CN115810676A - Adjustable double-step optical sensor packaging structure - Google Patents
Adjustable double-step optical sensor packaging structure Download PDFInfo
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- CN115810676A CN115810676A CN202211466544.8A CN202211466544A CN115810676A CN 115810676 A CN115810676 A CN 115810676A CN 202211466544 A CN202211466544 A CN 202211466544A CN 115810676 A CN115810676 A CN 115810676A
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Abstract
The invention discloses an adjustable double-step optical sensor packaging structure which comprises a step type cover (1), a light-transmitting plate (2), an emitting end chip (3), a receiving end chip (4) and a substrate (5); the transmitting end chip is fixed on the substrate, and the receiving end chip is overlapped on the transmitting end chip and is far away from the light beam transmitting part (301); the stepped cover is in a stepped structure with one side high and the other side low and is fixed on the substrate, the low-step section (101) covers the light beam emission part, and the high-step section (102) covers the receiving end chip; all be formed with fretwork portion (103) on low order bench and the high-order bench, two light-passing boards dress are in two fretwork portions department of cascaded lid and are located directly over light beam emission position and receiving end chip. The invention can solve the problems that the epoxy resin adhesive can not completely block light, the cost of the epoxy resin adhesive is high, the epoxy resin adhesive overflows, the line is pressed at the middle part of the cover, the size is large, and the typesetting utilization is limited in the prior art.
Description
Technical Field
The present disclosure relates to chip packaging structures, and particularly to an adjustable dual-step optical sensor packaging structure.
Background
The working principle of the optical sensor is as follows: the optical transmitting end chip emits light beams at a certain angle, the light beams are captured by the optical receiving end chip after being subjected to diffuse reflection of obstacles, shelters and the like, and the non-contact and non-destructive measurement purposes are achieved by utilizing reflection images with different depths. Wide sensors are currently widely used in the fields of motion detection in industry, automotive, electronics, and retail automation.
In the packaging of the optical sensor chip of the electronic product, the transmitting end chip and the receiving end chip of the optical sensor need to be packaged separately through two independent cavities, so that the optical measurement precision of the electronic product is reduced due to the fact that light rays transmitted by the transmitting end chip directly affect the receiving end chip.
Chinese utility model patent CN206134714U discloses an optical sensor packaging structure, and specifically discloses: the optical chip comprises a first optical chip arranged in the first cavity and a second optical chip arranged in the second cavity; the shell is provided with a first optical window corresponding to the first containing cavity and a second optical window corresponding to the second containing cavity; a light-transmitting cover plate covering the first optical window and the second optical window is further attached to the shell; and a first convex lens structure and a second convex lens structure are respectively formed on the light-transmitting cover plate at the positions of the first optical window and the second optical window.
The optical sensor packaging structure of prior art and above-mentioned utility model patent all have following weak point:
1. because the two cavities are separated by the middle part of the cover, the bottom of the middle part of the cover needs to be bonded and fixed with the substrate through epoxy resin glue and plays a role in blocking light, however, the epoxy resin glue cannot block 100% of light penetration, so that partial light beams in the cavity at the transmitting end chip side can penetrate through the epoxy resin glue layer and enter the cavity at the receiving end chip side, the light beams of the transmitting end chip are directly received by the receiving end chip, and the measurement accuracy of the optical sensor is influenced. Meanwhile, the production cost of light blocking by using the epoxy resin adhesive is high, and in order to ensure the full coating and light blocking effects of the epoxy resin adhesive, the problem of adhesive overflow caused by large consumption of the epoxy resin adhesive is frequent.
2. Because the cavities are separated by the middle part of the cover, if the transmitting end chip and the receiving end chip need to be wire bonded at the positions close to the middle part of the cover, the middle part of the cover often has a wire pressing problem during installation, and the normal use of the transmitting end chip and the receiving end chip is influenced.
3. Because the two cavities are transversely arranged, the size is larger, the typesetting of the chip packaging structure is not flexible, and the space utilization rate is limited.
