so that the stability of the optical sensor packaging structure is better.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
In the figure, 1, a substrate; 2. a light emitting component; 3. a light sensing component; 4. a transparent cover; 41. a first transparent clad daughter; 42. a second transparent clad daughter; 5. a metal sputtering layer; 51. A first light transmission opening; 52. a second light-transmitting opening; 6. a light blocking structure; 7. an installation space; 8. and (6) entering the light groove.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
As shown in fig. 1, the utility model provides a light sensor packaging structure of preferred embodiment, including substrate 1, be equipped with light emitting component 2, light sensing component 3 on the substrate 1 and be used for the cladding light emitting component 2, light sensing component 3's transparent cladding body 4, transparent cladding body 4's surface is equipped with metal sputtering layer 5, be equipped with first light trap 51, second light trap 52 on the metal sputtering layer 5, first light trap 51 corresponds light emitting component 2 arranges, second light trap 52 corresponds light sensing component 3 arranges.
In practical application, the light emitting component 2 is used for emitting light, when the light emitted by the light emitting component 2 meets a detected object, the light can be reflected, the light sensing component 3 is used for receiving the reflected light, and the light sensor generates a detection signal based on the reflected light;
the metal sputtering layer 5 is opaque, so that reflected light can only enter from the second light-transmitting opening 52. The normal operation of the optical sensor is ensured.
In this embodiment, the optical sensor package structure mainly includes a substrate 1, a light emitting element 2, a light sensing element 3, a transparent cover 4 and a metal sputtering layer 5, and the transparent cover and the opaque case in the prior art are replaced by the transparent cover 4 and the metal sputtering layer 5, so that the structure is simpler; moreover, because the optical sensor packaging structure is not provided with the transparent cover plate, the problem that the transparent cover plate falls off can not occur during reliability test or actual use, so that the stability of the optical sensor packaging structure is better.
As a specific implementation of this embodiment, the light-shielding structure 6 is further included, and is disposed between the light-emitting component 2 and the light-sensing component 3; the light blocking structure 6 is used for blocking light emitted by the light emitting component 2, so that the light is prevented from being received by the light sensing component 3 without being reflected, and the light blocking structure 6 improves the light blocking rate of the optical sensor packaging structure and ensures normal operation of the optical sensor packaging structure.
In practical applications, the light blocking structure 6 may be covered by a transparent covering body 4, or may not be covered by the transparent covering body 4, as a preferable choice of this implementation, the transparent covering body 4 includes a first transparent covering sub-body 41 for covering the light emitting assembly 2, and a second transparent covering sub-body 42 for covering the light sensing assembly 3, an installation space 7 is formed between the first transparent covering sub-body 41 and the second transparent covering sub-body 42, and the light blocking structure 6 is arranged at the installation space 7, that is, the light blocking structure 6 is not covered by the transparent covering body 4, so that the material consumption of the transparent covering body 4 can be reduced, and the production cost can be saved;
specifically, the metal sputtering layer 5 includes a first metal sputtering portion for coating the first transparent coating sub-body 41 and a second metal sputtering portion for coating the second transparent coating sub-body 42, the first metal sputtering portion and the second sputtering portion located at the installation space 7 cooperate to form the light blocking structure 6, and the light blocking structure 6 is formed while the metal sputtering layer 5 is processed, so that the structure is simple and the processing is convenient;
in another embodiment, the light blocking structure 6 is a light blocking plate, which may be covered by the transparent covering body 4 or not covered by the transparent covering body 4.
In this embodiment, the mounting space 7 is a trapezoidal groove-shaped structure, and the smaller end of the mounting space is connected to the substrate 1, so that the light blocking structure 6 has a larger light blocking area, and the light blocking ratio of the optical sensor package structure can be improved.
In another embodiment, the installation space 7 may also be a rectangular or triangular cross-sectional groove-like structure.
