CN217158187U

CN217158187U - Optical sensing packaging structure

Info

Publication number: CN217158187U
Application number: CN202220402919.3U
Authority: CN
Inventors: 苏炤亘; 翁念义; 邱政康; 林紘洋; 李昇哲; 万喜红
Original assignee: Fujian Lightning Optoelectronic Co ltd
Current assignee: Fujian Lightning Optoelectronic Co ltd
Priority date: 2022-02-25
Filing date: 2022-02-25
Publication date: 2022-08-09
Anticipated expiration: 2032-02-25

Abstract

The utility model relates to a light sensing technology field provides a light sensing packaging structure, which comprises a base plate, luminous chip, receive the light chip, printing opacity overlay structure, first barricade and second barricade, luminous chip sets up in the upper surface of base plate with receiving the light chip, printing opacity overlay structure sets up on the base plate and cladding luminous chip and receive the light chip, printing opacity overlay structure's opening is located luminous chip and receives between the light chip and expose the partial upper surface of base plate, first barricade sets up in the upper surface of base plate and is located the opening, the second barricade sets up on first barricade, the thickness of first barricade is greater than the thickness of second barricade, the upper surface width of first barricade is greater than the lower surface width of second barricade. Forming a double retaining wall by secondary dispensing, controlling the volume and diffusion area of the second retaining wall, and preventing the second retaining wall from covering the light-transmitting covering structure; and the thickness of the first retaining wall and the second retaining wall can be thicker than that of the existing retaining wall, so that the proportion of lateral light leakage is reduced.

Description

Optical sensing packaging structure

Technical Field

The utility model relates to a light sensing technical field, in particular to light sensing packaging structure.

Background

The optical sensor is a sensing device, mainly comprises photosensitive elements, is mainly divided into an ambient light sensor, an infrared light sensor, a sunlight sensor and an ultraviolet light sensor, is mainly applied to the fields of vehicle body electronic application change, intelligent lighting systems and the like, has the advantages of high precision, convenience for microcomputer connection to realize automatic real-time processing and the like, and is widely applied to the measurement of electrical quantity and non-electrical quantity.

The working principle of the optical sensor is mainly based on the photoelectric effect, and the optical sensor at least comprises a light emitting component and a light receiving component, wherein the light emitting component can emit light outwards, and if the emitted light strikes a detected object and is reflected, the light receiving component can receive the reflected light and enable the optical sensor to output a sensing signal.

As shown in fig. 1 and 2, in the conventional optical sensor 10, an infrared LED chip 14 is disposed on a PCB 12 as a light emitting chip, and a transparent plastic package 16 covers the light emitting chip. In addition, a photosensitive IC chip 18 is further integrated on the same plane of the PCB 12 as a light receiving chip, and a transparent plastic package body 20 is covered above the light receiving chip, so as to avoid false triggering of the photosensitive IC chip 18 caused by lateral light leakage, a retaining wall 22(Barrier) is formed between the two transparent

plastic package bodies

16 and 20 by opaque epoxy resin (usually black) for optical isolation. The retaining wall 22 is formed by one-time dispensing and then cured by baking. In order to ensure the light blocking effect of the retaining wall 22, the dispensing height needs to exceed the surface of the transparent

plastic package

16, 20 in the manufacturing process, and one-time dispensing is easy to form an overflow (as the area encircled by the dotted line in the figure) on the surface of the transparent

plastic package

16, 20, thereby shielding the LED chip 14 or the photosensitive IC chip 18, and the product cannot perform effective photoelectric conversion.

Therefore, an object of the present invention is to provide a light sensing package structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a pair of light sensing packaging structure, including base plate, luminous chip, receipts light chip, printing opacity coverage structure, first barricade and second barricade.

The upper surface of the substrate is provided with a light emitting area and a light receiving area. The light emitting chip is arranged on the upper surface of the substrate and is positioned at the light emitting area. The light receiving chip is arranged on the upper surface of the substrate and is positioned in the light receiving area. The light-transmitting covering structure is arranged on the substrate and covers the light-emitting chip and the light-receiving chip, and the light-transmitting covering structure is provided with an opening which is positioned between the light-emitting chip and the light-receiving chip and used for exposing the upper surface of the part of the substrate. The first retaining wall is arranged on the upper surface of the substrate and is positioned in the opening. The second retaining wall is arranged on the first retaining wall. The thickness of the first retaining wall is greater than that of the second retaining wall, and the first horizontal width of the upper surface of the first retaining wall is greater than the second horizontal width of the lower surface of the second retaining wall.

In one embodiment, the first retaining wall and the second retaining wall are made of opaque materials.

In one embodiment, the opaque material is a liquid material that can be cured by baking, such as black epoxy resin or silica gel with black dye added.

In one embodiment, the first retaining wall and the second retaining wall are made of the same material.

