CN106453723A - Sensor component and terminal - Google Patents

Sensor component and terminal Download PDF

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Publication number
CN106453723A
CN106453723A CN201611105820.2A CN201611105820A CN106453723A CN 106453723 A CN106453723 A CN 106453723A CN 201611105820 A CN201611105820 A CN 201611105820A CN 106453723 A CN106453723 A CN 106453723A
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CN
China
Prior art keywords
light
adhesive layer
sensor cluster
concentration structure
cover plate
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Granted
Application number
CN201611105820.2A
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Chinese (zh)
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CN106453723B (en
Inventor
周意保
张海平
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201611105820.2A priority Critical patent/CN106453723B/en
Publication of CN106453723A publication Critical patent/CN106453723A/en
Application granted granted Critical
Publication of CN106453723B publication Critical patent/CN106453723B/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

An embodiment of the invention provides a sensor component and a terminal. The sensor component comprises a light transmitter, a light receiver and a first light concentrating structure, the light transmitter is used for transmitting light which is transmitted to the outside after being concentrated by the first light concentrating structure, and the light receiver is used for receiving reflected light formed after being reflected by an outside object. By the sensor component, the light transmitted by the light transmitter can be concentrated and then transmitted to the outside, so that diffraction of the light on an ink layer is reduced, and detection accuracy of a proximity sensor is improved.

Description

Sensor cluster and terminal
Technical field
The present invention relates to communication technical field, more particularly to a kind of sensor cluster and terminal.
Background technology
With developing rapidly for terminal technology, mobile terminal is increasingly popularized, and is become requisite in people's life and is set Standby.People can be learnt by mobile terminal, entertain etc..
At present the non-display area of the touch panel of mobile terminal is transparent, in order that mobile terminal is more attractive in appearance, Typically ink can be sprayed in the lower surface of touch panel non-display area, multilamellar ink is formed to cover inside mobile terminal Structure.
However, the proximity transducer of mobile terminal is generally located on below ink layer, accordingly, it would be desirable to set on per layer of ink Two through holes (such as, two through holes are set on this layer of ink) are put when per layer of ink is sprayed, and a through hole is used as close biography The light launch hole of sensor, another through hole are used as the light receiver hole of proximity transducer.In the outside launching light of light emitters During line, there is some light that generation diffraction in ink layer can be entered, this some light of diffraction occurs without the anti-of exterior object It is directly entered by penetrating in light receiver, causes the accuracy of the detection of proximity transducer poor.
Content of the invention
The embodiment of the present invention provides a kind of sensor cluster and terminal, can improve the accuracy of proximity transducer detection.
The embodiment of the present invention provides a kind of sensor cluster, including optical transmitting set, optical receiver and the first concentration structure, institute Optical transmitting set is stated for launching light, the light is transmitted into outside after being polymerized through first concentration structure, the light-receiving Device is used for receiving the reflection light that the light is formed after exterior object reflection.
The embodiment of the present invention provides a kind of terminal, including sensor cluster, cover plate and is arranged on the cover plate side Adhesive layer, the sensor cluster is arranged on the side that the cover plate has adhesive layer, and the sensor cluster is above-mentioned sensing Device assembly.
The embodiment of the present invention also provides another kind of terminal, including including housing and sensor cluster, the sensor cluster is pacified It is mounted in the housing, the sensor cluster is the sensor component.
The embodiment of the present invention provides a kind of sensor cluster, including optical transmitting set, optical receiver and the first concentration structure, should Optical transmitting set is used for launching light, and the light is transmitted into outside after the first concentration structure polymerization, and the optical receiver is used for connecing Receive the reflection light that the light is formed after exterior object reflection.The program can be by the light polymerization transmitting of optical transmitting set transmitting To outside, diffraction of the light in ink layer is reduced, improve the accuracy of proximity transducer detection.
Description of the drawings
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below will be to making needed for embodiment description Accompanying drawing is briefly described.It should be evident that drawings in the following description are only some embodiments of the present invention, for For those skilled in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings other attached Figure.
Fig. 1 is terminal structure schematic diagram provided in an embodiment of the present invention.
Fig. 2 is the first structural representation of sensor cluster provided in an embodiment of the present invention.
Fig. 3 is second structural representation of sensor cluster provided in an embodiment of the present invention.
