CN212302503U

CN212302503U - Optical fingerprint identification chip and electronic equipment

Info

Publication number: CN212302503U
Application number: CN202022015366.XU
Authority: CN
Inventors: 娄椿杰
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-09-15
Filing date: 2020-09-15
Publication date: 2021-01-05
Anticipated expiration: 2030-09-15

Abstract

The application discloses optics fingerprint identification chip and electronic equipment, optics fingerprint identification chip includes: the touch device comprises a light-transmitting cover plate, a substrate and packaging glue, wherein a touch component, a light-emitting component and a fingerprint identification wafer are arranged on the surface, close to the light-transmitting cover plate, of the substrate, and the touch component is used for responding to touch operation of a finger on the light-transmitting cover plate and generating a trigger signal; the light emitting piece is used for corresponding to the trigger signal and emitting light rays to the light-transmitting cover plate; the fingerprint identification wafer is used for corresponding to the trigger signal and receiving light rays reflected by a finger positioned on the light-transmitting cover plate so as to perform fingerprint detection; the packaging adhesive is arranged between the light-transmitting cover plate and the substrate and is connected with the light-transmitting cover plate and the substrate. The optical fingerprint identification chip provided by the application is integrally packaged, so that when the electronic equipment is assembled or repaired, the damage of a fingerprint identification wafer caused by accidental collision can be avoided; the difficulty of the electronic equipment assembling process is reduced.

Description

Optical fingerprint identification chip and electronic equipment

Technical Field

The application relates to the technical field of fingerprint identification, in particular to an optical fingerprint identification chip and electronic equipment.

Background

The ultrathin optical fingerprint is a scheme adopted by many 5G mobile phones on the market at present, and can be ultrathin without occupying small plate space, so that the saved space can be provided for a battery, and the battery capacity is improved.

In the correlation technique, place the fingerprint identification wafer between screen and center, and expose the fingerprint identification wafer the all around need have the cotton sealed of sealed bubble.

However, the assembly process of the fingerprint identification wafer is complicated when the mobile phone is assembled, and the exposed fingerprint identification wafer is easy to damage.

SUMMERY OF THE UTILITY MODEL

Therefore, the present invention provides an optical fingerprint identification chip and an electronic device, which at least partially solve the above-mentioned problems.

The utility model provides an optics fingerprint identification chip, a serial communication port, include:

a light-transmitting cover plate;

the touch component is used for responding to touch operation of a finger positioned on the light-transmitting cover plate and generating a trigger signal; the light emitting piece is used for corresponding to the trigger signal and emitting light rays to the light-transmitting cover plate; the fingerprint identification wafer is used for corresponding to the trigger signal and receiving light rays reflected by a finger positioned on the light-transmitting cover plate so as to perform fingerprint detection;

and the packaging adhesive is arranged between the light-transmitting cover plate and the substrate and is connected with the light-transmitting cover plate and the substrate.

As an achievable alternative, the light emitting element and the fingerprint identification wafer are arranged at a distance of 0.5 mm-5 mm.

As an achievable alternative, at least two of the luminous elements are provided, and the fingerprint identification wafer is positioned between two adjacent luminous elements.

As an implementable option, the packaging adhesive covers the touch component, the light emitting element and the fingerprint identification die.

As an achievable alternative, the transparency of the encapsulation glue is greater than or equal to 90%.

As a realizable option, the touch assembly is arranged along the length direction of the fingerprint recognition die.

As an implementable option, the touch component encloses the fingerprint recognition die.

As a realisable alternative, the touch member partially encloses the fingerprint recognition die.

As an implementable alternative, the touch assembly comprises two touch pieces, and the two touch pieces are respectively arranged at two sides of the fingerprint identification wafer.

As an achievable alternative, the substrate thickness is equal to or greater than 0.1 mm.

As a practical alternative, the thickness of the fingerprint identification wafer is less than or equal to 0.2 mm.

As an achievable alternative, the thickness of the light-transmitting cover plate is equal to or greater than 0.1 mm.

The utility model provides an electronic equipment, include the basis optics fingerprint identification chip.

As an achievable optional mode, the optical fingerprint identification device further comprises a middle frame, and the optical fingerprint identification chip is arranged on the side edge of the middle frame.

