TWM590214U - Optical retaining wall structure - Google Patents

Abstract

The invention provides an optical retaining wall structure, which includes a substrate, a first retaining wall layer and a second retaining wall layer, the substrate has a working surface, the first retaining wall layer is formed on the working surface, and the first retaining wall The layer surrounds a first opening window of an exposed working surface; the second retaining wall layer is formed on the first retaining wall layer, and the second retaining wall layer surrounds a second opening window, and the cross-sectional area of the second retaining wall layer It is smaller than the first retaining wall layer, and the outline of the second window is larger than the first window.

Description

Optical retaining wall structure

The present invention relates to a structure of a photoelectric mechanism, in particular to a structure that forms a retaining wall on the photoelectric mechanism.

The existing light sensor includes a light-emitting unit and a photosensitive unit. After the light emitted by the light-emitting unit is reflected by the detection object, the light-sensing unit can receive and output a sensing signal. In order to prevent the light emitted by the light emitting unit from being directly transmitted to the photosensitive unit, the existing light sensor will set a barrier wall between the light emitting unit and the photosensitive unit, so that the light emitting unit emits light only in a predetermined direction, and the photosensitive unit only Light from a predetermined direction is measured, thereby increasing the reliability of the light sensor.

Retaining walls of existing light sensors are mostly formed by injection molding and other molding methods, but this process has its shortcomings: (1) There is a problem of overflowing glue, which reduces the yield; (2) It is easy to affect the accuracy due to mold shift, and it is not conducive to miniaturization; (3) It is necessary to separately make molds for different retaining wall shapes, thus increasing costs.

In view of this, the main purpose of the present invention is to provide an optoelectronic mechanism that can improve accuracy and reduce costs.

In order to achieve the above and other objects, the present invention provides an optical retaining wall structure including a substrate, a first retaining wall layer and a second retaining wall layer, the substrate has a working surface, and the first retaining wall layer is formed on the working surface And the first retaining wall layer encloses a first opening window of the exposed working surface; the second retaining wall layer is formed on the first retaining wall layer, and the second retaining wall layer encloses a second opening window, the second The cross-sectional area of the retaining wall layer is smaller than the first retaining wall layer, and the profile of the second window opening is larger than that of the first window opening.

The retaining wall formed by the above design has high precision, the processing cost can be reduced, and the circuit design freedom of the photoelectric mechanism can be improved. Even if the position or shape of the window is modified, it is not necessary to remake or modify the mold as in the prior art. In addition, the method of multiple photo-curing and one-time etching can make the multi-layer retaining wall layer have different profiles, and can also increase the thickness of the overall retaining wall layer, thereby greatly improving the degree of design freedom.

The present invention is to apply a method of forming an optical barrier wall by multiple photo-curing and one-time etching to form an optical barrier wall structure. The optical barrier wall structure can be applied to a light-emitting device, a photosensitive device, or a device having both light-emitting and photosensitive functions. For example, the photo sensor described in the prior art can be applied to, but not limited to, a remote controller and a lateral distance meter.

The following describes one embodiment of a method for forming an optical barrier by multiple photo-curing and one-time etching through FIGS. 1-12.

Please refer to FIG. 1, firstly, a substrate 10 is provided, which has a working surface 11. The substrate 10 may be a prefabricated circuit board or a lead frame for LED. For example, the substrate 10 has an insulating base material and is formed on The circuit structure and electrical contacts of an insulating substrate, such as epoxy resin, woven glass, polyester, or other materials commonly used to make circuit board substrates.

Next, please refer to FIG. 2, a laminating machine is used to laminate a light-curable first barrier film 20 to the working surface 11, and the broken line shown in the figure represents the first barrier film 20-a first barrier The boundary between the wall area 21 and a first non-retaining wall area 22 is, for example, a ring shape, and at least a portion of the first non-retaining wall area 22 is enclosed between the first retaining wall area 21. In the state shown in FIG. 1, the first barrier wall film 20 is in a state where it has not been completely cured. At this time, the first barrier wall region 21 and the first non-barrier wall region 22 have no substantial difference in chemical structure. Before being laminated on the working surface 11, the first retaining wall film 20 is, for example, pre-formed on a carrying film, and the carrying film is removed after the first retaining wall film 20 is laminated on the working surface 11. The carrier film can be polyethylene terephthalate (PET) or other polyester film, polyimide film, polyimide film, polypropylene film, polystyrene film. In a possible embodiment, the first barrier film 20 is black and can absorb most of the light.

As shown in FIG. 3, a first mask 30 is formed on the first barrier wall film 20. The first mask 30 covers the first non-blocking wall region 22 but exposes the first barrier wall region 21.

As shown in FIG. 4, the first barrier wall film 20 is illuminated to cross-link and cure the polymer in the first barrier wall area 21; the first non-blocking wall area 22 is covered by the first mask 30, so no light is applied Curing reaction.

As shown in FIG. 5, after curing is completed, the first photomask 30 is removed.

Next, as shown in FIG. 6, before the first barrier wall film 20 is etched, a light-curable second barrier wall film 40 is laminated on the first barrier wall film 20 using a laminator. Similar to the first retaining wall film 20, the second retaining wall film 40 also has a second retaining wall area 41 and a second non-retaining wall area 42, the second retaining wall area 41 is located on the first retaining wall area 21, and The cross-sectional area of the second retaining wall area 41 is not greater than the first retaining wall area 21, that is, the outline of the second retaining wall area 41 is equal to or smaller than that of the first retaining wall area 21. Similarly, before being laminated on the second retaining wall film 20, the second retaining wall film 40 is also pre-formed on a rider film, for example, and the rider film is laminated on the first retaining wall film 40 on the first After the barrier film 20 is removed, the carrier film may be polyethylene terephthalate (PET) or other polyester film, polyimide film, polyimide film, polypropylene film, Polystyrene film. In a possible embodiment, the second barrier film 40 is also black and can absorb most of the light.

