CN217182185U - Photoelectric module and optical sensor - Google Patents

Abstract

The utility model discloses a photoelectric module and optical sensor. The photoelectric module comprises a substrate, a shell, a light emitting component, a light receiving component and a light shielding layer. The shell is arranged on the substrate and comprises a body and a retaining wall. The body is provided with a first light hole and a second light hole. The light emitting component is arranged on the substrate and corresponds to the first light hole. The light receiving component is arranged on the substrate and corresponds to the second light-transmitting hole, and the light receiving component is separated from the light emitting component through a retaining wall. The light shielding layer covers at least part of the light receiving component to expose a receiving area of the light receiving component. Accordingly, the optoelectronic module and the optical sensor can be more compact, thereby further reducing the length of the signal path and stray light noise.

Description

Photoelectric module and optical sensor

Technical Field

The utility model relates to a module especially relates to a photovoltaic module and optical sensor.

Background

The existing photoelectric module cannot keep up with the development steps of intelligent equipment, and is particularly applied to the technology of 3D photography (such as a TOF depth camera). For example, when the conventional optoelectronic module is applied to identification and detection, the conventional optoelectronic module needs to be matched with various hardware components such as a scanner and an information processing device, but the conventional optoelectronic module has the disadvantages of low integration level, single function and the like, so that the overall design is not compact. That is to say, the light and thin degree of the existing optoelectronic module cannot meet the requirements of smart devices, especially smart phones, robots, medical biological devices, etc.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed a novel and effective method for improving the above-mentioned drawbacks.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a not enough to prior art provides a photovoltaic module and optical sensor.

In order to solve the technical problem, the utility model discloses one of them technical scheme who adopts is, provides a photovoltaic module, photovoltaic module includes: a substrate; the shell is arranged on the substrate and comprises a body and a retaining wall, and the body is provided with a first light hole and a second light hole; the light emitting component is arranged on the substrate and is configured corresponding to the first light hole; a light receiving assembly disposed on the substrate and corresponding to the second light hole, and separated from the light emitting assembly by the retaining wall; and a light shielding layer covering at least a part of the light receiving component to expose a receiving area of the light receiving component.

Optionally, an inner surface of the body extends toward the substrate to form the retaining wall, the retaining wall is located between the light emitting element and the light receiving element, and the body and the retaining wall jointly define a first chamber and a second chamber; the light emitting assembly is located in the first cavity and emits a detection light to an external object through the first light transmitting hole, and the light receiving assembly is partially located in the second cavity and can receive a reflection light reflected by the external object through the second light transmitting hole.

Optionally, the optoelectronic module further includes a light-transmissive encapsulation layer, and the encapsulation layer is respectively located in the portion of the first cavity and the portion of the second cavity.

Optionally, the light shielding layer is filled in the second cavity, and the light shielding layer has a channel on a light path where the light receiving element receives the reflected light.

Optionally, the cross-section of the channel tapers from the second light-transmitting hole towards the light-receiving component.

Optionally, the inner surface of the channel is roughened.

Optionally, the second chamber includes an upper portion and a lower portion communicating with the upper portion, a cross-section of the upper portion is tapered from the second light-transmitting hole toward the light-receiving element, and the lower portion accommodates the light-receiving element and the light-shielding layer.

Optionally, an inner surface of the upper portion of the second chamber is a rough surface.

Optionally, the optoelectronic module further includes a lens assembly disposed in the second chamber, the lens assembly has a base and a protruding portion connected to the base, the base is located in the lower portion, the protruding portion is located in the upper portion, and an optical center of the lens assembly is located on an optical path of the light receiving assembly receiving the reflected light.

Optionally, the housing has a plurality of protruding columns in the lower portion of the second chamber, the base of the lens assembly has a plurality of engaging holes, and the plurality of engaging holes of the lens assembly are used for the plurality of protruding columns of the housing to respectively penetrate through.

Optionally, a plurality of flow guide grooves are formed on an upper surface of the lower portion of the housing, and an area of the plurality of flow guide grooves, which is orthographically projected onto the base, does not overlap an area of the protrusion, which is orthographically projected onto the base.

Optionally, the housing includes a first setting groove, the first setting groove corresponds to the first light hole and communicates with the first cavity, and the first setting groove is configured to accommodate a first optical element.

Optionally, the housing includes a first air-escaping groove, the first air-escaping groove is located between the first optical element and the first setting groove, and the first air-escaping groove communicates the first chamber and the outside of the housing through the first setting groove.