As an optional mode for realization, a mounting hole is formed in the side edge of the middle frame, and the optical fingerprint identification chip is embedded into the mounting hole.

As an achievable optional mode, the display device further comprises a flexible circuit board, wherein the flexible circuit board is arranged on the substrate, and the flexible circuit board is electrically connected with the substrate.

As an implementable optional mode, the flexible printed circuit board further comprises a reinforcing plate, and the reinforcing plate is arranged on the flexible printed circuit board.

The optical fingerprint identification chip provided by the application is integrally packaged and has a fingerprint identification triggering function, a self-luminous function and a fingerprint identification function; when the electronic equipment is assembled or repaired, the damage of the fingerprint identification wafer caused by accidental collision can be avoided; the difficulty of the electronic equipment assembling process is reduced, and the electronic equipment assembling process is simplified.

Furthermore, the light-emitting element and the fingerprint identification wafer which are arranged at intervals are beneficial to reducing the thickness of the optical fingerprint identification chip.

Further, the fingerprint identification wafer is located between two adjacent light-emitting components, helps the fingerprint identification wafer to obtain good finger fingerprint information.

Further, the touch assembly is arranged along the length direction of the fingerprint identification wafer, and the sensitivity of the optical fingerprint identification chip is improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a schematic diagram of an optical fingerprint identification chip according to an embodiment of the present application;

FIG. 2 is a sectional view taken along line A-A of FIG. 1;

FIG. 3 is another sectional view taken in the direction A-A of FIG. 1;

FIG. 4 is a sectional view taken along line A-A of FIG. 1;

FIG. 5 is an exploded view of an optical fingerprint identification chip according to an embodiment of the present application;

FIG. 6 is a functional diagram of an optical fingerprint recognition chip according to an embodiment of the present application;

FIG. 7 is a schematic structural diagram illustrating a connection among an optical fingerprint identification chip, a flexible circuit board, and a stiffener of an electronic device according to an embodiment of the present disclosure;

FIG. 8 is a block diagram of an electronic device according to an embodiment of the present application;

fig. 9 is a flowchart of an optical fingerprint recognition chip according to an embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant application and are not limiting of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. It should be noted that, for the convenience of description, only the portions relevant to the application are shown in the drawings.

In the description of the present application, it is to be understood that the terms "radial," axial, "" upper "inner," "outer," and the like refer to an orientation or positional relationship based on that shown in the drawings, which is for convenience in describing the present application and simplifying the description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "disposed" and "connected" are to be understood in a broad sense, e.g. either fixedly or detachably or integrally connected: may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1, an optical fingerprint identification chip is shown, which is suitable for electronic devices, such as mobile phones, tablets, smart wearable devices, and the like.

Referring to fig. 1, the optical fingerprint recognition chip includes: a transparent cover plate 100, a substrate 200 and a packaging adhesive 300.

The substrate 200 is provided with a touch component 23, a light emitting component 22 and a fingerprint identification wafer 21 on the surface close to the light-transmitting cover plate 100, and the touch component 23 is used for responding to the touch operation of a finger on the light-transmitting cover plate 100 to generate a trigger signal; the light emitting member 22 is used for emitting light to the light-transmitting cover plate 100 in response to the trigger signal; the fingerprint identification wafer 21 is used for receiving the light reflected by the finger on the transparent cover plate 100 in response to the trigger signal, so as to perform fingerprint detection.

The encapsulation adhesive 300 is disposed between the transparent cover plate 100 and the substrate 200, and connects the transparent cover plate 100 and the substrate 200.

In the present embodiment, the light-transmissive cover plate 100 may be a glass plate, a tempered glass plate, or the like, and a main material thereof may be silicon dioxide.

In the present embodiment, the substrate 200 includes a first surface and a second surface opposite to each other, and the first surface is close to the light-transmitting cover plate 100. The touch component 23, the luminous component 22 and the fingerprint identification wafer 21 are arranged on the first surface of the substrate. The substrate 200 is a Printed Circuit Board (PCB), the substrate 200 can provide electric energy to the touch assembly 23, the light emitting element 22 and the fingerprint identification die 21, and the substrate 200 can also transmit signals to the touch assembly 23, the light emitting element 22 and the fingerprint identification die 21. Touch component 23 may be a touch sensor, such as a tx (transport)/rx (receive) module made of copper on a substrate. The glowing member 22 can be a low-light LED. Wherein, the control system of the electronic device can be electrically connected with the touch component 23, the light emitting component 22 and the fingerprint identification wafer 21 respectively.

