CN214585979U - Optical sensor and application device thereof - Google Patents

Abstract

The utility model relates to an optical sensor, which comprises a PCB board, wherein the PCB board is provided with an optical sensor module, a shading shell covering the optical sensor module and an infrared luminous source positioned outside the shading shell; the optical sensor module is welded with the PCB through a packaging pin and comprises a packaging substrate and an optical sensor chip; the optical sensor chip controls the infrared luminous source to emit infrared light; the upper surface of the packaging substrate is fixedly provided with a convex infrared light-transmitting lens for covering the optical sensor chip; a light guide hole is formed in the shading shell and is positioned right above the infrared light-transmitting lens; by applying the structure, the infrared ray detection sensitivity of the optical sensor is improved and the interference of visible light in the environment to the optical sensor is reduced by combining the optical sensor chip and the infrared light-transmitting lens; the utility model provides high optical sensor and application device's application convenience, detectivity and interference immunity.

Description

Optical sensor and application device thereof

Technical Field

The utility model relates to an optical sensor technical field, more specifically say, relate to an optical sensor and application apparatus thereof.

Background

The optical sensor is a miniaturized electronic device, measures according to an optical principle, converts a light intensity signal into an electric signal, can detect the change of light intensity, and further detects the change of a target inductor, thereby realizing the application control of the terminal device.

With the development of electronic product intelligence, optical sensors have become an indispensable part of electronic device applications; the conventional optical sensor module is easily affected by internal emission light and external environment light interference, and the mounting structure is complex, which is not beneficial to production and application, and on the other hand, in the practical application process, external static electricity or electromagnetic interference easily affects the normal work of the optical sensor, and the above factors reduce the sensitivity, accuracy and stability of the detection of the optical sensor, so the technology needs to be improved.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the present invention is to provide an optical sensor and an application device thereof.

The utility model provides a technical scheme that its technical problem adopted is:

constructing an optical sensor, wherein the optical sensor comprises a PCB (printed circuit board), and an optical sensor module, a shading shell covering the optical sensor module and an infrared luminous source positioned outside the shading shell are arranged on the PCB; the optical sensor module is welded with the PCB through a packaging pin and comprises a packaging substrate and an optical sensor chip which is arranged on the upper surface of the packaging substrate and electrically connected with the packaging substrate; the optical sensor chip controls the infrared luminous source to emit infrared light; the upper surface of the packaging substrate is fixedly provided with a convex infrared light-transmitting lens for covering the optical sensor chip; the light shading shell is provided with a light guide hole, and the light guide hole is located right above the infrared light-transmitting lens.

Optical sensor, wherein, infrared printing opacity camera lens is the hemisphere.

Optical sensor, wherein, optical sensor chip package is in the infrared printing opacity camera lens.

Optical sensor, wherein, infrared printing opacity lens is made by infrared printing opacity epoxy plastic packaging material. Optical sensor, wherein, infrared printing opacity camera lens cover through moulding plastics infrared printing opacity epoxy packaging material high temperature in optical sensor chip surface and packaging substrate surface makes.

The optical sensor of the utility model, wherein, leaded light hole diameter size scope is at 0.1-1.0mm, the degree of depth scope of leaded light hole is at 0.1-1.0 mm.

Optical sensor, wherein, shading casing overall dimension is 6.0mm 3.0 mm.

Optical sensor, wherein, the shading casing adopts metal material or plastic packaging material to make, the bottom surface of shading casing is the casing face of weld, the inboard of shading casing is the cavity district.

Optical sensor, wherein, the casing face of weld with the PCB board passes through soldering tin or viscose reinforcement and seals, and consolidates sealed back the cavity district becomes relative airtight space.

Optical sensor, optical sensor chip control infrared light source transmission infrared light, the infrared light that reflects when the infrared light of infrared light source transmission meets the target object passes through the leaded light hole, spreads into the inside optical sensor of shading casing into. Furthermore, infrared light is collected to the optical sensor chip through the infrared light-transmitting lens, and is subjected to photoelectric conversion and digital processing inside the optical sensor chip, so that detection of a target object, such as a position distance, a movement direction and the like of the target object, is achieved.

An optical sensor application device is provided with the optical sensor.

