CN209785935U

CN209785935U - Optical sensor and electronic equipment

Info

Publication number: CN209785935U
Application number: CN201920627792.3U
Authority: CN
Inventors: 蔡孟锦
Original assignee: Qingdao Geer Microelectronics Research Institute Co Ltd
Current assignee: Qingdao Geer Microelectronics Research Institute Co Ltd
Priority date: 2019-04-30
Filing date: 2019-04-30
Publication date: 2019-12-13
Anticipated expiration: 2029-04-30

Abstract

The utility model relates to an optical sensor and electronic equipment. The optical sensor comprises a substrate, and a light-emitting chip, a processing chip and a photosensitive chip which are arranged on the substrate, wherein the light-emitting chip and the photosensitive chip are respectively electrically connected with the processing chip; the metal shell is arranged on the substrate and forms a cavity with the substrate in a surrounding manner; the light-emitting chip, the processing chip and the photosensitive chip are positioned in the cavity; the metal shell is provided with a first through hole which enables light emitted by the light emitting chip to pass through, and the metal shell is provided with a second through hole which enables the light sensing chip to receive external light. The utility model discloses a casing can enough provide mechanical protection, also can provide the electromagnetic shield.

Description

Optical sensor and electronic equipment

Technical Field

The utility model belongs to the technical field of the electron, more specifically, the utility model relates to an optical sensor and electronic equipment.

Background

At present, optical sensors are applied more and more widely in consumer electronics, such as mobile phones, smart watches, smart bracelets and the like. By using the optical sensor, proximity light detection, ambient light detection, heart rate detection, blood oxygen detection, gesture recognition and the like can be realized. The basic principle is that the light emitting chip emits light with specific wavelength, and after reaching the object to be detected, the light returns to a beam of light related to the object to be detected and reaches the optical receiving area of the optical sensor chip to complete detection.

In the prior art, an optical sensor generally adopts a plastic package process to carry out plastic package on a light-emitting chip and an optical sensor chip, but the optical device after plastic package has poor optical path efficiency, the light emitted by the light-emitting chip and the light condensed by the optical sensor chip are poor, and the light reflected in the light-emitting chip influences the optical sensor chip and interferes the optical sensor chip. And the existing plastic package mode can not provide electromagnetic shielding protection for internal devices, and is easily interfered by electromagnetic radiation to influence the performance of the optical sensor.

Accordingly, there is a need for an improved optical sensor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a new technical scheme of optical sensor.

According to an aspect of the present invention, there is provided an optical sensor, including a substrate, and a light emitting chip, a processing chip and a light sensing chip disposed on the substrate, wherein the light emitting chip and the light sensing chip are electrically connected to the processing chip respectively;

The metal shell is arranged on the substrate and forms a cavity with the substrate in a surrounding manner; the light-emitting chip, the processing chip and the photosensitive chip are positioned in the cavity; the metal shell is provided with a first through hole which enables light emitted by the light emitting chip to pass through, and the metal shell is provided with a second through hole which enables the light sensing chip to receive external light.

Optionally, a circuit is disposed on the substrate, the circuit includes a ground circuit for grounding, and the metal housing is electrically connected to the ground circuit.

Optionally, the processing chip is electrically connected to the circuit.

Optionally, on a surface of the metal shell away from the substrate, the first through hole is directly opposite to the light emitting chip; or/and the second through hole is opposite to the photosensitive chip.

Optionally, the cavity is divided into two parts, and the light emitting chip and the light sensing chip are respectively located in the two parts of the cavity.

Optionally, the light emitting chip and the photosensitive chip are respectively located on two sides of the processing chip, and colloid is filled between the processing chip and one surface of the metal shell, which is far away from the substrate, to separate the light emitting chip and the photosensitive chip.

Optionally, the light emitting chip or/and the photosensitive chip are electrically connected to the processing chip through metal wires, respectively.

Optionally, the colloid is disposed at a position where the metal wire is connected to the processing chip, the light emitting chip and/or the photosensitive chip.

Optionally, the glue is an opaque protective glue.

According to another aspect of the present invention, the present invention also provides an electronic device, including the above optical sensor.

According to an aspect of the utility model, the utility model discloses a casing can enough provide mechanical protection, also can provide the electromagnetic shield.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic cross-sectional structure of some embodiments of the present invention.

Fig. 2 is a schematic top view of some embodiments of the present invention.

In the figure: the light-emitting chip comprises a substrate 1, a light-emitting chip 2, a processing chip 3, a photosensitive chip 4, a metal shell 5, a first through hole 51, a second through hole 52, a metal wire 6, a colloid 7 and an optical protective coating 8.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to an aspect of the present invention, an optical sensor is provided, in some embodiments, with reference to fig. 1, comprising a substrate 1 and a light emitting chip 2, a processing chip 3 and a light sensing chip 4 disposed on the substrate 1.