In one embodiment, the thickness of the first retaining wall is 2/3-3/4 of the thickness of the light-transmitting covering structure.

In one embodiment, the second horizontal width is 5/6-11/12 of the first horizontal width.

In one embodiment, the thickness of the second retaining wall is 1/3-1/2 of the thickness of the first retaining wall.

In one embodiment, a distance from a sidewall of the second retaining wall to the upper surface of the light-transmitting covering structure is greater than or equal to 0.1 mm.

In one embodiment, the first retaining wall is formed on the substrate before the second retaining wall.

In an embodiment, the light-transmissive cover structure is made of one of epoxy resin and silicone.

Based on the above, the light sensing package structure provided by the present invention can control the volume and diffusion area of the second retaining wall by the dual retaining wall arrangement of the first retaining wall and the second retaining wall, so as to prevent the second retaining wall from covering the light-transmitting covering structure; and, the utility model discloses a first barricade adds the whole thickness of second barricade can be thicker than the fashioned barricade of current one time point gluing, and then reduces the proportion of side direction light leak.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts; in the following description, the drawings are illustrated in a schematic view, and the drawings are not intended to limit the present invention.

FIG. 1 is a schematic cross-sectional view of a conventional optical sensor;

FIG. 2 is a schematic top view of a conventional optical sensor;

fig. 3 is a schematic cross-sectional view of the optical sensor package structure of the present invention;

fig. 4 is a schematic top view of the light sensing package structure of the present invention.

Reference numerals:

50-a light sensing package structure; 52-a substrate; 521-the upper surface of the substrate; 522-light emitting region; 523-light receiving area; 54-a light emitting chip; 56-light receiving chip; 58-light transmissive cover structures; 582-opening; 61-a first retaining wall; 62-a second retaining wall; h1-thickness of first retaining wall; h2-thickness of second retaining wall; h3 — thickness of light transmissive cover structure; w1 — first horizontal width; w2 — second horizontal width; l1-distance.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention; the technical features designed in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or component being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, the term "comprises" and any variations thereof mean "including at least".

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may include, for example, a fixed connection, a detachable connection, or an integrally formed connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Referring to fig. 3 and fig. 4, fig. 3 is a schematic cross-sectional structure diagram of the optical sensing package structure 50 of the present invention, and fig. 4 is a schematic top view structure diagram of the optical sensing package structure 50 of the present invention. To achieve at least one of the advantages described above or other advantages, an embodiment of the present invention provides a light sensing package structure 50. As shown in the figure, the photo-sensing package structure 50 includes a substrate 52, a light emitting chip 54, a light receiving chip 56, a light-transmitting covering structure 58, a first retaining wall 61, and a second retaining wall 62.

The upper surface 521 of the substrate 52 is provided with a light emitting region 522 and a light receiving region 523. The substrate 52 may be a PCB board. The light emitting chip 54 is disposed on the upper surface 521 of the substrate 52 and located at the light emitting region 522. The light receiving chip 56 is disposed on the upper surface 521 of the substrate 52 and located at the light receiving area 523. The light-transmitting cover structure 58 is disposed on the substrate 52 and covers the light-emitting chip 54 and the light-receiving chip 56, the light-transmitting cover structure 58 has an opening 582, and the opening 582 is located between the light-emitting chip 54 and the light-receiving chip 56 and is used for exposing a part of the upper surface of the substrate 52. The light-transmissive cover structure 58 may be made of one of epoxy resin and silicone. The first retaining wall 61 is disposed on the upper surface 521 of the substrate 52 and located in the opening 582. The second retaining wall 62 is disposed on the first retaining wall 61. The first retaining wall 61 and the second retaining wall 62 are used for blocking light from passing through, so as to ensure that the optical sensing package structure 50 can perform effective photoelectric conversion.

Further, the thickness H1 of the first retaining wall 61 is greater than the thickness H2 of the second retaining wall 62, and the first horizontal width W1 of the upper surface of the first retaining wall 61 is greater than the second horizontal width W2 of the lower surface of the second retaining wall 62, so as to prevent the second retaining wall 62 from covering the transparent cover structure 58, thereby ensuring that the photo-sensing package structure 50 can perform effective photoelectric conversion and improving the reliability of the product.

Specifically, the present embodiment modifies the conventional one-time dispensing method to form the first retaining wall 61 and the second retaining wall 62 by two-time dispensing, wherein the one-time dispensing is performed at the opening 582, the dispensing is performed to the positions 2/3-3/4 of the thickness H3 of the light-transmissive covering structure 58, and baking is performed to ensure that the surface is hardened, thereby forming the first retaining wall 61. Then, the second dispensing operation of the black epoxy resin of the same material is performed to form the second dam 62, and since the thickness of the second dispensing operation can be relatively low, the volume and the diffusion area of the second dispensing operation can be controlled to prevent the glue from overflowing onto the transparent cover structure 58, thereby ensuring that the photo-sensor package structure 50 can perform effective photoelectric conversion. Moreover, the thickness of the first blocking wall plus the thickness H2 of the second blocking wall 62 can be thicker than the thickness of the whole blocking wall formed by one-time dispensing, so as to reduce the proportion of side light leakage and improve the performance of the optical sensing package structure 50.