Fig. 4 is the third structural representation of sensor cluster provided in an embodiment of the present invention.
Fig. 5 is the 4th kind of structural representation of sensor cluster provided in an embodiment of the present invention.
Fig. 6 is the 5th kind of structural representation of sensor cluster provided in an embodiment of the present invention.
Fig. 7 is the first structural representation of cover plate assembly provided in an embodiment of the present invention.
Fig. 8 is second structural representation of cover plate assembly provided in an embodiment of the present invention.
Fig. 9 is the first structural representation of adhesive layer in cover plate assembly provided in an embodiment of the present invention.
Figure 10 is the third structural representation of cover plate assembly provided in an embodiment of the present invention.
Figure 11 is second structural representation of adhesive layer in cover plate assembly provided in an embodiment of the present invention.
Figure 12 is the 4th kind of structural representation of cover plate assembly provided in an embodiment of the present invention.
Figure 13 is the 4th kind of structural representation of cover plate assembly provided in an embodiment of the present invention.
The enlarged diagram in A portion in 4th kind of structure of Figure 14 cover plate assembly provided in an embodiment of the present invention.
Figure 15 is the application scenarios schematic diagram that in the embodiment of the present invention, light produces diffraction.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described.Obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, the every other enforcement obtained under the premise of creative work is not made by those skilled in the art Example, belongs to the scope of protection of the invention.
In describing the invention, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ", " up time The orientation of instruction such as pin ", " counterclockwise " or position relationship are based on orientation shown in the drawings or position relationship, are for only for ease of The description present invention and simplification description, rather than the device or element of instruction or hint indication must be with specific orientation, Yi Te Fixed azimuth configuration and operation, are therefore not considered as limiting the invention.Additionally, term " first ", " second " are only used for Description purpose, and it is not intended that indicating or hint relative importance or the implicit quantity for indicating indicated technical characteristic. Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more feature.? In description of the invention, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected;Can To be to be mechanically connected, or electrically connect or mutually can communicate;Can be joined directly together, it is also possible to by between intermediary Connect connected, can be the connection of two element internals or the interaction relationship of two elements.Ordinary skill for this area For personnel, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score The first and second feature directly contacts can be included, it is also possible to be not directly contact including the first and second features but by it Between other characterisation contact.And, fisrt feature second feature " on ", " top " and " above " include that first is special Levying directly over second feature and oblique upper, or fisrt feature level height is merely representative of higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of Fisrt feature level height is less than second feature.
Following disclosure provides the different structure that many different embodiments or example are used for realizing the present invention.In order to Simplify disclosure of the invention, hereinafter the part and setting of specific examples is described.Certainly, they are only merely illustrative, and And purpose does not lie in the restriction present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference letter, This repeat be for purposes of simplicity and clarity, itself do not indicate discussed various embodiments and/or arrange between Relation.Additionally, the invention provides various specific technique and material example, but those of ordinary skill in the art are permissible Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present invention provides a kind of sensor cluster, cover plate assembly and terminal, is described in detail respectively below.
With reference to Fig. 1, terminal 1000 include housing 10, receiver 20, photographic head 30, fingerprint module 40, sensor cluster 50, Cover plate assembly 60 and control circuit.
Wherein, housing 10 is used for forming the exterior contour of terminal 1000.Receiver 20, photographic head 30, fingerprint module 40 with And control circuit is in housing 10.Receiver 20 can be used to outwardly export acoustical signal.Photographic head 30 can be used to gather External image.Fingerprint module 40 can be used to gather the finger print information of user.Control circuit can be mainboard.Control circuit can be with Receiver 20, photographic head 30 and fingerprint module 40 are electrically connected with, to realize the integral monitoring to terminal 1000.And sensor group Part 50 is hidden in inside terminal 1000.
With reference to Fig. 2, sensor cluster 50 can include optical transmitting set 501, optical receiver 502, concentration structure 503 and circuit Plate 504, optical transmitting set 501 and optical receiver 502 are fixed on circuit board 504.Optical transmitting set 501 is used for launching light, such as red Outside line, laser etc..Concentration structure 503 is used for the polymerization of optical transmitting set transmitting, and light is transmitted into after the polymerization of concentration structure 503 Outside, optical receiver 502 is used for receiving the reflection light that light is formed after exterior object reflection.Terminal 1000 can be according to light The light intensity value that receptor 502 is received is judging that being in proximity state between terminal 1000 and exterior object is also remote from State, so as to be controlled to terminal 1000.