The substrate 1 may be a circuit board, a ceramic package, or the like, and a circuit pattern of the optical sensor may be previously provided on the circuit board or the ceramic package. The light emitting chip 2 may be an LED chip, such as a green light, red light, and infrared light LED chip commonly used for heart rate blood oxygen sensors, a light source capable of emitting light, such as a photodiode emitting green light, red light, and infrared light wavelengths. The light sensing chip 4 can receive an external light signal and convert the received light signal into an electrical signal. The light-emitting chip 2 and the photosensitive chip 4 are respectively electrically connected with the processing chip 3, and the processing chip 3 can control the light-emitting chip 2 to be turned on or off; it is also possible to process the electrical signal transmitted from the photosensitive chip 4 and transmit the processed result to the outside.

Referring to fig. 1, the optical sensor further includes a metal case 5. The metal shell 5 is arranged on the substrate 1, and the metal shell 5 and the substrate 1 enclose a cavity. As shown in fig. 1, the metal housing 5 has a top surface and a vertical wall extending downward from the periphery of the top surface, and an opening defined by the vertical wall is fastened and fixed on the substrate 1, so that the metal housing 5 and the substrate 1 define a cavity. The cavity is used for accommodating the light-emitting chip 2, the processing chip 3 and the photosensitive chip 4, namely the light-emitting chip 2, the processing chip 3 and the photosensitive chip 4 are arranged in the cavity, and the metal shell 5 can provide mechanical protection for the light-emitting chip 2, the processing chip 3 and the photosensitive chip 4 and prevent physical damage to the light-emitting chip 2, the processing chip 3 and the photosensitive chip 4 caused by external force; can also provide the electromagnetic shield for emitting chip 2, processing chip 3 and sensitization chip 4, completely cut off external electromagnetic signal, reduce electromagnetic interference, guarantee the utility model discloses a stable performance.

Referring to fig. 1, a first through hole 51 and a second through hole 52 are opened on the top surface of the metal housing 5 away from the substrate 1. First through-hole 51 that the light that sends of emitting chip 2 can pass reachs the external world, and sensitization chip 4 can receive external light through second through-hole 52, and emitting chip 2 sends the light of specific wavelength, and after this light passed first through-hole 51 and reachs the object that awaits measuring, can return a branch of light relevant with the object that awaits measuring, reachs sensitization chip 4's optical reception district, and sensitization chip 4 converts the light of accepting into the signal of telecommunication and gives processing chip 5, and processing chip 5 obtains specific result according to this signal of telecommunication, accomplishes the utility model discloses a normal work.

The optical sensor can realize a plurality of functions such as proximity light detection, ambient light detection, heart rate detection, blood oxygen detection, gesture recognition and the like, and one or more functions can be realized according to different processing chips 5, such as a heart rate sensor and the like; the present invention is not limited thereto.

In some other embodiments, the metal shell may also be a hemispherical shell, an ellipsoidal shell, or other shape, and the shape of the metal shell is not limited by the present invention; similarly, first through-hole and second through-hole can be seted up on the top surface of keeping away from the base plate at metal casing, also can set up on founding the wall, do not influence the utility model discloses the implementation of structure, on the casing of some other shapes, also can set up in some other corresponding particular position departments, the utility model discloses do not limit to this.

The metal shell 5 can be made of one or more of metal simple substances or alloys in the prior art such as iron, steel, copper, aluminum alloy and the like, and the skilled person in the art can select the metal simple substances or alloys according to the requirements of cost and performance, and the utility model discloses do not limit this.

The metal shell 5 may be integrally formed, for example, by press-molding a steel plate. The metal housing 5 may be connected at various positions by laser welding or the like, for example, the bent peripheral standing wall and the top surface are laser welded. The skilled person can select it as desired, without the invention being limited thereto.

The first through hole 51 and the second through hole 52 can be made in a steel plate through blanking, so that the machining precision is higher and the consistency is better. The size of first through-hole 51 and second through-hole 52 is corresponding with the size of the luminous region of emitting chip 2 and the optical reception district of sensitization chip 4 respectively, and is unanimous as far as possible, improves the throughput of light path, guarantees the utility model discloses a sensitivity. Referring to fig. 1, the first through hole 51 can be just right to the light emitting chip 2, and the second through hole 52 can be just right to the light sensing chip 4, so as to improve the light path efficiency and ensure the performance of the present invention.

Optionally, set up optical protection coating 8 respectively on the light-emitting region of emitting chip 2 and the optical reception area of sensitization chip 4 to guarantee the durability of light-emitting region and optical reception area, with prevent that light-emitting region and optical reception area can reduce the trafficability characteristic of light with the corrosion scheduling problem that outside contact leads to, the utility model discloses can prevent through optical protection coating 8 that the trafficability characteristic of light reduces, guarantee the reliability of product. The optical protective coating may be a coating material commonly used in the art, but the present invention is not limited thereto.