In this embodiment, the package adhesive 300 is an optical adhesive, which has the characteristics of being colorless and transparent, having a light transmittance of 90% or more, having a good adhesive strength, being curable at room temperature or at an intermediate temperature, and having a small curing shrinkage. The encapsulation adhesive 300 may be silicone, acrylic resin, unsaturated polyester, polyurethane, epoxy resin, or the like. The packaging adhesive 300 connects the transparent cover plate 100 and the substrate 200, and packages the transparent cover plate 100, the substrate 200, the touch component 23, the light emitting element 22 and the fingerprint identification die 21 into an integral module.

Referring to fig. 9 and 6, fig. 9 is a schematic diagram of a working flow of the optical fingerprint identification chip, and fig. 6 is a schematic diagram of a working principle of the optical fingerprint identification chip. When the finger touches the transparent cover 100 during fingerprint detection, the touch component 23 responds to the touch operation of the finger to generate a trigger signal and send the trigger signal to the control system. The control system receives the trigger signal, generates a first control signal and a second control signal, sends the first control signal to the light emitting element 22, and sends the second control signal to the fingerprint identification wafer 21. The light emitting member 22 receives the first control signal, and the light emitting member 22 emits light toward the light transmissive cover 100. Fingerprint identification wafer 21 receives the second control signal, and fingerprint identification wafer 21 starts work, and fingerprint identification wafer 21 receives the light through finger reflection, turns into the signal of telecommunication with light signal to generate fingerprint image. The fingerprint recognition die 21 further sends the fingerprint image to the control system. The control system receives the fingerprint image, performs image processing to obtain a fingerprint signal, and identifies the fingerprint signal through an algorithm. When the identification is correct, the unlocking success of the electronic equipment by the fingers is indicated, and when the identification is wrong, the unlocking failure of the electronic equipment by the fingers is indicated.

The optical fingerprint identification chip of the embodiment is integrally packaged and has a fingerprint identification triggering function, a self-luminous function and a fingerprint identification function; when the electronic equipment is assembled or repaired, the integrally packaged optical fingerprint identification chip can avoid the damage of the fingerprint identification wafer 21 caused by accidental collision; in addition, the integrally packaged optical fingerprint identification chip reduces the difficulty of the electronic equipment assembly process, simplifies the electronic equipment assembly process, thereby improving the assembly efficiency of the electronic equipment and further reducing the production cost.

In some preferred embodiments, the light emitting element 22 is spaced 0.5mm to 5mm from the fingerprint recognition die 21.

Referring to fig. 2 and 6, in the present embodiment, the fingerprint recognition die 21 is rectangular, and the fingerprint recognition die 21 is disposed at the middle position of the substrate 200. The lighting element 22 may be arranged at a distance d1 from the short side of the fingerprint recognition die 21, so that the light emitted by the lighting element 22 can be captured by the fingerprint recognition die 21 after being reflected by a finger, wherein d1 is 1 mm. In addition, d1 is selected to be 1mm in combination with the actual production process. In some embodiments, d1 may also be 0.5mm, or d1 may also be 5 mm. The embodiment is beneficial to increasing the incident angle and the reflection angle, so that the incident angle and the reflection angle are obtuse angles, and the thickness of the optical fingerprint identification chip is further reduced.

In some embodiments, the light emitting element 22 may be disposed at a distance d2 from the long side of the fingerprint recognition die 21, so that the light emitted from the light emitting element 22 can be captured by the fingerprint recognition die 21 after being reflected by the finger.

In some preferred embodiments, the optical fingerprint recognition chip is provided with at least two light emitting elements 22, and the fingerprint recognition die 21 is located between two adjacent light emitting elements 22.

Referring to fig. 2 and 6, in the present embodiment, the fingerprint recognition die 21 is rectangular, and the fingerprint recognition die 21 is disposed at the middle position of the substrate 200. The two luminous elements 22 are arranged along the length direction of the fingerprint recognition die 21, one luminous element 22 is arranged at a distance d1 from one short side of the fingerprint recognition die 21, and the other luminous element 22 is arranged at a distance d1 from the other short side of the fingerprint recognition die 21.