Optionally, the housing includes a second setting groove, the second setting groove corresponds to the second light hole and communicates with the second cavity, and the second setting groove is configured to accommodate a second optical element.

Optionally, the housing includes a second air-escape groove, the second air-escape groove is located between the second optical element and the second installation groove, and the second air-escape groove communicates the second chamber and the outside of the housing through the second installation groove.

Optionally, the housing further includes a plurality of loading platforms in the first and second setting grooves, and a top surface of each of the plurality of loading platforms is higher than a bottom surface of each of the first and second setting grooves, so that the side surfaces of the plurality of loading platforms and the bottom surfaces of the first and second setting grooves jointly form a glue guiding space.

Optionally, the first air escape groove and the second air escape groove are L-shaped, and the depth of the first air escape groove and the depth of the second air escape groove are between 0.35 and 0.45 mm.

Optionally, the light shielding layer covers a non-functional region of the light receiving element in the second chamber, and the light shielding layer has a channel on a light path of the light receiving element receiving the reflected light.

Optionally, an upper surface of the light shielding layer is higher than an upper surface of the light receiving element.

Optionally, a plurality of ribs are formed on one end face of the retaining wall; the photovoltaic module further comprises a light shielding glue, the light shielding glue is arranged between the substrate and the shell, the light shielding glue is partially filled between the convex ribs, and the light shielding glue is partially extended and configured along the surfaces of the convex ribs.

Optionally, the retaining wall has a recessed structure, and the recessed structure is correspondingly disposed across the light receiving assembly along the longitudinal direction.

Optionally, the light receiving module includes a sensor chip and a detection sensor disposed on the sensor chip, the sensor chip is disposed under the retaining wall, and the sensor chip has a groove, the position of the groove corresponds to the retaining wall and provides the light shielding glue.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an optical sensor, including: a substrate; a shell arranged on the substrate; a light receiving assembly disposed on the substrate and located in the housing; and the shading layer is arranged in the shell and covers at least part of the light receiving component so as to expose a receiving area of the light receiving component.

To sum up, the embodiment of the utility model provides a disclosed photovoltaic module and optical sensor can cover at least part light receiving component through "the light shield layer to expose the receiving area's of light receiving component's design, let photovoltaic module and optical sensor can be more compact, thereby further reduce signal path's length and stray light noise.

For a further understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are only intended to illustrate the present practical application, and not to limit the scope of the present invention.

Drawings

Fig. 1 is a schematic perspective view of a photovoltaic module according to a first embodiment of the present invention.

Fig. 2 is an exploded view of a photovoltaic module according to a first embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of fig. 1 taken along the line III-III.

Fig. 4 is a schematic perspective view of a housing according to a first embodiment of the present invention.

Fig. 5 is another perspective view of the housing according to the first embodiment of the present invention.

Fig. 6 is a schematic top view of the housing according to the first embodiment of the present invention.

Fig. 7 is a schematic bottom view of the housing according to the first embodiment of the present invention.

Fig. 8 is a cross-sectional view of fig. 1 taken along line VIII-VIII.

Fig. 9 is a partially enlarged view of region IX of fig. 3.

Fig. 10 is an exploded view of a photovoltaic module according to a second embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view of a photovoltaic module according to a second embodiment of the present invention.

Fig. 12 is an exploded view of a photovoltaic module according to a third embodiment of the present invention.

Fig. 13 is a schematic cross-sectional view of a photovoltaic module according to a third embodiment of the present invention.

Detailed Description

The embodiments disclosed in the present invention are described below with reference to specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure in the present specification. The present invention can be implemented or applied by other different embodiments, and various details in the present specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be. Furthermore, the term "electrically coupled", as used herein, refers to one of "indirectly electrically connected" and "directly electrically connected".

First embodiment

Referring to fig. 1 to 9, the present embodiment provides a photovoltaic module 100A. As shown in fig. 1 to 3, in the present embodiment, the optoelectronic module 100A includes a substrate 1, a light emitting device 2 disposed on the substrate 1, a light receiving device 3, and a housing 4.