The beneficial effects of the utility model reside in that: by applying the structure, the infrared ray detection sensitivity of the optical sensor is improved and the interference of visible light in the environment to the optical sensor is reduced by combining the optical sensor chip and the infrared light-transmitting lens; the light shading shell covers the optical sensor, light emitted by the infrared light emitting source can only enter the optical sensor inside the shell through the light guide hole after being reflected by an object, the light can be prevented from entering the optical sensor from an area outside the light guide hole, the infrared light emitted by the infrared light emitting source is prevented from directly irradiating the optical sensor, and the optical sensor module is prevented from being interfered; the utility model improves the application convenience, detection sensitivity and anti-interference performance of the optical sensor and the application device thereof; the utility model discloses a detection to target reflection object, like target reflection object's position distance, direction of motion etc.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the drawings:

fig. 1 is a schematic structural diagram of an optical sensor according to a preferred embodiment of the present invention;

fig. 2 is a schematic structural diagram of an optical sensor module according to a preferred embodiment of the present invention;

fig. 3 is a pin diagram of an optical sensor module according to a preferred embodiment of the present invention;

fig. 4 is a bottom view of the light blocking housing of the preferred embodiment of the present invention;

fig. 5 is a schematic diagram illustrating an application principle of an optical sensor according to a preferred embodiment of the present invention;

in the figure: 1-optical sensor module, 11-optical sensor chip, 12-packaging substrate, 13-infrared light-transmitting lens, 14-packaging pin, 2-light-shading shell, 21-light-guiding hole, 22-shell welding surface, 23-cavity area, 3-infrared light-emitting source, 4-PCB board, and 5-target reflecting object.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be given below with reference to the technical solutions of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, belong to the scope of protection of the present invention.

The optical sensor of the preferred embodiment of the present invention, as shown in fig. 1 and referring to fig. 2-5, includes a PCB 4, the PCB 4 is provided with an optical sensor module 1, a light shielding case 2 covering the optical sensor module 1, and an infrared light source 3 located outside the light shielding case 2; the optical sensor module 1 is welded with the PCB 4 through a packaging pin 14, and the optical sensor module 1 comprises a packaging substrate 12 and an optical sensor chip 11 which is arranged on the upper surface of the packaging substrate 12 and electrically connected with the packaging substrate 12; the upper surface of the package substrate 12 is fixedly provided with a convex infrared light-transmitting lens 13 covering the optical sensor chip 11; a light guide hole 21 is formed in the shading shell 2, and the light guide hole 21 is located right above the infrared light-transmitting lens 13;

by applying the structure of the application, the infrared ray detection sensitivity of the optical sensor is improved and the interference of visible light in the environment to the optical sensor is reduced by combining the optical sensor chip 11 and the infrared light-transmitting lens 13;

in addition, the light-shielding shell 2 covers the optical sensor, light emitted by the infrared light-emitting source 3 can only enter the optical sensor inside the shell through the light guide hole 21 after being reflected by an object, so that the light can be prevented from entering the optical sensor from an area outside the light guide hole 21, the infrared light emitted by the infrared light-emitting source 3 is prevented from directly irradiating the optical sensor, and the optical sensor module is prevented from being interfered;

the utility model improves the application convenience, detection sensitivity and anti-interference performance of the optical sensor and the application device thereof, and the whole structure can become very simple;

preferably, the infrared light-transmitting lens 13 is hemispherical; it should be noted that the hemispherical shape is an optimal arrangement mode, which can focus infrared light, and certainly those skilled in the art can also simply change the lens structure according to this principle, and the change based on this conventional shape and combination also belongs to the protection scope of the present application;

preferably, the optical sensor chip 11 is encapsulated within the infrared transparent lens 13; the infrared light-transmitting glue material has excellent adhesion and high reliability, so that the optical sensor chip has the best packaging effect and the service life;

preferably, the infrared light-transmitting lens 13 is made of an infrared light-transmitting epoxy plastic package material, and the material has extremely high transmittance to infrared light and can effectively block visible light from transmitting, so that the detection effectiveness of the optical sensor chip 11 to infrared light is ensured, and the anti-interference performance of the optical sensor chip 11 to visible light is improved;

preferably, the infrared light-transmitting lens 13 is made by high-temperature injection molding the infrared light-transmitting epoxy plastic packaging material on the surface of the optical sensor chip and the surface of the packaging substrate; the processing and forming are convenient, and the protection effect on the optical sensor chip 11 is good.