In some embodiments, the concentration structure 503 can be convex lenss.Such as, when light is launched from emitter 501 To in the air, from air enter convex lenss when, the transmission medium of light changes, due to the physical property of convex lenss, permissible Change the original transmission path of light, by the light for receiving toward middle its transmission of polymerization relief.
In some embodiments, optical transmitting set 501 can be arranged at intervals on circuit board 504 with optical receiver 502.Poly- Photo structure 503 may be disposed at the going out on light path of optical transmitting set 501, refer to Fig. 2, concentration structure 503 and optical transmitting set can between Every setting, if face P is the exiting surface of optical transmitting set 501, the aids such as support can be passed through concentration structure 503 is fixed on face The surface of P.
In some embodiments, concentration structure 503 can be directly arranged on the exiting surface of optical transmitting set 501.Refer to Fig. 3, the concentration structure 503 can be attached on the exiting surface P of optical transmitting set 501.
Fig. 4 is refer to, optical transmitting set 501 can be packaged with optical receiver 502, form a packaging body 510 and fix On circuit board 504.Wherein, concentration structure 503 may be provided at the going out on light path of the optical transmitting set 501 outside packaging body.
In some embodiments, concentration structure 503 can also be directly arranged on the exiting surface of optical transmitting set 501, and Together encapsulate with optical receiver 502 and form packaging body.
With reference to Fig. 5, in some embodiments, sensor cluster 50 can also include concentration structure 505, so that through outer The reflection light that portion's object is reflected to form can enter optical receiver 502 after being polymerized through concentration structure 505.Refer to Fig. 2 and Fig. 3 The positional structure of middle concentration structure 503, similarly, the concentration structure 505 may be disposed at the entering on light path of optical receiver 502, And with 502 interval setting of optical receiver;The concentration structure 505 can be also directly arranged on the incidence surface of optical receiver 502.One In a little embodiments, the concentration structure 505 can be convex lenss.
With reference to Fig. 6, in some embodiments, sensor cluster 50 can also include ambient light sensor 506.The environment Optical sensor 506 can be united two into one with optical receiver 502, and is disposed on circuit board 504 with optical transmitting set 501.Additionally, Also optical transmitting set 501, optical receiver 502 and ambient light sensor 506 together can be encapsulated and form packaging body 520 and be fixed on circuit On plate 504.Wherein, ambient light sensor 506 is used for receiving visible ray, to detect ambient light intensity.As shown in fig. 6, can gather Photo structure 505 is arranged at the entering on light path of optical receiver 502 and ambient light sensor 506.Terminal 1000 can be according to environment The ambient light intensity that optical sensor 506 is detected is adjusted to brightness of display screen.
In some embodiments, optical transmitting set 501, optical receiver 502 and ambient light sensor 506 can not be encapsulated, But optical transmitting set 501, optical receiver 502 and ambient light sensor 506 are disposed on circuit board 504, and it is environment Optical sensor 506 is separately provided a concentration structure.
With reference to Fig. 7, in certain embodiments, cover plate assembly 60 can include cover plate 61, be arranged on the attached of 61 side of cover plate Layer 62, and sensor cluster 63.Sensor cluster 63 is arranged at side of the cover plate 61 with adhesive layer.Cover plate 61 can be Clear glass cover plate.
In certain embodiments, cover plate 61 can also be the transparent cover plate that other materials is made, for example, it may be organic material The transparent cover plate that material is made.
Sensor cluster 63 can include optical transmitting set 631, optical receiver 632, concentration structure 633 and circuit board 634.Light Emitter 631 and optical receiver 632 are arranged on circuit board 634.In some embodiments, concentration structure 633 may be disposed at Optical transmitting set 631 go out on light path and with 631 interval setting of optical transmitting set.As shown in fig. 7, the concentration structure 633 is arranged Go out on light path in the bottom of adhesive layer 62 and positioned at optical transmitting set 631, so that the light that optical transmitting set 631 is launched is through optically focused Structure 633 is transmitted into outside through adhesive layer 62 and cover plate 61 after being polymerized successively, light institute's shape after the reflection of exterior object 2000 The reflection light for becoming enters optical receiver 632 through cover plate 61 and adhesive layer 62 successively.Wherein, the concentration structure 505 can be Convex lenss.