In the embodiment, the substrate 1 is, for example, a ceramic substrate 1 as shown in fig. 1 to 3, but the invention is not limited thereto. The substrate 1 has a first plate 11 and a second plate 12 located on opposite sides, and the substrate 1 defines a height direction D perpendicular to the first plate 11. A plurality of conductive posts 13 are embedded in the substrate 1, and one end of each conductive post 13 is exposed on the first board surface 11 of the substrate 1, and the other end of each conductive post 13 is exposed on the second board surface 12 of the substrate 1. In practice, a circuit 14 can be disposed on each of the first board 11 and the second board 12 of the substrate 1, and two ends of the conductive pillar 13 are electrically coupled to the circuits 14 disposed on the first board 11 and the second board 12.

As shown in fig. 3, in the present embodiment, the light emitting device 2 is disposed on one side of the first board 11, and the light emitting device 2 can be electrically coupled to the circuit 14 of the substrate 1. The light emitting device 2 may be a laser device in this embodiment, which can emit a probe light L1 to an external object.

In addition, the light receiving element 3 is disposed on the other side of the first board surface 11, and the light receiving element 3 can be electrically coupled to the circuit 14 of the substrate 1. The light receiving element 3 in the present invention can be a Photo sensor (PD) or a SPAD (Single-Photo Avalanche Diode) sensor chip, which can receive a reflected light L2 that is reflected by an external object from the detection light L1.

Referring to fig. 3, the light receiving element 3 of the present embodiment is exemplified by an SPDA sensor chip, and the SPDA sensor chip 31 is made of a semiconductor material (such as silicon). The SPDA sensor chip 31 includes one or more electrical components (e.g., an integrated circuit). The integrated circuit may be an analog or digital circuit. Specifically, the SPDA sensor chip 31 includes electrical components forming an Application Specific Integrated Circuit (ASIC). Thus, as is well known in the art, the SPDA sensor chip 31 includes circuitry for sending, receiving and analyzing electrical signals. Referring to fig. 2, in the present embodiment, the SPDA sensor chip 31 includes a detection sensor 32 (e.g., a plurality of Single Photon Avalanche Diodes (SPADs) arranged in a row and column), which may be formed in a top surface of the SPDA sensor chip 31 or otherwise coupled to the top surface of the SPDA sensor chip 31. In other embodiments, the SPDA sensor chip 31 further includes a reference sensor (not shown) disposed near the light emitting element 2 in addition to the detection sensor 32. The SPDA sensor chip 31 is located on the substrate 1, and the edge of the SPDA sensor chip 31 is not flush with the edge of the substrate 1. In other embodiments, the SPDA sensor chip 31 has a groove 311 on the surface of the nonfunctional area between the detection sensor 32 and the light emitting device 2.

As shown in fig. 3 to 5, the housing 4 is disposed on the substrate 1 and covers the light emitting device 2 and the light receiving device 3. In detail, the housing 4 includes a main body 41 and a retaining wall 42. The body 41 is provided with a first light hole 5 and a second light hole 6. The wall 42 may be formed by extending from an inner surface of the body 41 facing the substrate 1 toward the substrate 1 and located between the detecting sensors 32 of the light emitting device 2 and the light receiving device 3, so that the wall 42 can divide (or define) the first chamber S1 and the second chamber S2.

In a practical application, the housing 4 may be made of an opaque insulating material, and the first light-transmitting hole 5 of the housing 4 is communicated with the first chamber S1, and the second light-transmitting hole 6 is communicated with the second chamber S2. The light emitting module 2 is located in the first cavity S1 (in addition, a portion of the SPDA sensor chip 31 is also located in the first cavity S1), the detection sensor 32 is located in the second cavity S2, and a position of the light emitting module 2 corresponds to the first light hole 5, and a position of the detection sensor 32 corresponds to the second light hole 6. Accordingly, it is possible to prevent crosstalk (crosstalk) caused by the detection light L1 of the light emitting element 2 being received by the detection sensor 32.

In the present embodiment, as shown in fig. 2, fig. 3 and fig. 8, the housing 4 is fixed on the substrate 1 by a light-shielding adhesive G of the optoelectronic module 100A. Specifically, the light-shielding glue G can be black and has light-absorbing/light-shielding characteristics, and is disposed along an end surface of the main body 41 and the retaining wall 42 facing the substrate 1. In other words, a part of the light shielding paste G may be disposed along the periphery of the first plate surface 11 of the substrate 1, so that the housing 4 can be fixed on the substrate 1. Accordingly, the light-shielding adhesive G can prevent any light from entering the first chamber S1 and the second chamber S2 from the connection between the housing 4 and the substrate 1. In addition, the light from the first chamber S1 cannot reach the second chamber S2 through the retaining wall 42 and the light-shielding glue G therebelow, and similarly, the light from the second chamber S2 cannot reach the first chamber S1.

