TW201428982A - Optical sensor, optoelectronics devices and packaging method thereof - Google Patents

Abstract

The present invention discloses an optical sensor, optoelectronics devices and packaging method thereof. The optoelectronics device comprises a substrate and an opaque lid. At least one optoelectronics element, which is of any combination of light emitting element and light sensing element sealed in at least one molded transparent material, is mounted and electrically connected on the substrate. The opaque lid, which is connected with the substrate by an adherent substance, forms at least one opening corresponding the optoelectronics element respectively to allow the passing of light signal emitting from the optoelectronics element therein or entering into the optoelectronics element.

Description

Optical sensor, photoelectric device and packaging method thereof

The present invention relates to an optical sensor, an optoelectronic device, and a method of packaging the same, and more particularly to an optical sensor, an optoelectronic device, and a method of packaging the same.

Optoelectronic devices are widely used, and optical sensing is one of the indispensable roles in many automated machinery, industrial machinery, semiconductor equipment, machine tools, etc. For example, proximity sensing passes through two optical components. a light-emitting diode (LED) and a photosensitive element, wherein the photosensitive element captures and processes the light signal from the light-emitting diode to detect the presence of the object, so that the controller can know the presence or absence of the current mechanism and the position of the object. Or by number, etc. In detail, a light-emitting diode, such as an infrared light-emitting diode, emits an infrared signal, and if an object approaches in the detection range, part of the infrared signal is reflected to the object, and the photosensitive element is reflected. For example, the infrared sensor can detect the reflected infrared signal. After signal conditioning, analog-to-digital conversion, and other processing procedures, the microprocessor or microcontroller can apply digital signals for subsequent processing.

Similar to general electronic wafers, after the fabrication of photovoltaic elements such as light-emitting diodes or photosensitive elements, it is necessary to increase the mechanical strength, construct the power connection and the signal output/input connection channel, and maintain good heat dissipation through the assembly process. And there is still a need to maintain good optical properties. Therefore, in order to meet the needs of more optoelectronic component packages, it is generally required to have a higher cost or a more complicated fabrication process for packaging. Therefore, how to carry out the optoelectronic component packaging while taking into account the optical characteristics, cost and fabrication complexity is an urgent issue.

An object of the present invention is to provide an optoelectronic device and a packaging method thereof, which are sealed by at least one transparent molding material which has been previously molded, and then connected to the substrate via an adhesive with an opaque upper cover to form a stable Package structure.

Another object of the present invention is to provide an optoelectronic device and a method of encapsulating the same that combines at least one transparent molding material produced by a molding process with an opaque cap to simplify packaging process and reduce process cost.

A further object of the present invention is to provide an optoelectronic device and a packaging method thereof, which are integrally formed on a transparent molding material by a molding process to form a lens portion, preferably for collecting effective optical signals, and shielding the environment with an opaque cover. Ineffective light such as a light source to provide better optical characteristics or to aid in the interpretation of optical signals.

According to the present invention, there is provided an optoelectronic device comprising a substrate and an opaque cover. One or more photovoltaic elements are mounted on the substrate and electrically connected to the substrate. The photoelectric elements are any combination of the light-emitting elements and the photosensitive elements, and are sealed in at least one transparent molding material that has been molded. The opaque upper cover is disposed above the substrate, and is connected to the substrate via an adhesive material. The opaque upper cover forms one or more openings corresponding to the photoelectric components, so that the optical signals emitted by the photoelectric components can be emitted through the openings. An opaque cover, and/or from the opening into the optoelectronic component.

According to the present invention, there is provided an optoelectronic device comprising a substrate and an opaque cover. Only one photosensitive element is electrically connected to the substrate, and is sealed in a transparent molding material which is molded. The opaque upper cover is disposed above the substrate and connected to the substrate via an adhesive material. The opaque upper cover forms an opening corresponding to the photosensitive element, so that light can be incident from the opening to the photosensitive element.

According to the present invention, an optical sensor is provided for sensing an object located within a range of distances. The optical sensor includes a substrate and an opaque upper cover. A light-emitting element and a light-sensing element are mounted on the substrate, and the light-emitting element and the photosensitive element are electrically connected to the substrate, and the light-emitting element and the photosensitive element are sealed in the at least one transparent molding material which is molded. The opaque upper cover is disposed on the upper surface of the substrate, and is connected to the substrate via an adhesive material. The opaque upper cover forms two openings respectively corresponding to the light-emitting element and the photosensitive element, so that the light signal emitted by the light-emitting element can be emitted through an opening of the opaque upper cover, and reflected by an object. The other opening is incident on the photosensitive member.

