JPH1140859A - Infrared-ray data communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-priced microminiature and thin type infrared-ray data communication module of low power consumption having a high output light-emitting element by a method, wherein the upper surface of a light-emitting element and a light-receiving element are positioned on the outer circumference of semispherical lens parts, the circumference of the semispherical lens parts in surrounded by the reflection surface of the reflection member, and the infrared rays, emitted from the light-emitting element, are projected effectively and condensed on the light-emitting element. SOLUTION: Electronic components such as a light-emitting element 3, a light-receiving element 4, an IC chip, etc., are mounted on a circuit board 7. An inverted cone-shaped reflection surface 12b is provided in the vicinity of the inner edge part of a through-hole 12a of a shield case 12, which covers the main body of a module using an infrared-ray data communication module 11 to be sealed by light-transmitting resin 6, in such a manner that the upper surface of the light-emitting element 3 and the light-receiving element 4 are covered by semispherical lenses 6a and 6b, and the reflecting thin films 12c such as an Ni-plated layers, etc., are formed on the surface of the reflecting surfaces 12b. A wasteful light, which spreads to the left and the right sides of the light-emitting element 4, is made to be irradiated, the light of the outer circumference of the lens is condensed by the light-receiving element 4, the area of light-receiving part becomes wider, and the light-receiving and light-emitting sensitivity are enhanced. As a result, a small, thin type and low-power consuming domestic appliance for high speed and long distance operation can be attained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an infrared data communication module used for consumer equipment such as a personal computer, a printer, a PDA, a facsimile, a pager, and a portable telephone.

[0002]

2. Description of the Related Art In recent years, there has been a strong demand for miniaturization of infrared data communication modules in portable devices such as notebook computers, PDAs, and mobile phones equipped with an optical communication function. L
An infrared light emitting element composed of an ED, a light receiving element composed of a photodiode, an amplifier, a drive circuit and the like are incorporated.
An infrared data communication module has been developed in which a circuit portion made of C is directly die-bonded and wire-bonded to a lead frame, and a transmission unit and a reception unit are packaged in a resin-integrated resin mold using visible light cut epoxy resin. The outline of the structure of a conventional general infrared data communication module will be described with reference to FIGS. FIG. 3 is a front view showing the appearance of the infrared data communication module, and FIG.
3 is a plan view of FIG. 3 seen from above, and FIG. 5 is a sectional view showing the internal configuration of FIG.

In FIGS. 3 to 5, the infrared data communication module 1 has a light emitting element 3, a light receiving element 4, and an IC chip 5 connected only by a die bonding and a wire bonding only to the upper surface side of a lead frame 2. A hemispherical lens having a function of irradiating and condensing infrared light with a light-transmitting resin 6 such as an epoxy resin containing a visible light-cutting agent on the upper surfaces of the light emitting element 3 and the light receiving element 4 while protecting the electronic components. Resin sealing is performed to form the portions 6a and 6b.
The terminal 2a of the lead frame 2 projects outside the main body of the infrared data communication module 1 to be mounted on a wiring pattern of a mother board (not shown) such as a printed circuit board.

As shown in FIGS. 4 and 5, an inverted conical inclined surface 2b formed by press drawing or the like is formed at a position on the lead frame 2 where the light emitting element 3 is mounted, and is surrounded by the inclined surface 2b. The light emitting element 3 is mounted on the bottom surface.

However, in the infrared data communication module described above, the light emitting element 3 is surrounded by the inverted conical inclined surface 2b integrally formed with the lead frame 2, so that the infrared light emitted from the light emitting element 3 is directed to the upper surface. Although there is an effect of reflection, in the mounting structure using the lead frame 2, the light emitting element 3, the light receiving element 4, the IC chip 5, the capacitor (not shown), etc., which are the components of the infrared data communication module 1, In this case, the mounting space has no effect on the area of the component parts, and there is a limit in reducing the size in a planar manner. In addition, since the lead terminals 2a of the lead frame 2 protrude outside the main body, there are various problems such as a large mounting space on a motherboard such as a printed circuit board, which hinders high-density mounting.