As shown in fig. 5, the retaining wall 42 preferably has a concave structure OP. In addition, as shown in fig. 3 and fig. 5, a plurality of ribs 421 may be formed on one end surface of the retaining wall 42 facing the substrate 1, and a cross section of the retaining wall 42 along a sectional line III-III (horizontal direction) of fig. 1 may be substantially in a shape of an inverted U in fig. 3. In a practical application, the plurality of protruding ribs 421 may be designed to be two arc-shaped long ribs, but the present invention is not limited thereto. For example, the cross-sectional shapes of the plurality of ribs 421 may be square, triangular or wavy, or the cross-sectional shape of one portion of the ribs 421 may be different from the cross-sectional shape of another portion of the ribs 421. In addition, in the present embodiment, the total number of the plurality of ribs 421 is two, but not limited thereto, and in other embodiments, the total number of the plurality of ribs 421 may be one, three or more.

In addition, referring to fig. 8, the cross section of the retaining wall 42 along the section line VIII-VIII (longitudinal direction) of fig. 1 may be a plate-shaped structure with an inverted U-shape. Preferably, the recessed structure OP has a trapezoidal shape, and the position thereof corresponds to the position of the groove 311 of the SPDA sensor chip 31 (i.e., the light receiving element 3). Specifically, the intermediate portion of the retaining wall 42 forms a concave structure OP so that the intermediate portion does not contact the first plate surface 11 of the substrate 1. In other words, the retaining wall 42 longitudinally crosses the SPDA sensor chip 31, and both side end portions thereof directly contact the substrate 1, and the concave structures OP of the retaining wall 42 are opposite to the grooves 311 of the SPDA sensor chip 31 with a gap therebetween.

On top, the two sides of the retaining wall 42 are joined to the substrate 1 by the light-shielding glue G, and a portion of the light-shielding glue G fills the gap along the recess 311 of the light-receiving component 3 and extends outward to further form a light-shielding wall G1 (as shown in fig. 8). In more detail, since the plurality of ribs 421 are formed on one end surface of the retaining wall 42 (facing the substrate 1), and the plurality of ribs 421 are in the arc-shaped structure in this embodiment, the light-shielding glue G can fill in between the plurality of ribs 421, and part of the light-shielding glue G can extend along the outer surfaces of the plurality of ribs 421 to form the light-shielding wall G1, wherein the light-shielding wall G1 of the light-shielding glue G has a minimum height H1 and a maximum height H2, and the ratio between the minimum height H1 and the maximum height H2 is preferably 1: 2.5 (as shown in fig. 9). Accordingly, the light-shielding adhesive G can improve the bonding strength between the retaining wall 42 and the substrate 1, enhance the sealing strength and light-shielding performance between the retaining wall 42 and the SPDA sensor chip 31, and prevent the light-shielding adhesive G from overflowing to affect the circuit (e.g., wire bonding) on the substrate 1. In addition, when the light shielding wall G1 is disposed along the surface of the ribs 421, the light shielding effect can be improved, and light crosstalk caused by light entering the first cavity S1 and the second cavity S2 from the connection between the retaining wall 42 and the SPDA sensor chip 31 can be avoided. Therefore, the utility model discloses can provide a more compact design, can reduce the length of signal path, reduce the influence of optical crosstalk, guarantee the accuracy of measurationing.

As shown in fig. 3 to 5, the housing 4 further has a first setting groove 411 and a second setting groove 412 spaced from each other on the body 41, the first setting groove 411 corresponds to and communicates the first light-transmitting hole 5 and the first chamber S1, and the second setting groove 412 corresponds to and communicates the second light-transmitting hole 6 and the second chamber S2. Furthermore, the optoelectronic module 100A may further include a first optical element 5 'and a second optical element 6'. Accordingly, when the light emitting assembly 2 located in the first chamber S1 emits the probe light L1, the probe light L1 can illuminate the external object via the first optical element 5'. When the probe light L1 irradiates an external object to generate the reflected light L2, the reflected light L2 can be received by the light receiving assembly 3 (i.e., the detection sensor 32) located in the second chamber S2 via the second optical element 6'.