Preferably, the diameter of the light guide hole 21 is in the range of 0.1-1.0mm, and the depth of the light guide hole 21 is in the range of 0.1-1.0 mm.

Preferably, the outer dimension of the light shield case 2 is 6.0mm 3.0 mm.

Preferably, the bottom surface of the light shielding shell 2 is a shell welding surface 22, and the inner side of the light shielding shell 2 is a cavity area 23;

preferably, in order to facilitate assembly, the shell is made of a metal material or a plastic package material, so that the optical sensor is prevented from being deformed, and the anti-interference performance and the heat dissipation capacity of the device are improved;

the casing welding face 22 is arranged to be conveniently used for being fixedly connected and assembled with the PCB 4, and it should be noted that the casing welding face 22 can adopt the existing welding face structure form, and the replacement based on the conventional technical means belongs to the protection scope of the application.

Preferably, the welding surface 22 of the shell and the PCB 4 are reinforced and sealed by soldering tin or adhesive, and the cavity area becomes a relatively closed space after the reinforcement and sealing; the processing is convenient, and simultaneously, the better anti-interference effect is ensured.

Preferably, the optical sensor chip 11 controls the infrared light source 3 to emit infrared light, the infrared light emitted from the infrared light source 3 is reflected when encountering the target reflecting object 5, and the reflected light enters the cavity area 23 inside the light shielding case 2 through the light guiding hole 21 of the light shielding case 2. Further, the reflected light is condensed to the optical sensor chip 11 through the infrared transmission lens 13. Further, the optical sensor chip 11 performs photoelectric conversion and digital processing therein, thereby detecting the target reflecting object 5, such as a position distance, a moving direction, and the like of the target reflecting object.

An optical sensor application device is provided with the optical sensor; the application device can cover more fields, and all the application devices which use the optical sensor with the structure of the application to detect infrared light objects belong to the protection scope of the application.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.

Claims (10)

1. An optical sensor is characterized by comprising a PCB (printed circuit board), wherein an optical sensor module, a shading shell covering the optical sensor module and an infrared luminous source positioned outside the shading shell are arranged on the PCB; the optical sensor module is welded with the PCB through a packaging pin and comprises a packaging substrate and an optical sensor chip which is arranged on the upper surface of the packaging substrate and electrically connected with the packaging substrate; the optical sensor chip controls the infrared luminous source to emit infrared light; the upper surface of the packaging substrate is fixedly provided with a convex infrared light-transmitting lens for covering the optical sensor chip; the light shading shell is provided with a light guide hole, and the light guide hole is located right above the infrared light-transmitting lens.

2. The optical sensor of claim 1, wherein the infrared transparent lens is hemispherical.

3. The optical sensor of claim 1, wherein the optical sensor chip is encapsulated within the infrared transparent lens.

4. The optical sensor of any one of claims 1-3, wherein the infrared-transparent lens is made of an infrared-transparent epoxy molding compound.

5. The optical sensor of claim 4, wherein the IR transparent lens is made by high temperature injection molding an IR transparent epoxy molding material over the optical sensor die surface and the package substrate surface.

6. The optical sensor of any one of claims 1-3, wherein the light guide hole has a diameter in the range of 0.1-1.0mm and a depth in the range of 0.1-1.0 mm.

7. The optical sensor of claim 6, wherein the light-shielding housing outer dimension is 6.0mm 3.0 mm.

8. The optical sensor according to any one of claims 1 to 3, wherein the light-shielding shell is made of a metal material or a plastic package material, the bottom surface of the light-shielding shell is a shell welding surface, and the inner side of the light-shielding shell is a cavity region.

9. The optical sensor of claim 8, wherein the soldering surface of the housing is reinforced and sealed with the PCB by solder or glue, and the cavity becomes a relatively sealed space after the reinforcement and sealing.

10. An optical sensor application device, characterized in that the optical sensor application device is provided with an optical sensor according to any one of claims 1-9.

Images