As shown in FIG. 7, a second mask 50 is formed on the second barrier wall film 40. The second mask 50 covers the second non-blocking wall area 42 but exposes the second barrier wall area 41.

As shown in FIG. 8, the second barrier wall film 40 is illuminated to cross-link and cure the polymer in the second barrier area 41; the second non-blocking area 42 is covered by the second mask 50, so no light is applied Curing reaction.

As shown in FIG. 9, after curing is completed, the second photomask 50 is removed.

Next, as shown in FIG. 10, the uncured first and second non-retaining wall regions are removed using an etching solution, and the cured first and second retaining wall regions 21 and 41 are retained, and the remaining first The second retaining wall areas 21 and 41 respectively serve as the first and second retaining wall layers 20A and 40A. The first retaining wall layer 20A surrounds a first window 601 and the second retaining wall layer 40A surrounds a second opening The window 602, the combination of the first and second window openings 601, 602 is a window opening 60 that can expose the working surface 11. In this embodiment, the cross-sectional area of the second retaining wall layer 40A is smaller than that of the first retaining wall layer 20A, and the outline of the second window opening 602 is larger than that of the first window opening 601. Such a gradual opening window helps the robot arm operation.

Next, as shown in FIG. 11, a photoelectric unit 70 is formed on the working surface 11 in the window 60. The number of the photoelectric unit 70 can be determined according to requirements, and the photoelectric unit 70 is one of the light emitting unit and the photosensitive unit, and the first 1. The blocking wall formed by the combination of the second blocking wall layers 20A and 40A is higher than the photoelectric unit 70 and used to block light. The photovoltaic unit 70 can form an electrical connection with the circuit structure or electrical contacts on the substrate 10, for example, by wire bonding; in the case where the photovoltaic unit is a flip-chip LED or other suitable situations In the process, the wire bonding step can be omitted. The light-emitting unit is, for example, LED, and the light-sensing unit is, for example, CCD or CMOS. The light-emitting unit is used to emit light. The light-sensitive unit is used to sense light. The light may be visible light or invisible light, such as infrared light.

Next, as shown in FIG. 12, the glue is dispensed in the window 60. The glue 80 is a light-transmissive glue, such as transparent glue or fluorescent glue, for protecting the photoelectric unit 70 and/or for emitting Pre-selected wavelength light, that is, the fabricated optical barrier structure has a substrate 10, a first barrier layer 20A with a first window 601, and a second barrier layer 40A with a second window 602 1. A photovoltaic unit 70 formed on the working surface 11 and located in the window 60, and a colloid 80 formed in the window 60.

It should be noted that the foregoing embodiment only takes two barrier walls as an example for description. In other possible implementation manners of the present invention, more barrier walls may be formed by a similar multiple photocuring and one etching method For example, in the embodiment shown in FIG. 13, the obtained optical barrier structure has a substrate 10, a first barrier layer 20A with a first window 601, and a second barrier 602 with a second Two retaining wall layers 40A, a third retaining wall layer 90A having a third window 603, a photovoltaic unit 70 formed on the working surface 11 and located in the window 60, and a colloid 80 formed in the window 60 .

In summary, through the design of multiple photo-curing and one-etching, the present invention can make the multi-layer retaining wall layer have different contours and thicknesses, and can also increase the overall thickness of the retaining wall layer, so as to avoid one-time photo-curing because the retaining wall layer is too thick Problems, and can greatly improve the design freedom.

10‧‧‧ substrate

11‧‧‧Working surface

20‧‧‧The first retaining wall film

20A‧‧‧The first retaining wall

21‧‧‧The first retaining wall area

22‧‧‧The first non-retaining wall area

30‧‧‧ First Mask

40‧‧‧Second retaining wall film

40A‧‧‧Second retaining wall

41‧‧‧Second retaining wall area

42‧‧‧Second non-retaining wall area

50‧‧‧Second mask

60‧‧‧open window

601‧‧‧The first window

602‧‧‧The second window

603‧‧‧The third window

70‧‧‧Photoelectric unit

80‧‧‧Colloid

90A‧‧‧third retaining wall

1 to 12 are schematic diagrams of the manufacturing method of the first embodiment of the present invention.

Fig. 13 is another embodiment of the novel optical retaining wall structure.

10‧‧‧ substrate

11‧‧‧Working surface

20A‧‧‧The first retaining wall

40A‧‧‧Second retaining wall

60‧‧‧open window

601‧‧‧The first window

602‧‧‧The second window

70‧‧‧Photoelectric unit

80‧‧‧Colloid

Claims (2)

An optical retaining wall structure includes: a substrate having a working surface; a first retaining wall layer formed on the working surface, the first retaining wall layer surrounding a first window, the working surface is located in the first Exposed in an opening window; and a second retaining wall layer formed on the first retaining wall layer, the second retaining wall layer surrounding a second opening window, the cross-sectional area of the second retaining wall layer is smaller than the The first retaining wall layer, and the outline of the second window opening is larger than the first window opening. The optical barrier wall structure according to claim 1, further comprising at least one photovoltaic unit formed on the working surface in the first and second windows.

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