In some embodiments, referring to fig. 1, a cavity enclosed by the metal shell 5 and the substrate 1 is divided into two parts, and the light emitting chip 2 and the light sensing chip 4 are respectively located in the two parts of the cavity and are not interfered with each other, so that light emitted by the light emitting chip 2 is prevented from being directly received by the light sensing chip 4, light pollution is prevented, and performance accuracy is reduced. The synthetic cavity of metal casing 5 and base plate 1 enclosure can use colloid 7 to separate, does not set up the packing in the corresponding region of luminous chip 2 and sensitization chip 4, guarantees the utility model discloses a light path efficiency. Compared with the mode of fixing, protecting and separating the light-emitting chip 2 and the photosensitive chip 4 in a plastic package mode, the plastic package can lead to poor light path efficiency, the light-emitting chip and the photosensitive chip are poor in light condensation, and the performance of the optical sensor is affected.

In some embodiments, referring to fig. 1 and 2, the light emitting chip 2 and the photosensitive chip 4 are respectively located at two sides of the processing chip 3, the colloid 7 is filled between the processing chip 3 and one surface of the metal shell far away from the substrate 1, the colloid 7 and the processing chip 3 are used for separating the cavity, the light emitting chip 2 and the photosensitive chip 4 are separated, the usage amount of the colloid 7 can be reduced by arrangement of the structure, and the internal structure space of the cavity is fully utilized.

In some embodiments, the substrate 1 may be provided with a circuit, the circuit includes a grounding circuit for grounding, and the metal housing 5 is electrically connected to the grounding circuit, so that the metal housing 5 can be grounded, and a good electromagnetic shielding effect is provided.

In some embodiments, the processing chip 3 is electrically connected to circuitry on the substrate 1, such that the processing chip 3 can receive and externally generate electrical signals, enabling the reception and issuance of instructions.

In some embodiments, referring to fig. 1, the light emitting chip and the light sensing chip 4 are electrically connected to the processing chip 3 through metal wires 6, i.e., wire bonding. In some other embodiments, the light emitting chip and the light sensing chip 4 may also be electrically connected to the processing chip 3 by a circuit on the substrate 1, as long as the electrical connection therebetween can be realized, which is not limited by the present invention. The metal wire can be a common electric connection wire such as a gold wire and a copper wire.

In some embodiments, gel 7 may be a COB glue or a black glue, which one skilled in the art may select as desired.

In some embodiments, referring to fig. 1, the electrical connection position of the metal wire 6 with the light emitting chip 2, the processing chip 3 or/and the light sensing chip 4 is provided with a colloid 7 for ensuring the stability of the connection relationship, providing a buffer for the weak point, and improving the reliability of the present invention. The colloid 7 may extend onto the substrate 1 to enhance the connection stability between the light emitting chip 2, the processing chip and the photosensitive chip 4 and the substrate 1.

In some embodiments, the glue 7 is an opaque protective glue to prevent light emitted from the light emitting chip 2 in the cavity from being directly transmitted to the position of the photosensitive chip 4 to interfere with the photosensitive chip 4.

According to another aspect of the present application, there is also provided an electronic device including the optical sensor described above.

In some embodiments, the electronic device may be a laptop, a mobile phone, a smart band, a tablet, or the like.

Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for purposes of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. An optical sensor is characterized by comprising a substrate, a light-emitting chip, a processing chip and a photosensitive chip, wherein the light-emitting chip, the processing chip and the photosensitive chip are arranged on the substrate, and the light-emitting chip and the photosensitive chip are respectively and electrically connected with the processing chip;

2. the optical sensor of claim 1, wherein the substrate has circuitry disposed thereon, the circuitry including a ground circuit for grounding, the metal housing being electrically connected to the ground circuit.

3. The optical sensor of claim 2, wherein the processing chip is electrically connected to the circuit.

4. The optical sensor of claim 1, wherein the first through hole is opposite to the light emitting chip on a surface of the metal shell away from the substrate; or/and the second through hole is opposite to the photosensitive chip.

5. The optical sensor of claim 1, wherein the cavity is divided into two portions, and the light emitting chip and the light sensing chip are respectively located in the two portions of the cavity.

6. The optical sensor according to claim 5, wherein the light emitting chip and the light sensing chip are respectively located at two sides of the processing chip, and a colloid is filled between the processing chip and a surface of the metal shell away from the substrate to separate the light emitting chip and the light sensing chip.

7. The optical sensor of claim 6, wherein the light emitting chip or/and the light sensing chip are electrically connected to the processing chip through metal wires.

8. The optical sensor according to claim 7, wherein the colloid is disposed at a position where the metal wire is electrically connected to the light emitting chip, the processing chip, or/and the light sensing chip.

9. An optical sensor as claimed in any one of claims 6 to 8, wherein the gel is an opaque protective gel.

10. An electronic device comprising an optical sensor according to any one of claims 1 to 9.