This embodiment helps fingerprint identification wafer 21 to obtain good finger fingerprint information, guarantees that the finger is successful to the electronic equipment unblock.

In some preferred embodiments, the touch member 23 is disposed along the length of the fingerprint recognition die 21.

Referring to fig. 2, in the present embodiment, the fingerprint recognition die 21 is rectangular, and the fingerprint recognition die 21 is disposed at the middle position of the substrate 200. The two luminous elements 22 are arranged along the length direction of the fingerprint recognition die 21, one luminous element 22 is arranged at a distance d1 from one short side of the fingerprint recognition die 21, and the other luminous element 22 is arranged at a distance d1 from the other short side of the fingerprint recognition die 21. The touch assembly 23 includes two touch members, which are in the shape of a strip. Two touch pieces extend along the length direction of fingerprint identification wafer 21 and lay between two luminous pieces 22, and set up respectively in fingerprint identification wafer 21's both sides.

The touch component 23 of the embodiment enables the optical fingerprint identification chip to respond to the touch operation of the finger quickly, thereby improving the sensitivity of the optical fingerprint identification chip.

Referring to fig. 3, in some embodiments, the touch assembly 23 is U-shaped, and includes three touch members, which are connected end to end in sequence. The touch member 23 partially surrounds the fingerprint recognition die 21.

Referring to fig. 4, in some embodiments, touch assembly 23 is a kidney-shaped ring that includes four touch members that are connected end-to-end in sequence. The touch member 23 completely surrounds the fingerprint recognition die 21.

In some preferred embodiments, the packaging adhesive 300 covers the touch component 23, the light emitting component 22 and the fingerprint recognition die 21.

Referring to fig. 1 and 5, in the present embodiment, the fingerprint recognition die 21 is rectangular, and the fingerprint recognition die 21 is disposed at the middle position of the substrate 200. The two luminous elements 22 are arranged along the length direction of the fingerprint recognition die 21, one luminous element 22 is arranged at a distance d1 from one short side of the fingerprint recognition die 21, and the other luminous element 22 is arranged at a distance d1 from the other short side of the fingerprint recognition die 21. The touch assembly 23 includes two touch members, which are in the shape of a strip. Two touch pieces extend along the length direction of fingerprint identification wafer 21 and lay between two luminous pieces 22, and set up respectively in fingerprint identification wafer 21's both sides.

The packaging adhesive 300 completely covers the touch component 23, the light emitting component 22 and the fingerprint identification die 21, so that incident light or reflected light can be transmitted in the same medium, and light energy damage caused by light refraction is avoided.

Referring to fig. 8, in some preferred embodiments, the substrate 200 has a thickness of 0.1mm or more.

In this embodiment, the thickness of the substrate 200 is 0.1mm, which is helpful for reducing the thickness of the optical fingerprint identification chip, and the thickness of the optical fingerprint identification chip may be 1 mm. When the optical fingerprint identification chip is installed on the side of the middle frame 600 of the mobile phone, the side of the middle frame 600 is provided with the installation hole 64, and the depth of the installation hole 64 is equal to the thickness of the optical fingerprint identification chip. The middle frames 600 of different types of mobile phones correspond to different depths of the mounting holes 64, and the optical fingerprint identification chip is embedded in the different mounting holes 64 by adjusting the thickness of the substrate 200, so that the optical fingerprint identification chip is suitable for various types of mobile phones.

In some preferred embodiments, the thickness of the fingerprint recognition die 21 is less than or equal to 0.2 mm.

Referring to fig. 8, the thickness of the fingerprint recognition die 21 is 0.1mm, which helps to reduce the thickness of the optical fingerprint recognition chip, which may be 1 mm. When the optical fingerprint identification chip is installed on the side of the middle frame 600 of the mobile phone, the side of the middle frame 600 is provided with the installation hole 64, and the depth of the installation hole 64 is equal to the thickness of the optical fingerprint identification chip. The middle frame 600 of different types of mobile phones corresponds to different depths of the mounting holes 64, and the thickness of the fingerprint identification wafer 21 is adjusted, so that the optical fingerprint identification chip is embedded in different mounting holes 64, and the optical fingerprint identification chip is suitable for various types of mobile phones.