According to the present invention, there is provided a photovoltaic device packaging method comprising the steps of: (A) mounting one or more photovoltaic elements on a substrate to electrically connect the photovoltaic elements to the substrate, and the photovoltaic elements are any combination of the light-emitting elements and the photosensitive elements. (B) sealing the photovoltaic element in the at least one transparent molding material molded; and (C) placing an opaque upper cover over the substrate, connecting the substrate via an adhesive material, and forming the opaque cover into one or a The above openings respectively correspond to the photoelectric elements, so that the optical signals emitted by the photoelectric elements can be emitted through the openings to the opaque upper cover and/or from the openings into the photovoltaic elements.

According to the present invention, there is provided an optical sensor packaging method for sensing an object located within a range of distances. The optical sensor packaging method comprises the following steps: (A) mounting a light-emitting component and a photosensitive component on a substrate to electrically connect the light-emitting component and the photosensitive component to the substrate; (B) sealing the light-emitting component and the photosensitive component to the light-emitting component And (C) an opaque upper cover is disposed on the substrate, and is connected to the substrate via an adhesive material, and the opaque upper cover forms two openings respectively corresponding to the light-emitting element and the photosensitive element, so that the light-emitting element The emitted optical signal can be emitted through one of the openings to the opaque upper cover, reflected by an object, and injected into the photosensitive element from the other opening.

The optoelectronic device of the present invention includes any number, type, form of light-emitting elements and photosensitive elements, such as only one photosensitive element, only one light-emitting element, including a light-emitting element and a light-sensitive element, or other combinations. The optical sensor of the present invention can be any kind of optical sensor, preferably a proximity sensor, including a light-emitting element and a light-sensing element, but is not limited thereto.

The substrate can protect the photovoltaic element disposed thereon and amplify the electrode of the photovoltaic element, and the type of the electrode is not limited thereto. For example, it can be a Ball Grid Array substrate, a lead frame, or a copper foil substrate. The resin substrate, the printed circuit board substrate, or other types of substrates may be selected according to the pin specifications of the photovoltaic elements disposed thereon or the printed circuit board specifications to which the photovoltaic device is to be applied.

The formulation of the aforementioned transparent molding material is not limited, and it may be a single component compound or a mixture of a plurality of compounds in a plurality of ratios, such as: plastic, A mixture of a hardener and a catalyst. The transparent molding material is formed by a molding process and/or other forming process, for example, by applying a molding process to the same transparent molding of a substrate equipped with a plurality of photovoltaic devices. The substance is sealed, and the cavity shape of the mold used in the molding process can cover a plurality of photovoltaic elements, so that the heated transparent molding material flows into the cavity and seals the photovoltaic elements, and then a cutting process is applied. The transparent molding material is cut into separate transparent molding materials which respectively seal a photovoltaic element; another example is: applying a molding process to seal the substrate on which the photovoltaic element is mounted with a plurality of transparent molding materials, for example, arranged in the same column The photovoltaic element is sealed by a transparent molding material, or the photovoltaic elements arranged in the same row are sealed by a transparent molding material, and there is no need to be limited thereto. At this time, the mold used in the molding process forms a plurality of cavity portions, so that each transparent mold The plastic material has a cavity corresponding to the shape of the transparent molding material, so that the heated transparent molding material flows into the cavity to cover the cavity. The photovoltaic elements are such that the respective transparent molding materials are separated from each other. The shape of the transparent molding material is not limited, and the two sides are usually completely covered with the inner photoelectric element and the connecting line thereon, and the top surface thereof may be a flat surface or a curved surface, but it is preferable to additionally form a curved surface of the lens portion. The lens portion is correspondingly sealed to the inside of the photovoltaic element, and is accommodated in one of the openings of the opaque upper cover in step (C) to provide an optical adjustment effect.

The material of the opaque upper cover is not limited, and may be made of any opaque material that blocks light. For example, resin, nylon, plastic, metal, liquid crystal polyester, or other opaque materials may be used. Preferably, the black opaque upper cover made of a material resistant to high temperature is not limited in the present invention. For example, nylon can be selected from PA6T, PA9T, PA66, PPA, HTN, PA46, etc., the resin can be selected from polyphenylene sulfide (PPS) resin, and the plastic can be selected from PEK, PEEK, TPI, and the like. Secondly, the opaque top cover may optionally comprise other detail structures, such as additionally comprising at least one side wall, exemplarily between the transparent molding materials molded by sealing the photovoltaic elements and the transparent molding materials. On the outside, the adhesive material is connected to the substrate to block the ambient light source from laterally interfering with the photoelectric component, or to form a chamfer on the sidewall, so that when the opaque upper cover is bonded to the substrate, a large error can be tolerated and the alignment can be automatically performed.