In some embodiments, concentration structure 633 is can also be provided on the exiting surface of optical transmitting set 631.
With reference to Fig. 8, adhesive layer 62 may include the first adhesive layer 621 and the second adhesive layer 622, and the first adhesive layer 621 is arranged On cover plate 61, the second adhesive layer 622 is arranged on the side on first adhesive layer 621 away from cover plate 61, the first adhesive layer 621 light transmittance is more than the light transmittance of the second adhesive layer 622.For example, the absorbance of the first adhesive layer 621 can be 80% or More than 80%, the absorbance of the second adhesive layer 622 can be 10% or less than 10%.
First adhesive layer 621 can be referred to as transmission layer, can pass through major part light.Second adhesive layer 622 can be claimed For barrier bed, most of light can be blocked.
In practical application, the second adhesive layer 622 is used for the internal structure (as sensor cluster 50) of concealed terminal 1000, makes Obtain the internal structure that terminal 1000 cannot be seen from 61 outside of cover plate, to realize the aesthetic of the globality of terminal 1000.
In certain embodiments, the first adhesive layer 621 can be white ink layer, and the second adhesive layer 622 can be black Ink layer.Certainly, white ink layer and black ink layer are only for example, and first adhesive layer 621 and the second adhesive layer 622 also may be used To be designed to other colors according to different aesthetic requirements, as long as the absorbance of first adhesive layer 621 is more than second attachment The absorbance of layer 622.Wherein, the ink layer of white ink layer, black ink layer or other colors can be by spraying Or typography is making.
With reference to Fig. 9, the second adhesive layer 622 can include first area 622A and second area 622B.The first area 622A can be understood as second adhesive layer 622 and the underlapped part of first adhesive layer 621, and 622B is permissible for the second area It is interpreted as second adhesive layer 622 and the overlapped part of first adhesive layer 621.First area 622A and second area 622B by the second adhesive layer 622 border defining.Absorbance of the absorbance of first area 622A more than second area 622B.
In conjunction with Fig. 8 and Fig. 9, in some embodiments, concentration structure 633 can be arranged at the bottom of first area 622A And go out on light path positioned at optical transmitting set 631 so that light can pass through successively first area 622A, the first adhesive layer 621, Cover plate 61, and successively through cover plate 61, the first adhesive layer 621 and first area 622A after reflecting through exterior object 2000.
Wherein, the first adhesive layer 621 covers the first area 622A of the second adhesive layer 622, so that from outside terminal 100 First area 622A cannot be seen.
In certain embodiments, when the second adhesive layer 622 is black ink layer, can be to the black of first area 622A Ink carries out being processed so that the absorbance of the absorbance more than second area 622B in the region.First adhesive layer 621 covers the The first area 622A of two adhesive layers 622, so that be hidden from first area 622A 61 profile of cover plate and invisible.
In certain embodiments, first area 622A could be arranged to through hole, and now the absorbance in the region is 100%, First adhesive layer 621 covers the through hole.The through hole can be functional hole, and it is logical that the light that launches as optical transmitting set 631 passes through Road, the passage that the reflection light for reflecting through exterior object 2000 passes through, and light enter ambient light sensor 506, photographic head The passage that 30 grades pass through.In certain embodiments, the material for being available for light transmission can be filled in the through hole of first area 622A Material.
In certain embodiments, first area 622A could be arranged to two through holes, so that light can be logical from one Hole outgoing, from another through hole incidence after exterior object reflection.With reference to Figure 10, concentration structure 633 can extend to the through hole In 622A, the top of concentration structure 633 is made to direct reach 621 bottom of the first adhesive layer, so that light can be tied through optically focused successively Structure 633, the first adhesive layer 621, cover plate 61, and after reflecting, pass through cover plate 61, the first adhesive layer 621 through exterior object 2000 successively And first area 622A.
In certain embodiments, the first adhesive layer 621 can be monolayer, and the second adhesive layer 622 is monolayer or multilamellar;Or Person can also the first adhesive layer 621 be the multilamellar, second adhesive layer 622 be monolayer or multilamellar.