Therefore, it is desirable to provide an adjustable dual-step optical sensor package structure to solve the problems in the prior art that the epoxy resin adhesive cannot completely block light, the epoxy resin adhesive has high cost, the epoxy resin adhesive overflows, the middle part of the cover is pressed, the size is large, and the typesetting and utilization are limited.
Disclosure of Invention
The invention aims to provide an adjustable double-step optical sensor packaging structure which can solve the problems that epoxy resin glue cannot completely block light, the epoxy resin glue is high in cost, the epoxy resin glue overflows, the middle part of a cover is pressed, the size is large, and typesetting and utilization are limited in the prior art.
The invention is realized in the following way:
an adjustable double-step optical sensor packaging structure comprises a step type cover, a light-transmitting plate, an emitting end chip, a receiving end chip and a substrate; the transmitting end chip is fixed on the substrate, the receiving end chip is fixed on the transmitting end chip in a stacking mode, and the receiving end chip is far away from a light beam transmitting part of the transmitting end chip; the stepped cover is in a stepped structure with one high side and the other low side, is fixed on the substrate and covers the transmitting end chip and the receiving end chip, so that a low-order step section of the stepped cover covers the light beam transmitting part of the transmitting end chip, and a high-order step section of the stepped cover covers the receiving end chip; all be formed with fretwork portion on the low order bench and the high-order bench of cascaded lid, two light-passing boards are installed respectively in two fretwork portion departments of cascaded lid and are located light beam emission position and receiving end chip directly over.
The inner wall of the high-order step section of the stepped cover is provided with a light barrier, and the light barrier is positioned on the inner wall of a joint vertical surface between the high-order step section and the low-order step section.
The light barrier is provided with one or more light barriers, the light barriers are sequentially and horizontally arranged at intervals from bottom to top, and the widths of the light barriers are sequentially increased from bottom to top to form a stepped light blocking structure.
The width of the light barrier does not exceed the horizontal distance between the connecting vertical surface and the hollow part on the high-order ladder section.
The low order bench extend to the side of receiving terminal chip, and the low order bench is not higher than the receiving terminal chip, make the lateral wall of high order bench, linking facade and cascaded lid encircle around the receiving terminal chip.
The substrate is provided with a first embedded groove, and the bottom of the transmitting end chip is embedded on the substrate through the first embedded groove in a matching manner, so that the transmitting end chip is fixed on the substrate in a sinking manner.
The base plate is provided with a second embedded groove, the second embedded groove circumferentially surrounds the outer side of the first embedded groove, and the bottom of the stepped cover is embedded on the base plate through the second embedded groove in a matched mode, so that the stepped cover is fixed on the base plate in a sinking mode.
The depth of the first embedded groove and the depth of the second embedded groove do not exceed half of the thickness of the substrate.
The top of light-transmitting board all be formed with the convex lens face, the light-transmitting board is fixed on the inner wall of cascaded lid, makes convex lens face wholly or partly be located fretwork portion.
The top width of the hollow part is larger than the bottom width, so that the side wall of the hollow part forms an inclined plane structure.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention is provided with the stepped cover and the light barrier, and adopts the low-order bench section, the high-order bench section and the joint vertical surface to form a stepped structure, the low-order bench section and the light barrier can play an effective and complete light-shielding role on the transmitting end chip, the light beam of the transmitting end chip can only be emitted through the light-transmitting plate above the transmitting end chip, the high-order bench section can play an effective light-shielding role on the receiving end chip, the receiving end chip can only receive the light beam from the light-transmitting plate above the receiving end chip, the light beam of the transmitting end chip is prevented from directly influencing the receiving end chip, and the optical measurement performance of the optical sensor is ensured; simultaneously, cascaded lid is separated into two regions through linking up the facade, and the middle part of cascaded lid need not to glue through epoxy and fix with the base plate, has avoided epoxy to glue the problem that processing cost is high and overflow to glue easily, and the middle part of cascaded lid can not take place to interfere with near routing, is favorable to reduction in production cost and the production technology degree of difficulty.