Similarly, the formulation of the aforementioned adhesive substance is not limited, but is preferably an epoxy resin.

Therefore, the present invention encapsulates at least one transparent molding material produced by a molding process with an opaque upper cover, and integrally forms a lens portion on the transparent molding material to provide good optical characteristics and is simplified. Package the program and reduce process costs.

To further illustrate the various embodiments, the invention is provided with the drawings. The drawings are a part of the disclosure of the present invention, and are mainly used to explain the embodiments, and the operation of the embodiments may be explained in conjunction with the related description of the specification. With reference to such content, those of ordinary skill in the art should be able to understand other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale, and similar Component symbols are often used to indicate similar components.

Referring first to Figure 1, there is shown a schematic cross-sectional view of a photovoltaic device in accordance with an embodiment of the present invention, wherein one or more photovoltaic devices are employed, including any number, type, form of light-emitting elements and photosensitive elements. For example, the optical sensor 1 including a light-emitting element 20 and a light-receiving element 30 is taken as an example, but the invention is not limited thereto, and may be, for example, including only one photosensitive element, including only one light-emitting element, including A light-emitting element and a photosensitive element or other combination of aspects. As shown in the figure, the optical sensor 1 includes a substrate 10 and an opaque upper cover 60. The opaque upper cover 60 is disposed above the substrate 10 and connected to the substrate 10 via an adhesive substance 50. The opaque upper cover 60 forms one or more openings. For example, the two openings 62 and 63 respectively correspond to an electronic component, that is, the light-emitting component 20 or the photosensitive component 30, so that the light signal emitted by the light-emitting component 20 can be emitted through the opening 62 to the opaque upper cover 60. An object 2 located within a range of reflections is incident from the opening 63 into the photosensitive element 30. When the photosensitive element 30 detects the reflected optical signal, the optical signal conversion electronic signal output is provided to the rear end component (not shown).

Please refer to FIG. 2 together to understand the optoelectronic device and its packaging program of the embodiment, wherein FIG. 2 is a schematic diagram showing one state of the optoelectronic device encapsulation method according to an embodiment of the present invention, which is clearly illustrated herein. According to the structure of the optical sensor 1 shown in FIG. 1, the photovoltaic device packaging method of the present invention is not limited to the optical sensor of such a structure. As shown in FIG. 2, one or more photovoltaic elements, such as a light-emitting element 20, are first assembled on a substrate 10. And a photosensitive element 30, the light emitting element 20 and the photosensitive element 30 are electrically connected to the substrate 10. In the present embodiment, the optical sensor 1 is exemplarily constructed as a proximity sensor, wherein the light-emitting element 20 is an infrared light-emitting diode, and the light-receiving element 30 is an infrared sensor. The substrate 10 can protect the light-emitting element 20 and the photosensitive element 30 disposed thereon and amplify the electrodes of the light-emitting element 20 and the photosensitive element 30 to transmit the conductor medium on the substrate 10, such as a pin, a ball, or other form of conductor medium. An electronic signal or a power source is output/inputted to operate the light emitting element 20 and the light receiving element 30. It should be noted that the type of the substrate 10 is not limited herein, and may be, for example, a Ball Grid Array substrate, a lead frame, a copper foil substrate, a resin substrate, a printed circuit board substrate or the like. For a substrate of a type, a specific type of substrate can be selected depending on the size of the light-emitting element 20 and the photosensitive element 30 on which the light-emitting element 20 and the photosensitive element 30 are disposed or the printed circuit board to which the photovoltaic device is to be applied. The process of assembling the light-emitting element 20 and the photosensitive element 30 on the substrate 10 is also not limited. When the substrate 10 is a lead frame, for example, the light-emitting element 20 and the photosensitive element 30 can be fixed by a die-bonding process. On the substrate 10, a wire bounding process is electrically connected to the input and output electrodes (not shown) on the substrate 10 by bonding wires 21 and 31, respectively.