Accordingly, the present applicant has filed Japanese Patent Application No. 9-4958.
No. 8 (filed on Feb. 19, 1997), "Infrared data communication module and manufacturing method thereof", discloses a technique in which a module body is covered with a shield case. The outline will be described with reference to FIG.

FIG. 6 is a sectional view of the infrared data communication module. Reference numeral 7 denotes a circuit board made of glass epoxy resin or the like having a substantially rectangular insulated surface and having an insulating property. Conductive patterns (not shown) formed on the upper and lower surfaces of the circuit board are formed through through holes 8 formed in the circuit board 7. It is electrically connected via the hole electrode 8a. In addition, the circuit board 7
Although a glass epoxy substrate is used, an alumina ceramic substrate, a plastic film substrate such as polyester or polyimide may be used.

Reference numeral 3 denotes a light-emitting element comprising a high-speed infrared LED, and reference numeral 4 denotes a light-receiving element comprising a photodiode. Both are mounted on the upper surface side of the circuit board 7, and are connected to the conductive pattern by die bonding and wire bonding. Reference numeral 5 denotes an IC chip having a circuit section in which a high-speed amplifier, a drive circuit and the like are incorporated, and is die-bonded and wire-bonded to a conductive pattern on the upper surface of the circuit board 7. A capacitor 9 is provided on the lower surface side of the circuit board 7.
Are soldered by the solder 10 and are connected via the through-hole electrodes 8 a of the through-holes 8. When the capacitor 9 and the like are not mounted on the lower surface side of the circuit board 7, the through hole 8 is unnecessary.

Reference numeral 6 denotes an epoxy-based translucent resin containing a visible light cutting agent for sealing the light emitting element 3 and the light receiving element 4 with a resin as described above. The translucent resin 6 forms hemispherical lens portions 6a and 6b on the upper surfaces of the light emitting element 3 and the light receiving element 4 so as to provide the function of irradiating and condensing infrared light and at the same time protect both elements. The capacitor 9 mounted on the lower surface of the circuit board 7 may or may not be sealed with a sealing resin.

[0010] Infrared data communication module 1 shown in FIG.
, The through-holes 1 are provided at positions corresponding to the hemispherical lens portions 6a and 6b formed on the upper surfaces of the light emitting element 3 and the light receiving element 4.
The module body is covered by a shield case 12 made of a member such as stainless steel, aluminum, or copper having 2a. As shown in FIG. 6, the irradiation width of the infrared light on the light emitting element 3 side corresponds to A1, and the light condensing width of the infrared light on the light receiving element 4 side corresponds to B1. Since the shield case 12 surrounds the circuit section and the like, it is possible to take measures against electromagnetic shielding, which is extremely effective in preventing the influence of external noise and the like. Therefore, the surfaces other than those mounted on the hemispherical lens portions 6a and 6b and the motherboard (not shown) are covered by the shield case 12.

[0011]

However, the infrared data communication module described above has the following problems. That is, as an infrared data communication module, Ir
There are two types of DA, one of which is IrD
There are A1.0 standard (medium output) and 1.1 standard (high output). 1.1 When high output power of the LED according to the standard is required, as described above, in particular, a part of the infrared light from the light emitting element side condenses and irradiates useless light that spreads right and left. Can not. Also, unless the light receiving area is widened on the light receiving element side as well, light around the lens outer periphery cannot be efficiently collected. Therefore, when irradiating and condensing light only with the hemispherical lens, it is necessary to rely on LEDs to achieve high output,
There was no choice but to increase the lens diameter considerably, and there was a limit to reducing the size of the product. In addition, when the current flowing through the LED is greatly increased, this causes deterioration of the output of the LED, and at the same time,
It became a fatal problem, such as hindering the reduction in power consumption of the set.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to be located at the outer periphery of a hemispherical lens portion which covers the upper surfaces of a light emitting element and a light receiving element, and the periphery of which is a reflecting surface of a reflecting member. By effectively irradiating and focusing the infrared light from the light emitting element and the infrared light to the light receiving element,
An object of the present invention is to provide an ultra-compact, thin, and inexpensive infrared data communication module which can achieve low power consumption and high output of a light emitting element.