2. The stepped cover is arranged, so that the height difference is formed by the low-order step section and the high-order step section, more elements can be arranged in the fall space between the low-order step section and the connecting vertical surface, the stepped cover has higher arrangement flexibility and adjustment elasticity, the size of the whole packaging structure is favorably reduced, and the size of an electronic product is reduced.
3. The invention is provided with the first embedded groove and the second embedded groove, the first embedded groove is used for realizing the sinking type installation of the emitting end chip, the second embedded groove is used for realizing the sinking type installation of the stepped cover, the height of the whole packaging structure can be reduced, and the size of the whole packaging structure can be further reduced.
Drawings
FIG. 1 is a cross-sectional view of an adjustable dual-step optical sensor package structure according to the present invention.
In the figure, a stepped cover 1, a low-step section 101, a high-step section 102, a hollow-out part 103, a joint vertical face 104, a light-transmitting plate 2, a convex lens face 201, a chip at an emitting end 3, a light beam emitting part 301, a chip at a receiving end 4, a substrate 5, a first embedded groove 501, a second embedded groove 502 and a light barrier 6.
Detailed Description
The invention is further described with reference to the following figures and specific examples.
Referring to fig. 1, an adjustable dual-step optical sensor package structure includes a step-shaped cover 1, a transparent plate 2, an emitting-end chip 3, a receiving-end chip 4, and a substrate 5; the transmitting end chip 3 is fixed on the substrate 5, the receiving end chip 4 is fixed on the transmitting end chip 3 in a stacking mode, and the receiving end chip 4 is far away from the light beam transmitting part 301 of the transmitting end chip 3; the stepped cover 1 is in a stepped structure with one high side and the other low side, the stepped cover 1 is fixed on the substrate 5 and covers the transmitting end chip 3 and the receiving end chip 4, so that the low-order step section 101 of the stepped cover 1 covers the light beam transmitting part 301 of the transmitting end chip 3, and the high-order step section 102 of the stepped cover 1 covers the receiving end chip 4; all be formed with fretwork portion 103 on the low order bench 101 of cascaded lid 1 and the high order bench 102, two light-passing boards 2 are installed respectively in two fretwork portions 103 departments of cascaded lid 1 and are located light beam emission position 301 and receiving end chip 4 directly over.
Cascaded lid 1 carries out the shading shroud through low order bench 101 to transmitting terminal chip 3, and low order bench 101 covers the most area of transmitting terminal chip 3, makes the light beam of transmitting terminal chip 3's light beam emission position 301 can only follow the light-passing board 2 of the fretwork portion 103 department of low order bench 101 and outwards launches, avoids the light beam to produce direct influence to receiving terminal chip 4. The stepped cover 1 covers the receiving-end chip 4 in a light-shielding manner through the high-order step 102, so that the receiving-end chip 4 can only receive the light beams reflected diffusely from the light-transmitting plate 2 at the hollow part 103 of the high-order step 102. The middle part of cascaded lid 1 need not to glue through epoxy and is fixed with base plate 5 to when guaranteeing light sensor measurement accuracy, avoided epoxy glue among the prior art can't be in the light totally, epoxy glue with high costs, epoxy glue overflow glue, the problem of lid mid portion line ball. Meanwhile, a height difference is formed between the low-order bench 101 and the high-order bench 102, and a layout space is formed between the low-order bench 101 and the connecting vertical face 104, so that the electronic device can be used for typesetting other chip elements, the flexibility and flexibility of typesetting utilization and adjustment are improved, and the size of the whole electronic product is favorably reduced.
The inner wall of the high-order step section 102 of the stepped cover 1 is provided with a light barrier 6, and the light barrier 6 is positioned on the inner wall of a joint vertical surface 104 between the high-order step section 102 and the low-order step section 101.