In certain embodiments, as shown in figure 11, the first adhesive layer 621 includes two sub- adhesive layers 6211,6212, and this two Individual sublayer is overlapped successively.A through hole 6212A is set in sub- adhesive layer 6212, so that light can be from through hole 6212A Outgoing.Wherein, through hole 6212 is relative with through hole 622A.
In conjunction with Figure 11 and Figure 12, in some embodiments, concentration structure 633 through through hole 622A and can be embedded into logical In the 6212A of hole, the top of concentration structure 633 is made to direct reach 6211 bottom of sub- adhesive layer.
With reference to Figure 13, the sensor cluster 63 can also include concentration structure 635, and the concentration structure 635 may be disposed at attached 62 bottom of layer, so that the reflection light for reflecting to form through exterior object 2000 can be through successively through cover plate 61, adhesive layer 62, optical receiver 632 is entered through concentration structure 635 after being polymerized.Similarly, the concentration structure 635 may be disposed at optical receiver 632 Enter on light path, and with 632 interval setting of optical receiver;The concentration structure 635 can also be directly arranged at optical receiver 632 On incidence surface.In some embodiments, the concentration structure 635 can be convex lenss.
As shown in figure 13, with reference to the location layout of concentration structure 633, can by concentration structure 635 through through hole 622A simultaneously Being embedded into makes the top of concentration structure 635 direct reach 6211 bottom of sub- adhesive layer in the through hole set by sub- adhesive layer 6211 so that Light can pass through cover plate 61 successively through the reflection light that exterior object 2000 is reflected to form, after sub- adhesive layer 6211, through optically focused Structure 635 enters optical receiver 632 after being polymerized.
With reference to Figure 13-Figure 15, it is assumed that infrared ray launched by optical transmitting set 631.After the infrared ray is reflected by exterior object 2000 Reflection light is formed, optical receiver 632 receives the reflection light.After infrared ray launched by optical transmitting set 631, infrared ray is through optically focused Structure 633 is polymerized, so that the transmission path of light is deflected, it is to avoid infrared ray occurs diffraction inside the first adhesive layer 621 (as shown in figure 15, infrared ray is when through the first adhesive layer 621, and some infrared ray occurs inside the first adhesive layer 621 Diffraction, infrared ray after diffraction is entered in optical receiver 632) when excessive diffracted light enter in optical receiver 632, reduce The diffraction amount of light, improves the accuracy of testing result.
And during reflection light is received, if no concentration structure 635, part reflection light then can be as in Figure 14 Light b, is brushed past with optical receiver 632 and cannot be introduced in optical receiver 632.After concentration structure 635 is set, then instead Penetrate light transmission path when through concentration structure 635 to shift, the light a in the light after skew such as Figure 14 so that Light is gathered toward 635 center of concentration structure, enters back into optical receiver.
In certain embodiments, the sensor cluster 60 can also include ambient light sensor.The ambient light sensor can Unite two into one with optical receiver 632, and be disposed on circuit board 634 with optical transmitting set 631.Additionally, also light can be launched Device 631, optical receiver 632 and ambient light sensor together encapsulate to form packaging body and be fixed on circuit board 634.Wherein, ring Border optical sensor is used for receiving visible ray, to detect ambient light intensity.In addition, optical receiver can be arranged at concentration structure 635 632 and the entering on light path of ambient light sensor.The ambient light intensity that terminal 1000 can be detected according to ambient light sensor Brightness of display screen is adjusted.
In some embodiments, optical transmitting set 631, optical receiver 632 and ambient light sensor can not be encapsulated, but Optical transmitting set 631, optical receiver 632 and ambient light sensor are disposed on circuit board 634, and are ambient light sensor It is separately provided a concentration structure.
The light polymerization of optical transmitting set transmitting can be transmitted into outside, reduce by terminal provided in an embodiment of the present invention Light improves the accuracy of proximity transducer detection in the diffraction of ink layer.
A kind of sensor cluster for above embodiment of the present invention being provided and terminal are described in detail, and herein should With specific case, the principle of the present invention and embodiment are set forth, the explanation of above example is only intended to help and manages The solution method of the present invention and its core concept;Simultaneously for those skilled in the art, according to the thought of the present invention, concrete All will change in embodiment and range of application, in sum, this specification content is should not be construed as to the present invention's Limit.