[0013]

In order to achieve the above object, an infrared data communication module according to the present invention comprises a light emitting element, a light receiving element,
An infrared data communication module in which electronic components such as an IC chip and a capacitor are mounted, and the light emitting element and the light receiving element are resin-sealed with a translucent resin so as to cover an upper surface of the light emitting element and the light receiving element. Is located on the outer periphery of a hemispherical lens portion that covers at least one of the upper surfaces, and the periphery of the hemispherical lens portion is surrounded by a reflecting surface of a reflecting member.

Further, the shape of the reflecting surface of the reflecting member is an inverted conical shape.

Further, the shape of the reflecting surface of the reflecting member is a curved shape.

Further, a reflective thin film is formed on a reflective surface of the reflective member.

The reflecting surface of the reflecting member has a through hole at a position corresponding to a hemispherical lens formed on the upper surface of the light emitting element and the light receiving element, and is a part of a shield case that covers the module body. , Formed near the inner edge of the through hole of the shield case.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an infrared data communication module according to the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of the infrared data communication module according to the first embodiment of the present invention. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

In FIG. 1, light emitting elements 3, light receiving elements 4, IC chips 5 and capacitors 9 and other electronic components are mounted on a circuit board 7 having a substantially rectangular flat surface, and the upper surfaces of the light emitting elements 3 and light receiving elements 4 are formed. The configuration of the infrared data communication module 11 in which the resin is sealed with the translucent resin 6 so that the infrared data communication module 11 is covered with the hemispherical lens portions 6a and 6b is the same as the above-described conventional technology, and thus the description is omitted.

As shown in the figure, a shield case made of a member made of stainless steel, aluminum, copper or the like having a through hole 12a at a position corresponding to the hemispherical lens portions 6a and 6b on the upper surface of the light emitting element 3 and the light receiving element 4. 12, a reflection surface 12b having an inverted conical shape near the inner edge of the through-hole portion 12a is formed. For reference, the shape of the through-hole portion 12a of the conventional shield case 12 is indicated by a two-dot chain line.

The light emitting element 3 is provided on the surface of the reflection surface 12b.
Infrared light from (high-speed infrared LED) and light receiving element 4
In order to increase the reflection efficiency of infrared light to (P-Di), a silver reflective thin film 12c, for example, a Ni plating layer is formed.

As shown in FIG. 1, the infrared light from the light emitting element 3 side is not limited to the useless light which conventionally spreads right and left.
Reflection surface 12b and reflection thin film 12c formed on the surface
The light is efficiently reflected, condensed and irradiated upward. In addition, the infrared light to the light receiving element 4 side is the infrared light that could not be condensed outside the lens diameter of the hemispherical lens portion 6b in the past, the reflection surface 12b and the reflection thin film 1 formed on the surface.
Since the light can be condensed efficiently by 2c, the light receiving area is enlarged, and the sensitivity is increased on both the light emitting element side and the light receiving element side.

As shown in FIG. 1, the irradiation width A2 of the infrared light on the light emitting element 3 side and the light condensing width B2 of the infrared light on the light receiving element 4 side are, as described above (FIG. 6), the light emitting element 3 side. Both are wider than the irradiation width A1 of the infrared light and the light collection width B1 of the infrared light on the light receiving element 4 side. That is, for the same size lens diameter, A2> A1, B2> B1, and
The light emitting and receiving areas are enlarged by the reflecting surface 12b.

FIG. 2 is a sectional view of an infrared data communication module according to a second embodiment of the present invention.

In FIG. 2, reference numeral 11 denotes an infrared data communication module, which is located on the upper surface of the light emitting element 3 and the light receiving element 4 at the inner edge of the through hole 12a of the shield case 12 at a position corresponding to the hemispherical lens parts 6a and 6b. A reflective surface 12d having a curved shape is formed near the portion, and a silver reflective thin film 12c, for example, a Ni plating layer is formed on the surface in the same manner as described above. For reference, the shape of the through-hole portion 12a of the conventional shield case 12 is indicated by a two-dot chain line. The operation and effect of the curved reflecting surface 12d are the same as those of the first embodiment, and thus the description is omitted.