The light beam of the emitting end chip 3 is further prevented from spreading to the area of the receiving end chip 4 by the arrangement of the light barrier 6, so that the performance of the optical sensor is ensured. The setting height of the light barrier 6 can be determined according to the actual arrangement condition, and the interference between the light barrier 6 and the routing of the receiving end chip 4 can be avoided.
The light barrier 6 be equipped with one or polylith, polylith light barrier 6 is horizontal interval arrangement in proper order from lower to upper, and the width of polylith light barrier 6 increases in proper order from lower to upper, forms cascaded structure of being in the light.
The number, the arrangement distance, the width and the like of the light barriers 6 can be adjusted adaptively according to actual light blocking requirements, and the stepped light blocking structure can not only ensure that the light beams of the transmitting end chip 3 are completely shielded, but also avoid interference with routing of the receiving end chip 4.
The width of the light barrier 6 does not exceed the horizontal distance between the connecting vertical surface 104 and the hollow part 103 of the high-order bench 102, so that the light barrier 6 can be prevented from influencing the receiving end chip 4 to receive the diffusely reflected light beam from the light-transmitting plate 2 of the hollow part 103 of the high-order bench 102, and the intensity of the optical signal is ensured.
The low-order step section 101 extends to the side of the receiving end chip 4, and the low-order step section 101 is not higher than the receiving end chip 4, so that the high-order step section 102, the engaging vertical surface 104 and the side wall of the stepped cover 1 surround the receiving end chip 4.
The low-order bench 101 extends to the side of the receiving end chip 4, so that the transmitting end chip 3 can be completely shielded, and the width of the step between the high-order bench 102 and the low-order bench 101 can be increased, so that more elements can be arranged, and the size of the electronic product can be further reduced. The high-order step 102, the joint vertical surface 104 and the side wall of the stepped cover 1 wrap the receiving end chip 4 in a surrounding manner, so that the receiving end chip 4 can only receive the light beams after diffuse reflection from the light transmitting plate 2 of the hollow part 103 on the high-order step 102, and the direct influence of the transmitting end chip 3 is avoided, and the performance of the optical sensor is ensured.
The substrate 5 is formed with a first embedded groove 501, and the bottom of the emitting end chip 3 is embedded on the substrate 5 through the first embedded groove 501 in a matching manner, so that the emitting end chip 3 is fixed on the substrate 5 in a sinking manner.
By using the sinking type installation of the transmitting end chip 3, the height of the whole packaging structure is further reduced, and the size of the electronic product is reduced.
The depth of the first embedding groove 501 is not more than half of the thickness of the substrate 5, so that the influence on the internal structure of the substrate 5 is avoided.
The base plate 5 is provided with a second embedded groove 502, the second embedded groove 502 circumferentially surrounds the outer side of the first embedded groove 501, and the bottom of the stepped cover 1 is embedded on the base plate 5 through the second embedded groove 502 in a matching manner, so that the stepped cover 1 is fixed on the base plate 5 in a sinking manner.
By using the sunken installation of the stepped cover 1, the height of the whole packaging structure is further reduced, so that the size of an electronic product is reduced.
The depth of the second embedding groove 502 is not more than half of the thickness of the substrate 5, so as to avoid influencing the internal structure of the substrate 5.
The top of light-transmitting board 2 all be formed with convex lens face 201, light-transmitting board 2 is fixed on the inner wall of cascaded lid 1, makes convex lens face 201 wholly or partly be located fretwork portion 103.
The receiving and dispatching intensity of the light beam can be enhanced by the convex lens surface 201, the convex lens surface 201 is completely or partially hidden in the hollow part 103, the convex lens surface 201 which protrudes outwards can be prevented from occupying the packaging space, the height of the whole packaging structure is further reduced, and the size of an electronic product is further reduced.
Convex lens face 201 height no longer than the thickness of cascaded lid 1, make convex lens face 201 all hide in fretwork portion 103, reduce the influence to arranging other components on cascaded lid 1 when reducing the encapsulation height.
The top width of the hollow-out part 103 is greater than the bottom width, so that the side wall of the hollow-out part 103 forms an inclined plane structure, and the receiving and transmitting strength of the optical signal can be further ensured.