In this embodiment, the transparent coating 4 is further provided with a light entrance groove 8, the light entrance groove 8 is disposed corresponding to the second light transmission opening 52, and the light entrance groove 8 can reduce the influence of the transparent coating 4 on the receiving capability of the reflected light of the light sensing component 3; the depth of the light incident groove 8 can be set according to the application, and this embodiment does not limit this;
as the preferred of this embodiment, go into light recess 8 and be the trapezium structure, its great end with second printing opacity mouth 52 is connected, and the setting of trapezium structure has improved the ability of the receipt reflection light of going into light recess 8 for go into light recess 8 can receive the reflection light of multiple different incident angles, thereby improve light sensor's sensitivity.
In this embodiment, the transparent coating 4 is made of epoxy resin; the material of the metal sputtering layer 5 can be stainless steel, copper or other metal materials; the metal sputtering layer 5 may also be a composite layer structure composed of stainless steel and copper, for example, the metal sputtering layer 5 is a three-layer composite layer structure of a stainless steel layer, a copper layer and a stainless steel layer arranged from inside to outside, which is not limited in this embodiment.
In another embodiment, the transparent cover 4 may also be silicone.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be considered as the protection scope of the present invention.
Claims (8)
1. The utility model provides a light sensor packaging structure, includes the substrate, be equipped with light emission component, light sensing component on the substrate and be used for the cladding light emission component, light sensing component's transparent cladding body, its characterized in that, the surface of transparent cladding body is equipped with the metal layer of sputtering, be equipped with first printing opacity mouth, second printing opacity mouth on the metal layer of sputtering, first printing opacity mouth corresponds light emission component arranges, the second printing opacity mouth corresponds light sensing component arranges.
2. The light sensor package structure of claim 1, further comprising a light blocking structure disposed between the light emitting element and the light sensing element.
3. The light sensor package structure of claim 2, wherein the transparent cover body comprises a first transparent cover sub-body for covering the light emitting element and a second transparent cover sub-body for covering the light sensing element, the first and second transparent cover sub-bodies form an installation space therebetween, and the light blocking structure is disposed at the installation space.
4. The optical sensor package structure as claimed in claim 3, wherein the metal sputtering layer includes a first metal sputtering portion for coating the first transparent coating sub-body and a second metal sputtering portion for coating the second transparent coating sub-body, and the first metal sputtering portion and the second metal sputtering portion located at the installation space cooperate to form the light blocking structure.
5. The light sensor package structure of claim 3, wherein the mounting space is a trapezoidal groove-shaped structure, and a smaller end of the mounting space is connected to the substrate.
6. The optical sensor package structure of claim 1, wherein the transparent cover further has a light-entering groove disposed thereon, and the light-entering groove is disposed corresponding to the second light-transmitting opening.
7. The optical sensor package structure as claimed in claim 6, wherein the light incident groove has a trapezoid shape, and a larger end thereof is connected to the second light-transmitting opening.
8. The light sensor package structure of claim 1, wherein the transparent encapsulant is an epoxy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222689948.5U CN218827060U (en) | 2022-10-12 | 2022-10-12 | Optical sensor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222689948.5U CN218827060U (en) | 2022-10-12 | 2022-10-12 | Optical sensor packaging structure |
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| CN218827060U true CN218827060U (en) | 2023-04-07 |
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| CN202222689948.5U Active CN218827060U (en) | 2022-10-12 | 2022-10-12 | Optical sensor packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116613622A (en) * | 2023-07-19 | 2023-08-18 | 青岛泰睿思微电子有限公司 | Double-groove light sensor packaging structure |
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2022
- 2022-10-12 CN CN202222689948.5U patent/CN218827060U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116613622A (en) * | 2023-07-19 | 2023-08-18 | 青岛泰睿思微电子有限公司 | Double-groove light sensor packaging structure |
| CN116613622B (en) * | 2023-07-19 | 2024-04-05 | 青岛泰睿思微电子有限公司 | Double-groove light sensor packaging structure |
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