Next, the electronic components, such as the light-emitting component 20 and the photosensitive component 30, are sealed in at least one transparent molding material 4 which has been molded. For the state at this time, please refer to FIG. 3, which shows an implementation according to one embodiment of the present invention. A schematic diagram of another state of the photovoltaic device packaging method. The formulation of the transparent molding material 4 is not limited, and it may be a mixture of a single component compound or a plurality of compounds in a plurality of ratios. a compound such as a mixture of plastic, hardener and catalyst. After the light-emitting element 20 and the photosensitive element 30 are sealed, substances such as moisture and the like which affect the normal operation of the light-emitting element 20 or the photosensitive element 30 can be blocked, and the shape of the transparent molding material 4 is not limited, and the two sides are usually completely covered with the inner light. The element 20 and/or the photosensitive element 30 and the connecting line thereon may have a flat surface or a curved surface, and preferably further form a light-emitting element 20 or a photosensitive element 30 correspondingly sealed by a lens portion 421, The effect of optical adjustment is provided, but the invention is not limited thereto.

It should be noted that the manufacturing process of the transparent molding material 4 may also be changed in several ways. Please refer to FIGS. 6 to 8 to show another state of the photovoltaic device packaging method according to an embodiment of the present invention. Three top view schematics. As shown in Fig. 8, for example, an example is that a substrate 10 to which a photovoltaic element, such as the light-emitting element 20 and the photosensitive element 30, is mounted is sealed by a single transparent molding material 4 by applying a molding process. The cavity shape of the mold used in the molding process can coat all the photovoltaic elements, so that the heated transparent molding material flows into the cavity and seals the light-emitting element 20 and the photosensitive element 30, and the transparent molding material 4 is cured. After cutting, it has become a plurality of transparent molding materials separated from each other, and respectively coated with a photoelectric element. In this case, please refer to FIG. 4; another example: applying a molding process will be equipped with a photovoltaic element, such as The plurality of light-emitting elements 20 and the plurality of light-emitting elements 30 are respectively sealed by a plurality of transparent molding materials 4, for example, in FIG. 6, the transparent molding materials 4 respectively cover the same row of photovoltaic elements, In the figure 7, the transparent molding material 4 respectively covers the photovoltaic elements of the same column, and the mold used in the molding process forms a plurality of cavities, so that each of the transparent molding materials 4 has Corresponding to a cavity, the shape of the cavity corresponds to the shape of the transparent molding material 4, respectively, so that the heated transparent molding material 4 flows into the same row or column of photovoltaic elements encapsulated in the cavity. Next, a cutting process is applied to cut the aforementioned transparent molding material 4 along a cutting line (shown in phantom to FIGS. 3 and 6 to 8) into a plurality of independent transparent moldings respectively sealing a photovoltaic element. The substances 40, 42 are such that the transparent molding materials 40, 42 are sealed from each other by one of the photovoltaic elements in order to form the state shown in Fig. 4.

In the present embodiment, the transparent molding materials 40, 42 are separated from each other and completely encapsulate the photovoltaic elements, such as the light-emitting element 20, the photosensitive element 30 and the gold wires 21, 31 thereon, and the transparent molding material 42 forms a lens. The portion 421 corresponds to the photosensitive member 30 sealed therein. The lens portion 421 is received in the opening 63 of the opaque upper cover 60, and thus is not shielded by the opaque upper cover 60. Since the lens portion 421 of the present embodiment is approximately convex, when the light signal emitted from the light-emitting element 20 is reflected into the lens portion 421, The lens portion 421 can provide an effect of collecting light, and the optical signal is incident on the photosensitive element 30. Next, an opaque upper cover 60 is disposed above the substrate 10 and connected to the substrate 10 via an adhesive substance 50. For the state at this time, refer to FIG. 5, and the state after the opaque upper cover 60 is connected, please refer to FIG. The material of the opaque upper cover 60 is not limited, and may be made of any opaque material that blocks light. For example, it may be made of resin, metal, nylon, plastic, liquid crystal polymer, or other opaque material, and the invention is not limited. For example, nylon can be selected from PA6T, PA9T, PA66, PPA, HTN, PA46, etc., the resin can be selected from polyphenylene sulfide (PPS) resin, and the plastic can be selected from PEK, PEEK, TPI, and the like. opaque The upper cover 60 is exemplified herein as a black opaque upper cover made of high temperature resistant nylon. Second, the opaque upper cover 60 can optionally include other detailing structures, such as additionally including at least one side wall 61, 64. The opaque upper cover 60 is exemplarily sealed between the transparent molding materials 40, 42 and the transparent molding materials 40, 42 which are sealed with photovoltaic elements, such as the light-emitting elements 20 and the photosensitive elements 30. The adhesive material 50 is connected to the substrate 10 to block the ambient light source from interfering with the photosensitive element 30 to interpret the optical signal. The formulation of the adhesive substance 50 is also not limited, but is preferably an epoxy resin.