Referring to fig. 1, the manufacturing process of the present invention is:
1. forming a first embedded groove 501 on the substrate 5 according to the size of the emitting end chip 3, and fixing the emitting end chip 3 on the substrate 5 through the first embedded groove 501; the receiving-end chip 4 is stacked Die on the emitting-end chip 3, and the receiving-end chip 4 is far away from the light beam emitting portion 301 of the emitting-end chip 3. And (5) baking after the Die stacking is finished.
2. And (3) carrying out wire bonding on the transmitting end chip 3 and the receiving end chip 4, and bonding plasma before wire bonding.
3. The stepped cover 1 is manufactured according to the sizes of the transmitting end chip 3 and the receiving end chip 4, two light barriers 6 are arranged on the inner wall of a joint vertical face 104 between a low-step section 101 and a high-step section 102 of the stepped cover 1, the width of the light barrier 6 positioned below is smaller than that of the light barrier 6 positioned above, and a stepped light blocking structure is formed. The width of the light barrier 6 above is smaller than the horizontal distance between the connecting vertical surface 104 and the hollow part 103 on the high-step section 102.
The stepped cover 1 and the light barrier 6 are made of light-shielding materials and are integrally formed by injection molding.
According to the position of the light beam emission part 301, a hollow-out part 103 is formed on the lower-step section 101, so that the hollow-out part 103 is positioned right above the light beam emission part 301. According to the position of the receiving-end chip 4, a hollow-out portion 103 is formed on the high-order step 102, so that the hollow-out portion 103 is located right above the receiving-end chip 4.
The light transmission plates 2 are made of light transmission materials such as transparent glass, the two light transmission plates 2 are fixed on the inner walls of the low-order bench section 101 and the high-order bench section 102 through glass cement respectively, the hollow parts 103 are covered respectively, and the convex lens surfaces 201 of the light transmission plates 2 are embedded into the hollow parts 103. The glass cement is baked so that it is reliably mounted on the stepped lid 1.
4. The second fitting groove 502 is formed in the base plate 5 in accordance with the size of the stepped cover 1, and the stepped cover 1 is fixed to the base plate 5 by the second fitting groove 502 so that the low-step section 101 is covered over the emitter chip 3 that is not stacked Die and the high-step section 102 is covered over the emitter chip 3 and the receiver chip 4 that are stacked Die.
Utilize low order bench 101 of cascaded lid 1 to form in the top of transmitting terminal chip 3 and shelter from, because low order bench 101 highly lower, increase the usable space in low order bench 101 top when can guarantee the shading function to transmitting terminal chip 3, increase the utilization and the adjustment elasticity of typesetting. The light beam emitting portion 301 of the emitting end chip 3 emits the light beam from the light transmitting plate 2 of the hollow portion 103, and the light beam emission intensity is increased by the convex lens surface 201.
The high-order step 102 of the stepped cover 1 and the two light barriers 6 are used for forming effective light blocking between the transmitting end chip 3 and the receiving end chip 4, and the double-step structure of the stepped cover 1 and the two light barriers 6 enables the receiving end chip 4 to receive the light beams after diffuse reflection only from the light transmission plate 2 on the hollow part 103 above the receiving end chip 4, and meanwhile, the light beam receiving intensity is improved under the action of the convex lens surface 201.
The present invention is not limited to the above embodiments, and any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a two ladder light sensor packaging structure with adjustable which characterized by: the LED packaging structure comprises a stepped cover (1), a light-transmitting plate (2), a transmitting end chip (3), a receiving end chip (4) and a substrate (5); the transmitting end chip (3) is fixed on the substrate (5), the receiving end chip (4) is fixed on the transmitting end chip (3) in a stacking mode, and the receiving end chip (4) is far away from a light beam transmitting part (301) of the transmitting end chip (3); the stepped cover (1) is in a stepped structure with one high side and the other low side, the stepped cover (1) is fixed on the substrate (5) and covers the transmitting end chip (3) and the receiving end chip (4), so that a low-order step section (101) of the stepped cover (1) covers the light beam transmitting part (301) of the transmitting end chip (3), and a high-order step section (102) of the stepped cover (1) covers the receiving end chip (4); all be formed with fretwork portion (103) on low order bench (101) and the high order bench (102) of cascaded lid (1), two light-passing boards (2) are installed respectively and are located light beam emission position (301) and receiving end chip (4) directly over two fretwork portions (103) departments of cascaded lid (1).