Claims (13)

1. a kind of sensor cluster, it is characterised in that including optical transmitting set, optical receiver and the first concentration structure, the light is sent out Emitter is used for launching light, and the light is transmitted into outside after being polymerized through first concentration structure, and the optical receiver is used for Receive the reflection light that the light is formed after exterior object reflection.
2. sensor cluster as claimed in claim 1, it is characterised in that between first concentration structure and the optical transmitting set Every setting, first concentration structure is arranged at the optical transmitting set and goes out on light path.
3. sensor cluster as claimed in claim 1, it is characterised in that first concentration structure is arranged on light transmitting On the exiting surface of device.
4. sensor cluster as claimed in claim 3, it is characterised in that first concentration structure is sealed with the optical transmitting set Dress forms a packaging body.
5. sensor cluster as claimed in claim 1, it is characterised in that also include the second concentration structure, the optical receiver Reflect through exterior object and through the reflection light for being formed after second concentration structure polymerization for receiving the light.
6. sensor cluster as claimed in claim 5, it is characterised in that between second concentration structure and the optical receiver Every setting, second concentration structure is arranged at the entering on light path of the optical receiver.
7. the sensor cluster as described in claim 1-6, it is characterised in that first concentration structure be.
8. the sensor cluster as described in claim 1-6, it is characterised in that also include circuit board, the optical transmitting set and institute State optical receiver to be arranged on the circuit board.
9. a kind of terminal, it is characterised in that including sensor cluster, cover plate and be arranged on the adhesive layer of the cover plate side, The sensor cluster is arranged on the side that the cover plate has adhesive layer, and the sensor cluster is to appoint in claim 1-8 Sensor cluster described in one;
The light of the optical transmitting set transmitting passes through the adhesive layer and the lid after being polymerized through first concentration structure successively Plate is transmitted into outside, the light after exterior object reflection the reflection light that formed successively through the cover plate and described attached Layer and enter the optical receiver.
10. terminal as claimed in claim 9, it is characterised in that first concentration structure is arranged on the bottom of the adhesive layer Portion simultaneously goes out on light path positioned at the optical transmitting set.
11. terminals according to claim 9, it is characterised in that the adhesive layer includes the first adhesive layer and the second attachment Layer, first adhesive layer is arranged on the cover plate, and second adhesive layer is arranged on first adhesive layer away from institute The side of cover plate is stated, the light transmittance of first adhesive layer is more than the light transmittance of second adhesive layer;
Second adhesive layer includes first area and second area, and the light transmittance of the first area is more than the second area Light transmittance;
First adhesive layer covers the first area of second adhesive layer, so that described described from cover plate profile first Region is hidden and invisible.
12. want the terminal as described in 11 as right, it is characterised in that first adhesive layer is that white ink layer, described second is attached Layer for black ink layer.
13. a kind of terminals, it is characterised in that including housing and sensor cluster, the sensor cluster is arranged on the housing Inside, the sensor cluster is the sensor cluster described in any one of claim 1-8.
CN201611105820.2A 2016-12-06 2016-12-06 Sensor assembly and terminal Active CN106453723B (en)

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CN106933415A (en) * 2017-03-07 2017-07-07 广东欧珀移动通信有限公司 A kind of sensor cluster and terminal
CN107145886A (en) * 2017-05-03 2017-09-08 广东欧珀移动通信有限公司 Optical ftngetpnnt acquisidon method and Related product
CN107153818A (en) * 2017-05-03 2017-09-12 广东欧珀移动通信有限公司 Optical finger print verification method and Related product
CN107220592A (en) * 2017-05-03 2017-09-29 广东欧珀移动通信有限公司 A kind of optical ftngetpnnt acquisidon method and Related product
CN107978260A (en) * 2017-11-22 2018-05-01 广东欧珀移动通信有限公司 Display screen component and electronic equipment
CN108200246A (en) * 2018-01-15 2018-06-22 维沃移动通信有限公司 Mobile terminal
CN108304038A (en) * 2018-02-08 2018-07-20 维沃移动通信有限公司 A kind of electronic equipment
CN108366142A (en) * 2018-01-15 2018-08-03 维沃移动通信有限公司 Mobile terminal
CN108922398A (en) * 2018-07-26 2018-11-30 维沃移动通信有限公司 A kind of mobile terminal

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