Preferably, as shown in fig. 3 and 5, the second chamber S2 further includes an upper portion S21 and a lower portion S22 connected to the upper portion S21 along the height direction D. The upper portion S21 is adjacent to and communicated with the second installation groove 412, and the lower portion S22 is located between the upper portion S21 and the substrate 1. Here, the cross section of the upper portion S21 is tapered (i.e., tapered) from the second installation groove 412 toward the light receiving element 3, thereby ensuring that the reflected light L2 can be smoothly received by the detection sensor 32 via the upper portion S21. In addition, an inner surface of the upper portion S21 can be designed to be rough, so as to reduce the interference of stray light noise on the detecting sensor 32, and effectively reduce the light refraction loss and concentrate the light effect.

In a practical application, as shown in fig. 2, 3 and 5, the optoelectronic module 100A may further include a lens assembly 7, wherein the lens assembly 7 is disposed in the second chamber S2 and above the detecting sensor 32, so as to ensure that the detecting sensor 32 can smoothly and intensively receive the optical signal (e.g., the reflected light L2). Specifically, the lens assembly 7 has a base 71 and a convex portion 72 connected to the base 71, the base 71 is in a plate-like structure and located in the lower portion S22, the convex portion 72 is in an arc-like structure and located in the upper portion S21, and an optical center of the lens assembly 7 is located on an optical path of the reflected light L2 received by the detection sensor 32. It will be appreciated that it is most desirable that the path of the reflected light L2 preferably passes through both the optical center position of the lens assembly 7 and the center of the upper position S21.

In the present embodiment, the base 71 of the lens assembly 7 has a plurality of engaging holes 73, and the inner surface of the housing 4 is disposed with a plurality of protruding pillars 44 at corresponding positions. Specifically, the plurality of pillars 44 are located in the lower portion S22 of the second chamber S2, and the plurality of pillars 44 are formed from an upper surface of the lower portion S22 toward the substrate 1. Preferably, the plurality of studs 44 are symmetrically disposed. The protrusions 44 respectively penetrate the engaging holes 73, so that the lens assembly 7 can be positioned and fixed in the lower portion S22 to achieve optical alignment.

Furthermore, the lens element 7 and the upper surface of the lower portion S22 can be fixed by an adhesive (not shown). Therefore, the upper surface of the lower portion S22 of the housing 4 is further formed with a plurality of guiding grooves 45 for the overflowing adhesive to flow in. In addition, the area of the plurality of flow guide grooves 45 orthographically projected on the base 71 does not overlap the area of the protrusion 72 orthographically projected on the base 71, so as to prevent the plurality of flow guide grooves 45 and the adhesive from affecting the light entering the second chamber S2 (as shown in fig. 5 and 7).

Referring to fig. 2 and 3 again, in the present embodiment, the first optical element 5' may be an optical package, and may further be coated with an antireflection film on a side facing the light emitting device 2; the second optical element 6' may be a grating, a filter, etc., but the present invention is not limited thereto.

Further, when the first optical element 5 'and the second optical element 6' are disposed in the first disposing groove 411 and the second disposing groove 412, respectively, the first chamber S1 and the second chamber S2 may be respectively in a closed state, so that the housing 4 generates an internal-external pressure difference. However, the aforementioned internal and external pressure differences may damage some components (e.g., the first optical element 5 'and the second optical element 6') of the optoelectronic module 100A, thereby affecting the overall lifetime. Therefore, the housing 4 further includes a first air escape groove 46 communicating with the first chamber S1 and a second air escape groove 47 communicating with the second chamber S2 (as shown in fig. 4 and 6).

Specifically, the first air-escaping groove 46 is L-shaped in the present embodiment and is disposed between the first optical element 5' and the first setting groove 411, one end of the first air-escaping groove 46 is communicated with the first chamber S1 through the first setting groove 411, and the other end of the first air-escaping groove 46 is communicated with the outside of the housing 4. In addition, the second air-escaping groove 47 is L-shaped in the present embodiment and is disposed between the second optical element 6' and the second disposing groove 412, one end of the second air-escaping groove 47 is communicated with the second chamber S2 through the second disposing groove 412, and the other end of the second air-escaping groove 47 is communicated with the outside of the housing 4. Accordingly, the first chamber S1 and the second chamber S2 can reach the balance of the internal and external pressure difference through the first air-escape slot 46 and the second air-escape slot 47, respectively. The depth DL of the first air escape groove 46 and the second air escape groove 47 is preferably between 0.35 mm and 0.45 mm (as shown in fig. 3), so as to facilitate the circulation of the air in the first chamber S1 and the second chamber S2 with the outside of the housing 4, but the invention is not limited thereto.