2. The adjustable dual step optical sensor package structure of claim 1, wherein: the inner wall of the high-order step section (102) of the stepped cover (1) is provided with a light barrier (6), and the light barrier (6) is positioned on the inner wall of a joint vertical surface (104) between the high-order step section (102) and the low-order step section (101).
3. The adjustable dual step optical sensor package structure of claim 2, wherein: the light barrier (6) is provided with one or more light barriers, the light barriers (6) are sequentially and horizontally arranged from bottom to top at intervals, and the widths of the light barriers (6) are sequentially increased from bottom to top to form a stepped light blocking structure.
4. The tunable dual step photosensor package structure of claim 2 or 3, wherein: the width of the light barrier (6) does not exceed the horizontal distance between the connecting vertical surface (104) and the hollow part (103) on the high-order ladder section (102).
5. The tunable dual step photosensor package structure of claim 1, wherein: low order bench (101) extend to the side of receiving end chip (4), and low order bench (101) are not higher than receiving end chip (4), make the lateral wall of high order bench (102), linking facade (104) and cascaded lid (1) encircle around receiving end chip (4).
6. The adjustable dual step optical sensor package structure of claim 1, wherein: the substrate (5) is provided with a first embedded groove (501), the bottom of the emitting end chip (3) is embedded on the substrate (5) through the first embedded groove (501) in a matching mode, and the emitting end chip (3) is fixed on the substrate (5) in a sinking mode.
7. The tunable dual step photosensor package structure of claim 6, wherein: the base plate (5) is provided with a second embedded groove (502), the second embedded groove (502) circumferentially surrounds the outer side of the first embedded groove (501), the bottom of the stepped cover (1) is embedded on the base plate (5) through the second embedded groove (502) in a matching mode, and the stepped cover (1) is fixed on the base plate (5) in a sinking mode.
8. The adjustable dual step photosensor package of claim 7, wherein: the depths of the first embedded groove (501) and the second embedded groove (502) are not more than half of the thickness of the substrate (5).
9. The tunable dual step photosensor package structure of claim 1, wherein: the top of light-transmitting board (2) all be formed with convex lens face (201), light-transmitting board (2) are fixed on the inner wall of cascaded lid (1), make convex lens face (201) wholly or partly be located fretwork portion (103).
10. The tunable dual step photosensor package structure of claim 1 or 9, wherein: the top width of the hollow-out part (103) is larger than the bottom width, so that the side wall of the hollow-out part (103) forms an inclined plane structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211466544.8A CN115810676A (en) | 2022-11-22 | 2022-11-22 | Adjustable double-step optical sensor packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211466544.8A CN115810676A (en) | 2022-11-22 | 2022-11-22 | Adjustable double-step optical sensor packaging structure |
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| CN115810676A true CN115810676A (en) | 2023-03-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116722007A (en) * | 2023-08-10 | 2023-09-08 | 青岛泰睿思微电子有限公司 | Optical packaging structure based on mixed heterogeneous substrate material |
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2022
- 2022-11-22 CN CN202211466544.8A patent/CN115810676A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116722007A (en) * | 2023-08-10 | 2023-09-08 | 青岛泰睿思微电子有限公司 | Optical packaging structure based on mixed heterogeneous substrate material |
| CN116722007B (en) * | 2023-08-10 | 2023-12-08 | 青岛泰睿思微电子有限公司 | Optical packaging structure based on mixed heterogeneous substrate material |
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