In some preferred embodiments, the thickness of the light-transmissive cover sheet 100 is 0.1mm or greater.

Referring to fig. 8, the light-transmitting cover plate 100 has a thickness of 0.1mm, which helps to reduce the thickness of the optical fingerprint recognition chip, which may be 1 mm. When the optical fingerprint identification chip is installed on the side of the middle frame 600 of the mobile phone, the side of the middle frame 600 is provided with the installation hole 64, and the depth of the installation hole 64 is equal to the thickness of the optical fingerprint identification chip. The middle frames 600 of different types of mobile phones correspond to different depths of the mounting holes 64, and the optical fingerprint identification chip is embedded in the different mounting holes 64 by adjusting the thickness of the light-transmitting cover plate 100, so that the optical fingerprint identification chip is suitable for various types of mobile phones.

In some preferred embodiments, the cross-section of the optical fingerprint identification chip can be circular, oval, rectangular, kidney-shaped, or the like. The shape of the optical fingerprint recognition chip and the shape of the mounting hole 64 match so that the optical fingerprint recognition chip can be embedded in the mounting hole 64. It should be noted that the term "cross section" herein refers to a cross section parallel to the substrate 200 or the transparent cover plate 100.

In some preferred embodiments, the optical fingerprint identification chip is encapsulated with EMC and a molding compound of thermosetting epoxy resin is used. The thermosetting epoxy resin material has excellent light and heat resistance, and ensures longer service life under the same packaging condition and power.

An electronic device comprises a flexible circuit board 400 and the optical fingerprint identification chip.

In the present embodiment, the optical fingerprint recognition chip is disposed on the flexible circuit board (FPC)400, and the optical fingerprint recognition chip is electrically connected to the flexible circuit board 400.

Referring to fig. 7, in particular, the optical fingerprint identification chip includes a light-transmitting cover plate 100, a packaging adhesive 300 and a substrate 200, which are sequentially disposed. The touch component 23, the light emitting component 22 and the fingerprint identification wafer 21 are disposed on the surface of the substrate 200 close to the light-transmitting cover plate 100. The packaging adhesive 300 is disposed between the transparent cover plate 100 and the substrate 200, and connects the transparent cover plate 100 and the substrate 200, so as to realize the packaging of the optical fingerprint identification chip. The flexible circuit board 400 is disposed on the substrate 200, and the flexible circuit board 400 is electrically connected to the substrate 200.

The optical fingerprint identification chip is electrically connected to the control system of the electronic device by the flexible circuit board 400, the flexible circuit board 400 can provide electric energy to the optical fingerprint identification chip, and the flexible circuit board 400 can also transmit signals to the optical fingerprint identification chip and the control system of the electronic device.

In some preferred embodiments, the electronic device further includes a reinforcing plate 500, and the reinforcing plate 500 is disposed on the flexible circuit board 400.

In this embodiment, the optical fingerprint recognition chip, the flexible circuit board 400 and the stiffener 500 are sequentially disposed. The optical fingerprint recognition chip is disposed on the upper surface of the flexible circuit board 400, and the reinforcing plate 500 is disposed on the lower surface of the flexible circuit board 400.

Referring to fig. 7, in particular, the optical fingerprint identification chip includes a light-transmitting cover plate 100, a packaging adhesive 300 and a substrate 200, which are sequentially disposed. The touch component 23, the light emitting component 22 and the fingerprint identification die 21 are arranged on the surface of the substrate 200 close to the light-transmitting cover plate 100, the packaging adhesive 300 is arranged between the light-transmitting cover plate 100 and the substrate 200 and is connected with the light-transmitting cover plate 100 and the substrate 200, and the optical fingerprint identification chip is packaged. The upper surface of the flexible circuit board 400 is disposed on the substrate 200, and the flexible circuit board 400 is electrically connected to the substrate 200. The reinforcing plate 500 is disposed on the lower surface of the flexible circuit board 400.

The reinforcing plate 500 is an ultrathin steel sheet with the thickness of about 0.1mm, and is thin and high in strength. This embodiment has improved the intensity of optics fingerprint identification chip under the prerequisite that guarantees that the whole thickness of electronic equipment is little, helps guaranteeing electronic equipment's yield and life.