Please refer to FIG. 9, which shows a schematic cross-sectional view of a photovoltaic device according to an embodiment of the present invention. For the sake of brevity of the present embodiment, only the differences between the present embodiment and FIG. 1 will be described herein, and the rest will not be described again. The photovoltaic device 3 of the present embodiment can be separately provided with a photovoltaic element, such as the photosensitive member 30, on its substrate 10, and the photosensitive member 30 is sealed in a molded transparent molding material 42. The transparent molding material 42 is exemplified here to form the photosensitive member 30 in which the lens portion 421 is sealed correspondingly. However, the present invention is not limited thereto, and the lens portion 421 may be omitted to form a smooth surface on the top surface of the transparent molding material 42. The opaque upper cover 60 is exemplarily connected to the substrate 10 via the adhesive substance 50 on the outside of the transparent molding materials 40, 42.

Please refer to FIG. 10, which shows a cross-sectional structural view of a photovoltaic device according to an embodiment of the present invention. For the sake of brevity of the present embodiment, only the differences between the present embodiment and FIG. 1 will be described herein, and the rest will not be described again. The optoelectronic device 5 of the embodiment can be separately provided with a photoelectric component on the substrate 10, such as here. The light element 20 is sealed and the light emitting element 20 is sealed in a molded transparent molding material 40. The transparent molding material 40 is exemplified here to form the light-emitting element 20 in which the lens portion 401 is sealed correspondingly. However, the present invention is not limited thereto, and the lens portion 401 may be omitted to form a smooth surface on the top surface of the transparent molding material 40. The opaque upper cover 60 is exemplarily connected to the substrate 10 via the adhesive substance 50 on the outside of the transparent molding materials 40, 42.

Please refer to FIG. 11, which shows a schematic cross-sectional view of a photovoltaic device according to an embodiment of the present invention. For the sake of brevity of the present embodiment, only the differences between the present embodiment and FIG. 1 will be described herein, and the rest will not be described again. The main difference of the photovoltaic device 7 of the present embodiment is that a light-emitting element 20 corresponding to the lens portion 401 is sealed on the transparent molding material 40 to provide a condensing effect on the light emitted by the light-emitting element 20. Good optical properties.

Please refer to FIG. 12, which shows a schematic cross-sectional view of a photovoltaic device according to an embodiment of the present invention. The difference between this embodiment and FIG. 1 is mainly that in the photovoltaic device 8, the sidewalls 61 and 64 of the opaque upper cover 60 are respectively chamfered, so that when the opaque upper cover 60 is bonded to the substrate 10, a large error can be tolerated. Can be automatically aligned.

Please also refer to FIG. 13 , which shows a schematic flow chart of a photovoltaic device packaging method according to an embodiment of the invention. As shown in the figure, first, one or more photovoltaic elements are mounted on a substrate, and the photoelectric elements are electrically connected to the substrate, and the photoelectric elements are any combination of the light-emitting elements and the photosensitive elements (step 110); then, the photoelectric elements are sealed. In at least one transparent molding material molded by molding (step 120); an opaque upper cover is disposed on the upper surface of the substrate, and is connected to the substrate via an adhesive material, and the opaque upper cover forms one or more openings respectively corresponding to the photoelectric elements, so that the optical signals emitted by the photoelectric elements can be emitted through the openings to the opaque upper cover, and/ Or into the optoelectronic component from the opening (step 130). Optionally, additional steps may be additionally included, such as a die bonding process for fixing the light emitting element on the substrate, a gold wire process for forming a gold wire and an input and output electrode on the substrate, a plasma cleaning step, and a heating and baking process. The baking step, the curing step, the visual inspection, the opening and the breaking detection, etc., are regarded as the requirements of the respective embodiments, and are not described herein again.