In one embodiment, the first retaining wall 61 and the second retaining wall 62 are made of opaque material. The opaque material can be black epoxy resin, or liquid material which can be cured by baking such as silica gel added with black dye. Preferably, the first retaining wall 61 and the second retaining wall 62 are made of the same material.

In one embodiment, the thickness H1 of the first retaining wall 61 is between 2/3 and 3/4 of the thickness H3 of the transparent cover structure 58, so as to further reduce the proportion of side light leakage and improve the performance of the photo-sensing package structure 50.

In one embodiment, the second horizontal width W2 is between 5/6 and 11/12 of the first horizontal width W1, so as to prevent the second horizontal width W2 from covering the transparent cover structure 58 and affecting the photoelectric conversion performance of the photo-sensing package structure 50.

In an embodiment, the thickness H2 of the second wall 62 is between 1/3 and 1/2 of the thickness H1 of the first wall 61, so as to further reduce the proportion of side light leakage and improve the performance of the photo-sensing package structure 50.

In one embodiment, the distance L1 between the sidewall of the second retaining wall 62 and the upper surface of the transparent cover structure 58 is greater than or equal to 0.1mm, so as to prevent the sidewall from covering the transparent cover structure 58 and affecting the photoelectric conversion performance of the photo-sensing package structure 50.

In one embodiment, the first walls 61 are formed on the substrate 52 before the second walls 62, so as to control the volume and diffusion area of the second walls 62.

To sum up, the light sensing package structure 50 provided by the present invention can control the volume and the diffusion area of the second retaining wall 62 by the dual retaining wall arrangement of the first retaining wall 61 and the second retaining wall 62, so as to prevent the second retaining wall 62 from covering the light-transmitting covering structure 58; and, the utility model discloses a first shelves wall adds second and keeps off 62 whole thickness can be thicker than the fashioned barricade of current one shot point glue, and then reduces the proportion of side direction light leak.

In addition, the value range of the "to" includes the two end points, and all belong to the protection scope of the present invention. It will be appreciated by those skilled in the art that, although there may be many problems with the prior art, each embodiment or solution of the present invention may be improved in one or more respects, without necessarily simultaneously solving all the technical problems listed in the prior art or in the background. It will be understood by those skilled in the art that nothing in a claim should be taken as a limitation on that claim.

Although terms are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A light sensing package, comprising:

the light-emitting device comprises a substrate, wherein the upper surface of the substrate is provided with a light-emitting area and a light-receiving area;

the light-emitting chip is arranged on the upper surface of the substrate and is positioned at the light-emitting area;

the light receiving chip is arranged on the upper surface of the substrate and is positioned at the light receiving area;

the light-transmitting covering structure is arranged on the substrate and covers the light-emitting chip and the light-receiving chip, and is provided with an opening which is positioned between the light-emitting chip and the light-receiving chip and used for exposing part of the upper surface of the substrate;

the first retaining wall is arranged on the upper surface of the substrate and is positioned in the opening;

the second retaining wall is arranged on the first retaining wall;

the thickness of the first retaining wall is greater than that of the second retaining wall, and the first horizontal width of the upper surface of the first retaining wall is greater than the second horizontal width of the lower surface of the second retaining wall.

2. The light sensing package structure of claim 1, wherein: the first retaining wall and the second retaining wall are made of light-tight materials.

3. The light sensing package structure of claim 2, wherein: the opaque material can be black epoxy resin or silica gel added with black dye.

4. The light sensing package structure of any one of claims 1-3, wherein: the first retaining wall and the second retaining wall are made of the same material.

5. The light sensing package structure of claim 1, wherein: the thickness of the first retaining wall is 2/3-3/4 of the thickness of the light-transmitting covering structure.

6. The light sensing package structure of claim 1, wherein: the second horizontal width is 5/6-11/12 of the first horizontal width.

7. The light sensing package structure of claim 1, wherein: the thickness of the second retaining wall is 1/3-1/2 of the thickness of the first retaining wall.

8. The light sensing package structure of claim 1, wherein: and the distance from the side wall of the second retaining wall to the upper surface of the light-transmitting covering structure is more than or equal to 0.1 mm.

9. The light sensing package structure of claim 1, wherein: the first retaining wall is formed on the substrate before the second retaining wall.

10. The light sensing package structure of claim 1, wherein: the light-transmitting covering structure is made of one of epoxy resin or silica gel.