In addition, in a practical application, the housing 4 further includes a plurality of symmetrically disposed loading platforms 48 in the first installation slot 411 and the second installation slot 412, respectively (as shown in fig. 4 and 6). In the present embodiment, the number of the plurality of susceptors 48 is four, and preferably, the plurality of susceptors 48 located in the first disposition groove 411 and/or the second disposition groove 412 may be a fan-shaped sheet structure (i.e. 1/4 circular) with a thickness between 0.015 to 0.025 mm, and disposed at four corners of the first disposition groove 411 and/or the second disposition groove 412, but not limited thereto.

Further, the plurality of susceptors 48 are disposed at four corners of the bottom surfaces of the first disposition groove 411/the second disposition groove 412, respectively, and the top surfaces thereof are higher than the bottom surfaces of the first disposition groove 411/the second disposition groove 412, so that the susceptors 48 can be used to support the first optical element 5 '/the second optical element 6', and the side surfaces of the plurality of susceptors 48 and the bottom surfaces of the first disposition groove 411/the second disposition groove 412 can form a glue guiding space together. Accordingly, when the first optical element 5 'and the second optical element 6' are respectively fixed on the four carrying tables 48 of the first setting groove 411 and the second setting groove 412 through a transparent adhesive, part of the adhesive can flow into the adhesive guiding space in the first setting groove 411 and the second setting groove 412 to avoid the overflow.

It should be noted that, in other embodiments, the first optical element 5 ', the second optical element 6', the first setting groove 411 and the second setting groove 412 of the optoelectronic module 100A may be omitted according to design requirements. In other words, the first air-escape groove 46, the second air-escape groove 47 and the plurality of stages 48 can be omitted.

Second embodiment

As shown in fig. 10 and 11, which are second embodiments of the present invention, the present embodiment is similar to the optoelectronic module 100A of the first embodiment, and the same parts of the two embodiments are not repeated, and the difference between the optoelectronic module 100B of the present embodiment and the optoelectronic module 100A of the first embodiment mainly lies in:

the optoelectronic module 100B further includes a light shielding layer 8 disposed in the second chamber S2, the light shielding layer 8 can be made of black material with light absorption property, but the present invention is not limited thereto. The light shielding layer 8 covers at least a part of the light receiving element 3 and exposes a receiving area (e.g., the detection sensor 32) of the light receiving element 3. Accordingly, the light shielding layer 8 can be used to prevent the light entering the second cavity S2 from the outside of the housing 4 from being reflected between the lens assembly 7 and the substrate 1 to generate noise (stray light).

In the present embodiment, the light shielding layer 8 is filled in the lower portion S22 of the second chamber S2, and the light shielding layer 8 forms a channel 81 on the light path of the light receiving element 3 receiving the reflected light L2. In other words, the light shielding layer 8 covers at least a part of the non-functional area of the SPDA sensor chip 31 in the second cavity S2, so that the channel 81 does not block the receiving area of the light receiving element 3, thereby ensuring that the reflected light L2 can be received by the light receiving element 3 (the detection sensor 32).

Preferably, as shown in fig. 11, the cross section of the channel 81 is tapered (i.e., cone-shaped) from the second light-transmitting hole 6 toward the light-receiving component 3 to ensure that the reflected light L2 can be converged on the light-receiving component 3 (i.e., the detection sensor 32) by the lens component 7. In addition, the inner surface of the channel 81 may be rough, so as to reduce the interference of stray light noise to the detection sensor 32. It should be noted that the inner surface of the channel 81 may be formed by particles to achieve the same effect as the rough surface.

Compared with the conventional design, the utility model discloses a light shield layer 8's design can let the casing attenuation and can provide more compact design, not only can reduce the length of signal path, and can also reduce the influence of optical crosstalk. Furthermore, the utility model discloses the equipment precision between each subassembly can effectively be improved again simultaneously to ensure the accuracy of measurationing.

It should be noted that the substrate 1, the light emitting element 2, the light receiving element 3, the housing 4, the first light hole 5, the second light hole 6, and the light shielding layer 8 of the second embodiment are collectively defined as the optoelectronic module 100B in this embodiment, but the invention is not limited thereto. For example, the substrate 1, the housing 4, the light receiving element 3 and the light shielding layer 8 can be defined as an optical sensor, and the optical sensor can be used alone (e.g., implemented, manufactured, sold, etc.) or used in combination with other components.