Step 120 may additionally include sealing a plurality of photovoltaic elements separately to a molded transparent molding material, the transparent molding materials being separated from each other. The method of separating such transparent molding materials from each other is exemplified herein. Similarly to the foregoing, the first method uses a cutting process to apply a molding process to laminate the substrates of the plurality of photovoltaic elements to be assembled. The transparent molding material is sealed and cut into a plurality of transparent molding materials which respectively seal a photovoltaic element, and the other method is to seal a plurality of photovoltaic elements mounted on the substrate with a transparent molding material respectively during the application molding process. Next, in step 130, it may optionally include a step of bonding at least one sidewall of the opaque cap to the substrate via a bonded material and a plurality of transparent molding materials molded by the photovoltaic element and transparent molding. The outer side of the substance, or optionally a step, corresponds to the opening of the opaque upper cover of the lens portion formed by the transparent molding material, so that the lens portion is accommodated in the opening. In other embodiments, a step may be additionally included to form at least one side wall having a chamfer in the opaque upper cover, so that the opaque upper cover is bonded to the substrate. Larger errors can be tolerated and can be automatically aligned.

Please refer to FIG. 14, which is a flow chart showing an optical sensor packaging method according to an embodiment of the present invention. Here, the optical sensor is used to sense an object located within a range of distances. As shown in the figure, a light-emitting element and a light-sensing element are first mounted on a substrate, and the light-emitting element and the photosensitive element are electrically connected to the substrate (step 210). Next, the light-emitting element and the photosensitive element are sealed in at least one of the transparent molding materials molded (step 220). An opaque upper cover is disposed on the upper surface of the substrate, and is connected to the substrate via an adhesive material. The opaque upper cover forms two openings respectively corresponding to the light-emitting element and the light-sensing element, so that the light signal emitted by the light-emitting element can exit the opaque upper cover through one of the openings, through an object. Reflected and incident on the photosensitive element from another opening (step 230).

Similar to the previous embodiment, steps 210, 220, and 230 may be changed corresponding to the contents of steps 110, 120, and 130, respectively, to increase or decrease the steps therein, and other chamfering forms may be added as described above. The die bonding process, the gold wire process for forming the gold wire and the input and output electrodes on the substrate, the plasma cleaning step, the heating baking step, the curing step, the visual inspection, the opening and the breaking detection, etc., are not described herein again. .

Therefore, as can be seen from the above, the present invention encapsulates at least one transparent molding material produced by a molding process with an opaque upper cover, and a lens portion can be integrally formed on the transparent molding material to provide good. Optical characteristics and simplify packaging and reduce process costs.

The above description is in accordance with various embodiments of the present invention, wherein various features may Implemented in a single or different combination. Therefore, the disclosure of the embodiments of the present invention is intended to be illustrative of the embodiments of the invention. Further, the foregoing description and the accompanying drawings are merely illustrative of the invention and are not limited. Variations or combinations of other elements are possible and are not intended to limit the spirit and scope of the invention.

1‧‧‧Optical sensor

2‧‧‧ objects

3, 5, 7, 8‧ ‧ photoelectric devices

10‧‧‧Substrate

20‧‧‧Lighting elements

21‧‧‧ Gold Line

30‧‧‧Photosensitive elements

31‧‧‧ Gold wire

40, 42‧‧‧ Transparent molding materials

421, 401‧‧ ‧ lens department

50‧‧‧Adhesive substance

60‧‧‧Optical cover

61, 64‧‧‧ side walls

62, 63‧‧‧ openings

110, 120, 130, 210, 220, 230 ‧ ‧ steps

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing a photovoltaic device in accordance with an embodiment of the present invention.

Fig. 2 is a view showing one of the states of a photovoltaic device packaging method according to an embodiment of the present invention.

Figure 3 is a diagram showing one of the states of a photovoltaic device packaging method in accordance with an embodiment of the present invention.

Fig. 4 is a view showing one of the states of a photovoltaic device packaging method according to an embodiment of the present invention.

Fig. 5 is a view showing one of the states of a photovoltaic device packaging method according to an embodiment of the present invention.

Figure 6 is a top plan view showing one state of a photovoltaic device packaging method in accordance with an embodiment of the present invention.

Figure 7 is a top plan view showing one state of a photovoltaic device packaging method in accordance with an embodiment of the present invention.

Figure 8 is a diagram showing a method of packaging a photovoltaic device according to an embodiment of the present invention. Another top view of a state.

Figure 9 is a schematic cross-sectional view showing a photovoltaic device in accordance with an embodiment of the present invention.

Figure 10 is a schematic cross-sectional view showing a photovoltaic device in accordance with an embodiment of the present invention.

Figure 11 is a schematic cross-sectional view showing a photovoltaic device in accordance with an embodiment of the present invention.