In the first and second embodiments described above,
A reflective surface was formed near the inner edge of the through-hole of each hemispherical lens portion using a part of the shield case, but was positioned at the outer peripheral portion of the hemispherical lens portion covering the upper surfaces of the light emitting element and the light receiving element. Needless to say, a reflection member (not shown) other than the shield case may be provided around the periphery to form a reflection surface.

In the first and second embodiments described above, the reflecting surfaces are provided on both the light emitting element side and the light receiving element side, but they may be provided on either one side. For example, providing the light-emitting element on the light-emitting element side is more effective in increasing the irradiation sensitivity of the light-emitting element.

[0028]

As described above, conventionally, in the case of condensing light only by the hemispherical lens portion, in order to realize a high output,
You have to rely on LEDs or increase the lens diameter considerably,
Although miniaturization was difficult, according to the present invention, the periphery of the hemispherical lens portion is surrounded by the reflecting surface of the reflecting member, so that the light emitting element side collects and irradiates useless light that spreads right and left. However, on the light receiving element side, the light receiving area is increased and the sensitivity is increased.

Further, since the reflection surface of the reflection member uses a part of the shield case formed in the vicinity of the inner edge of the through hole of the shield case, providing the reflection surface does not increase the cost.

The reflection efficiency can be improved by forming a reflective thin film on the reflective surface.

As described above, it is possible to provide an infrared data communication module with high power output of LEDs and high sensitivity of light reception and light emission with low power consumption, and is a small, thin, low power consumption consumer device for high speed and long distance communication. Can be realized.

[Brief description of the drawings]

FIG. 1 is a sectional view of an infrared data communication module according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an infrared data communication module according to a second embodiment of the present invention.

FIG. 3 is an external front view of a conventional infrared data communication module.

FIG. 4 is a plan view seen through from the upper surface of FIG. 3;

FIG. 5 is a sectional view of FIG. 3;

FIG. 6 is a sectional view of an infrared data communication module equipped with a conventional shield case.

[Explanation of symbols]

 Reference Signs List 3 light emitting element 4 light receiving element 5 IC chip 6 translucent resin 6a, 6b hemispherical lens unit 7 circuit board 11 infrared data communication module 12 shield case 12a through hole 12b, 12d reflective surface 12c reflective thin film A1, A2 light emitting element side Irradiation width of infrared light B1, B2 Focusing width of infrared light on the light receiving element side

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Shimozawa Shin 1-23-1, Kagureji, Fujiyoshida-shi, Yamanashi Pref. Citizen Electronics Co., Ltd.

Claims (5)

[Claims] An electronic component such as a light emitting element, a light receiving element, an IC chip and a capacitor is mounted on a circuit board surface having a substantially rectangular shape in a plane, and the upper surfaces of the light emitting element and the light receiving element are covered with a hemispherical lens portion. In an infrared data communication module resin-sealed with a translucent resin, the infrared data communication module is located on an outer periphery of a hemispherical lens portion covering an upper surface of at least one of the light emitting element and the light receiving element, and a periphery of the hemispherical lens portion is a reflecting member An infrared data communication module characterized by being surrounded by a reflective surface. 2. The infrared data communication module according to claim 1, wherein the shape of the reflection surface of the reflection member is an inverted conical shape. 3. The infrared data communication module according to claim 1, wherein the shape of the reflection surface of the reflection member is a curved shape. 4. The infrared data communication module according to claim 2, wherein a reflection thin film is formed on a reflection surface of the reflection member. 5. The reflection surface of the reflection member has a through hole at a position corresponding to a hemispherical lens formed on the upper surface of the light emitting element and the light receiving element, and is a part of a shield case that covers a module body. 2. The infrared data communication module according to claim 1, wherein the infrared data communication module is formed near an inner edge of the through hole of the shield case.