Third embodiment

As shown in fig. 12 and 13, which are third embodiments of the present invention, the present embodiment is similar to the optoelectronic module 100B of the second embodiment, and the same parts of the two embodiments are not repeated, and the difference between the optoelectronic module 100C of the present embodiment and the optoelectronic module 100B of the second embodiment mainly lies in:

in the present embodiment, the light shielding layer 8 is a ring frame structure and is disposed around the receiving area (e.g., the detection sensor 32) of the light receiving element 3, and the upper surface of the light shielding layer 8 is slightly higher than the upper surface of the receiving area (e.g., the detection sensor 32) of the light receiving element 3 (as shown in fig. 13).

In addition, in the optoelectronic module 100C of the present embodiment, a light-transmissive encapsulation layer 9 may be formed by injection molding (molding), and the encapsulation layer 9 is respectively located in the first cavity S1 and the second cavity S2.

Specifically, the encapsulation layer 9 may fill or partially fill the first chamber S1 and the second chamber S2. For example, as shown in fig. 13, the encapsulation layer 9 located in the first cavity S1 fills a lower space of the first cavity S1 and covers the light emitting device 2, and the top surface may be a flat surface, but not limited thereto. In other embodiments, the top surface of the packaging layer 9 in the first chamber S1 may also be concave, similar to a concave lens. A portion of the encapsulation layer 9 in the second chamber S2 fills the space of the lower portion S22 and covers the light receiving element 3; and a boss 92 is formed in the upper portion S21, and the boss 92 has a substantially circular arc shape. The function of the convex portion 92 of the encapsulating layer 9 is the same as that of the convex portion 72 of the lens component 7 of the optoelectronic module 100B, and in brief, the encapsulating layer 9 having the convex portion 92 can replace the lens component 7 of the optoelectronic module 100B, so that it is not described in detail herein.

It should be noted that, in other embodiments, the first optical element 5 ', the second optical element 6', the first setting groove 411 and the second setting groove 412 of the optoelectronic module 100C may be omitted according to design requirements. In other words, in another practical application, the light emitting module 2 and the light receiving module 3 can emit the detection light L1 to the external object and receive the reflected light L2 reflected by the external object through the first light-transmitting hole 5 and the second light-transmitting hole 6 respectively after being encapsulated and protected by the transparent encapsulating layer 9. Of course, the technical features of the optoelectronic module 100C in this embodiment can also be applied to an optical sensor.

The embodiment of the utility model provides a technological effect

To sum up, the embodiment of the utility model discloses a photoelectric module and optical sensor can cover at least part light receiving component through "the light shield layer to expose the receiving area's of light receiving component's design, let photoelectric module and optical sensor can be more compact, thereby further reduce signal path's length and stray light noise, ensure the accuracy of measurationing.

The above mentioned embodiments are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the present invention, and all the equivalent changes and modifications made by the claims of the present invention should be included in the scope of the present invention.

Claims (25)

1. An optoelectronic module, comprising:

a substrate;

the shell is arranged on the substrate and comprises a body and a retaining wall, and the body is provided with a first light hole and a second light hole;

the light emitting component is arranged on the substrate and is configured corresponding to the first light hole;

a light receiving assembly disposed on the substrate and corresponding to the second light hole, and separated from the light emitting assembly by the retaining wall; and

a light shielding layer covering at least a portion of the light receiving element to expose a receiving area of the light receiving element.

2. The optoelectronic module of claim 1, wherein an inner surface of the body extends toward the substrate to form the dam, the dam is located between the light emitting element and the light receiving element, and the body and the dam together define a first chamber and a second chamber; the light emitting assembly is located in the first cavity and emits detection light to an external object through the first light-transmitting hole, and the light receiving assembly is partially located in the second cavity and can receive reflected light, reflected by the external object, of the detection light through the second light-transmitting hole.

3. The optoelectronic module of claim 2 further comprising a light transmissive encapsulant layer disposed in the first and second chambers, respectively.

4. The optoelectronic module of claim 2 wherein the light-shielding layer fills the second cavity and has a channel in a light path where the light-receiving element receives the reflected light.

5. The optoelectronic module of claim 4 wherein the cross-section of the channel tapers from the second light-transmitting aperture toward the light-receiving component.