Figure 12 is a schematic cross-sectional view showing a photovoltaic device in accordance with an embodiment of the present invention.

Figure 13 is a flow chart showing a method of packaging an optoelectronic device according to an embodiment of the present invention.

Figure 14 is a flow chart showing an optical sensor packaging method according to an embodiment of the present invention.

1‧‧‧Optical sensor

2‧‧‧ objects

10‧‧‧Substrate

20‧‧‧Lighting elements

21‧‧‧ Gold Line

30‧‧‧Photosensitive elements

31‧‧‧ Gold wire

40, 42‧‧‧ Transparent molding materials

421‧‧‧ lens department

50‧‧‧Adhesive substance

60‧‧‧Optical cover

61, 64‧‧‧ side walls

62, 63‧‧‧ openings

Claims (38)

An optoelectronic device comprising: a substrate on which one or more optoelectronic components are electrically connected to the substrate, the optoelectronic component being any combination of a light emitting component and a photosensitive component, and sealed in at least one transparent molded And a opaque upper cover disposed on the substrate and connected to the substrate via an adhesive material, the opaque upper cover forming one or more openings respectively corresponding to the photoelectric element, so that the optical signal emitted by the photoelectric element can be The opening exits the opaque upper cover and/or emits light from the opening to the optoelectronic component. The photovoltaic device according to claim 1, which comprises a plurality of photovoltaic elements which are each sealed by molding a transparent molding material, and the transparent molding materials are separated from each other. The photovoltaic device of claim 2, wherein the transparent molding materials are separated from each other by cutting. The photovoltaic device of claim 2, wherein the opaque upper cover further comprises at least one sidewall between the transparent molding materials molded by molding the photovoltaic elements and the transparent molds The outer side of the plastic material is connected to the substrate via the adhesive substance. The photovoltaic device according to claim 1, wherein the at least one transparent molding material comprises a lens portion corresponding to the photoelectric element sealed therein, and is accommodated In one of the openings of the opaque cover. An optoelectronic device comprising: a substrate on which only one photosensitive element is electrically connected to the substrate, and sealed in a transparent molding material molded; and an opaque upper cover disposed above the substrate The opaque upper cover forms an opening corresponding to the photosensitive member via an adhesive material, such that light can be incident from the opening to the photosensitive member. The photovoltaic device according to claim 6, wherein the opaque upper cover further comprises at least one side wall, outside the transparent molding material molded by the photosensitive member, through the adhesive substance and the substrate connection. The photovoltaic device according to claim 1 or 6, wherein the top surface of the transparent molding material is a flat surface or a curved surface. The photovoltaic device according to claim 1 or 6, wherein the substrate is a copper foil substrate, a lead frame, a resin substrate or a printed circuit board substrate. The optoelectronic device of claim 1 or 6, wherein the opaque cover is a black opaque cover. The photovoltaic device according to claim 1 or 6, wherein the opaque cover is a nylon, a plastic, a metal, or a liquid crystal polymer. The optoelectronic device of claim 1 or 6, wherein the opaque upper cover further comprises at least one side wall connected to the substrate, the side wall forming a chamfer. The photovoltaic device according to claim 1 or 6, wherein the adhesive material is an epoxy resin. An optical sensor for sensing an object located within a range of distances, comprising: a substrate on which a light-emitting element and a photosensitive element are mounted, the light-emitting element and the photosensitive element being electrically connected to the substrate, and The illuminating element and the photographic element are respectively sealed in a transparent molding material which is molded; and an opaque upper cover is disposed on the substrate, and is connected to the substrate via an adhesive material, and the opaque upper cover forms two openings respectively Corresponding to the light-emitting element and the photosensitive element, the light signal emitted by the light-emitting element can be emitted through the one of the openings to the opaque upper cover, reflected by the object, and injected into the photosensitive element from the other opening. The optical sensor of claim 15, wherein the transparent molding materials are separated from each other. The optical sensor of claim 16, wherein the transparent molding materials are separated from each other by cutting. The optical sensor of claim 16, wherein the opaque upper cover further comprises at least one side wall between the transparent molding material sealed by molding the light-emitting element and the photosensitive element. The outer side of the transparent molding material is connected to the substrate via the adhesive material. The optical sensor of claim 15, wherein the top surface of the transparent molding material is a flat surface or a curved surface. The optical sensor of claim 15, wherein the substrate is a copper foil substrate, a lead frame, a resin substrate or a printed circuit board substrate. The optical sensor of claim 15, wherein the opaque upper cover is a black opaque upper cover. The optical sensor of claim 15, wherein the opaque cover is a nylon, plastic, metal, or liquid crystal polymer. The