In some preferred embodiments, the electronic device further comprises a middle frame 600, the side of the middle frame 600 is provided with a mounting hole 64, and the optical fingerprint identification chip is embedded in the mounting hole 64.

Referring to fig. 8, in the present embodiment, the electronic device is a mobile phone. The middle frame 600 of the mobile phone comprises a first surface and a second surface which are arranged in a back-to-back mode, and the first surface is sequentially provided with a first groove 61, a second groove 62 and a third groove 63. The first recess 61 is used for mounting a main board, the second recess 62 is used for mounting a battery, and the third recess 63 is used for mounting a small board, an acoustic component, and the like. A fourth groove (not shown) is provided on the second surface for mounting a display screen. A mounting hole 64 is formed at a side of the middle frame 600, and the optical fingerprint recognition module is inserted into the mounting hole 64.

In the related art: the optical fingerprint identification module is arranged in the fourth groove and located below the display screen, and compared with the related art, the optical fingerprint identification module is beneficial to reducing the overall thickness of the electronic equipment.

In some embodiments, the optical fingerprinting module may also be arranged on the first surface of the electronic device.

In some embodiments, an optical fingerprint recognition module is disposed at a side of the middle frame 600, and the optical fingerprint recognition module is integrally designed with a power key located at the side of the middle frame 600.

The above embodiments are merely illustrative of the technical solutions of the application and not restrictive, and although the present application is described in detail with reference to the embodiments, those of ordinary skill in the art should understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical fingerprint identification chip, comprising:

a light-transmitting cover plate;

the touch component is used for responding to touch operation of a finger positioned on the light-transmitting cover plate to generate a trigger signal; the light emitting piece is used for responding to the trigger signal so as to emit light rays towards the light-transmitting cover plate; the fingerprint identification wafer is used for receiving light rays reflected by a finger positioned on the light-transmitting cover plate so as to perform fingerprint detection;

and the packaging adhesive is arranged between the light-transmitting cover plate and the substrate and is used for connecting the light-transmitting cover plate and the substrate.

2. The optical fingerprint identification chip of claim 1, wherein the light emitting element is disposed 0.5mm to 5mm apart from the fingerprint identification die.

3. The optical fingerprint identification chip of claim 2, wherein said optical fingerprint identification chip is provided with at least two said light emitting members, and said fingerprint identification die is located between two adjacent said light emitting members.

4. The optical fingerprint identification chip of claim 1, wherein the encapsulant covers the touch component, the light emitting element and the fingerprint identification die.

5. The optical fingerprint identification chip of claim 4, wherein the transparency of the encapsulant is greater than or equal to 90%.

6. The optical fingerprint recognition chip of claim 1, wherein the touch assembly is disposed along a length of the fingerprint recognition die.

7. The optical fingerprint recognition chip of claim 6, wherein the touch assembly surrounds the fingerprint recognition die.

8. The optical fingerprint recognition chip of claim 6, wherein the touch component partially encloses the fingerprint recognition die.

9. The optical fingerprint recognition chip of claim 6, wherein the touch component comprises two touch members, and the two touch members are respectively disposed on two sides of the fingerprint recognition die.

10. The optical fingerprint identification chip according to any one of claims 1 to 9, wherein the substrate thickness is 0.1mm or more.

11. The optical fingerprint identification chip according to any one of claims 1 to 9, wherein the thickness of the fingerprint identification wafer is less than or equal to 0.2 mm.

12. The optical fingerprint identification chip according to any one of claims 1 to 9, wherein the thickness of the light-transmitting cover plate is greater than or equal to 0.1 mm.

13. An electronic device, comprising: the optical fingerprint identification chip according to any one of claims 1 to 12.

14. The electronic device of claim 13, further comprising a middle frame, wherein the optical fingerprint identification chip is disposed on a side of the middle frame.

15. The electronic device of claim 14, wherein a side of the middle frame is provided with a mounting hole, and the optical fingerprint identification chip is embedded in the mounting hole.

16. The electronic device of claim 13, further comprising a flexible circuit board disposed on the substrate, the flexible circuit board being electrically connected to the substrate.

17. The electronic device of claim 16, further comprising a stiffener, wherein the stiffener is attached to the flexible circuit board.