6. The photovoltaic module of claim 4, wherein the inner surface of the channel is roughened.

7. The optoelectronic module of claim 2 wherein the second chamber comprises an upper portion and a lower portion connected to the upper portion, the upper portion having a cross-section tapering from the second light-transmitting hole toward the light-receiving element, the lower portion accommodating the light-receiving element and the light-shielding layer.

8. The photovoltaic module of claim 7, wherein an inner surface of the upper portion of the second chamber is roughened.

9. The optoelectronic module of claim 7 further comprising a lens assembly disposed in the second chamber, the lens assembly having a base and a protrusion connected to the base, the base being located in the lower portion, the protrusion being located in the upper portion, and an optical center of the lens assembly being located in an optical path of the light receiving assembly receiving the reflected light.

10. The optoelectronic module of claim 9, wherein the housing has a plurality of protruding pillars in the lower portion of the second chamber, the base of the lens assembly has a plurality of engaging holes, and the plurality of engaging holes of the lens assembly are used for the plurality of protruding pillars of the housing to respectively penetrate through.

11. The optoelectronic module of claim 9 wherein a plurality of channels are formed on an upper surface of the lower portion of the housing, and an area of the plurality of channels that is orthographically projected onto the base does not overlap an area of the protrusion that is orthographically projected onto the base.

12. The optoelectronic module of claim 2, wherein the housing includes a first installation groove corresponding to the first light-transmitting hole and communicating with the first cavity, the first installation groove being configured to receive a first optical element.

13. The optoelectronic module of claim 12, wherein the housing includes a first air-escape groove, the first air-escape groove is located between the first optical element and the first installation groove, and the first air-escape groove communicates the first chamber and the exterior of the housing through the first installation groove.

14. The photovoltaic module of claim 13, wherein the first air-escape groove is L-shaped, and the depth of the first air-escape groove is between 0.35 and 0.45 mm.

15. The optoelectronic module of claim 12, wherein the housing further comprises a plurality of loading stages in the first setting groove, and a top surface of the plurality of loading stages is higher than a bottom surface of the first setting groove, so that the side surfaces of the plurality of loading stages and the bottom surface of the first setting groove form a glue guiding space together.

16. The optoelectronic module of claim 2, wherein the housing includes a second installation groove corresponding to the second light hole and communicating with the second cavity, the second installation groove being configured to receive a second optical element.

17. The optoelectronic module of claim 16, wherein the housing includes a second air-escape groove, the second air-escape groove is located between the second optical element and the second installation groove, and the second air-escape groove communicates the second cavity with the outside of the housing through the second installation groove.

18. The optoelectronic module of claim 16, wherein the housing further comprises a plurality of loading stages in the second setting groove, and a top surface of the plurality of loading stages is higher than a bottom surface of the second setting groove, so that the side surfaces of the plurality of loading stages and the bottom surface of the second setting groove form a glue guiding space together.

19. The photovoltaic module of claim 17, wherein the second air-escape groove is L-shaped, and the depth of the second air-escape groove is between 0.35 and 0.45 mm.

20. The optoelectronic module of claim 2 wherein the light-shielding layer covers a non-functional area of the light-receiving element within the second chamber, the light-shielding layer having a channel on a light path of the light-receiving element receiving the reflected light.

21. The optoelectronic module of claim 20 wherein an upper surface of the light shielding layer is higher than an upper surface of the light receiving element.

22. The photovoltaic module of claim 1, wherein a plurality of ribs are formed on one end surface of the retaining wall; the photovoltaic module further comprises a light shielding glue, the light shielding glue is arranged between the substrate and the shell, the light shielding glue is partially filled between the convex ribs, and the light shielding glue is partially extended and configured along the surfaces of the convex ribs.

23. The optoelectronic module of claim 22 wherein the dam has a recessed structure, the recessed structure being disposed longitudinally across the light receiving element.

24. The optoelectronic module according to claim 22 or 23, wherein the light receiving element comprises a sensor chip and a detecting sensor disposed on the sensor chip, the sensor chip is disposed under the retaining wall, and the sensor chip has a groove corresponding to the retaining wall and providing a portion of the light shielding glue.

25. An optical sensor, characterized in that the optical sensor comprises:

a substrate;

a shell arranged on the substrate;

a light receiving assembly disposed on the substrate and located in the housing; and

the shading layer is arranged in the shell and covers at least part of the light receiving component to expose a receiving area of the light receiving component.

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