optical sensor of claim 15, wherein the opaque upper cover further comprises at least one side wall connected to the substrate, the side wall forming a chamfer. The optical sensor of claim 15, wherein the adhesive material is an epoxy resin. A photovoltaic device packaging method comprising the steps of: (A) mounting one or more photovoltaic elements on a substrate, electrically connecting the photovoltaic elements to the substrate, the photoelectric elements being any combination of the light-emitting elements and the photosensitive elements; B) sealing the photovoltaic element in at least one transparent molding material molded; and (C) placing an opaque upper cover over the substrate, connecting the substrate via an adhesive material, the opaque upper cover forming a Or more than one opening respectively corresponding to the optoelectronic component, such that the optical signal emitted by the optoelectronic component can exit the opaque cap through the opening and/or into the optoelectronic component from the opening. The method of packaging a photovoltaic device according to claim 25, wherein the step (B) further comprises sealing a plurality of photovoltaic elements separately to a transparent molding material, wherein the transparent molding materials are Separated from each other. The method of packaging a photovoltaic device according to claim 26, wherein the step (B) further comprises: applying a molding process to seal the substrate equipped with the plurality of photovoltaic elements with the same transparent molding material; The same transparent molding material is cut by a cutting process into a plurality of transparent molding materials each sealing a photovoltaic element. The method of encapsulating a photovoltaic device according to claim 26, wherein the step (B) further comprises: applying a molding process to seal a plurality of photovoltaic elements mounted on the substrate with a transparent molding material. The method of packaging a photovoltaic device according to claim 25, wherein the step (C) further comprises: between the transparent molding materials molded by molding the photovoltaic elements and the transparent molds; The outer side of the plastic material is connected to the substrate via at least one side wall of the opaque upper cover. The photovoltaic device packaging method of claim 25, wherein the step (A) further comprises: assembling a photosensitive element as the photovoltaic element only on the substrate. The method of packaging a photovoltaic device according to claim 25, wherein the step (B) further comprises forming a lens portion in the at least one transparent molding material, corresponding to the step (C). The opening of the opaque cover is such that the lens portion is received in the opening in step (C). An optoelectronic device as claimed in claim 25 or claim 30, wherein The method further includes: forming at least one side wall having a chamfer on the opaque upper cover. An optical sensor packaging method for sensing an object located within a range of distances, comprising the steps of: (A) assembling a light-emitting component and a photosensitive component on a substrate, and causing the light-emitting component and The photosensitive element is electrically connected to the substrate; (B) the light emitting element and the photosensitive element are sealed in at least one transparent molding material which is molded; and (C) an opaque upper cover is disposed on the substrate, The opaque upper cover is formed to be connected to the substrate, and the opaque upper cover forms two openings respectively corresponding to the light-emitting element and the photosensitive element, so that the light signal emitted by the light-emitting element can be emitted through the opening of the opaque upper cover, reflected by an object, and Another opening is incident on the photosensitive element. The optical sensor packaging method of claim 33, wherein the step (B) further comprises sealing the light-emitting element and the photosensitive element to a transparent molding material, which is molded, respectively. The transparent molding materials are separated from each other. The optical sensor packaging method of claim 34, wherein the step (B) further comprises: applying a molding process to mount the light-emitting element and the photosensitive element The substrate is sealed with the same transparent molding material; and the same transparent molding material is cut by a cutting process into a plurality of transparent molding materials each of which is sealed with the light-emitting element and the photosensitive element. The optical sensor packaging method of claim 34, wherein the step (B) further comprises: applying a molding process to separately mold the substrate on which the light-emitting element and the photosensitive element are mounted, respectively. Material seal. The optical sensor packaging method of claim 33, wherein the step (C) further comprises: between the transparent molding materials molded by molding the light-emitting element and the photosensitive element; And at least one sidewall of the opaque upper cover is connected to the substrate via the adhesive material on the outside of the transparent molding material. The optical sensor packaging method of claim 33, wherein the step (B) further comprises forming a lens portion in the at least one transparent molding material, wherein the opaque portion corresponds to the opacity in the step (C) One of the openings of the upper cover is such that the lens portion is received in the opening in step (C). The optical sensor of claim 33, wherein the step (C) further comprises: forming at least one sidewall having a chamfer on the opaque cover.